CN108550475B - Film capacitor production is with heat abstractor's circulating refrigeration device - Google Patents
Film capacitor production is with heat abstractor's circulating refrigeration device Download PDFInfo
- Publication number
- CN108550475B CN108550475B CN201810681978.7A CN201810681978A CN108550475B CN 108550475 B CN108550475 B CN 108550475B CN 201810681978 A CN201810681978 A CN 201810681978A CN 108550475 B CN108550475 B CN 108550475B
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- semiconductor
- refrigeration
- heat
- finned radiator
- air duct
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- 238000005057 refrigeration Methods 0.000 title claims abstract description 55
- 239000003990 capacitor Substances 0.000 title claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000004065 semiconductor Substances 0.000 claims abstract description 55
- 238000001816 cooling Methods 0.000 claims abstract description 20
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000007788 liquid Substances 0.000 claims abstract description 11
- 238000004321 preservation Methods 0.000 claims abstract description 5
- 238000007664 blowing Methods 0.000 claims abstract description 4
- 239000002826 coolant Substances 0.000 claims description 8
- 238000011084 recovery Methods 0.000 claims description 7
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 230000005679 Peltier effect Effects 0.000 claims description 4
- 239000011232 storage material Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 4
- 238000004064 recycling Methods 0.000 abstract description 3
- 238000009825 accumulation Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 10
- 239000004793 Polystyrene Substances 0.000 description 5
- 239000004743 Polypropylene Substances 0.000 description 4
- 239000002985 plastic film Substances 0.000 description 4
- 229920006255 plastic film Polymers 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 229920004933 Terylene® Polymers 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention discloses a circulating refrigeration device of a heat dissipation device for producing a film capacitor, which comprises a refrigeration box, wherein a cooling fan for blowing out cold air is installed at the top of the refrigeration box, a semiconductor heat exchange sheet is installed above an air outlet of the cooling fan, and a circulating air duct is covered at the top end of the semiconductor heat exchange sheet; the semiconductor heat exchange plate comprises a semiconductor refrigeration plate, the semiconductor refrigeration plate is vertically arranged above the refrigeration box, an aluminum finned radiator is arranged at the cold end, close to the refrigeration box, of the semiconductor refrigeration plate, and a heat pipe finned radiator is arranged at the hot end of the top of the semiconductor refrigeration plate; the bottom of the aluminum finned radiator is connected with a cooling fan through a pipeline, and the other end of the heat pipe finned radiator is connected to an air inlet of the circulating air duct; the outer surface of the semiconductor refrigeration sheet is wrapped with a heat preservation cavity for reducing the heat conductivity; the invention has good refrigeration effect, can realize the recycling of cold accumulation liquid, and is green and environment-friendly.
Description
Technical Field
The invention relates to the technical field of capacitor production, in particular to a circulating refrigeration device of a heat dissipation device for producing a film capacitor.
Background
Film Capacitor (Film Capacitor) is also called Plastic Film Capacitor (Plastic Film Capacitor). Which uses a plastic film as a dielectric.
A film capacitor has many excellent characteristics, and thus is a capacitor having excellent performance. Its main characteristics are as follows: no polarity, high insulation resistance, excellent frequency characteristics (wide frequency response), and low dielectric loss. Due to the above advantages, the thin film capacitor is used in a large number of analog circuits. In particular, in the signal connection portion, a capacitor having good frequency characteristics and extremely low dielectric loss must be used to ensure that the signal is not distorted too much during transmission.
The structure of the paper is the same as the dielectric capacity of paper, and the medium is terylene or polystyrene and the like. The terylene film capacitor has the advantages of high dielectric constant, small volume, large capacity and good stability, and is suitable for being used as a bypass capacitor. The polystyrene film capacitor has small dielectric loss, high insulation resistance and large temperature coefficient, and can be used for high-frequency circuits.
Of all plastic film capacitors, the characteristics of polypropylene (PP) and Polystyrene (PS) capacitors are most significant, and of course, the price of these capacitors is also relatively high. However, in recent years, in order to improve the sound quality of the audio equipment, the material of the parts used has become more advanced, and the price is not the most important consideration, so in recent years, the frequency and the number of the PP capacitor and the PS capacitor used in the audio equipment have become higher. The reader can often see the equipment of a certain brand, and the reason is that how many PP mass capacitors or PS mass capacitors of a certain brand are used as endorsements on the sound quality.
