CN112667036A - Computer server - Google Patents
Computer server Download PDFInfo
- Publication number
- CN112667036A CN112667036A CN201910984579.2A CN201910984579A CN112667036A CN 112667036 A CN112667036 A CN 112667036A CN 201910984579 A CN201910984579 A CN 201910984579A CN 112667036 A CN112667036 A CN 112667036A
- Authority
- CN
- China
- Prior art keywords
- heat
- computer server
- components
- exhaust fan
- installation cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009434 installation Methods 0.000 claims abstract description 48
- 238000010521 absorption reaction Methods 0.000 claims abstract description 11
- 239000004065 semiconductor Substances 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 15
- 238000004891 communication Methods 0.000 claims description 11
- 238000001816 cooling Methods 0.000 claims description 9
- 238000005057 refrigeration Methods 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 19
- 238000000034 method Methods 0.000 abstract description 7
- 239000000428 dust Substances 0.000 abstract description 6
- 239000012535 impurity Substances 0.000 abstract description 5
- 238000012546 transfer Methods 0.000 description 11
- 230000017525 heat dissipation Effects 0.000 description 8
- 239000007788 liquid Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses a computer server, and relates to the field of computer hardware equipment. The specific implementation scheme is as follows: the method comprises the following steps: the device comprises a shell, a first fixing device and a second fixing device, wherein a closed installation cavity is defined in the shell; the plurality of components are arranged in the mounting cavity; the first radiator comprises a heat absorption part and a heat release part, the heat absorption part is connected with the heat release part through a heat conduction pipe, a heat exchange medium is arranged in the heat conduction pipe, the heat absorption part is arranged in a preset range of the component, and the heat release part is arranged on the wall body of the shell and located outside the installation cavity. According to the computer server provided by the embodiment of the application, the installation cavity in the shell is constructed into a closed structure, so that external dust or impurities can be prevented from entering the installation cavity to damage components, and the waterproof, dustproof and anticorrosion effects are achieved; secondly, through setting up first radiator, the radiating effect of components and parts is good, the radiating efficiency is high to can avoid the ambient temperature of installation intracavity to rise, thereby promote the reliability of components and parts during operation.
Description
Technical Field
The application relates to the technical field of computers, in particular to a computer hardware device.
Background
An edge computing server is a hardware product that provides computing and storage services nearby, near the side of the origin of the object or data. With the development of the fifth generation mobile communication technology, the application scenarios of the edge computing server are more and more extensive, for example, when the vehicle and the road are cooperatively driven by unmanned vehicles, the edge computing server with high performance needs to be deployed nearby the road to work, so as to reduce the influence of time delay and bandwidth. Such application scenarios require the edge computing server to be deployed outdoors, where the local area may exceed 55 ℃ at high temperature in summer and may be as low as-40 ℃ in winter. In addition, the edge computing server also needs to consider the influence of dust, moisture, harmful substances and other factors comprehensively, so that the running environment of the edge computing server is very severe.
Disclosure of Invention
Embodiments of the present application provide a computer server to solve one or more technical problems in the prior art.
The present application provides a computer server comprising: the device comprises a shell, a first fixing device and a second fixing device, wherein a closed installation cavity is defined in the shell; the plurality of components are arranged in the mounting cavity; the first radiator comprises a heat absorption part and a heat release part, the heat absorption part is connected with the heat release part through a heat conduction pipe, a heat exchange medium is arranged in the heat conduction pipe, the heat absorption part is arranged in a preset range of the component, and the heat release part is arranged on the wall body of the shell and located outside the installation cavity.
In one embodiment, the heat absorbing portion is an evaporator and the heat releasing portion is a condenser. From this, can improve the heat exchange efficiency of heat absorption portion and heat release portion to promote first radiator to the radiating effect and the radiating efficiency of components and parts.
In one embodiment, the first heat sinks are provided in plurality corresponding to the plurality of components, and the heat shielding portions of the plurality of first heat sinks are provided at intervals on the wall body. Therefore, the heat dissipation requirements of a plurality of components can be met.
