CN107658729A - A kind of cooling system for sealed power distribution cabinet - Google Patents
A kind of cooling system for sealed power distribution cabinet Download PDFInfo
- Publication number
- CN107658729A CN107658729A CN201711093970.0A CN201711093970A CN107658729A CN 107658729 A CN107658729 A CN 107658729A CN 201711093970 A CN201711093970 A CN 201711093970A CN 107658729 A CN107658729 A CN 107658729A
- Authority
- CN
- China
- Prior art keywords
- rack
- axial flow
- flow blower
- radiator
- fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/26—Casings; Parts thereof or accessories therefor
- H02B1/30—Cabinet-type casings; Parts thereof or accessories therefor
- H02B1/301—Cabinet-type casings; Parts thereof or accessories therefor mainly consisting of a frame onto which plates are mounted
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/26—Casings; Parts thereof or accessories therefor
- H02B1/28—Casings; Parts thereof or accessories therefor dustproof, splashproof, drip-proof, waterproof or flameproof
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/56—Cooling; Ventilation
- H02B1/565—Cooling; Ventilation for cabinets
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention provides a kind of good airproof performance, the high cooling system for sealed power distribution cabinet of radiating efficiency.Wherein, in radiator for semiconductor, one end of fin sets heat absorbing end, and radiating end is close to heat absorbing end installation, fin is installed on radiating end, and the fin other end installs axial flow blower, and the overall dimensions of axial flow blower are equal with the overall dimensions of fin；Interior of equipment cabinet is hollow, and rack is integrally airtight；Interior of equipment cabinet installs rack supporting plate, and rack pallets level is set, and enclosure interior is divided into multilayer by rack supporting plate；Through hole is opened up at the left side plate of each sheaf space, radiator for semiconductor is symmetrically mounted in above-mentioned through hole；The heat absorbing end and radiating end of radiator for semiconductor go deep into interior of equipment cabinet, and the fin of radiator for semiconductor passes through the through hole of Side plate of machine cabinet, and the axial flow blower of radiator for semiconductor is in the outside of rack；Rack axial flow blower is installed, the rack axial flow blower is located in rack centre position on the top plate of above-mentioned interior of equipment cabinet.
Description
Technical field
The present invention relates to power distribution cabinet, is applied particularly to the radiating of sealed power distribution cabinet.
Background technology
In high-low voltage electric power distribution cabinet field, due to being mounted with substantial amounts of connector and various electronic components in power distribution cabinet,
And there is the presence of substantial amounts of wire, cause the total resistance value of power distribution cabinet very high, therefore directly result in high-low voltage electric power distribution cabinet in work
When work, i.e., substantial amounts of heat can be distributed in case an electrically conductive, the temperature in power distribution cabinet is improved suddenly, and because distribution
The dust-proof requirement of electronic component and connector to power distribution cabinet inside cabinet is very high, therefore power distribution cabinet is all using sealed, reduction
Dust enters in power distribution cabinet, the discharge power distribution cabinet that can thus make the caused heat in high-low voltage electric power distribution cabinet be difficult, nowadays
Conventional heat dissipating method is to install powerful axial flow blower additional again in rack, and opens up heat emission hole, makes what axial flow blower was blown out
Wind forms air-cooled circulation, and the heat inside high-low voltage electric power distribution cabinet is quickly blown out into body, reaches the effect of radiating.
But this radiating mode is used, shortcoming is obvious：First destroys the sealing of high-low voltage electric power distribution cabinet, makes dust
The dust of dirt, also static electrification is entered in power distribution cabinet by blower fan and heat emission hole, and the circulation through blower fan is attached to various electronics members
On device, connector or wire, the insulating properties of power distribution cabinet is directly affects, or even leads to short circuit and causes the accident；Second lacks
Point is that radiating rate is slow, because in general high voltage power distributing cabinet body is bigger, in order to maintain the sealing of rack as far as possible, installation
Axial flow blower quantity is few, and the radiating bore open of cutting is small, therefore air-cooled circulation is by interior of equipment cabinet electronic component, various pallets
Baffle plate blocks, and leads to form many air-cooled dead angles, can not radiate, therefore radiating effect is very poor.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of good airproof performance, radiating efficiency it is high be used for sealed distribution
The cooling system of cabinet.
The technical solution adopted for the present invention to solve the technical problems is：A kind of radiating system for sealed power distribution cabinet
System, including radiator for semiconductor, rack supporting plate, rack, rack axial flow blower, Door of communication apparatus cabinet, release end of heat, heat absorbing end, fin,
Axial flow blower.
In the radiator for semiconductor, one end of fin sets heat absorbing end, and radiating end is close to heat absorbing end installation, heat absorbing end
Heat-conducting silicone grease is smeared between radiating end, fin is installed on radiating end, heat-conducting silicone grease is also smeared between radiating end and fin,
The fin other end installs axial flow blower, and the motor of axial flow blower is arranged on the middle of axial flow blower, the entirety of axial flow blower
Size is equal with the overall dimensions of fin.
