CN217849909U - Heat radiation structure and high-protection driver comprising same - Google Patents
Heat radiation structure and high-protection driver comprising same Download PDFInfo
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- CN217849909U CN217849909U CN202220733927.6U CN202220733927U CN217849909U CN 217849909 U CN217849909 U CN 217849909U CN 202220733927 U CN202220733927 U CN 202220733927U CN 217849909 U CN217849909 U CN 217849909U
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 121
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- 239000003990 capacitor Substances 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000007664 blowing Methods 0.000 description 7
- 238000009434 installation Methods 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model relates to a heat radiation structure and contain high protection driver of this structure, heat radiation structure includes: a face shell; the base is arranged below the face shell and comprises a heat dissipation substrate, a closed cavity formed between one side of the heat dissipation substrate and the face shell, a heat dissipation cavity formed at the other side of the heat dissipation substrate, and an air inlet and an air outlet which are communicated with the heat dissipation cavity; the heat dissipation substrate allows part of electronic elements of the circuit board arranged in the closed cavity to approach or penetrate to the heat dissipation cavity; an airflow channel is formed from the air inlet to the air outlet, the radiating substrate is provided with radiating fins towards the radiating cavity, and the radiating fins are arranged in an extending manner along the airflow channel; the high-protection driver comprises the heat dissipation structure. The utility model discloses a high protection driver can compromise good radiating effect and the dustproof effect of circuit board, and simple structure is compact, can effective reduction in production cost.
Description
Technical Field
The utility model relates to an electrical equipment field especially relates to heat radiation structure and contain high protection driver of this structure.
Background
The motor is an electrical device that converts electrical energy into mechanical energy, and since a driving current or a driving voltage of the motor is large, a general switch or an electronic component cannot be a switch for directly controlling the motor, the switch control of the motor is generally realized by a driver.
The inside circuit board of current driver contains a plurality of electronic component, these electronic component are when carrying out work, can give out a large amount of heats, and in the service environment of high dust, the dust can be piled up and attached to on the circuit board, thereby lead to the unable effectual giving off of heat, seriously influence the life and the performance of driving motor work of driver, consequently in the inside circuit board of protection driver in the in-service use, often the driver can adopt relative sealed and have certain radiating shell, but the radiating effect of driver is still not ideal enough, the operating temperature that can't keep its interior circuit board falls to the scope that is favorable to keeping driver life-span.
SUMMERY OF THE UTILITY MODEL
The utility model provides a heat radiation structure and contain the high protection driver of this structure aims at solving one of the technical problem that exists among the prior art at least.
The technical scheme of the utility model relate to a heat radiation structure, heat radiation structure includes: a face shell; the base is arranged below the face shell and comprises a heat dissipation substrate, a closed cavity formed between one side of the heat dissipation substrate and the face shell, a heat dissipation cavity formed at the other side of the heat dissipation substrate, and an air inlet and an air outlet communicated with the heat dissipation cavity; the heat dissipation substrate allows part of electronic elements of the circuit board arranged in the closed cavity to approach or penetrate to the heat dissipation cavity; wherein, form the air current passageway from the air inlet to the gas outlet, the heat dissipation base plate sets up the fin to the heat dissipation chamber, the fin is arranged along the air current passageway extends.
Further, the heat-dissipating substrate includes: a first plate portion; a second plate portion; and the two ends of the inclined plane part are respectively connected with the first plate part and the second plate part; wherein the distance between the second plate part and the face shell is greater than the distance between the first plate part and the face shell; part of electronic elements of the circuit board penetrate into the heat dissipation cavity at the bottom of the first plate part, the part of electronic elements of the circuit board is close to the heat dissipation cavity at the bottom of the second plate part, and the heat dissipation fins are arranged at the bottom of the second plate part; the air inlet and the air outlet are respectively arranged on two side walls of the base corresponding to the first plate part and the second plate part.
Further, the air inlet is arranged on the side wall of the base, which corresponds to the first plate part and is far away from the second plate part; the air outlet is arranged on the side wall, corresponding to the second plate part and far away from the first plate part, of the base.