Film capacitor adds the coolant through the regenerator of cold-storage box and cools down in the production heat dissipation link, and the effect of cooling down is limited on the one hand, and on the other hand excessively uses the coolant to cool down and can cause serious environmental pollution.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides a circulating refrigeration device of a heat dissipation device for producing a film capacitor, which can effectively solve the problems in the background art.
The technical scheme adopted by the invention for solving the technical problems is as follows:
a circulating refrigeration device of a heat dissipation device for producing a film capacitor comprises a refrigeration box for storing a coolant, wherein a cooling fan for blowing out cold air is installed at the top of the refrigeration box, a semiconductor heat exchange sheet for heat energy exchange is installed above an air outlet of the cooling fan, and a circulating air duct for air flow circulation is covered at the top end of the semiconductor heat exchange sheet;
the semiconductor heat exchange plate comprises a semiconductor refrigeration plate adopting a semiconductor Peltier effect, the semiconductor refrigeration plate is vertically arranged above the refrigeration box, an aluminum finned radiator is arranged at the cold end, close to the refrigeration box, of the semiconductor refrigeration plate, and a heat pipe finned radiator is arranged at the hot end of the top of the semiconductor refrigeration plate; the bottom of the aluminum finned radiator is connected with a cooling fan through a pipeline, and the other end of the heat pipe finned radiator is connected to an air inlet of the circulating air duct; the outer surface of the semiconductor refrigeration piece is wrapped with a heat preservation cavity used for reducing the heat conduction performance.
Furthermore, a three-way liquid inlet valve for adding a coolant is installed on the side edge of the top of the refrigeration box, and the recovery end of the three-way liquid inlet valve is connected with the recovery end of the circulating air duct through a guide pipe.
Furthermore, the semiconductor refrigeration piece is formed by mutually arranging a plurality of groups of N-type and P-type semiconductors, the adjacent N-type and P-type semiconductors are connected through copper conductors, and the outer surfaces of the outermost N-type and P-type semiconductors are wrapped with piezoelectric ceramic pieces.
Furthermore, the circulating air duct is made of stainless steel into a U-shaped elbow, and the inlet and outlet of the circulating air duct are inlaid with filter screens for removing large particles.
Furthermore, the outer surfaces of the aluminum finned radiator and the heat pipe finned radiator are coated with heat conduction silicone grease layers for reducing thermal resistance.
Compared with the prior art, the invention has the beneficial effects that:
(1) the invention makes the hot end of the thermopile continuously radiate heat and keep a certain temperature by arranging the semiconductor heat exchange sheet and utilizing various heat transfer devices based on the Peltier effect, and puts the cold end of the thermopile into the working environment to absorb heat, thereby realizing cooling and refrigeration; the aluminum finned radiator and the heat pipe finned radiator are combined, so that cold air can circulate conveniently, and the refrigeration effect is improved; the thermal resistance can be reduced and the heat dissipation performance can be improved by arranging the heat conduction silicone grease layer;
(2) the refrigeration box is arranged to be filled with the cold storage agent for refrigeration and cooling, the cooling fan is used for controlling the output of cold air of the box, the circulation air channel is combined to form a circulation passage, and the recycling of the cold storage agent which is not completely used is realized by combining the three-way liquid inlet valve, so that the refrigeration box is clean and environment-friendly; can filter the dust through setting up the filter screen net, effectively prevent the pipeline jam.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Reference numbers in the figures:
1-a refrigeration box; 2-a cooling fan; 3-semiconductor heat exchange fins; 4-a circulating air duct; 5-a three-way liquid inlet valve; 6-filtering the mesh screen;
301-semiconductor chilling plates; 302-aluminum finned heat sink; 303-heat pipe fin radiator; 304-heat preservation chamber; 305-thermally conductive silicone layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, the present invention provides a circulating refrigeration device of a heat dissipation device for producing a thin film capacitor, including a refrigeration box 1 for storing a coolant, a cooling fan 2 for blowing out cold air is installed on the top of the refrigeration box 1, a semiconductor heat exchanger fin 3 for exchanging heat energy is installed above an air outlet of the cooling fan 2, and a circulating air duct 4 for circulating air flow is covered on the top end of the semiconductor heat exchanger fin 3; the refrigeration case 1 produces cold air through adding the cold-storage agent, then blows off to semiconductor heat exchanger fin 3 through cooling fan 2, exchanges cold air to circulation wind channel 4 through semiconductor heat exchanger fin 3, sends into cold wind through circulation wind channel 4 and cools down to the insulation can is inside.
