CN211831667U - Electrical apparatus box and be equipped with its indirect heating equipment - Google Patents
Electrical apparatus box and be equipped with its indirect heating equipment Download PDFInfo
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- CN211831667U CN211831667U CN202020771670.4U CN202020771670U CN211831667U CN 211831667 U CN211831667 U CN 211831667U CN 202020771670 U CN202020771670 U CN 202020771670U CN 211831667 U CN211831667 U CN 211831667U
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- heat
- heat conducting
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- conducting member
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- 238000010438 heat treatment Methods 0.000 title abstract description 6
- 230000017525 heat dissipation Effects 0.000 claims abstract description 40
- 230000001681 protective effect Effects 0.000 claims 3
- 239000004020 conductor Substances 0.000 description 5
- 238000004378 air conditioning Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
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Abstract
The utility model relates to an electrical apparatus box and be equipped with its indirect heating equipment, electrical apparatus box includes: the main box body is provided with an accommodating cavity for accommodating electronic components; the heat conduction structure is arranged in the accommodating cavity, one end of the heat conduction structure is used for being in surface contact with the electronic component, the other end of the heat conduction structure is in surface contact with the cavity wall of the accommodating cavity, and the heat conduction coefficient of the heat conduction structure is higher than that of air; and the heat dissipation structure is arranged on the outer side of the cavity wall of the accommodating cavity in contact with the heat conduction structure. Above-mentioned electrical apparatus box utilizes the heat conduction structure with electronic components face contact to carry out high-efficient heat dissipation to electronic components to when making electrical apparatus box can be totally sealed, avoid the heat dissipation untimely lead to electronic components because of the high temperature burns out.
Description
Technical Field
The utility model relates to a indirect heating equipment technical field especially relates to an electrical apparatus box and be equipped with its indirect heating equipment.
Background
With the improvement of social progress and the improvement of scientific and technical level, the application occasions of the air conditioner capable of adjusting the indoor environment temperature are more and more extensive, and the comfort level of production and life of people is greatly improved. For the air-conditioning electrical box provided with various electronic components, the working environment is more complex, and the open electrical box is not enough to meet the protection requirement on the electronic components, so that the closed electrical box is more and more widely applied. The electronic components are sealed in the closed electrical appliance box, so that damage can be avoided, and the service life of the electronic components is prolonged.
However, the enclosed electrical box has poor heat dissipation effect and large heat generation amount of electronic components, so that the enclosed electrical box is easy to rapidly heat up, and if the temperature of the enclosed electrical box is not lowered in time, the electronic components are easy to be burnt, and the use of air conditioning equipment is further influenced.
SUMMERY OF THE UTILITY MODEL
Therefore, it is necessary to provide a closed electrical box with a good heat dissipation effect and a heat exchange device with the same for solving the problem of poor heat dissipation effect of the closed electrical box.
An electrical enclosure for housing electronic components, the electrical enclosure comprising:
the main box body is provided with an accommodating cavity for accommodating the electronic component;
the heat conduction structure is arranged in the accommodating cavity, one end of the heat conduction structure is used for being in surface contact with the electronic component, the other end of the heat conduction structure is in surface contact with the cavity wall of the accommodating cavity, and the heat conduction coefficient of the heat conduction structure is higher than that of air; and
and the heat dissipation structure is arranged on the outer side of the cavity wall of the accommodating cavity, which is in contact with the heat conduction structure.
Above-mentioned electrical apparatus box utilizes the heat conduction structure with electronic components face contact to carry out high-efficient heat dissipation to electronic components to when making electrical apparatus box can be totally sealed, avoid the heat dissipation untimely lead to electronic components because of the high temperature burns out.
In one embodiment, the heat conducting structure includes a first heat conducting member, the first heat conducting member includes a first heat conducting portion, a side surface of the first heat conducting portion facing the electronic component is provided with a first heat conducting groove having a bottom wall, the first heat conducting groove is used for accommodating the electronic component, and the bottom wall of the first heat conducting groove can be in surface contact with the electronic component.