The rack is the cabinet of power distribution cabinet, and inner hollow, provided with Door of communication apparatus cabinet, the opening and closing place of Door of communication apparatus cabinet and rack is pacified
Fill sealing joint strip；Rack is integrally airtight；Interior of equipment cabinet installs rack supporting plate, and rack pallets level is set, and rack supporting plate is by machine
Cabinet inner space is divided into multilayer.
Through hole is opened up at the left side plate of above-mentioned each sheaf space, radiator for semiconductor is symmetrically mounted in above-mentioned through hole；
The heat absorbing end and radiating end of radiator for semiconductor go deep into interior of equipment cabinet, fin the leading to through Side plate of machine cabinet of radiator for semiconductor
Hole, the axial flow blower of radiator for semiconductor are in the outside of rack.
Rack axial flow blower is installed, the rack axial flow blower is located in rack interposition on the top plate of above-mentioned interior of equipment cabinet
Put, play a part of allowing air circulation in rack.
It is further：Two horizontal rack supporting plates are set in above-mentioned rack, rack is divided into three layers.
It is further：Three groups of radiator for semiconductor are symmetrically installed in above-mentioned rack on each layer of side plate.
Moreover：The number of above-mentioned rack axial flow blower is two.
The beneficial effects of the invention are as follows：
The present invention is used for the cooling system of sealed power distribution cabinet, because the radiator for semiconductor used is overall structure, Ke Yizhi
Connect and be deep into interior of equipment cabinet, after radiator for semiconductor surrounding smears fluid sealant, the good airproof performance of whole system；This structure dissipates
Hot arrangement is reasonable, and radiating efficiency is high.
Brief description of the drawings
Fig. 1 is the schematic front view of the present invention.
Fig. 2 is the left view schematic diagram of the present invention.
Fig. 3 is the structural representation of radiator for semiconductor.
Description of reference numerals:
1- radiator for semiconductor, 2- rack supporting plates, 3- racks, 4- rack axial flow blowers, 5- Door of communication apparatus cabinet, 6- release end of heat, 7- inhale
Hot junction, 8- fin, 9- axial flow blowers.
Embodiment
Below in conjunction with the accompanying drawings and embodiment describes the specific embodiment of the invention：
The structure that Fig. 1,2 show one embodiment of the invention, as illustrated, the present invention includes radiator for semiconductor 1, rack supporting plate
2nd, rack 3, rack axial flow blower 4, Door of communication apparatus cabinet 5, release end of heat 6, heat absorbing end 7, fin 8, axial flow blower 9；The present invention uses
Semiconductor cooler 1 carries out heat absorption and transmits radiating, and the heat absorbing end 7 of radiator for semiconductor 1 absorbs the heat in rack 3,
The release end of heat 6 of radiator for semiconductor 1 discharges heat to the high-performance fin 8 being installed on it, and is blown by axial flow blower 9
Fin accelerates radiating.
The structure of above-mentioned radiator for semiconductor 1 is as shown in figure 3, one end setting heat absorbing end 7 of fin 8, radiating end 6 are tight
Patch heat absorbing end 7 is installed, and heat-conducting silicone grease is smeared between heat absorbing end 7 and radiating end 6, fin 8, the He of radiating end 6 are installed on radiating end 6
Also heat-conducting silicone grease, the other end of fin 8 installation axial flow blower 9 are smeared between fin 8, the motor of axial flow blower 9 is arranged on axle
The middle of flow fan 9, the overall dimensions of axial flow blower 9 are equal with the overall dimensions of fin 8.
Rack 3 is the cabinet of power distribution cabinet, and inner hollow, provided with Door of communication apparatus cabinet 5, the opening and closing place of Door of communication apparatus cabinet 5 and rack 3 is pacified
Fill sealing joint strip.Rack 3 is overall airtight.The inside of rack 3 installation rack supporting plate 2, rack supporting plate 2 is horizontally disposed, rack supporting plate 2
The inner space of rack 3 is divided into multilayer.
Through hole is opened up at the side plate of the left and right sides rack 3 of each sheaf space, above-mentioned radiator for semiconductor 1 is symmetrically installed
In above-mentioned through hole.The heat absorbing end 7 and radiating end 6 of radiator for semiconductor 1 are goed deep into inside rack 3, the radiating of radiator for semiconductor
Piece 8 passes through the through hole of the side plate of rack 3, and the axial flow blower 9 of radiator for semiconductor is in the outside of rack 3.
Rack axial flow blower 4 is installed, the rack axial flow blower 4 is located in rack 3 on the top plate inside above-mentioned rack 3
Between position, play a part of allowing air circulation in rack 3.
Two horizontal rack supporting plates 2 are set in above-mentioned rack 3, rack 3 is divided into three layers.
Further, three groups of radiator for semiconductor 1 are symmetrically installed in rack 3 on each layer of side plate.
The preferred embodiment for the present invention is explained in detail above in conjunction with accompanying drawing, but the invention is not restricted to above-mentioned implementation
Mode, can also be on the premise of present inventive concept not be departed from those of ordinary skill in the art's possessed knowledge
Make a variety of changes.
Many other changes and remodeling can be made by not departing from the spirit and scope of the present invention.It should be appreciated that the present invention is not
It is limited to specific embodiment, the scope of the present invention is defined by the following claims.