In an embodiment, the first heat sink further includes a first exhaust fan, the first exhaust fan is disposed on a wall of the housing and located outside the mounting cavity, and an air outlet direction of the first exhaust fan is toward the heat releasing portion. Therefore, the efficiency of heat exchange between the heat radiating part and the outside can be improved, so that the heat exchange medium in the heat radiating part can be rapidly cooled, and the heat radiating part can be prevented from exchanging heat with the air in the mounting cavity through the shell.
In one embodiment, the heat pipe, the heat absorbing part and the heat releasing part form a closed loop, the heat pipe comprises a first section and a second section which are connected end to end, the heat exchange medium flows from the heat absorbing part to the heat releasing part in the first section, and the heat exchange medium flows from the heat releasing part to the heat absorbing part in the second section, wherein the heat absorbing part is positioned below the heat releasing part in the vertical direction. Therefore, the flow rate of the heat exchange medium can be improved, and the heat dissipation effect and the heat dissipation efficiency of the first heat radiator on the component are further improved.
In one embodiment, the outer surface of the heat conductive pipe is provided with a heat insulating layer. From this, can avoid the heat that gives off in the components and parts working process to be absorbed the back by heat transfer medium, transmit to the installation intracavity through the heat pipe to avoid the high temperature of installation intracavity.
In one embodiment, the computer server further comprises: the second radiator is installed in the wall body of casing, and the second radiator includes the semiconductor refrigeration piece, and the semiconductor refrigeration piece includes refrigeration end and heating end, and the refrigeration end is located the installation cavity, and heating end is located outside the installation cavity. Therefore, the air temperature in the mounting cavity can be reduced, and the component cooling effect is further improved.
In one embodiment, the second radiator further comprises a second exhaust fan and a third exhaust fan, the second exhaust fan is mounted on the wall body of the shell and located in the mounting cavity, and the air outlet direction of the second exhaust fan is arranged towards the refrigerating end; the third exhaust fan is installed in the wall body of casing and is located outside the installation cavity, and the air-out direction of third exhaust fan sets up towards the heating end. Therefore, the heat exchange efficiency of the heating end and the external environment can be improved, heat emitted by the heating end is prevented from exchanging heat with the shell, and the air temperature in the installation cavity is further guaranteed.
In one embodiment, the computer server further comprises: a plurality of communication cable, communication cable's one end is connected in components and parts, and communication cable's the other end is equipped with water joint, and water joint wears to locate the wall body of casing. From this, can guarantee the closure of installation cavity, avoid the water among the external environment to pass through the clearance entering installation cavity between the wall body of communication cable and casing to waterproof effect has further been improved.
In one embodiment, the shell comprises a body and a top plate, the top plate and the body define a mounting cavity, the top plate is detachably mounted on the top opening of the body, the plurality of components are mounted on the bottom wall of the body, and the first heat radiator is mounted on the side wall of the body. Therefore, the components are convenient to mount and dismount in the mounting cavity, and the components are convenient to maintain or replace.
One embodiment in the above application has the following advantages or benefits: through constructing the casing for closed structure in order to inject confined installation cavity, can avoid external dust or impurity to get into the installation cavity and cause the harm to components and parts to play waterproof, dustproof and anticorrosive effect, and then improved the reliability of components and parts during operation. Secondly, through setting up first radiator, can be outside the heat direct transfer to the installation cavity of the release of components and parts in the working process, from this, first radiator is good, the radiating efficiency is high to the radiating effect of components and parts to can avoid the ambient temperature of installation cavity to rise, thereby further promote the reliability of components and parts during operation.
The foregoing summary is provided for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present application will be readily apparent by reference to the drawings and following detailed description.
Drawings
In the drawings, like reference numerals refer to the same or similar parts or elements throughout the several views unless otherwise specified. The figures are not necessarily to scale. It is appreciated that these drawings depict only some embodiments in accordance with the disclosure and are therefore not to be considered limiting of its scope.
FIG. 1 shows a schematic structural diagram of a computer server according to an embodiment of the present application;
fig. 2 shows an operational schematic diagram of a first heat sink of a computer server according to an embodiment of the present application.
