CN203068872U - Semiconductor auxiliary refrigerating system - Google Patents
Semiconductor auxiliary refrigerating system Download PDFInfo
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- CN203068872U CN203068872U CN 201320037519 CN201320037519U CN203068872U CN 203068872 U CN203068872 U CN 203068872U CN 201320037519 CN201320037519 CN 201320037519 CN 201320037519 U CN201320037519 U CN 201320037519U CN 203068872 U CN203068872 U CN 203068872U
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- free room
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Abstract
The utility model belongs to the technical field of heat exchange, and discloses a semiconductor auxiliary refrigerating system, which includes a semiconductor refrigerating device, wherein the semiconductor refrigerating device includes a cold end and a hot end; the cold end is arranged inside a dust free room; and the hot end is arranged outside the dust free room. When a circulatory pipeline of the refrigerating equipment is frozen and the refrigerating effect cannot achieve the requirement, the semiconductor refrigerating device is started to perform auxiliary refrigeration on the dust free room by virtue of the Peltier effect of the semiconductor, as a result, the refrigeration requirement is achieved, the normal production of a production line is not affected, the frozen circulatory pipeline is deiced, the refrigerating equipment get back to normal operation, the constant temperature and constant humidity environment of the dust free room is not affected, and the reliability and the stability of the system are improved.
Description
Technical field
The utility model relates to technical field of heat exchange, particularly relates to a kind of semiconductor auxiliary cooling system.
Background technology
In conjunction with shown in Figure 1, the refrigeration plant 2 that the refrigeration system in the present LCD manufacturing industry comprises the dust free room 1 of constant temperature and humidity and is used for dust free room 1 is freezed.Wherein, refrigeration plant 2 comprises compressor 3, condenser 4 and the evaporimeter 5 that is communicated with by circulating line 9, compressor 3 promotes cold-producing medium (being generally steam) and is high pressure from low pressure, and cold-producing medium is constantly circulated, thereby constantly the heat with dust free room 1 inside is discharged in the external environment, keeps the constant temperature of dust free room 1; Condenser 4 is used for steam is transformed into liquid, makes ducted heat pass near the pipeline the air in very fast mode, forms the condensation " liquid " of low temperature, can realize the recycling of cold-producing medium.Wherein, compressor 3 and condenser 4 all are arranged on outside the dust free room 1, to guarantee the isoperibol of dust free room 1, evaporimeter 5 then is arranged in the dust free room 1, ducted cryogenic condensation " liquid " body carries out heat exchange by the air in evaporimeter 5 and the dust free room 1, forms steam, and " gas " changes heat absorption, thereby reach the effect of refrigeration, the steam that obtains is recycling by compressor 3.
But there is following defective in existing refrigeration system: the steam that leaks outside in the dust free room 1 can freeze below zero point and be coated near (as the frame of broken lines place among Fig. 1) on the circulating line 9 of dust free room, cause the refrigeration of refrigeration plant 2 to reduce greatly, do not reach the refrigeration requirement, need production line to stop line, cause damage, also need to arrange special resistance heater the circulating line 9 after freezing is changed ice.
The utility model content
(1) technical problem that will solve
The technical problems to be solved in the utility model provides a kind of semiconductor auxiliary cooling system, circulating line at refrigeration plant freezes, refrigeration does not reach when requiring, assist dust free room is freezed, to satisfy the refrigeration requirement, realize the ordinary production of production line, and to circulating line ice, make refrigeration plant recover operate as normal, also can not influence the environment of dust free room constant temperature and humidity.
(2) technical scheme
In order to solve the problems of the technologies described above, the utility model provides a kind of semiconductor auxiliary cooling system, comprises dust free room and the refrigeration plant that described dust free room is freezed, and wherein, described refrigeration plant comprises semiconductor cooling device; Described semiconductor cooling device comprises and is arranged on the indoor cold junction of described dust free room and is arranged on the outdoor hot junction of described dust free room.
Aforesaid semiconductor auxiliary cooling system preferably, is provided with fan at described a plurality of fin away from a side of described circulating line; The air port of described fan is towards described circulating line; Described a plurality of fin is roughly parallel to the wind direction of described fan.
Aforesaid semiconductor auxiliary cooling system, preferably, the described first insulate heat transmitting medium connects a plurality of fin, is provided with fan at described a plurality of fin away from a side of described circulating line; The air port of described fan is towards described circulating line; Described a plurality of fin is approximately perpendicular to the wind direction of described fan;
All have a plurality of first through holes on described a plurality of fin, and being centered close on the straight line of first through hole of relative position on described a plurality of fin.