Further, the number of the heat radiating fins is plural, the plurality of heat radiating fins are vertically arranged at the bottom of the second plate portion, and the plurality of heat radiating fins are arranged to extend along the airflow passage.
The technical scheme of the utility model still relate to a high protection driver, include heat radiation structure.
Furthermore, a plurality of first mounting columns are respectively arranged at the tops of the first plate part and the second plate part, a plurality of second mounting columns are arranged at the top of the second plate part, the distance between each second mounting column and the face shell is greater than the distance between each first mounting column and the face shell, the circuit board comprises capacitor plates arranged on the first mounting columns and drive plates arranged on the second mounting columns, and the capacitor plates are electrically connected with the drive plates; the part of the electronic elements comprise a plurality of capacitance elements connected to the bottom of the capacitance plate and/or a resistor connected with the driving plate through a first connecting line, wherein the capacitance elements penetrate into the heat dissipation cavity at the bottom of the first plate part, and the resistor penetrates into the heat dissipation cavity at the bottom of the first plate part through the first connecting line.
Further, the bottom of the driving board is connected with an IGBT module, and the bottom of the IGBT module is close to the heat dissipation cavity at the bottom of the second board part through the top of the second board part.
Furthermore, a wire passing hole and a cable threading opening are further formed in the inclined plane portion, a first connecting wire of the resistor penetrates through the wire passing hole and is connected with the drive plate, and the cable of the drive plate penetrates through the cable threading opening and is connected with electrical equipment.
Further, dust covers are arranged between the plurality of capacitor elements and the first plate part; a wire passing sealing ring is arranged between the first connecting wire and the wire passing hole; and a cable dustproof rubber sleeve is arranged between the cable and the cable threading opening.
Further, one side, close to the base, of the bottom of the first plate portion is provided with an installation groove, and the resistor is arranged in the installation groove; the wire passing hole is arranged on the inclined plane part of the mounting groove behind the airflow direction of the airflow channel; the cable threading opening is vertical to the bottom of the face shell.
The beneficial effects of the utility model are as follows.
1. The utility model discloses a heat radiation structure sets up the closed intracavity at heat dissipation base plate top through the electric capacity board with the driver and drive plate, makes the circuit board part of driver sealed completely, improves the dustproof effect of circuit board part, avoids external dust to pile up and adheres to on the circuit board and lead to the unable outer heat that looses of heat, effective increase of service life.
2. The utility model discloses a driver sets up on the surface of electrical equipment or wall body at the heat dissipation during operation, through the ingenious cooperation on heat dissipation base plate and surface, has formed the heat dissipation chamber that has airflow channel in the bottom of driver to set up forced-air-blowing's radiator fan or other blast apparatus through the air inlet in intercommunication heat dissipation chamber on the drain pan, improve the air flow velocity of heat dissipation intracavity airflow channel, thereby simplify heat radiation structure's design and reach the purpose that reduces production material cost.
3. The utility model discloses a heat radiation structure exposes the heat dissipation intracavity in first board bottom like the big electric capacity component of calorific capacity and resistor with part heating electronic component to and the top of the bottom contact second board of the big IGBT module of calorific capacity, thereby realize heating electronic component's quick heat dissipation, avoid the circuit board heat to gather and influence performance.
4. The utility model discloses a heat radiation structure sets the distance that is greater than the first board and the face-piece that the heat dissipation base plate is located the air inlet side through the second board that is located the air outlet side with the distance of face-piece that will dispel the heat the base plate, and the inclined plane portion of first board and second board is connected in the cooperation, realize that heat dissipation chamber airflow channel presents the hourglass hopper-shaped of narrowing gradually along the air current direction, thereby according to the venturi effect, make the air velocity that flows through the second board bottom that is located airflow channel latter half accelerate, and the heat transfer rate is improved, and then the radiating effect of second board bottom fin is improved.
