CN202109282U - Semiconductor high-power LED lamp - Google Patents
Semiconductor high-power LED lamp Download PDFInfo
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- CN202109282U CN202109282U CN2011202351038U CN201120235103U CN202109282U CN 202109282 U CN202109282 U CN 202109282U CN 2011202351038 U CN2011202351038 U CN 2011202351038U CN 201120235103 U CN201120235103 U CN 201120235103U CN 202109282 U CN202109282 U CN 202109282U
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- chilling plate
- led lamp
- semiconductor chilling
- radiator
- temperature
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Abstract
A semiconductor high-power LED lamp mainly solves the junction temperature problem of the high-power LED lamp, and adopts the technical scheme that a cold end of a semiconductor chilling plate is connected with a module base plate of a high-power LED module through a cold end sheet metal; a temperature sensor is arranged on or beside the module base plate and electrically connected with an upper and lower limit temperature control circuit; a temperature control switch electrically connected with the semiconductor chilling plate is electrically connected with the upper and lower limit temperature control circuit; and a power source is connected with the temperature control switch, the upper and lower limit temperature control circuit and the high-power LED module through a power source switch respectively; the module base plate, the cold end sheet metal and a radiator are connected together through a plurality of heat insulation screws; and heat insulation materials are filled at the periphery of the semiconductor chilling plate and between the radiator and the cold end sheet metal. As the lamp adopts the semiconductor chilling plate to actively and enforcedly lower the temperature, the working temperature of the high-power LED module is reduced to lower than 40 DEG, and the luminous efficiency of the high-power LED lamp is improved to a maximum degree.
Description
Technical field
The utility model relates to a kind of LED lamp, particularly relates to a kind of semiconductor refrigerating high-powered LED lamp, belongs to lighting field.
Background technology
LED (Light Emitting Diode) is as a kind of outstanding semiconductor light sources,, advantages such as power consumption low, long service life, environmental protection little with its volume, and being expected to became desirable of new generation solid-state energy-saving illumination light source in following 10 years.Yet LED throws light in the process of high-power development, has received the influence of heat dissipation problem, becomes the main bottleneck that present obstruction great power LED technology popularization is used.Because the characteristics of luminescence of LED has determined its operating temperature and luminous efficiency to be inversely proportional to, the rising of LED junction temperature can make the luminous efficiency of great power LED reduce, and quickens the light decay of LED, the life-span of obviously reducing LED.For the above great power LED module illumination of 50W, the fault more than 70% all is to cause owing to the LED temperature is too high.The experiment proof: if single great power LED module temperature is reduced to below 40 ℃, the corresponding increase of luminous efficiency, also can increase by 1 times service life.
At present, the heat dissipation technology of both at home and abroad great power LED being used adopts following 4 kinds of modes: the fin natural heat dissipation, install fan forced heat radiation, the heat radiation of loop heat pipe technology additional basically.First kind is the fin natural heat dissipation, owing to rely on the structure of self to realize heat radiation fully, transient response is poor, and the heat radiation conduction is slow, makes that the fin area is bigger, and volume and cost increase; Second kind is to install the fan forced heat radiation additional, the limited service life of fan, and general about 3 years, the fan noise that has been in operation, because the requirement of waterproof, this radiating mode can't be used in specific occasions such as outdoor lamp; The third is loop heat pipe technology heat radiation, need charge into heat transfer medium in the pipeline of sealing, and the volume and weight of radiator portion is very big and need be exposed on the lamp outer casing face, influences the light fixture outward appearance, and cost is higher, applies difficulty; The 4th kind is to reduce the great power LED temperature through semiconductor chilling plate.Semiconductor chilling plate; Claim thermoelectric refrigerator again; Basic principle is a peltier effect: the flow through contact place of two different conductors of electric current can produce heat release and heat absorption phenomenon; The size of heat release and heat absorption is by the size decision of operating current, and in normal working conditions, the temperature difference of cold and hot end will remain between 40～65 degree.Theoretical according to semiconductor refrigerating, apply a DC voltage at the semiconductor chilling plate two ends, can make the heating of semiconductor chilling plate one end, other end refrigeration.The end that we claim to generate heat is " hot junction ", and an end of refrigeration be " cold junction ", the cooperation temperature control circuit, cryogenic temperature is accurately controlled, no working medium and moving component, simple in structure, volume is little, noiselessness.