Aforesaid semiconductor auxiliary cooling system, preferably, described a plurality of fin form towards the L of described circulating line type structure through a bending; Described first through hole be positioned at described fin be approximately perpendicular to described fan wind to end face on;
Described a plurality of fin be roughly parallel to described fan wind to end face on all have a plurality of second through holes, and being centered close on the straight line of second through hole of relative position on described a plurality of fin;
Described circulating line passes second through hole on described a plurality of fin.
Aforesaid semiconductor auxiliary cooling system, preferably, described a plurality of fin be arranged in parallel.
Aforesaid semiconductor auxiliary cooling system, preferably, the cold junction of described semiconductor cooling device comprises the absorber of being made up of N-type semiconductor and P-type semiconductor and the second insulate heat transmitting medium that is connected with described absorber.
Aforesaid semiconductor auxiliary cooling system preferably, is provided with thermal insulation layer between the cold junction of described semiconductor cooling device and the hot junction.
Aforesaid semiconductor auxiliary cooling system, preferably, the absorber of described semiconductor cooling device cold junction and the heater in hot junction are electrically connected, and share a dc source.
Aforesaid semiconductor auxiliary cooling system, preferably, described refrigeration plant also comprises control device; Described control device is included as described semiconductor cooling device provides the power module of DC current, be arranged on the indoor temperature sensor of described dust free room and controller, described temperature sensor is connected with the instruction input of described controller, and described power module is connected with the instruction output end of described controller.
(3) beneficial effect
The refrigeration plant of semiconductor auxiliary cooling system provided by the utility model comprises semiconductor cooling device, and this semiconductor cooling device comprises cold junction and hot junction, and wherein, it is indoor that cold junction is arranged on dust free room, and it is outdoor that the hot junction is arranged on dust free room.When the circulating line of refrigeration plant freezes, refrigeration does not reach when requiring, start semiconductor cooling device, utilize semi-conductive Peltier effect, dust free room is carried out auxiliary cooling, reach the refrigeration requirement, do not influence the ordinary production of production line, and simultaneously to the circulating line ice at the place that freezes, make refrigeration plant recover operate as normal, also can not influence the environment of dust free room constant temperature and humidity, improve the reliability and stability of system.
Description of drawings
Fig. 1 is the structural representation one of semiconductor auxiliary cooling system among the utility model embodiment;
Fig. 2 is the structural representation of semiconductor cooling device among Fig. 1;
Fig. 3 is the left view of fin among Fig. 1;
Fig. 4 is the structural representation two of semiconductor auxiliary cooling system among the utility model embodiment;
Fig. 5 is the structural representation of semiconductor cooling device among Fig. 4;
Fig. 6 is the structural representation three of semiconductor auxiliary cooling system among the utility model embodiment;
Fig. 7 is the vertical view of fin among Fig. 6.
Fig. 8 is the composition frame chart of control device among the utility model embodiment;
Wherein, 1: dust free room; 2: refrigeration plant; 3: compressor; 4: condenser; 5: evaporimeter; 6: semiconductor cooling device; 7: cold junction; 8: the hot junction; 9: circulating line; 10: absorber; 11: heater; 12: fin; 13: the first insulate heat transmitting mediums; 14: the second insulate heat transmitting mediums; 15: fan; 16: thermal insulation layer; 17: metallic conductor; 18: power supply; 19: the first through holes; 20: the second through holes; 100: control device; 101: power module; 102: temperature sensor; 103: controller.
The specific embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present utility model is described in further detail.Following examples are used for explanation the utility model, but are not used for limiting scope of the present utility model.
Fig. 1, Fig. 4 and Figure 6 shows that the structural representation of semiconductor auxiliary cooling system among the utility model embodiment.Semiconductor refrigerating, heating technology are to utilize semi-conductive Peltier effect (Peltier effect is exactly that DC current is when flowing through the interface of two kinds of different conductors, to absorb heat from the external world, or emit heat to the external world) realize refrigeration or heating, have the following advantages: movement-less part, thereby when work noiseless, nothing is worn and torn, the life-span is long, the reliability height; Do not use cold-producing medium, so do not have leakage, environmentally safe; The semiconductor cooler parameter is not subjected to the influence of direction in space, not influenced by gravitational field, is widely used in field of aerospace; Speed of action is fast, reliable operation, and long service life, easy to control, easy to adjust, can regulate refrigeration, heating capacity by regulating the operating current size; Can change the duty of its refrigeration or heating by the direction of switch current; Size is little, and is in light weight, is fit to low capacity, undersized special refrigerating environment.Yet the refrigeration system in the liquid crystal display manufacturing industry can not directly be used semiconductor refrigerating, because the heat that produces in the process of refrigerastion can be dispersed in the environment, influences the environment of dust free room constant temperature and humidity.Therefore, the utility model provides a kind of semiconductor auxiliary cooling system, circulating line at refrigeration plant freezes, and does not reach and freezes when requiring, and utilizes semi-conductive Peltier effect, dust free room is freezed, to satisfy the refrigeration requirement, realize the ordinary production of production line, and to circulating line ice, make the refrigeration plant can operate as normal, also can not influence the environment of dust free room constant temperature and humidity.