Drawings
Fig. 1 is an exploded schematic view of a high protection driver and a motor surface connection relationship according to an embodiment of the present invention.
Fig. 2 is a longitudinal sectional view of a high protection driver and a motor surface connection relationship according to an embodiment of the present invention.
Fig. 3 is a perspective view of a bottom view of a high protection driver according to an embodiment of the present invention.
Fig. 4 is a perspective view of a top view of a high shield drive with portions of the structure removed, according to an embodiment of the present invention.
Fig. 5 is a front view of a high shield driver according to an embodiment of the present invention.
Fig. 6 is a schematic diagram of a wind direction of an airflow channel of a heat dissipation structure of a high-protection driver according to an embodiment of the present invention.
Description of reference numerals:
100. a base; 110. a heat dissipating substrate; 111. a heat sink; 112. a first plate portion; 113. an inclined plane part; 114. a second plate portion; 115. a first mounting post; 116. a second mounting post; 117. a cable threading opening; 118. connecting columns; 120. A closed cavity; 130. a heat dissipation cavity; 140. a convex edge; 150. an air inlet; 160. an air outlet; 200. a face shell; 300. Mounting a plate; 400. a heat-dissipating fan; 500. a capacitive plate; 510. a capacitive element; 600. a resistor; 700. a drive plate; 710. an IGBT module; 800. a dust-proof sleeve; 910. a socket; 920. a dustproof rubber sleeve of the cable; 930. a wire-passing seal ring; 940. a motor; 950. and (7) mounting the bar.
Detailed Description
The conception, specific structure and technical effects of the present invention will be described clearly and completely with reference to the accompanying drawings and embodiments, so as to fully understand the objects, aspects and effects of the present invention. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it may be directly fixed or connected to the other feature or indirectly fixed or connected to the other feature. Furthermore, the description of the upper, lower, left, right, top, bottom, etc. used in the present invention is only relative to the mutual positional relationship of the components of the present invention in the drawings.
Furthermore, unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any combination of one or more of the associated listed items.
It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element of the same type from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present disclosure.
Referring to fig. 1, fig. 2 and fig. 5, in an embodiment, according to the technical solution of the present invention, including a heat dissipation structure and a high protection driver including the structure, the heat dissipation structure includes: a face shell 200; the base 100 is arranged under the face shell 200, the base 100 comprises a heat dissipation substrate 110, a closed cavity 120 formed between one side of the heat dissipation substrate 110 and the face shell 200, a heat dissipation cavity 130 formed at the other side of the heat dissipation substrate 110, and an air inlet 150 and an air outlet 160 communicated with the heat dissipation cavity 130, the high-protection driver comprising the heat dissipation structure is arranged on the surface of electrical equipment or a wall body during heat dissipation work, and the matching surface of the base 100 forms the heat dissipation cavity 130 which is communicated with the outside only through the air inlet 150 and the air outlet 160 and has better air tightness; the heat dissipation substrate 110 allows a part of the electronic components of the circuit board disposed in the closed cavity 120 to approach or penetrate the heat dissipation cavity 130; an airflow channel is formed from the air inlet 150 to the air outlet 160, the heat dissipation substrate 110 is provided with the heat dissipation fins 111 towards the heat dissipation cavity 130, and the heat dissipation fins 111 are arranged in an extending manner along the airflow channel, so that the airflow blown into the heat dissipation cavity 130 from the air inlet 150 through an external blowing device takes away the heat of the electronic component exposed in the heat dissipation cavity 130 and penetrating through the heat dissipation cavity 130, the heat is prevented from being transferred into the closed cavity 120 through a circuit board, meanwhile, the heat transferred to the heat dissipation substrate 110 from the circuit board in the closed cavity 120 is dissipated through the heat dissipation fins 111 at the bottom of the heat dissipation substrate 110, the closed cavity 120 ensures that the circuit board in the closed cavity is prevented from dust accumulation, and the performances of high heat dissipation and high protection are effectively maintained. Specifically, in order to satisfy the heat conduction efficiency of the base 100 and the face housing 200 in the heat dissipation structure, the base 100 and the face housing 200 are both formed by die casting of ADC12 aluminum. And the top of the sidewall of the base 100 is provided with a convex edge 140, the bottom of the face cover 200 corresponding to the position of the convex edge 140 is provided with a groove matching with the convex edge 140, when the face cover 200 covers the base 100 and is locked by screws, the tight matching of the convex edge 140 and the groove improves the sealing performance of the closed cavity 120, prevents dust from falling onto a circuit board in the closed cavity 120 from a gap between the face cover 200 and the base 100, and maintains stable heat dissipation.