In one embodiment, the heat conducting structure further includes a second heat conducting member, the second heat conducting member is disposed on a side of the first heat conducting member facing the electronic component, the second heat conducting member includes a second heat conducting member main body and a heat conducting filling portion, the second heat conducting member main body is provided with a second heat conducting groove in a penetrating manner, the second heat conducting groove is used for accommodating the electronic component, and the heat conducting filling portion is formed by solidifying a heat dissipation medium poured into the second heat conducting groove.
In one embodiment, the first heat-conducting member further includes a second heat-conducting portion, and a side surface of the second heat-conducting member facing the second heat-conducting member is in surface contact with the heat-conducting filling portion.
In one embodiment, the second heat conducting member main body is provided with a second avoiding groove in a penetrating manner, and the second avoiding groove allows the electronic component to extend out of the second heat conducting member main body.
In one embodiment, the first heat conducting member further includes a first avoiding portion, the first avoiding portion has a first avoiding groove formed therethrough, and the first avoiding groove allows the electronic component to extend out of the first avoiding portion.
In one embodiment, the heat conducting structure further comprises a third heat conducting member, and the third heat conducting member is formed by solidifying a heat dissipation medium coated on the surface of the electronic component.
In one embodiment, the heat conducting structure further comprises a heat conducting plate, and the heat conducting plate is located on one side of the heat conducting structure away from the electronic component and is in contact with the wall surface of the accommodating cavity.
In one embodiment, the heat dissipation structure comprises fins and a fin protection cover plate, the fin protection cover plate and the outer surface of the main box body are arranged at intervals, and the fins are arranged between the fin protection cover plate and the outer surface of the main box body.
A heat exchange device comprises the electric appliance box.
In one embodiment, the heat exchange device comprises an air exhaust device facing the heat dissipation structure, and the air flow generated by the air exhaust device flows through the heat dissipation structure.
Drawings
Fig. 1 is a schematic structural view of an electrical box and an air exhaust device according to an embodiment of the present invention;
FIG. 2 is an exploded view of the appliance cartridge of FIG. 1;
fig. 3 is a schematic structural view of an electrical box and an air exhaust device according to another embodiment of the present invention;
fig. 4 is a schematic structural view of a first heat-conducting member according to an embodiment of the present invention;
fig. 5 is a schematic structural view of a second heat-conducting member according to an embodiment of the present invention;
FIG. 6 is a schematic view of the second thermally conductive member of FIG. 5 mounted;
fig. 7 is a schematic view illustrating an installation of a third heat-conducting member according to an embodiment of the present invention.
Description of reference numerals:
100. an electrical box; 20. a main box body; 21. the bottom wall of the box body; 23. the side wall of the box body; 25. the top wall of the box body; 40. a heat conducting structure; 41. a first heat-conducting member; 412. a first heat-conducting portion; 414. a second heat conduction portion; 416. a first avoidance portion; 4161. a first avoidance slot; 43. a second heat-conducting member; 432. a second heat-conducting member main body; 4321. a second heat conduction groove; 4323. a second avoidance slot; 45. a third heat-conducting member; 47. a heat conducting plate; 60. a heat dissipating structure 60; 61. a fin; 63. a fin guard plate; 70. a circuit board; 80. an electronic component; 200. and an air exhaust device.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1 and fig. 2, a heat exchanging apparatus (not shown) according to an embodiment of the present invention includes an electrical box 100 for accommodating an electronic component 80. The structure of the electrical box 100 in the present application will be described below by taking a heat exchanger as an air conditioning system as an example. The present embodiment is described as an example, and the technical scope of the present application is not limited thereto. It is understood that in other embodiments, the heat exchanging device may also be embodied as other devices installed with the electrical box 100, and is not limited herein.