As Fig. 1, Fig. 4 and shown in Figure 6, the semiconductor auxiliary cooling system among the utility model embodiment comprises dust free room 1 and the refrigeration plant 2 that dust free room 1 is freezed, and wherein, refrigeration plant 2 comprises semiconductor cooling device 6.In order to realize the auxiliary cooling to dust free room 1, and the circulating line 9 of refrigeration plant 2 changed ice, semiconductor cooling device 6 comprises cold junction 7 and hot junction 8, cold junction 7 is arranged on the indoor of dust free room 1, when refrigeration plant 2 cisco unity malfunctions, utilize Peltier effect absorption heat to assist dust free room 1 is freezed; Hot junction 8 is arranged on the outdoor of dust free room 1, utilizes Peltier effect to emit heat equally circulating line 9 is changed ice, makes refrigeration plant 2 recover operate as normal,, also can not influence the environment of dust free room constant temperature and humidity, improve the reliability and stability of system.
As Fig. 2 and shown in Figure 5, the hot junction 8 of preferred semiconductor refrigerating plant 6 comprises the heater of being made up of N-type semiconductor and P-type semiconductor 11 and the first insulate heat transmitting medium 13 that is connected with heater 11 in the present embodiment, wherein, the first insulate heat transmitting medium 13 can be insulating ceramic film, circulating line 9 near refrigeration plant 2 arranges, for increasing heat exchange area.By N-type semiconductor and P-type semiconductor are connected into semiconductor galvanic, when electric current flows to P-type semiconductor from N-type semiconductor, emit heat, after the first insulate heat transmitting medium 13 is heated circulating line 9 is changed ice.
For raising ice efficient, the first insulate heat transmitting medium 13 can be set connect a plurality of fin 12, as: thermal conductivity preferred metal fin such as copper, iron, increase heat transfer area, improve heat conduction efficiency.
In actual application; owing to have certain distance between semiconductor cooling device 6 and the circulating line 9; preferably away from a side of circulating line 9 fan 15 is set at a plurality of fin 12; and the air port that fan 15 is set is towards circulating line 9; accelerate heat exchange, protection semiconductor chip temperature can be too not high.Wherein, a plurality of fin 12 can be arranged in parallel, improve the effect that fan 15 promotes heat exchange.
Further, a plurality of fin 12 in the present embodiment can be roughly parallel to the wind direction setting of fan 15, as shown in Figure 4 and Figure 5.
Certainly, a plurality of fin 12 also can be approximately perpendicular to the wind direction setting of fan 15, as depicted in figs. 1 and 2, and at a plurality of first through holes 19 of a plurality of fin 12 designs, the circulation of realization wind-force, as shown in Figure 3, and being centered close on the straight line of first through hole 19 of relative position on a plurality of fin 12, the effect that fan 15 promotes heat exchanges improved.
Further, a plurality of fin 12 can also be formed towards the L of circulating line 9 type structure through a bending, as shown in Figure 6, wherein, first through hole 19 is positioned on the end face that fin 12 is approximately perpendicular to fan 15 wind directions, and be roughly parallel to a plurality of second through holes 20 of end face design of fan 15 wind directions at a plurality of fin 12, as shown in Figure 7, and second through hole 20 that being centered close on the straight line of second through hole 20 of relative position on a plurality of fin 12, circulating line 9 can be passed on a plurality of fin 12 arranges.
Preferred a plurality of fin 12 be arranged in parallel in the present embodiment, and are easy to process, can also reduce the occupation of land space of device.
Correspondingly, the cold junction 7 of semiconductor cooling device 6 also comprises the absorber of being made up of N-type semiconductor and P-type semiconductor 10 and the second insulate heat transmitting medium 14 that is connected with absorber 10.By N-type semiconductor and P-type semiconductor are connected into semiconductor galvanic, when electric current flows to N-type semiconductor from P-type semiconductor, can absorb heat by the first insulate heat transmitting medium 13, increase heat exchange area, dust free room 1 is freezed.Wherein, the second insulate heat transmitting medium 14 also can be insulating ceramic film.
