CN201652977U - Semiconductor temperature adjustor - Google Patents
Semiconductor temperature adjustor Download PDFInfo
- Publication number
- CN201652977U CN201652977U CN2010201125016U CN201020112501U CN201652977U CN 201652977 U CN201652977 U CN 201652977U CN 2010201125016 U CN2010201125016 U CN 2010201125016U CN 201020112501 U CN201020112501 U CN 201020112501U CN 201652977 U CN201652977 U CN 201652977U
- Authority
- CN
- China
- Prior art keywords
- radiator
- chilling plate
- semiconductor chilling
- control module
- plate group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 40
- 239000004020 conductor Substances 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 238000005057 refrigeration Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 235000012149 noodles Nutrition 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000011149 active material Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Images
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The patent discloses a semiconductor temperature adjustor comprising a semiconductor refrigerating piece group formed by serial connection and/or parallel connection of a plurality of semiconductor refrigerating pieces, a control unit and a temperature sensor, wherein one side of the semiconductor refrigerating piece group is provided with an inner radiator, and the other side thereof is provided with an outer radiator; the control unit is arranged on the outer radiator; the temperature sensor is arranged on the inner radiator; the control unit is electrically connected with the temperature sensor by a compensating wire and is respectively and electrically connected with the semiconductor refrigerating piece group, the inner radiator and the outer radiator; and by being installed on a shell of high-power electronic equipment, the semiconductor temperature adjustor can reduce the temperature for the electronic equipment in time, reduce the ambient temperature and lead the electronic equipment to be also capable of working normally in hot summer.
Description
Technical field:
The utility model relates to a kind of conductor temperature adjuster, belongs to the semiconductor refrigerating application.
Background technology:
Material is one of three big pillar industries of the world today, material is the material base that the mankind depend on for existence and development, especially in recent decades along with human sciences's development of technology, Development of Materials is maked rapid progress especially, new material emerges in an endless stream, wherein semiconductor refrigeration material is exactly one of them emerging active material, obtains in fields such as national defence, industry, agricultural, medical treatment and daily lifes to use.
Semiconductor refrigerating claims electronic cooling again, perhaps thermoelectric cooling, it is a subject that grows up from the fifties between Refrigeration Technique and semiconductor technology edge, the P-N knot that it utilizes extraordinary semi-conducting material to constitute, the formation thermocouple is right, produce peltier effect, i.e. a kind of New Refrigerating method by the direct current refrigeration is with compression-type refrigeration and absorption refrigeration and be called the world's three big refrigeration modes.As shown in Figure 1, two kinds of semi-conducting materials of opposed polarity (P type, N type), it is right to be connected into galvanic couple, and galvanic couple is to the transfer of energy just takes place by DC current the time; Electric current just absorbs heat when flowing to P type element by N type element, and this end face is a huyashi-chuuka (cold chinese-style noodles), just emits heat when electric current flows to N type element by P type element, and this end face is a hot side.Can add dc source at the cooling piece two ends like this, just can realize the heat of huyashi-chuuka (cold chinese-style noodles) constantly is transferred to hot side, thereby make huyashi-chuuka (cold chinese-style noodles) keep certain low temperature.As shown in Figure 2, the concrete structure of semiconductor chilling plate 5 is served as reasons, and how the group semi-conducting materials are formed refrigerators, wherein P-type semiconductor 52 is serially connected successively with N-type semiconductor 53, the two ends of semi-conducting material are respectively equipped with hot side 51 and huyashi-chuuka (cold chinese-style noodles) 54, are provided with two electric connection lines 55 on the huyashi-chuuka (cold chinese-style noodles) 54 and directly are connected with dc source.The hot side of semiconductor chilling plate 5 or huyashi-chuuka (cold chinese-style noodles) should simultaneously be arranged in the car, and one side is arranged on outside the car, and when needs refrigeration or heating, the polarity that only needs to adjust dc source gets final product.Utilizing semiconductor refrigerating to come for high power electronic equipment carries out adjustment is a feasible technology path, less to the research of this respect in the art, the utility model is designed a kind of simple in structure, adjustment outstanding effect conductor temperature adjuster in conjunction with the semiconductor refrigerating principle.