The electrical box 100 is disposed on one side of the air exhaust device 200 of the heat exchange device, and includes a main box body 20, a heat conduction structure 40 and a heat dissipation structure 60, wherein the electronic component 80 is accommodated in the main box body 20, and heat generated by the electronic component 80 is transferred to the heat dissipation structure 60 through the heat conduction structure 40. The air flow brought by the side negative pressure of the air conditioning system and the air flow brought by the forced air exhaust of the air exhaust device 200 are utilized, so that the heat of the electric appliance box 100 can be quickly taken away, and the overheating of the electric appliance box 100 is avoided. The specific structure of the air exhaust device 200 is not limited, and in one embodiment, the air exhaust device 200 includes three fans arranged longitudinally.
In other embodiments, as shown in fig. 3, the electrical box 100 has two main cases 20, the two main cases 20 share one heat dissipation structure 60, the two main cases 20 are stacked, and one heat dissipation structure 60 is located between the two main cases 20, so as to dissipate heat from the two main cases 20 at the same time. The air exhausting device 200 is located at the same side of the two main cases 20 and faces the side of the heat dissipating structure 60 to rapidly take away the heat of the electrical box 100.
Referring to fig. 1 and fig. 2 again, the main box 20 is substantially a cubic shell structure, and includes a box bottom wall 21, a box side wall 23 extending from the edge of the box bottom wall 21 in the same direction, and a box top wall 25 covering the side of the box side wall 23 away from the box bottom wall 21, wherein the box bottom wall 21, the box side wall 23, and the box top wall 25 together enclose a closable accommodating cavity for accommodating the electronic component 80. The electronic component 80 is mounted on the circuit board 70, and the circuit board 70 is fixed to the case bottom wall 21. In this way, the electronic component 80 is completely accommodated in the accommodating cavity of the main case 20.
Further in some embodiments, the main case 20 is formed at least partially of a semiconductor material, thereby having a high thermal conductivity, further increasing the heat dissipation speed of the electrical box 100. It is understood that the material forming the main case 20 is not limited thereto, and may be provided according to various needs, for example, a metal material having a good thermal conductive property.
The heat conduction structure 40 is arranged in the accommodating cavity of the main box body 20, one end of the heat conduction structure 40 is in surface contact with the electronic component 80, the other end of the heat conduction structure 40 is in surface contact with the cavity wall of the accommodating cavity, and the heat conduction coefficient of the heat conduction structure 40 is higher than that of air.
In this manner, while the receiving cavity may be closed to reduce noise, heat generated from the electronic component 80 may be transferred to the main case 20 through the heat conductive structure 40. Since the thermal conductivity of the thermal conductive structure 40 is greater than that of air, the cooling rate of the electronic component 80 can be increased. In addition, since the heat conducting structure 40 is in surface contact with the electronic component 80, a large heat transfer area is provided, and the heat transfer rate is further increased.
Specifically, the heat conducting structure 40 includes the first heat conducting member 41, the second heat conducting member 43, the third heat conducting member 45 and the heat conducting plate 47 that are different in shape, the first heat conducting member 41, the second heat conducting member 43 and the third heat conducting member 45 can be matched with the electronic components 80 of different shapes and different distribution modes, the heat of the electronic components 80 is transferred to the heat conducting plate 47, and then the heat is transferred from the heat conducting plate 47 to the cavity wall of the accommodating cavity, so that the electronic components 80 in the main box body 20 are all effectively cooled.
As shown in fig. 2 and 4, the first heat conducting member 41 is used for dissipating heat from an electronic component 80 having a large structural span and a large curvature radius (for example, the diameter of a large choke is usually larger than 50mm, and the distance between two large chokes is larger than 12mm) such as a large choke.