Referring to fig. 2 to 4, the heat dissipation substrate 110 includes: a first plate portion 112; a second plate portion 114; and an inclined surface portion 113 having both ends connected to the first plate portion 112 and the second plate portion 114, respectively; wherein, the distance between the second plate part 114 and the face shell 200 is larger than the distance between the first plate part 112 and the face shell 200; wherein, part of the electronic components of the circuit board penetrate into the heat dissipation cavity 130 at the bottom of the first plate part 112, part of the electronic components of the circuit board are close to the heat dissipation cavity 130 at the bottom of the second plate part 114, and the heat dissipation fins 111 are arranged at the bottom of the second plate part 114; the air inlet 150 and the air outlet 160 are respectively disposed on two sidewalls of the base 100 corresponding to the first plate 112 and the second plate 114. Specifically, the first plate portion 112 and the second plate portion 114 are parallel to the bottom of the panel 200, so as to facilitate the installation of the circuit board, and the first plate portion 112 of the heat dissipation substrate 110 on the side of the air inlet 150 is disposed at a distance from the panel 200 that is greater than the distance from the second plate portion 114 on the side of the air outlet 160 to the panel 200, so that a part of the electronic component with large heat generation amount can penetrate into the heat dissipation cavity 130 in a larger area and be exposed in the airflow channel, thereby increasing the heat dissipation area, increasing the heat dissipation speed of the electronic component, and matching with the inclined surface portion 113 connecting the first plate portion 112 and the second plate portion 114, realizing that the airflow channel of the heat dissipation cavity 130 presents a gradually narrowed funnel shape along the airflow direction, so as to accelerate the airflow speed flowing through the bottom of the second plate portion 114 on the rear half of the airflow channel according to the venturi effect, thereby increasing the heat exchange speed, and further improving the heat dissipation effect of the heat dissipation fins 111 on the bottom of the second plate portion 114.
In the present invention, the positions of the air inlet 150 and the air outlet 160 and the radian of the heat dissipation plate 111 extending along the air flow channel can be adjusted by dislocation according to actual conditions, so as to change the direction of the air flow in the heat dissipation chamber 130, thereby allowing the air flow to stay in the heat dissipation chamber 130 for a longer time, but this will increase the resistance of the air flow passing through the heat dissipation chamber 130, and increase the working pressure of the air blowing device at the air inlet 150, therefore, referring to fig. 2 and 3, the air inlet 150 is disposed on the side wall of the base 100 corresponding to the first plate portion 112 and far away from the second plate portion 114; the air outlet 160 is disposed on the side wall of the base 100 corresponding to the second plate portion 114 and far away from the first plate portion 112, so that the airflow channel direction of the heat dissipation chamber 130 is linearly distributed as shown in fig. 6, and the heat dissipation chamber 130 is smoothly and rapidly passed through by the air flow due to the approximately linear plurality of cooling fins 111 extending along the airflow channel airflow direction, thereby further improving the heat exchange efficiency.