Claims (4)
- A kind of 1. cooling system for sealed power distribution cabinet, it is characterised in that：Including radiator for semiconductor（1）, rack supporting plate （2）, rack（3）, rack axial flow blower（4）, Door of communication apparatus cabinet（5）, release end of heat（6）, heat absorbing end（7）, fin（8）, axle stream wind Machine（9）；The radiator for semiconductor（1）In, fin（8）One end set heat absorbing end（7）, radiating end（6）It is close to heat absorbing end（7） Installation, heat absorbing end（7）And radiating end（6）Between smear heat-conducting silicone grease, radiating end（6）Upper installation fin（8）, radiating end（6） And fin（8）Between also smear heat-conducting silicone grease, fin（8）The other end installs axial flow blower（9）, axial flow blower（9）Electricity Machine is arranged on axial flow blower（9）Middle, axial flow blower（9）Overall dimensions and fin（8）Overall dimensions it is equal；The rack（3）For the cabinet of power distribution cabinet, inner hollow, provided with Door of communication apparatus cabinet（5）, Door of communication apparatus cabinet（5）With rack（3）'s Opening and closing place is installed by sealing joint strip；Rack（3）It is overall airtight；Rack（3）Inside installation rack supporting plate（2）, rack supporting plate（2）Water It is flat to set, rack supporting plate（2）By rack（3）Inner space is divided into multilayer；Through hole, radiator for semiconductor are opened up at the left side plate of above-mentioned each sheaf space（1）It is symmetrically mounted in above-mentioned through hole；Half Conductor radiator（1）Heat absorbing end（7）And radiating end（6）Go deep into rack（3）Inside, the fin of radiator for semiconductor（8）Wear Cross rack（3）The through hole of side plate, the axial flow blower of radiator for semiconductor（9）In rack（3）Outside；Above-mentioned rack（3）Rack axial flow blower is installed on internal top plate（4）, the rack axial flow blower（4）It is located in rack （3）Centre position.
- A kind of 2. cooling system for sealed power distribution cabinet as claimed in claim 1, it is characterised in that：Described rack （3）Two horizontal rack supporting plates of interior setting（2）, by rack（3）It is divided into three layers.
- A kind of 3. cooling system for sealed power distribution cabinet as claimed in claim 2, it is characterised in that：The rack（3） Three groups of radiator for semiconductor are symmetrically installed on interior each layer of side plate（1）.
- 4. any one as described in claim 1-3 is used for the cooling system of sealed power distribution cabinet, it is characterised in that：The machine Cabinet axial flow blower（4）Number be two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711093970.0A CN107658729A (en) | 2017-11-09 | 2017-11-09 | A kind of cooling system for sealed power distribution cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711093970.0A CN107658729A (en) | 2017-11-09 | 2017-11-09 | A kind of cooling system for sealed power distribution cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107658729A true CN107658729A (en) | 2018-02-02 |
Family
ID=61120758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711093970.0A Pending CN107658729A (en) | 2017-11-09 | 2017-11-09 | A kind of cooling system for sealed power distribution cabinet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107658729A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109257911A (en) * | 2018-10-29 | 2019-01-22 | 上海联影医疗科技有限公司 | Heat transporting device, electric and electronic cabinet and heat transmission method |
| CN115315164A (en) * | 2022-09-29 | 2022-11-08 | 杭州蓝海拓凡科技有限公司 | Power rectifier with efficient heat dissipation function |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202353034U (en) * | 2011-11-22 | 2012-07-25 | 陕西同力电气有限公司 | Semiconductor refrigerating and cooling device of sealing type power distribution cabinet |
| CN202434923U (en) * | 2011-11-21 | 2012-09-12 | 陕西同力电气有限公司 | High-voltage sealed power distribution cabinet with heat radiation function |
| CN103855628A (en) * | 2012-11-29 | 2014-06-11 | 西安上尚机电有限公司 | Semiconductor-based power distribution cabinet heat dissipation system |
-
2017
- 2017-11-09 CN CN201711093970.0A patent/CN107658729A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202434923U (en) * | 2011-11-21 | 2012-09-12 | 陕西同力电气有限公司 | High-voltage sealed power distribution cabinet with heat radiation function |
| CN202353034U (en) * | 2011-11-22 | 2012-07-25 | 陕西同力电气有限公司 | Semiconductor refrigerating and cooling device of sealing type power distribution cabinet |
| CN103855628A (en) * | 2012-11-29 | 2014-06-11 | 西安上尚机电有限公司 | Semiconductor-based power distribution cabinet heat dissipation system |
Non-Patent Citations (1)
| Title |
|---|
| 周文英，丁小卫: "《导热高分子材料》", 30 April 2014, 国防工业出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109257911A (en) * | 2018-10-29 | 2019-01-22 | 上海联影医疗科技有限公司 | Heat transporting device, electric and electronic cabinet and heat transmission method |
| CN115315164A (en) * | 2022-09-29 | 2022-11-08 | 杭州蓝海拓凡科技有限公司 | Power rectifier with efficient heat dissipation function |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180202 |