A three-way liquid inlet valve 5 for adding a coolant is arranged on the side edge of the top of the refrigeration box 1, and the recovery end of the three-way liquid inlet valve 5 is connected with the recovery end of the circulating air duct 4 through a guide pipe; the three-way liquid inlet valve 5 is added with a coolant according to actual conditions, and condensed waste liquid obtained after circulation through the circulation air duct 4 enters the refrigeration box 1 through the recovery end for recycling.
In this embodiment, the semiconductor heat exchange plate 3 includes a semiconductor refrigeration plate 301 using a semiconductor Peltier effect, the semiconductor refrigeration plate 301 is vertically installed above the refrigeration box 1, an aluminum finned radiator 302 is installed at a cold end of the semiconductor refrigeration plate 301 close to the refrigeration box 1, and a heat pipe finned radiator 303 is installed at a hot end of the top of the semiconductor refrigeration plate 301; the bottom of the aluminum finned radiator 302 is connected with the cooling fan 2 through a pipeline, and the other end of the heat pipe finned radiator 303 is connected to an air inlet of the circulating air duct 4; the outer surface of the semiconductor refrigeration sheet 301 is wrapped with a heat preservation cavity 304 for reducing heat conduction performance; the semiconductor refrigeration piece 301 is cooled at the cold end through the electrifying semiconductor effect, is heated at the hot end, and generates cold air output under the action of the cooling fan 2 by combining with cold air in the refrigeration box 1 to form cold air circulation.
Further, the semiconductor refrigeration piece 301 is formed by mutually arranging a plurality of groups of N-type and P-type semiconductors, the adjacent N-type and P-type semiconductors are connected through copper conductors, and the outer surfaces of the outermost N-type and P-type semiconductors are wrapped with piezoelectric ceramic pieces; the semiconductor refrigeration sheet 301 starts to work by being connected with a temperature control circuit, 12V direct current is supplied to the thermopile, the hot end of the thermopile continuously dissipates heat by means of various heat transfer devices, a certain temperature is kept, and the cold end of the thermopile is placed in a working environment to absorb heat, so that the cooling refrigeration operation is realized.
Particularly, the outer surfaces of the aluminum fin radiator 302 and the heat pipe fin radiator 303 are coated with a heat conduction silicone layer 305 for reducing heat resistance, and the heat resistance of the radiators is reduced through the heat conduction silicone layer 305, so that the heat radiation effect is effectively improved.
Preferably, the circulating air duct 4 is made of stainless steel into a U-shaped elbow, and a filter screen 6 for removing large particles is embedded at the inlet and outlet of the circulating air duct 4; the circulating cold air can be filtered by arranging the filter mesh screen 6, and the circulating air duct 4 is prevented from being blocked.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (1)
1. The utility model provides a film capacitor production is with heat abstractor's circulation refrigerating plant which characterized in that: the refrigerator comprises a refrigeration box (1) for storing cold storage agent, wherein a cooling fan (2) for blowing out cold air is installed at the top of the refrigeration box (1), a semiconductor heat exchange sheet (3) for heat energy exchange is installed above an air outlet of the cooling fan (2), and a circulating air duct (4) for air flow circulation is covered at the top end of the semiconductor heat exchange sheet (3);
the semiconductor heat exchange plate (3) comprises a semiconductor refrigerating plate (301) adopting a semiconductor Peltier effect, the semiconductor refrigerating plate (301) is vertically arranged above the refrigerating box (1), an aluminum finned radiator (302) is arranged at the cold end, close to the refrigerating box (1), of the semiconductor refrigerating plate (301), and a heat pipe finned radiator (303) is arranged at the hot end of the top of the semiconductor refrigerating plate (301); the bottom of the aluminum finned radiator (302) is connected with the cooling fan (2) through a pipeline, and the other end of the heat pipe finned radiator (303) is connected to an air inlet of the circulating air duct (4); the outer surface of the semiconductor refrigeration sheet (301) is wrapped with a heat preservation cavity (304) for reducing heat conduction performance;