Disclose a kind of led light source with semiconductor heat dissipation device in the one Chinese patent application 200910109212.2, it comprises: led light source and semiconductor chilling plate, the cold junction of described semiconductor chilling plate closely is connected with the led light source back side.The hot junction of semiconductor chilling plate closely is connected with a radiator.During work, the semiconductor chilling plate cold junction absorbs the heat that light source produces and also is transmitted to the hot junction, and the radiator through being attached thereto then is discharged into heat in the surrounding environment and goes, and thus, keeps LED under the temperature environment about 60 degree, to work.But; The problem that this structure exists is: on the one hand because the cold junction of this scheme semiconductor chilling plate is connected the led light source back side and radiator with the hot junction respectively through organic silica gel; Not firm phenomenon often appears combining for high-powered LED lamp; And in a single day the organic silica gel cracking appears, will directly cause product rejection; On the other hand; In the practical set process; Between the led light source back side of high-powered LED lamp and the radiator because metal shell connects or the existence of metal connecting piece; Can occur without " the heat conduction short circuit " of crossing the semiconductor chilling plate effect; And the temperature rise of the radiator that is caused by " heat conduction short circuit " is not to produce the semiconductor chilling plate effect under, that is to say that the forced cooling usefulness of semiconductor chilling plate is not given full play to, and becomes very difficult so further keep LED under lower temperature environment, to work.
The utility model content
In order further to reduce the operating temperature of high-powered LED lamp; The purpose of the utility model provides a kind of semiconductor refrigerating high-powered LED lamp; This lamp is applied to high-power LED lighting system with semiconductor refrigerating technology; Adopt initiatively forced cooling of semiconductor chilling plate, can the operating temperature of great power LED module be reduced to below 40 ℃, improve the great power LED luminous efficiency to greatest extent.
The scheme that its technical problem of the utility model solution is taked is: this semiconductor refrigerating high-powered LED lamp; Comprise led light source and semiconductor chilling plate; The cold junction of described semiconductor chilling plate is connected with the led light source back side, and the hot junction of semiconductor chilling plate is connected with a radiator, it is characterized in that; Described led light source is the great power LED module, and the cold junction of described semiconductor chilling plate is connected with the module group substrates of great power LED module through the cold side metal sheet; On the module group substrates or near temperature sensor of arrangement; This temperature sensor is electrically connected a bound temperature-control circuit; The temperature detect switch (TDS) that is electrically connected with semiconductor chilling plate is electrically connected the bound temperature-control circuit, and power supply connects temperature detect switch (TDS), bound temperature-control circuit and great power LED module respectively through power switch; A plurality of adiabatic screws link together described module group substrates, cold side metal sheet and radiator, the peripheral of semiconductor chilling plate and between radiator and cold side metal sheet filling with insulation material.
Described semiconductor refrigerating high-powered LED lamp, its further scheme are that described cold side metal sheet is the reflective surface of LED lamp.
Described semiconductor refrigerating high-powered LED lamp, its further scheme are that described cold side metal sheet is a parabolic shape.
Described semiconductor refrigerating high-powered LED lamp, its further scheme are that described adiabatic screw is the screw that nonmetal heat-insulating material is processed.
Described semiconductor refrigerating high-powered LED lamp, its further scheme be, between cold side metal sheet and the module group substrates, between semiconductor chilling plate and the cold side metal sheet, be coated with heat-conducting silicone grease between semiconductor chilling plate and the radiator.
Described semiconductor refrigerating high-powered LED lamp, its further scheme are that described radiator is the metal shade of LED lamp.
Described semiconductor refrigerating high-powered LED lamp, its further scheme are that described radiator is the independently radiator structure that passes lampshade.
The good effect of the utility model is:
Because a plurality of adiabatic screws link together described module group substrates, cold side metal sheet and radiator, the peripheral of semiconductor chilling plate and between radiator and cold side metal sheet filling with insulation material.Can prevent that not only high-powered LED lamp from occurring combining not firm phenomenon to take place; And the setting of adiabatic screw and heat-barrier material has also been avoided without " the heat conduction short circuit " of crossing the semiconductor chilling plate effect; The active forced cooling usefulness of semiconductor chilling plate is not fully exerted; LED solved the heat dissipation problem of great power LED module, obtained good actual effect, so can work under lower temperature environment.This technical scheme can be reduced to the operating temperature of great power LED module below 40 ℃ as required, even 0 ℃.This programme semiconductor chilling plate is an electric current transducing type device, through the electric current of control input, can realize high-precision temperature control.The semiconductor chilling plate thermal inertia is very little, and under the good situation of hot-side heat dissipation, cooling time is lacked, can be reached maximum temperature difference soon, reduces the temperature of great power LED module rapidly, has improved the luminous efficiency of high-powered LED lamp to greatest extent; The setting of simultaneous temperature sensor, bound temperature-control circuit, it is interval to make that the great power LED module is operated in predefined optimum temperature, has obviously reduced light decay, has prolonged the service life of high-powered LED lamp greatly.