The reference numbers illustrate:
a computer server 100;
a housing 10; a base plate 11; side plates 12;
a component 20; a central processing unit 21; a graphics processor 22;
a first heat sink 30; a heat absorbing part 31; a heat radiating section 32; a heat conductive pipe 33; a first section 331; a second segment 332; a first exhaust fan 34;
a second heat sink 40; a semiconductor refrigerating sheet 41; a refrigerating end 411; a heating end 412; a second exhaust fan 42; a third exhaust fan 43;
a watertight fitting 50.
Detailed Description
The following description of the exemplary embodiments of the present application, taken in conjunction with the accompanying drawings, includes various details of the embodiments of the application for the understanding of the same, which are to be considered exemplary only. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the embodiments described herein can be made without departing from the scope and spirit of the present application. Also, descriptions of well-known functions and constructions are omitted in the following description for clarity and conciseness.
A computer server 100 according to an embodiment of the present application is described below with reference to fig. 1 and 2. The computer server 100 of the embodiment of the present application may be an edge computing server, and further, the computer server 100 of the embodiment of the present application may provide a service of vehicle-road coordination for an unmanned vehicle.
As shown in fig. 1, a computer server 100 according to an embodiment of the present application includes a case 10, a plurality of components 20, and a first heat sink 30.
Specifically, the housing 10 defines a closed mounting cavity therein. That is, the case 10 is constructed in a closed structure to isolate the installation cavity from the outside. From this, can avoid impurity such as external water or dust to get into the installation intracavity to play waterproof, dustproof and anticorrosive effect, it is better to a plurality of components and parts 20's protection effect.
A plurality of components 20 are mounted in the mounting cavity. The components 20 may include a central processing unit 21, a graphics processing unit 22, a motherboard, a storage device, a power supply system, and the like. The first heat sink 30 includes a heat absorbing portion 31 and a heat dissipating portion 32, the heat absorbing portion 31 and the heat dissipating portion 32 are connected by a heat pipe 33, a heat exchange medium is provided in the heat pipe 33, the heat absorbing portion 31 is provided in a predetermined range of the component 20, and the heat dissipating portion 32 is provided on a wall of the housing 10 and outside the mounting cavity. It is understood that a circulation flow path is formed between the heat conductive pipe 33, the heat absorbing part 31, and the heat radiating part 32, and the heat exchange medium can flow back and forth between the heat absorbing part 31 and the heat radiating part 32 through the heat conductive pipe 33. The heat exchange medium exchanges heat with the outside when flowing through the heat absorption part 31 to absorb heat released by the component 20 in the working process, so that the component 20 is cooled; the heat exchange medium exchanges heat with the outside while flowing through the heat radiating portion 32 to release heat to the outside of the installation cavity, thereby preventing heat from accumulating in the closed installation cavity. In order to improve the heat exchange effect between the component 20 and the heat sink 31, the heat sink 31 may be preferably mounted on the outer surface of the component 20.
Preferably, the outer surface of the heat conductive pipe 33 is provided with a heat insulating layer. The heat insulating layer is made of a heat insulating material, and the heat insulating layer covers the outer surface of the heat transfer pipe 33. Thus, when the heat transfer medium flows through the heat transfer pipe 33, heat exchange with the air in the installation chamber can be avoided, that is, the heat transfer medium exchanges heat with the outside only in the heat absorbing portion 31 and the heat radiating portion 32, and the heat transfer pipe 33 only functions to transfer heat. Therefore, the heat emitted in the working process of the component 20 can be prevented from being absorbed by the heat exchange medium and then transferred into the installation cavity through the heat conduction pipe 33, so that the temperature in the installation cavity is prevented from being too high.
According to computer server 100 of the embodiment of the application, through constructing casing 10 into the enclosed structure in order to inject the confined installation cavity, can avoid external dust or impurity to get into the installation cavity and cause the harm to components and parts 20 to play waterproof, dustproof and anticorrosive effect, and then improved the reliability of components and parts 20 during operation. Secondly, through setting up first radiator 30, can be with the heat direct transfer to the installation cavity outside of the release of components and parts 20 in the course of the work, from this, first radiator 30 is good, the radiating efficiency is high to components and parts 20's radiating effect to can avoid the ambient temperature rise in the installation cavity, thereby further promote the reliability of components and parts 20 during operation.