a three-way liquid inlet valve (5) for adding a coolant is arranged on the side edge of the top of the refrigeration box (1), and the recovery end of the three-way liquid inlet valve (5) is connected with the recovery end of the circulating air duct (4) through a guide pipe;
the semiconductor refrigerating piece (301) is formed by mutually arranging a plurality of groups of N-type and P-type semiconductors, the adjacent N-type and P-type semiconductors are connected through copper conductors, and the outer surfaces of the outermost N-type and P-type semiconductors are wrapped with piezoelectric ceramic pieces;
the circulating air duct (4) is made of stainless steel into a U-shaped bent pipe, and a filter screen (6) for removing large particles is embedded at the inlet and the outlet of the circulating air duct (4);
the outer surfaces of the aluminum finned radiator (302) and the heat pipe finned radiator (303) are coated with heat conduction silicone layers (305) for reducing thermal resistance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810681978.7A CN108550475B (en) | 2018-06-27 | 2018-06-27 | Film capacitor production is with heat abstractor's circulating refrigeration device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810681978.7A CN108550475B (en) | 2018-06-27 | 2018-06-27 | Film capacitor production is with heat abstractor's circulating refrigeration device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108550475A CN108550475A (en) | 2018-09-18 |
| CN108550475B true CN108550475B (en) | 2020-07-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810681978.7A Active CN108550475B (en) | 2018-06-27 | 2018-06-27 | Film capacitor production is with heat abstractor's circulating refrigeration device |
Country Status (1)
| Country | Link |
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| CN (1) | CN108550475B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114420452B (en) * | 2022-02-10 | 2023-10-31 | 北京国家新能源汽车技术创新中心有限公司 | Structure of thin film capacitor and heat dissipation method |
| CN114899013B (en) * | 2022-05-26 | 2024-01-16 | 安徽联盈控电子科技有限公司 | Aluminum electrolytic capacitor with small transmission energy consumption and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001057322A (en) * | 1999-08-18 | 2001-02-27 | Matsushita Electric Ind Co Ltd | Solid-electrolyte-layer forming apparatus for solid electrolytic capacitor |
| CN1535383A (en) * | 2000-10-24 | 2004-10-06 | 液体空气乔治洛德方法利用和研究的具 | Metod and apparatus for recycling cryogenic liquid or gas from test chambers |
| CN203068872U (en) * | 2013-01-21 | 2013-07-17 | 合肥京东方光电科技有限公司 | Semiconductor auxiliary refrigerating system |
| CN206073496U (en) * | 2016-09-23 | 2017-04-05 | 张怀 | A kind of water cooling radiator for semiconductor |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2542999Y (en) * | 2002-04-23 | 2003-04-02 | Tcl集团有限公司 | Thermoelectric refrigerator using forced ventilation and forced circulation radiating |
| CN201149352Y (en) * | 2007-12-21 | 2008-11-12 | 中国人民解放军总装备部航天医学工程研究所 | Apparatus for controlling cultivation temperature of space plant |
| CN203478683U (en) * | 2013-07-05 | 2014-03-12 | 赖耀华 | Semiconductor cooler |
-
2018
- 2018-06-27 CN CN201810681978.7A patent/CN108550475B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001057322A (en) * | 1999-08-18 | 2001-02-27 | Matsushita Electric Ind Co Ltd | Solid-electrolyte-layer forming apparatus for solid electrolytic capacitor |
| CN1535383A (en) * | 2000-10-24 | 2004-10-06 | 液体空气乔治洛德方法利用和研究的具 | Metod and apparatus for recycling cryogenic liquid or gas from test chambers |
| CN203068872U (en) * | 2013-01-21 | 2013-07-17 | 合肥京东方光电科技有限公司 | Semiconductor auxiliary refrigerating system |
| CN206073496U (en) * | 2016-09-23 | 2017-04-05 | 张怀 | A kind of water cooling radiator for semiconductor |
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| Publication number | Publication date |
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| CN108550475A (en) | 2018-09-18 |
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