Than the fin natural heat dissipation that at present both at home and abroad great power LED is used, install fan forced heat radiation, three kinds of radiating modes of loop heat pipe technology heat radiation additional, the present technique scheme simple in structure, volume is little, cost is low.Can obtain significant especially actual benefit for fields such as the high-power LED street lamp illumination of the current demand that is widely used, automobile front illumination, indoor and outdoor high-power illuminations.
Description of drawings:
Fig. 1 is a semiconductor refrigerating high-power LED lamp structure sketch map;
Fig. 2 is a semiconductor refrigerating high-powered LED lamp electrical schematic diagram.
Wherein, 1-cold junction; The 2-hot junction; The 3-radiator; 4, adiabatic screw, 5-great power LED module; The 6-module group substrates; 7-cold side metal sheet; The 8-heat-barrier material; The adiabatic screw of 9-; The 10-semiconductor chilling plate; 11 temperature sensors; 12 bound temperature-control circuits; The E-dc source; The JK-temperature detect switch (TDS); The K-power switch.
The specific embodiment
Like Fig. 1, Fig. 2.The semiconductor refrigerating high-powered LED lamp comprises parts such as great power LED module 5, cold side metal sheet 7, semiconductor chilling plate 10 and radiator 3.
The cold junction of semiconductor chilling plate 10 is connected with the module group substrates 6 of great power LED module 5 through cold side metal sheet 7; On the module group substrates 6 or near temperature sensor 11 of arrangement; This temperature sensor is electrically connected a bound temperature-control circuit 12; The temperature detect switch (TDS) JK that is electrically connected with semiconductor chilling plate is electrically connected bound temperature-control circuit 12, and power supply E connects temperature detect switch (TDS) JK, bound temperature-control circuit 12 and great power LED module 5 respectively through power switch K.A plurality of adiabatic screws 4 link together described module group substrates 6, cold side metal sheet 7 and radiator 3, the peripheral of semiconductor chilling plate and between radiator and cold side metal sheet filling with insulation material 8.
Semiconductor chilling plate 10, the heat that produces when the great power LED module 5 of cold junction 1 absorption is worked is transferred to radiator 3 through hot junction 2, and it is outside to diffuse to the great power LED lamp system.
Near great power LED module group substrates 6, settle a temperature sensor, behind the power switch K of connection dc source E, great power LED module 5 is luminous; Produce heat simultaneously, when temperature reached the temperature of setting, the bound temperature-control circuit was connected temperature detect switch (TDS) JK; The temperature of great power LED module 5 begins to descend, and when dropping to the temperature of setting, the bound temperature-control circuit breaks off temperature detect switch (TDS) JK; It is interval to make great power LED module 5 be operated in predefined optimum temperature, has reached the temperature of real-time reduction and control great power LED module 5, improves the great power LED luminous efficiency to greatest extent; Reduce light decay, the purpose that increases the service life.
Because great power LED module group substrates 6 can be not in full accord with area, the shape of semiconductor chilling plate 10, just needs through the 7 adaptive connections of cold side metal sheet, cold side metal sheet 7 closely contacts with great power LED module group substrates 6; The cold junction 1 of semiconductor chilling plate 10 is pressed on the cold side metal sheet 7, and cold side metal sheet 7 can be the reflective surface of lamp, and shape can be made tubular or parabolic shape; Hot junction 2 closely contacts with radiator 3, and radiator 3 is made of metal, and it can be the metal shade of LED lamp, also can be the independently radiator structure that passes lampshade, the fin that for example is provided with separately.Adiabatic screw 4, adiabatic screw 9 pass the module group substrates 6 of great power LED, and be fastening in the screw-in radiator 3, and adiabatic screw 4 can with 2-8 only can be made by materials such as nylon, pottery, lucite, rigid plastics with adiabatic screw 9; Form the space between radiator 3 and the cold side metal sheet 7, for the heat conduction, the convection current that prevent hot junction 2, be radiated cold junction 1, and then influence system's refrigerating efficiency, be packed into heat-barrier material 8 in this space, as: plastics, resin, polyurathamc etc.Between cold side metal sheet 7 and the great power LED module group substrates 6, between cold junction 1 and the cold side metal sheet 7, between hot junction 2 and the radiator 3, the coating heat-conducting silicone grease reduces hot slippages, improves heat transfer efficiency.