In one embodiment, the heat absorbing portion 31 is an evaporator and the heat radiating portion 32 is a condenser. Therefore, the heat exchange efficiency of the heat absorbing part 31 and the heat radiating part 32 can be improved, and the heat radiating effect and the heat radiating efficiency of the first heat radiator 30 on the component 20 can be improved. Wherein the evaporator and the condenser may adopt various technical solutions known to the skilled person now and in the future.
In one example, the heat exchange medium releases heat during heat exchange with the component 20 at the evaporator, and the liquid heat exchange medium absorbs heat and is converted into a gas state during heat exchange, and then flows to the condenser through the heat conductive pipe 33. The heat exchange medium releases heat in the process of exchanging heat with the external environment at the condenser, the gaseous heat exchange medium releases heat and is converted into liquid in the heat exchange process, and the liquid heat exchange medium flows back to the evaporator through the heat conduction pipe 33. Thereby, the heat exchange medium forms a circulating flow between the evaporator and the condenser.
In one embodiment, the first heat sinks 30 are provided in plural numbers corresponding to the plural components 20, and the heat radiation portions 32 of the plural first heat sinks 30 are provided at intervals on the wall body.
In one example, the plurality of components 20 may include one central processing unit 21 and two graphics processors 22, three first heat sinks 30 are correspondingly provided, and the heat absorbing portion 31 of each first heat sink 30 is mounted on the corresponding component 20. Further, a plurality of components 20 are arranged on the wall body of the casing 10 at intervals along the circumferential direction of the heat dissipation cavity, so that the heat dissipation effect is prevented from being affected by heat exchange between two adjacent components 20. This can satisfy the heat dissipation requirements of the plurality of components 20. It should be noted that the number of the components 20 in the computer server 100 of the embodiment of the present application is not particularly limited, for example, the number of the central processing units 21 may be one or more, and the number of the graphics processing units 22 may also be one or more.
In one embodiment, as shown in fig. 1, the first heat sink 30 further includes a first exhaust fan 34, the first exhaust fan 34 is disposed on a wall of the casing 10 and located outside the mounting cavity, and an air outlet direction of the first exhaust fan 34 is disposed toward the heat releasing portion 32.
In one example, the first exhaust fan 34 and the heat radiating portion 32 are arranged side by side in a length direction of a wall body of the case 10, and an air outlet direction of the first exhaust fan 34 is arranged toward the heat radiating portion 32 to form an air flow passing through the heat radiating portion 32. Thereby, the efficiency of heat exchange between the heat radiating portion 32 and the outside can be improved, so that the heat exchange medium in the heat radiating portion 32 can be rapidly cooled, and the heat radiating portion 32 can be prevented from exchanging heat with the air in the installation chamber through the case 10.
In one embodiment, the heat pipe 33, the heat absorbing part 31 and the heat releasing part 32 form a closed loop, the heat pipe 33 includes a first section 331 and a second section 332 connected end to end, the heat exchange medium flows from the heat absorbing part 31 to the heat releasing part 32 in the first section 331, and the heat exchange medium flows from the heat releasing part 32 to the heat absorbing part 31 in the second section 332, wherein the heat absorbing part 31 is located below the heat releasing part 32 in the vertical direction.
In one example, as shown in fig. 2, the first heat sink 30 may be a thermosiphon heat sink, with the shaded portion in the illustration being the heat exchange medium. The heat conductive pipe 33 includes a first section 331 and a second section 332 arranged side by side, the first section 331 and the second section 332 are respectively connected between the condenser and the evaporator, the first section 331 is used for the heat exchange medium to flow from the evaporator to the condenser, and the second section 332 is used for the heat exchange medium to flow from the condenser to the evaporator. Wherein, in the vertical direction, the evaporator is positioned below the condenser. Because the liquid heat exchange medium in the evaporator and the liquid heat exchange medium in the condenser have a height difference, the liquid heat exchange medium in the evaporator and the liquid heat exchange medium in the condenser have a pressure difference, and the heat exchange medium can flow between the condenser and the evaporator through the first section 331 and the second section 332 under the action of the pressure difference. This can increase the flow rate of the heat exchange medium, thereby further improving the heat dissipation effect and heat dissipation efficiency of the first heat sink 30 with respect to the component 20.