Preferably between the cold junction 7 of semiconductor cooling device 6 and hot junction 8, be provided with thermal insulation layer 16, reduce the heat conduction between cold junction 7 and the hot junction 8, improve refrigeration and change ice efficient.
Because the auxiliary cooling of 6 pairs of dust free rooms 1 of semiconductor cooling device and the change ice of circulating line 9 is generally simultaneously carries out, can realize the electrical connection of cold junction 7 absorbers 10 and hot junction 8 heaters 11 in the present embodiment by metallic conductor 17, thereby they can share a dc source 18, convenient control.Be that the semiconductor galvanic of cold junction 7 intersects successively with the semiconductor galvanic in hot junction 8 and is electrically connected, be specifically as follows, the P-type semiconductor of cold junction 7 semiconductor galvanics is electrically connected by metallic conductor 17 with the P-type semiconductor of hot junction 8 semiconductor galvanics, and the N-type semiconductor of hot junction 8 semiconductor galvanics is electrically connected with the N-type semiconductor of cold junction 7 semiconductor galvanics by metallic conductor 17.
In order to realize the automatic control to the semiconductor auxiliary cooling system, preferred refrigeration plant 2 also comprises control device 100, is used for the course of work of control semiconductor cooling device 6.As shown in Figure 8, control device 100 in the present embodiment can comprise power module 101, temperature sensor 102 and controller 103, wherein, temperature sensor 102 is connected with the instruction input of controller 103, and power module 101 is connected with the instruction output end of controller 103.Temperature sensor 102 is used for the indoor temperature of induction dust free room 1, when the indoor temperature of dust free room 1 is higher than desired steady temperature, controller 103 control power modules 101 provide DC current for semiconductor cooling device 6, and according to the size of adjustment DC current of induction, improve refrigeration and change ice efficient.When the indoor temperature of dust free room 1 returned to desired steady temperature, controller 103 control power modules 101 cut off the power supply of semiconductor cooling device 6, effectively guaranteed the refrigeration of dust free room 1.Wherein, controller 103 can be selected programmable logic controller (PLC).
As can be seen from the above embodiments, the refrigeration plant of semiconductor auxiliary cooling system provided by the utility model comprises semiconductor cooling device, and this semiconductor cooling device comprises cold junction and hot junction, wherein, it is indoor that cold junction is arranged on dust free room, and it is outdoor that the hot junction is arranged on dust free room.When the circulating line of refrigeration plant freezes, refrigeration does not reach when requiring, start semiconductor cooling device, utilize semi-conductive Peltier effect, dust free room is carried out auxiliary cooling, reach the refrigeration requirement, do not influence the ordinary production of production line, and simultaneously to the circulating line ice at the place that freezes, make refrigeration plant recover operate as normal, also can not influence the environment of dust free room constant temperature and humidity, improve the reliability and stability of system.
The above only is preferred embodiment of the present utility model; should be understood that; for those skilled in the art; under the prerequisite that does not break away from the utility model know-why; can also make some improvement and replacement, these improvement and replacement also should be considered as protection domain of the present utility model.
Claims (10)
1. a semiconductor auxiliary cooling system comprises dust free room and to the refrigeration plant that described dust free room freezes, it is characterized in that described refrigeration plant comprises semiconductor cooling device; Described semiconductor cooling device comprises and is arranged on the indoor cold junction of described dust free room and is arranged on the outdoor hot junction of described dust free room.
2. semiconductor auxiliary cooling system according to claim 1 is characterized in that, the hot junction of described semiconductor cooling device comprises the heater of being made up of N-type semiconductor and P-type semiconductor and the first insulate heat transmitting medium that is connected with described heater; The described first insulate heat transmitting medium is near the circulating line setting of described refrigeration plant.
3. semiconductor auxiliary cooling system according to claim 2 is characterized in that, the described first insulate heat transmitting medium connects a plurality of fin, is provided with fan at described a plurality of fin away from a side of described circulating line; The air port of described fan is towards described circulating line; Described a plurality of fin is roughly parallel to the wind direction of described fan.
4. semiconductor auxiliary cooling system according to claim 2 is characterized in that, the described first insulate heat transmitting medium connects a plurality of fin, is provided with fan at described a plurality of fin away from a side of described circulating line; The air port of described fan is towards described circulating line; Described a plurality of fin is approximately perpendicular to the wind direction of described fan;
All have a plurality of first through holes on described a plurality of fin, and being centered close on the straight line of first through hole of relative position on described a plurality of fin.