The utility model content:
The purpose of this utility model provides a kind of conductor temperature adjuster, solves cooling when working summer such as high-speed high-power electronic equipment, the webserver, large-scale power distribution cabinet, the difficult problem of heat radiation, guarantees the working stability of electronic equipment.
The technical solution of the utility model is as follows: a kind of conductor temperature adjuster, comprise a plurality of semiconductor chilling plate series connection and/or the semiconductor chilling plate group that is formed in parallel, one control module, one temperature sensor, side in described semiconductor chilling plate group is installed inner radiator, radiator outside opposite side is installed; Described control module is installed on the described outer radiator, and described temperature sensor is installed on the described inner radiator; Described control module is electrically connected with described temperature sensor by compensating wire, and described control module is electrically connected with semiconductor chilling plate group, inner radiator, outer radiator respectively.
Further, be provided with radiator fan in the described inner radiator, be provided with an outer radiator fan in the described outer radiator, described interior radiator fan and described outer radiator fan are electrically connected with described control module respectively.
Further, described inner radiator and described outer radiator all bond on the described semiconductor chilling plate group by heat conductive silica gel.
Further, described inner radiator and described outer radiator two ends are equipped with the radiating fin of a plurality of enhance heats.
Further, described interior radiator fan and described outer radiator fan all are bonded on the described semiconductor chilling plate group by heat conductive silica gel.
Control module has temperature setting, Remote and timing function in this patent, has the effect of voltage stabilizing current limliting simultaneously.
Technique effect of the present utility model is: by this device is installed on the high power electronic device housings, can in time be the electronic equipment cooling, the reduction environment temperature makes the electronic equipment during the broiling summer also can operate as normal.
Description of drawings:
Fig. 1 is the operation principle schematic diagram of semiconductor chilling plate;
Fig. 2 is the structural representation of semiconductor chilling plate;
Fig. 3 is the internal structure schematic diagram of the utility model device;
Fig. 4 is the overall structure schematic diagram of the utility model device;
The drawing reference numeral explanation:
1-semiconductor chilling plate group, the 2-inner radiator, the outer radiator of 3-, radiator fan in the 4-,
The outer radiator fan of 5-, 6-control module, 7-temperature sensor.
The specific embodiment:
As shown in Figure 3, Figure 4, the utility model comprises semiconductor chilling plate group 1, inner radiator 2, outer radiator 3, interior radiator fan 4, outer radiator fan 5, control module 6, temperature sensor 7.Semiconductor chilling plate group 1 is fixed in the groove between inner radiator 2 and the outer radiator 3 by screw, is filled with heat-insulating material between inner radiator 2 and the outer radiator 3, such as asbestos, prevent heat inner radiator 2 and outside transmit between the radiator 3.Interior radiator fan 4 is inlaid in the inner radiator 2 by screw, and outer radiator fan 5 is inlaid in the outer radiator 3 by screw.Control module 6 is installed in an end of outer radiator 5, and the lead of semiconductor chilling plate group 1, interior radiator fan 3 and outer radiator fan 4 all is connected with control module 6, and temperature sensor 7 is connected by the signal end of compensating wire with control module 6.
The utility model is that semiconductor refrigerating is initiatively worked, and does not have mechanical running part, noiselessness in the work, and without any need for cold-producing medium, but continuous operation is free from environmental pollution.This device can freeze, and can heat again.Therefore use this device just can replace discrete heating system and refrigeration system.
The utility model can carry out adjustment for high-power electronic device, distribution bin, network workstation and the server etc. of continuous operation in summer, guarantees normal and stable operation.
Those skilled in the art will recognize that; the above-mentioned specific embodiment is exemplary; be in order better to make those skilled in the art can understand this patent; can not be interpreted as it is restriction to this patent protection domain; so long as according to spirit that this patent discloses done anyly be equal to change or modify, all fall into the scope of this patent protection.
Claims (5)
1. a conductor temperature adjuster comprises a plurality of semiconductor chilling plate series connection and/or the semiconductor chilling plate group that is formed in parallel, a control module, and a temperature sensor is characterized in that:
Side in described semiconductor chilling plate group is installed inner radiator, radiator outside opposite side is installed; Described control module is installed on the described outer radiator, and described temperature sensor is installed on the described inner radiator; Described control module is electrically connected with described temperature sensor by compensating wire, and described control module is electrically connected with semiconductor chilling plate group, inner radiator, outer radiator respectively.