In one embodiment, as shown in fig. 1, the computer server 100 further includes a second heat sink 40, the second heat sink 40 is mounted on a wall of the casing 10, the second heat sink 40 includes a semiconductor cooling sheet 41, the semiconductor cooling sheet 41 includes a cooling end 411 and a heating end 412, the cooling end 411 is located in the installation cavity, and the heating end 412 is located outside the installation cavity. Preferably, the semiconductor chilling plates 41 can be arranged in a plurality at intervals.
It is understood that the semiconductor chilling plate 41 is a cooling device composed of semiconductors, the semiconductor chilling plate 41 includes a P-type semiconductor and an N-type semiconductor which are oppositely arranged, and the P-type semiconductor and the N-type semiconductor are connected to form a thermocouple pair, when current passes through the semiconductor chilling plate 41, heat transfer occurs between the two ends, so that heat is transferred from one end to the other end, thereby generating a temperature difference to form the chilling end 411 and the heating end 412.
In one example, other components 20 such as a motherboard, a storage device, and a power supply device are also disposed in the mounting cavity, and these components 20 also generate heat during operation and cause the temperature of the air in the mounting cavity to rise. Through the second heat sink 40, the air in the mounting chamber can exchange heat with the refrigerating end 411 to reduce the air temperature in the mounting chamber, thereby achieving the purpose of cooling and dissipating heat for the above-mentioned components 20.
In one embodiment, the second heat sink 40 further includes a second exhaust fan 42 and a third exhaust fan 43. The second exhaust fan 42 is installed on the wall of the casing 10 and located in the installation cavity, and the air outlet direction of the second exhaust fan 42 is toward the refrigerating end 411; the third exhaust fan 43 is installed on the wall of the casing 10 and located outside the installation cavity, and the air outlet direction of the third exhaust fan 43 is toward the heating end 412. In this way, the second exhaust fan 42 forms an air flow passing through the cooling end 411 to form a cold air flowing in the mounting chamber, thereby functioning to cool the components 20 in the mounting chamber; the third exhaust fan 43 forms an air flow passing through the heating end 412, so that the heat exchange efficiency between the heating end 412 and the external environment can be improved, the heat emitted from the heating end 412 is prevented from exchanging heat with the housing 10, and the air temperature in the installation cavity is further ensured.
In one embodiment, as shown in fig. 1, the computer server 100 further includes a plurality of communication cables, one end of each of the communication cables is connected to the component 20, and the other end of each of the communication cables is provided with a waterproof connector 50, and the waterproof connector 50 is inserted into a wall of the casing 10. From this, can guarantee the closure of installation cavity, avoid the water among the external environment to pass through the clearance entering installation cavity between the wall body of communication cable and casing 10 to waterproof effect has further been improved.
In one embodiment, the housing 10 includes a body and a top plate defining a mounting cavity with the body, the top plate being detachably mounted to the top opening of the body, the plurality of components 20 being mounted to the bottom wall of the body, and the first heat sink 30 being mounted to the side wall of the body.
In one example, the body includes a bottom plate 11 and a side plate 12 attached to an edge of the bottom plate 11, and the top plate is removably attached to an upper edge of the side plate 12 to define an enclosed mounting cavity. During assembly of the computer server 100, the top plate may be removed from the body to mount the component 20 in the mounting cavity, and after mounting, the top plate is mounted to the upper edge of the side plate 12 to close the top opening of the body. Therefore, the component 20 is convenient to mount and dismount in the mounting cavity, and the component 20 is convenient to maintain or replace. Preferably, a sealing member is installed between the top plate and the upper edge of the body, so that the sealing performance of the installation cavity can be further improved.