Specifically, the first heat-conducting member 41 includes a first heat-conducting portion 412, a second heat-conducting portion 414, and a first escape portion 416 that are connected to each other. The first heat conducting portion 412 has a first heat conducting groove 4121 with a bottom wall formed on a side surface facing the electronic component 80, and the shape of the first heat conducting groove 4121 matches the shape of the corresponding electronic component 80. The second heat conduction portion 414 is disposed on one side of the first heat conduction portion 412, and one side surface of the second heat conduction portion 414 is in surface contact with the second heat conduction member 43, so as to transfer heat of the second heat conduction member 43 to the wall of the accommodating chamber. The first avoiding portion 416 is provided with a first avoiding groove 4323 communicating the two opposite surfaces in a penetrating manner, and the first avoiding groove 4323 allows the electronic component 80 to extend out of the first avoiding portion 416 to contact other structures for heat dissipation.
Thus, the electronic components 80 having a large structural span and a large curvature radius, such as a large choke coil, can be at least partially accommodated in the first heat conduction groove 4121 and brought into contact with the groove wall surface of the first heat conduction groove 4121, and heat generated by these electronic components 80 can be efficiently transferred to the first heat conduction portion 412 and further transferred to the heat conduction plate 47 through the first heat conduction portion 412. The electronic components 80 having other shapes near the electronic components 80 such as the large choke coil may contact the second heat-conducting member 43 to transfer heat to the first heat-conducting member 41 through the second heat-conducting member 43, or may extend out of the first heat-conducting member 41 through the first escape portion 416 to directly contact the heat-conducting plate 47.
As shown in fig. 2, 5, and 6, the second heat conductor 43 is provided on the side of the first heat conductor 41 facing the electronic component 80, and the second heat conductor 43 is used for radiating heat from a small heat element such as a rectifier chip or a resistor, and the electronic component 80 has a small volume (smaller than a large choke coil), a wide distribution, and a large height difference (greater than 10mm) from other electronic components 80, and therefore is difficult to match with the first heat conductor 41.
The second heat conducting member 43 includes a second heat conducting member main body 432 and a heat conducting filling portion, the second heat conducting member main body 432 penetrates through a second heat conducting groove 4321 formed in two opposite surfaces of the second heat conducting member main body 432, the second heat conducting groove 4321 is used for accommodating the electronic component 80, and the heat conducting filling portion is formed by solidifying a heat dissipation medium poured into the second heat conducting groove 4321.
Thus, the electronic component 80 can be accommodated in the second heat conduction groove 4321 and completely covered by the heat conduction filling portion, so that the electronic component 80 and the heat conduction filling portion have a larger contact area, and heat generated by the electronic component 80 can be efficiently transferred to the heat conduction filling portion. The second heat conducting portion 414 of the first heat conducting member 41 faces one side surface of the second heat conducting member 43 to contact the heat conducting filling portion, and heat generated by the electronic component 80 is rapidly transferred to the second heat conducting portion 414 through the heat conducting filling portion, and then transferred to the cavity wall of the accommodating cavity. Therefore, the height difference between the electronic component 80 having a small size such as a rectifying chip and a resistor and the other electronic components 80 is eliminated to a certain extent by filling the heat conductive filling portion, so that the electronic components 80 can dissipate heat quickly.
Further, the second heat conducting member main body 432 is provided with a second avoiding groove 4323 communicating the two opposite surfaces in a penetrating manner, and the second avoiding groove 4323 is disposed corresponding to the first avoiding groove 4161 of the first heat conducting member 41, so as to allow the electronic component 80 to sequentially extend out of the second heat conducting member main body 432 and the first heat conducting member 41 to directly contact the heat conducting plate 47 or extend into the first heat conducting groove 4121 of the first heat conducting member 41. It is understood that the electronic component 80 extending out of the second heat-conducting member main body 432 to be in direct contact with the heat-conducting plate 47 may be a regular device such as a capacitor having a flat surface that can be in surface contact with the heat-conducting plate 47, thereby eliminating the need to transfer heat through the first heat-conducting member 41 or the second heat-conducting member 43.
As shown in fig. 2 and 7, the third heat conducting material 45 is used for dissipating heat from an electronic component 80 such as a small choke coil having a special-shaped structure, a small volume, and a small radius of curvature. Specifically, the third heat conducting member 45 is formed by solidifying a heat dissipating medium coated on the surface of the electronic component 80, and the solidified third heat conducting member 45 is in surface contact with the electronic component 80, so that heat generated by the electronic component 80 can be quickly transferred.