5. semiconductor auxiliary cooling system according to claim 4 is characterized in that, described a plurality of fin form towards the L of described circulating line type structure through a bending; Described first through hole be positioned at described fin be approximately perpendicular to described fan wind to end face on;
Described a plurality of fin be roughly parallel to described fan wind to end face on all have a plurality of second through holes, and being centered close on the straight line of second through hole of relative position on described a plurality of fin;
Described circulating line passes second through hole on described a plurality of fin.
6. according to each described semiconductor auxiliary cooling system of claim 3-5, it is characterized in that described a plurality of fin be arranged in parallel.
7. semiconductor auxiliary cooling system according to claim 2 is characterized in that, the cold junction of described semiconductor cooling device comprises the absorber of being made up of N-type semiconductor and P-type semiconductor and the second insulate heat transmitting medium that is connected with described absorber.
8. semiconductor auxiliary cooling system according to claim 7 is characterized in that, is provided with thermal insulation layer between the cold junction of described semiconductor cooling device and the hot junction.
9. semiconductor auxiliary cooling system according to claim 7 is characterized in that, the absorber of described semiconductor cooling device cold junction and the heater in hot junction are electrically connected, and shares a dc source.
10. semiconductor auxiliary cooling system according to claim 1 is characterized in that, described refrigeration plant also comprises control device; Described control device is included as described semiconductor cooling device provides the power module of DC current, be arranged on the indoor temperature sensor of described dust free room and controller, described temperature sensor is connected with the instruction input of described controller, and described power module is connected with the instruction output end of described controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320037519 CN203068872U (en) | 2013-01-21 | 2013-01-21 | Semiconductor auxiliary refrigerating system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320037519 CN203068872U (en) | 2013-01-21 | 2013-01-21 | Semiconductor auxiliary refrigerating system |
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| CN203068872U true CN203068872U (en) | 2013-07-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201320037519 Expired - Lifetime CN203068872U (en) | 2013-01-21 | 2013-01-21 | Semiconductor auxiliary refrigerating system |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106813338A (en) * | 2017-03-24 | 2017-06-09 | 合肥天鹅制冷科技有限公司 | Air-conditioning device |
| CN108550475A (en) * | 2018-06-27 | 2018-09-18 | 安徽盛美金属科技有限公司 | A kind of circulating refrigerating device of thin film capacitor production radiator |
| CN108645072A (en) * | 2018-05-30 | 2018-10-12 | 无锡艾迪尔家居有限公司 | A kind of semiconductor refrigeration radiating device |
| CN109195419A (en) * | 2018-10-29 | 2019-01-11 | 珠海格力电器股份有限公司 | Air conditioner electrical box and heat abstractor thereof |
| CN111407011A (en) * | 2019-01-05 | 2020-07-14 | 青岛海尔空调器有限总公司 | Air-conditioning clothes |
| CN114895728A (en) * | 2022-05-05 | 2022-08-12 | 北京北方华创微电子装备有限公司 | Temperature control device and semiconductor process equipment |
-
2013
- 2013-01-21 CN CN 201320037519 patent/CN203068872U/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106813338A (en) * | 2017-03-24 | 2017-06-09 | 合肥天鹅制冷科技有限公司 | Air-conditioning device |
| CN108645072A (en) * | 2018-05-30 | 2018-10-12 | 无锡艾迪尔家居有限公司 | A kind of semiconductor refrigeration radiating device |
| CN108550475A (en) * | 2018-06-27 | 2018-09-18 | 安徽盛美金属科技有限公司 | A kind of circulating refrigerating device of thin film capacitor production radiator |
| CN108550475B (en) * | 2018-06-27 | 2020-07-03 | 安徽盛美金属科技有限公司 | Film capacitor production is with heat abstractor's circulating refrigeration device |
| CN109195419A (en) * | 2018-10-29 | 2019-01-11 | 珠海格力电器股份有限公司 | Air conditioner electrical box and heat abstractor thereof |
| CN109195419B (en) * | 2018-10-29 | 2024-03-19 | 珠海格力电器股份有限公司 | Air conditioner electrical box and heat radiating device thereof |
| CN111407011A (en) * | 2019-01-05 | 2020-07-14 | 青岛海尔空调器有限总公司 | Air-conditioning clothes |
| CN114895728A (en) * | 2022-05-05 | 2022-08-12 | 北京北方华创微电子装备有限公司 | Temperature control device and semiconductor process equipment |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130717 |
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| CX01 | Expiry of patent term |