Other components of the computer server 100 according to the embodiment of the present application, such as a motherboard, a power system, a storage device, etc., may be adopted by various technical solutions known to those skilled in the art now and in the future, and will not be described in detail herein.
One embodiment in the above application has the following advantages or benefits: by constructing the housing 10 in a closed structure to define a closed installation cavity, external dust or impurities can be prevented from entering the installation cavity to damage the components 20, so that waterproof, dustproof and anticorrosive effects are achieved, and the reliability of the components 20 during operation is improved. Secondly, through setting up first radiator 30, can be with the heat direct transfer to the installation cavity outside of the release of components and parts 20 in the course of the work, from this, first radiator 30 is good, the radiating efficiency is high to components and parts 20's radiating effect to can avoid the ambient temperature rise in the installation cavity, thereby further promote the reliability of components and parts 20 during operation.
In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
The above-described embodiments should not be construed as limiting the scope of the present application. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions may be made in accordance with design requirements and other factors. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. A computer server, comprising:
a housing defining a closed mounting cavity therein;
the components are arranged in the installation cavity;
the first radiator comprises a heat absorption part and a heat release part, the heat absorption part is connected with the heat release part through a heat conduction pipe, a heat exchange medium is arranged in the heat conduction pipe, the heat absorption part is arranged in a preset range of the component, and the heat release part is arranged on a wall body of the shell and located outside the installation cavity.
2. The computer server of claim 1, wherein the heat absorbing portion is an evaporator and the heat emitting portion is a condenser.
3. The computer server according to claim 1, wherein the first heat sink is provided in plural in correspondence with the plural components, and the heat radiating portions of the plural first heat sinks are provided at intervals on the wall body.
4. The computer server of claim 1, wherein the first heat sink further comprises a first exhaust fan, the first exhaust fan is disposed on a wall of the housing and located outside the mounting cavity, and an air outlet direction of the first exhaust fan is disposed toward the heat releasing portion.
5. The computer server according to claim 1, wherein the heat pipe, the heat absorbing portion, and the heat radiating portion constitute a closed loop, the heat pipe includes a first section and a second section connected end to end, the heat exchange medium flows from the heat absorbing portion to the heat radiating portion in the first section, and the heat exchange medium flows from the heat radiating portion to the heat absorbing portion in the second section, wherein the heat absorbing portion is located below the heat radiating portion in a vertical direction.
6. The computer server of claim 1, wherein an outer surface of the heat pipe is provided with a thermal insulation layer.
7. The computer server of claim 1, further comprising:
the second radiator is installed on the wall body of the shell and comprises a semiconductor refrigeration piece, the semiconductor refrigeration piece comprises a refrigeration end and a heating end, the refrigeration end is located in the installation cavity, and the heating end is located outside the installation cavity.
8. The computer server of claim 7, wherein the second heat sink further comprises a second exhaust fan and a third exhaust fan, the second exhaust fan is mounted on the wall of the housing and located in the mounting cavity, and an air outlet direction of the second exhaust fan is arranged toward the cooling end; the third exhaust fan is installed in the wall body of casing just is located outside the installation cavity, the air-out direction of third exhaust fan is towards the hot junction sets up.
9. The computer server of claim 1, further comprising:
a plurality of communication cable, communication cable's one end connect in components and parts, communication cable's the other end is equipped with water joint, water joint wears to locate the wall body of casing.