Referring to fig. 2 to 4, a plurality of first mounting posts 115 are respectively disposed on the top of the first plate portion 112 and the second plate portion 114, a plurality of second mounting posts 116 are disposed on the top of the second plate portion 114, the distance between the second mounting posts 116 and the panel housing 200 is greater than the distance between the first mounting posts 115 and the panel housing 200, the circuit board includes a capacitive plate 500 disposed on the plurality of first mounting posts 115 and a driving plate 700 disposed on the plurality of second mounting posts 116, the capacitive plate 500 is electrically connected with the driving plate 700, so that the capacitive plate 500 and the driving plate 700 are mounted in an overlapping manner, the internal vertical space of the enclosed cavity 120 is fully utilized, the requirement for a transverse mounting space is reduced, and the high-protection driver is miniaturized with a compact structure; part of the electronic components includes a plurality of capacitive elements 510 connected to the bottom of capacitive plate 500 and/or a resistor 600 connected to drive plate 700 via a first connecting line, wherein each of the plurality of capacitive elements 510 is inserted into heat dissipation chamber 130 at the bottom of first plate portion 112, and resistor 600 is inserted into heat dissipation chamber 130 at the bottom of first plate portion 112 via the first connecting line. Specifically, the resistor 600 may be a cement resistor. Preferably, the capacitive element 510 and the resistor 600 with a large heat generation amount are exposed in the heat dissipation cavity 130, so that rapid heat dissipation is realized, and the influence of heat accumulation on the capacitive plate 500 and the driving plate 700 on the use performance is avoided. Meanwhile, the bottom of the driving board 700 is connected with the IGBT module 710, the bottom of the IGBT module 710 is close to the heat dissipation cavity 130 at the bottom of the second plate part 114 by contacting the top of the second plate part 114, heat generated by the IGBT module 710 during operation is transferred to the second plate part 114 of the heat dissipation substrate 110 by contact relation, and finally dissipated into air flow rapidly by the heat dissipation fins 111, and the IGBT module 710 disposed in the closed cavity 120 can be kept in a relatively dust-free environment, and can effectively keep its performance.
Referring to fig. 1 to 3, a mounting plate 300 for ventilation is mounted on the air inlet 150 of the base 100 by screws, the bottom of the mounting plate 300 abuts against the surface of the electrical equipment or the wall, two heat dissipation fans 400 for blowing air to the air flow channel are arranged side by side on the air inlet 150 side of the mounting plate 300, and the heat dissipation fans 400 are connected to the driving plate 700 by a second connection line passing through the inclined plane portion 113. Specifically, the heat dissipation fan 400 includes an axial flow fan with a large blowing amount, and can maintain a sufficient air intake amount, thereby further satisfying the requirement of heat dissipation performance.
Referring to fig. 4, in order to facilitate that various lines outside the closed cavity 120 can be connected to the driving board 700 inside the closed cavity 120, a wire passing hole and a cable threading port 117 are further disposed on the inclined surface portion 113, a first connection wire of the resistor 600 and a second connection wire of the heat dissipation fan 400 both pass through the wire passing hole and are connected to the driving board 700, and a cable of the driving board 700 passes through the cable threading port 117 and is connected to an electrical device driven by the driving board 700 (the first connection wire, the second connection wire and the cable are not shown in the drawing). Referring to fig. 3 and 4, in order to further prevent dust from blowing into the closed cavity 120 from the heat dissipation cavity 130 along with the airflow, dust-proof sleeves 800 are disposed between the plurality of capacitor elements 510 and the first plate portion 112, inner sides of the dust-proof sleeves 800 are sleeved on the surfaces of the capacitor elements 510, and outer sides of the dust-proof sleeves 800 are tightly clamped on the first plate portion 112 of the heat dissipation substrate 110 through clamping slots; a wire-passing sealing ring 930 is arranged between the first connecting wire, the second connecting wire and the wire-passing hole; a cable dustproof rubber sleeve 920 is arranged between the cable and the cable threading opening 117, so that the heat dissipation cavity 130 and the closed cavity 120 are completely sealed, and dust is prevented from blowing into the closed cavity 120. And the dust-proof sleeve 800, the wire-passing sealing ring 930 and the dust-proof rubber sleeve are made of fireproof silica gel, and meet the RoHS requirement.