In the above embodiment, the heat dissipation medium may be a heat dissipation gel or other heat dissipation materials with good fluidity, and the heat dissipation medium is easily solidified when exposed to a room temperature environment, so as to form a fixed shape to contact with the heat conduction plate to transfer heat generated by the electronic component 80.
The heat conducting plate 47 is located on the side of the heat conducting structure 40 away from the electronic component 80, and the shape of the heat conducting plate 47 is the same as that of the circuit board 70 provided with the electronic component 80. One side surface of the heat conduction plate 47 is in contact with the first heat conduction portion 412 of the first heat conduction member 41 and the electronic component 80 passing through the first heat conduction member 41 and the second heat conduction member 43, and the other side surface of the heat conduction plate 47 is in contact with the wall surface of the accommodating chamber, so that heat of the above structure is transferred to the wall of the accommodating chamber. In one embodiment, the heat conducting plate 47 is made of a semiconductor material, so that the heat conducting plate has good heat conducting performance and effectively improves heat conducting efficiency.
The heat dissipation structure 60 is disposed outside the cavity wall of the receiving cavity contacting the heat conduction structure 40, and is used to increase the heat dissipation area of the main case 20. Specifically, the heat dissipation structure 60 includes fins 61 and a fin protection cover 63, the fin protection cover 63 is spaced apart from the outer surface of the main case 20, and the plurality of fins 61 are mounted between the fin protection cover 63 and the outer surface of the main case 20. Because the arrangement of the fins 61 greatly increases the heat dissipation area, the heat dissipation structure 60 has good heat dissipation efficiency, and can quickly dissipate the heat of the top wall 25 of the box body into the air, thereby effectively avoiding the occurrence of an over-high temperature in the electrical box 100. Specifically, in some embodiments, the heat dissipating structure 60 is integrally provided with the case top wall 25 of the main case 20.
Thus, the air exhausting device 200 faces the heat dissipating structure 60, and the air flow generated by the air exhausting device 200 flows through the heat dissipating structure 60. Therefore, the heat on the heat dissipation structure 60 can be rapidly taken away through the air flow generated by the internal and external negative pressure and the exhaust device, so that the heat dissipation effect of the heat dissipation structure 60 is improved.
Above-mentioned electrical apparatus box 100 and be equipped with its indirect heating equipment utilizes heat conduction structure 40 can carry out the high-efficient heat dissipation of pertinence to the electronic components 80 of different types, different shapes to when making electrical apparatus box 100 can be totally sealed, avoid the heat dissipation untimely lead to electronic components 80 because of the high temperature burns out.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (11)
1. An electrical box for housing electronic components (80), the electrical box comprising:
the main box body (20) is provided with an accommodating cavity for accommodating the electronic component (80);
the heat conduction structure (40) is arranged in the accommodating cavity, one end of the heat conduction structure (40) is used for being in surface contact with the electronic component (80), the other end of the heat conduction structure (40) is in surface contact with the cavity wall of the accommodating cavity, and the heat conduction coefficient of the heat conduction structure (40) is higher than that of air; and
and the heat dissipation structure (60) is arranged on the outer side of the cavity wall of the accommodating cavity contacting with the heat conduction structure (40).
2. The electrical box according to claim 1, wherein the heat conducting structure (40) comprises a first heat conducting member (41), the first heat conducting member (41) comprises a first heat conducting portion (412), a side surface of the first heat conducting portion (412) facing the electronic component (80) is provided with a first heat conducting groove (4121) having a bottom wall, the first heat conducting groove (4121) is used for accommodating the electronic component (80), and the bottom wall of the first heat conducting groove (4121) can be in surface contact with the electronic component (80).