2. conductor temperature adjuster according to claim 1 is characterized in that:
Be provided with radiator fan in the described inner radiator, be provided with an outer radiator fan in the described outer radiator, described interior radiator fan and described outer radiator fan are electrically connected with described control module respectively.
3. conductor temperature adjuster according to claim 1 is characterized in that:
Described inner radiator and described outer radiator all bond on the described semiconductor chilling plate group by heat conductive silica gel.
4. conductor temperature adjuster according to claim 1 is characterized in that:
Described inner radiator and described outer radiator two ends are equipped with the radiating fin of a plurality of enhance heats.
5. conductor temperature adjuster according to claim 1 is characterized in that:
Radiator fan and described outer radiator fan all are bonded on the described semiconductor chilling plate group by heat conductive silica gel in described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201125016U CN201652977U (en) | 2010-02-11 | 2010-02-11 | Semiconductor temperature adjustor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201125016U CN201652977U (en) | 2010-02-11 | 2010-02-11 | Semiconductor temperature adjustor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201652977U true CN201652977U (en) | 2010-11-24 |
Family
ID=43118217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201125016U Expired - Lifetime CN201652977U (en) | 2010-02-11 | 2010-02-11 | Semiconductor temperature adjustor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201652977U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107464572A (en) * | 2017-08-16 | 2017-12-12 | 重庆科技学院 | Multimodal interaction Music perception system and its control method |
| CN108475000A (en) * | 2015-12-23 | 2018-08-31 | 伊森株式会社 | Video camera cooling device and its method |
| CN109357328A (en) * | 2018-10-17 | 2019-02-19 | 宁波奥克斯电气股份有限公司 | A kind of electric-controlled plate controller for heat sink and method and air conditioner |
| CN112664307A (en) * | 2019-10-16 | 2021-04-16 | 比亚迪股份有限公司 | Thermostat and cooling circulation system of vehicle with same |
-
2010
- 2010-02-11 CN CN2010201125016U patent/CN201652977U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108475000A (en) * | 2015-12-23 | 2018-08-31 | 伊森株式会社 | Video camera cooling device and its method |
| CN107464572A (en) * | 2017-08-16 | 2017-12-12 | 重庆科技学院 | Multimodal interaction Music perception system and its control method |
| CN107464572B (en) * | 2017-08-16 | 2020-10-16 | 重庆科技学院 | Multi-mode interactive music perception system and control method thereof |
| CN109357328A (en) * | 2018-10-17 | 2019-02-19 | 宁波奥克斯电气股份有限公司 | A kind of electric-controlled plate controller for heat sink and method and air conditioner |
| CN112664307A (en) * | 2019-10-16 | 2021-04-16 | 比亚迪股份有限公司 | Thermostat and cooling circulation system of vehicle with same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C53 | Correction of patent for invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Kang Lixia Inventor after: Zhang Genfa Inventor after: Su Qingfeng Inventor after: Lai Jianming Inventor after: Feng Shijun Inventor before: Kang Lixia Inventor before: Zhang Genfa Inventor before: Su Qingfeng Inventor before: Lai Jianming Inventor before: Feng Shijun |
|
| C56 | Change in the name or address of the patentee |
Owner name: SHANGHAI LIANFU NEW ENERGY TECHNOLOGY GROUP CO., L Free format text: FORMER NAME: SHANGHAI LIANFU NEW ENERGY SCIENCE AND TECHNOLOGY CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: 201201 Pudong New Area, Shengli Road, No. 17, building 1, floor 836, Patentee after: SHANGHAI LIANFU NEW ENERGY SCIENCE & TECHNOLOGY GROUP CO., LTD. Address before: 201201 Shanghai city Pudong New Area King Road No. 1003 Patentee before: Shanghai Lianfu New Energy Science and Technology Co., Ltd. |
|
| CP03 | Change of name, title or address | ||
| PP01 | Preservation of patent right | ||
| PP01 | Preservation of patent right |
Effective date of registration: 20190710 Granted publication date: 20101124 |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20101124 |
|
| PD01 | Discharge of preservation of patent | ||
| PD01 | Discharge of preservation of patent |
Date of cancellation: 20200211 Granted publication date: 20101124 |