Referring to fig. 3, a mounting groove is formed at a side of the bottom of the first plate portion 112 close to the base 100, the resistor 600 is disposed in the mounting groove, and a portion of the resistor 600 is exposed in the heat dissipation cavity 130, so that the resistor 600 is prevented from blocking an airflow of a heat dissipation flow channel, and the airflow smoothness is improved; the wire through hole is arranged on the inclined surface part 113 of the mounting groove behind the airflow direction of the airflow channel; the cable threading opening 117 is perpendicular to the bottom of the panel shell 200, so that the wire passing hole and the cable threading opening 117 are prevented from being over against the air inlet end of the air flow channel in the heat dissipation cavity 130, thereby reducing the wind pressure borne by the wire passing hole and the cable threading opening 117, reducing the possibility that dust enters the closed cavity 120 from a gap between the cable dustproof rubber sleeve 920 and the wire passing sealing ring 930, being beneficial to the wiring of the first connecting wire, the second connecting wire and the cable, and improving the assembly efficiency during production.
Referring to fig. 2 to 5, the heat dissipation structure further includes: the plurality of sockets 910 are disposed on the side wall of the base 100, the plurality of sockets 910 penetrate into the closed cavity 120, the plurality of sockets 910 are electrically connected to the driving board 700, and the plurality of sockets 910 are all aviation sockets 910, so that power transmission and control between an external upper computer having a power line and a high-protection driver can be rapidly and conveniently achieved.
Referring to fig. 1 to 3, in the practical application of the embodiment of the utility model, electrical equipment is motor 940, heat dissipation base plate 110 is equipped with a plurality of spliced poles 118 that are used for at the motor 940 high protection driver of fixed on the surface in the bottom of second board portion 114, particularly, when the assembly, there is a mounting bar 950 through the screw mounting on the spliced pole 118, this mounting bar 950 can adapt to the multiple motor 940 below the installation 15Kw power, thereby realize on the high protection driver can simply assemble multiple motor 940 conveniently, the suitability is high, and it is simple convenient to install.
The foregoing is merely a preferred embodiment of the present invention, and the present invention is not limited to the above embodiment, as long as the technical effects of the present invention are achieved by the same means, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present disclosure should be included within the scope of the present disclosure. All belong to the protection scope of the utility model. The technical solution and/or the embodiments of the invention may be subject to various modifications and variations within the scope of the invention.
Claims (10)
1. A heat dissipation structure, comprising:
a face shell (200);
the base (100) is arranged below the face shell (200), and the base (100) comprises a heat dissipation substrate (110), a closed cavity (120) formed between one side of the heat dissipation substrate (110) and the face shell (200), a heat dissipation cavity (130) formed on the other side of the heat dissipation substrate (110), and an air inlet (150) and an air outlet (160) communicated with the heat dissipation cavity (130);
wherein the heat dissipation substrate (110) allows a part of electronic components of a circuit board disposed in the closed cavity (120) to approach or pass through to the heat dissipation cavity (130);
wherein an air flow passage is formed from the air inlet (150) to the air outlet (160), the heat dissipation substrate (110) is provided with a heat dissipation fin (111) to the heat dissipation chamber (130), and the heat dissipation fin (111) is arranged to extend along the air flow passage.
2. The heat dissipation structure of claim 1, wherein the heat dissipation substrate (110) comprises:
a first plate section (112);
a second plate portion (114); and
an inclined surface part (113) having both ends connected to the first plate part (112) and the second plate part (114), respectively;
wherein the distance of the second plate portion (114) from the face case (200) is greater than the distance of the first plate portion (112) from the face case (200);
part of electronic components of the circuit board penetrate into the heat dissipation cavity (130) at the bottom of the first plate part (112), the part of electronic components of the circuit board are close to the heat dissipation cavity (130) at the bottom of the second plate part (114), and the heat dissipation fins (111) are arranged at the bottom of the second plate part (114);
the air inlet (150) and the air outlet (160) are respectively arranged on two side walls of the base (100) corresponding to the first plate part (112) and the second plate part (114).