3. The electrical box according to claim 2, wherein the heat conducting structure (40) further comprises a second heat conducting member (43), the second heat conducting member (43) is disposed on a side of the first heat conducting member (41) facing the electronic component (80), the second heat conducting member (43) comprises a second heat conducting member main body (432) and a heat conducting filling portion, the second heat conducting member main body (432) has a second heat conducting groove (4321) formed therethrough, the second heat conducting groove (4321) is configured to accommodate the electronic component (80), and the heat conducting filling portion is formed by solidifying a heat dissipating medium filled in the second heat conducting groove (4321).
4. The electrical box according to claim 3, characterized in that the first heat-conducting member (41) further comprises a second heat-conducting portion (414), the second heat-conducting portion (414) being in surface contact with the heat-conducting filling portion towards a side surface of the second heat-conducting member (43).
5. The electrical box according to claim 3, wherein a second avoiding groove (4323) is formed through the second heat conducting member main body (432), and the second avoiding groove (4323) allows the electronic component (80) to extend out of the second heat conducting member main body (432).
6. The electrical box according to claim 2, wherein the first heat conducting member (41) further comprises a first avoiding portion (416), the first avoiding portion (416) has a first avoiding groove (4161) formed therethrough, and the first avoiding groove (4161) allows the electronic component (80) to extend out of the first avoiding portion (416).
7. The electrical box according to claim 1, characterized in that the heat conducting structure (40) further comprises a third heat conducting member (45), wherein the third heat conducting member (45) is formed by solidifying a heat dissipation medium coated on the surface of the electronic component (80).
8. The electrical box according to claim 1, characterized in that the heat-conducting structure (40) further comprises a heat-conducting plate (47), the heat-conducting plate (47) being located on a side of the heat-conducting structure (40) remote from the electronic component (80) and being in contact with a wall surface of the containing cavity.
9. The electrical box according to claim 1, wherein the heat dissipating structure (60) comprises fins (61) and a fin protective cover (63), the fin protective cover (63) is spaced apart from the outer surface of the main box (20), and a plurality of the fins (61) are mounted between the fin protective cover (63) and the outer surface of the main box (20).
10. A heat exchange device comprising an appliance casing as claimed in any one of claims 1 to 9.
11. A heat exchange device according to claim 10, characterised in that the heat exchange device comprises air exhaust means (200), the air exhaust means (200) facing the heat dissipation structure (60), the air flow generated by the air exhaust means (200) flowing through the heat dissipation structure (60).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020771670.4U CN211831667U (en) | 2020-05-11 | 2020-05-11 | Electrical apparatus box and be equipped with its indirect heating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020771670.4U CN211831667U (en) | 2020-05-11 | 2020-05-11 | Electrical apparatus box and be equipped with its indirect heating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211831667U true CN211831667U (en) | 2020-10-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020771670.4U Active CN211831667U (en) | 2020-05-11 | 2020-05-11 | Electrical apparatus box and be equipped with its indirect heating equipment |
Country Status (1)
| Country | Link |
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| CN (1) | CN211831667U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111479450A (en) * | 2020-05-11 | 2020-07-31 | 珠海格力电器股份有限公司 | Electrical box and heat exchange equipment provided therewith |
| CN118935798A (en) * | 2023-05-09 | 2024-11-12 | 广东美的暖通设备有限公司 | HVAC equipment |
-
2020
- 2020-05-11 CN CN202020771670.4U patent/CN211831667U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111479450A (en) * | 2020-05-11 | 2020-07-31 | 珠海格力电器股份有限公司 | Electrical box and heat exchange equipment provided therewith |
| CN111479450B (en) * | 2020-05-11 | 2025-01-24 | 珠海格力电器股份有限公司 | Electrical box and heat exchange equipment equipped therewith |
| CN118935798A (en) * | 2023-05-09 | 2024-11-12 | 广东美的暖通设备有限公司 | HVAC equipment |
| WO2024230537A1 (en) * | 2023-05-09 | 2024-11-14 | 广东美的暖通设备有限公司 | Heating and ventilating apparatus |
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