10. The computer server of claim 1, wherein the housing comprises a body and a top plate, the top plate and the body defining the mounting cavity, the top plate being detachably mounted to the top opening of the body, the plurality of components being mounted to the bottom wall of the body, and the first heat sink being mounted to a side wall of the body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910984579.2A CN112667036A (en) | 2019-10-16 | 2019-10-16 | Computer server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910984579.2A CN112667036A (en) | 2019-10-16 | 2019-10-16 | Computer server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112667036A true CN112667036A (en) | 2021-04-16 |
Family
ID=75400380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910984579.2A Pending CN112667036A (en) | 2019-10-16 | 2019-10-16 | Computer server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112667036A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1646871A (en) * | 2002-04-08 | 2005-07-27 | 夏普株式会社 | Loop-type thermosiphon and stirling refrigerator |
| CN102216871A (en) * | 2008-12-26 | 2011-10-12 | 佳电株式会社 | Industrial computer capable of dust prevention and resistant to vibration |
| CN202285078U (en) * | 2011-10-31 | 2012-06-27 | 深圳雅图数字视频技术有限公司 | Smoke-proof projector |
| CN202353034U (en) * | 2011-11-22 | 2012-07-25 | 陕西同力电气有限公司 | Semiconductor refrigerating and cooling device of sealing type power distribution cabinet |
| CN105759923A (en) * | 2014-12-18 | 2016-07-13 | 研祥智能科技股份有限公司 | Separating type radiating device and method for closed industrial computer |
| CN208384330U (en) * | 2018-07-04 | 2019-01-15 | 无锡视美乐激光显示科技有限公司 | A kind of cooling system of heating element |
-
2019
- 2019-10-16 CN CN201910984579.2A patent/CN112667036A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1646871A (en) * | 2002-04-08 | 2005-07-27 | 夏普株式会社 | Loop-type thermosiphon and stirling refrigerator |
| CN102216871A (en) * | 2008-12-26 | 2011-10-12 | 佳电株式会社 | Industrial computer capable of dust prevention and resistant to vibration |
| CN202285078U (en) * | 2011-10-31 | 2012-06-27 | 深圳雅图数字视频技术有限公司 | Smoke-proof projector |
| CN202353034U (en) * | 2011-11-22 | 2012-07-25 | 陕西同力电气有限公司 | Semiconductor refrigerating and cooling device of sealing type power distribution cabinet |
| CN105759923A (en) * | 2014-12-18 | 2016-07-13 | 研祥智能科技股份有限公司 | Separating type radiating device and method for closed industrial computer |
| CN208384330U (en) * | 2018-07-04 | 2019-01-15 | 无锡视美乐激光显示科技有限公司 | A kind of cooling system of heating element |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102791107B (en) | Sealing and water-cooling method and equipment for cooling electronic equipment | |
| CN202050634U (en) | Sealing water cooling device for cooling electronic equipment | |
| CN114423135A (en) | Radiation source | |
| CN220156945U (en) | Radiating assembly, electric control box and air conditioner | |
| CN117881169A (en) | Heat dissipation system for solving problem of ring temperature in closed cavity | |
| CN111479450A (en) | Electrical apparatus box and be equipped with its indirect heating equipment | |
| CN112667036A (en) | Computer server | |
| CN107223009B (en) | Power module and heat dissipation system thereof | |
| CN214256985U (en) | Radiating assembly, electric cabinet and air conditioner | |
| CN211831667U (en) | Electrical apparatus box and be equipped with its indirect heating equipment | |
| CN210692519U (en) | Dustproof heat dissipation protection casing for semiconductor | |
| CN210610168U (en) | Radiating assembly, electric cabinet and air conditioning unit | |
| CN210328410U (en) | Gain amplifier's heat radiation structure | |
| CN110944488B (en) | Heat dissipation device and electronic equipment | |
| CN211044135U (en) | Server cooling system and server | |
| CN219068802U (en) | Network equipment with low temperature protection mechanism | |
| KR100477947B1 (en) | Cooling apparatus for electronic equipment | |
| CN220106031U (en) | High-reliability solid state disk | |
| CN104519717A (en) | Forward rotation and reverse rotation switching equipment and heat dissipation system thereof | |
| CN218451050U (en) | Cooling system for inner ring temperature | |
| CN219244038U (en) | Heat radiation assembly for refrigeration equipment | |
| CN219583972U (en) | Fill electric pile heat abstractor | |
| CN221948515U (en) | Control cabinet of closed liquid-cooled variable-frequency pumping unit | |
| CN221828903U (en) | Unmanned aerial vehicle shield assembly | |
| CN211702710U (en) | Sealed heat dissipation case |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20210416 |