3. The heat dissipation structure according to claim 2,
the air inlet (150) is arranged on the side wall, corresponding to the first plate part (112), of the base (100) and far away from the second plate part (114);
the air outlet (160) is arranged on the side wall of the base (100) corresponding to the second plate part (114) and far away from the first plate part (112).
4. The heat dissipation structure according to claim 2,
the number of the heat radiating fins (111) is plural, and each of the heat radiating fins (111) is disposed perpendicularly to the second plate portion (114) and arranged to extend along the airflow passage.
5. A high-protection driver, characterized by comprising the heat dissipation structure of claim 1.
6. A high-protection driver, characterized by comprising the heat dissipation structure of any one of claims 2 to 4.
7. The high shield driver of claim 6,
the top of the first plate part (112) and the top of the second plate part (114) are respectively provided with a plurality of first mounting columns (115), the top of the second plate part (114) is provided with a plurality of second mounting columns (116), the distance between the second mounting columns (116) and the face shell (200) is greater than the distance between the first mounting columns (115) and the face shell (200), the circuit board comprises capacitor plates (500) arranged on the first mounting columns (115) and driving plates (700) arranged on the second mounting columns (116), and the capacitor plates (500) are electrically connected with the driving plates (700);
the part of the electronic elements comprise a plurality of capacitance elements (510) connected to the bottom of the capacitance plate (500) and/or a resistor (600) connected to the driving plate (700) through a first connecting line, wherein the plurality of capacitance elements (510) are all penetrated into the heat dissipation cavity (130) at the bottom of the first plate part (112), and the resistor (600) is penetrated into the heat dissipation cavity (130) at the bottom of the first plate part (112) through the first connecting line.
8. The high shield driver of claim 7,
the bottom of the driving plate (700) is connected with an IGBT module (710), and the bottom of the IGBT module (710) is close to the heat dissipation cavity (130) at the bottom of the second plate part (114) by contacting the top of the second plate part (114).
9. The high shield driver of claim 7, wherein:
the inclined plane part (113) is further provided with a wire passing hole and a cable threading opening (117), a first connecting wire of the resistor (600) penetrates through the wire passing hole and is connected with the driving plate (700), and a cable of the driving plate (700) penetrates through the cable threading opening (117) and is connected with electrical equipment;
dust covers (800) are arranged between the plurality of capacitor elements (510) and the first plate part (112);
a wire passing sealing ring (930) is arranged between the first connecting wire and the wire passing hole;
and a cable dustproof rubber sleeve (920) is arranged between the cable and the cable threading opening (117).
10. The high shield driver of claim 9,
a mounting groove is formed in one side, close to the base (100), of the bottom of the first plate part (112), and the resistor (600) is arranged in the mounting groove;
the wire passing hole is arranged on an inclined plane part (113) of the mounting groove behind the airflow direction of the airflow channel;
the cable threading opening (117) is vertical to the bottom of the surface shell (200).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220733927.6U CN217849909U (en) | 2022-03-31 | 2022-03-31 | Heat radiation structure and high-protection driver comprising same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220733927.6U CN217849909U (en) | 2022-03-31 | 2022-03-31 | Heat radiation structure and high-protection driver comprising same |
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| CN217849909U true CN217849909U (en) | 2022-11-18 |
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| CN202220733927.6U Active CN217849909U (en) | 2022-03-31 | 2022-03-31 | Heat radiation structure and high-protection driver comprising same |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117528990A (en) * | 2024-01-05 | 2024-02-06 | 深圳市中科云科技开发有限公司 | Heat radiation protection assembly for electronic equipment |
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2022
- 2022-03-31 CN CN202220733927.6U patent/CN217849909U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117528990A (en) * | 2024-01-05 | 2024-02-06 | 深圳市中科云科技开发有限公司 | Heat radiation protection assembly for electronic equipment |
| CN117528990B (en) * | 2024-01-05 | 2024-03-22 | 深圳市中科云科技开发有限公司 | Heat radiation protection assembly for electronic equipment |
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