Claims (7)
1. semiconductor refrigerating high-powered LED lamp; Comprise led light source and semiconductor chilling plate; The cold junction of described semiconductor chilling plate is connected with the led light source back side, and the hot junction of semiconductor chilling plate is connected with a radiator, it is characterized in that; Described led light source is the great power LED module, and the cold junction of described semiconductor chilling plate is connected with the module group substrates of great power LED module through the cold side metal sheet; On the module group substrates or near temperature sensor of arrangement; This temperature sensor is electrically connected a bound temperature-control circuit; The temperature detect switch (TDS) that is electrically connected with semiconductor chilling plate is electrically connected the bound temperature-control circuit, and power supply connects temperature detect switch (TDS), bound temperature-control circuit and great power LED module respectively through power switch; A plurality of adiabatic screws link together described module group substrates, cold side metal sheet and radiator, the peripheral of semiconductor chilling plate and between radiator and cold side metal sheet filling with insulation material.
2. semiconductor refrigerating high-powered LED lamp according to claim 1 is characterized in that, described cold side metal sheet is the reflective surface of LED lamp.
3. semiconductor refrigerating high-powered LED lamp according to claim 1 is characterized in that, described cold side metal sheet is a parabolic shape.
4. according to claim 2 or 3 described semiconductor refrigerating high-powered LED lamps, it is characterized in that described adiabatic screw is the screw that nonmetal heat-insulating material is processed.
5. semiconductor refrigerating high-powered LED lamp according to claim 4 is characterized in that, between cold side metal sheet and the module group substrates, between semiconductor chilling plate and the cold side metal sheet, be coated with heat-conducting silicone grease between semiconductor chilling plate and the radiator.
6. semiconductor refrigerating high-powered LED lamp according to claim 1 is characterized in that, described radiator is the metal shade of LED lamp.
7. semiconductor refrigerating high-powered LED lamp according to claim 1 is characterized in that, described radiator is the independently radiator structure that passes lampshade.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202351038U CN202109282U (en) | 2011-07-06 | 2011-07-06 | Semiconductor high-power LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202351038U CN202109282U (en) | 2011-07-06 | 2011-07-06 | Semiconductor high-power LED lamp |
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| CN202109282U true CN202109282U (en) | 2012-01-11 |
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| CN2011202351038U Expired - Fee Related CN202109282U (en) | 2011-07-06 | 2011-07-06 | Semiconductor high-power LED lamp |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102878455A (en) * | 2012-09-06 | 2013-01-16 | 青岛市灯具二厂 | Intelligent semiconductor heat radiating LED (light-emitting diode) lamp |
| TWI461635B (en) * | 2012-06-08 | 2014-11-21 | Univ Nat Formosa | Led light with heat dissipating structure capable of avoiding frosting over and temperature controlling method thereof |
| CN104281172A (en) * | 2014-09-27 | 2015-01-14 | 无锡市恒通智能交通设施有限公司 | Temperature controller for intelligent traffic streetlamp |
| CN107435873A (en) * | 2017-09-15 | 2017-12-05 | 线武勇 | A kind of marine LED fish-luring light of new luminous intensity distribution |
-
2011
- 2011-07-06 CN CN2011202351038U patent/CN202109282U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI461635B (en) * | 2012-06-08 | 2014-11-21 | Univ Nat Formosa | Led light with heat dissipating structure capable of avoiding frosting over and temperature controlling method thereof |
| CN102878455A (en) * | 2012-09-06 | 2013-01-16 | 青岛市灯具二厂 | Intelligent semiconductor heat radiating LED (light-emitting diode) lamp |
| CN102878455B (en) * | 2012-09-06 | 2017-05-10 | 青岛市灯具二厂 | Intelligent semiconductor heat radiating LED (light-emitting diode) lamp |
| CN104281172A (en) * | 2014-09-27 | 2015-01-14 | 无锡市恒通智能交通设施有限公司 | Temperature controller for intelligent traffic streetlamp |
| CN107435873A (en) * | 2017-09-15 | 2017-12-05 | 线武勇 | A kind of marine LED fish-luring light of new luminous intensity distribution |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120111 Termination date: 20140706 |
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| EXPY | Termination of patent right or utility model |