CN210328377U

CN210328377U - Easy heat dissipation type network server

Info

Publication number: CN210328377U
Application number: CN201920865779.1U
Authority: CN
Inventors: 崔梦; 高栋; 崔莉; 郑丽娟
Original assignee: Shijiazhuang Tiedao University
Current assignee: Shijiazhuang Tiedao University
Priority date: 2019-06-11
Filing date: 2019-06-11
Publication date: 2020-04-14
Anticipated expiration: 2029-06-11

Abstract

The utility model discloses an easy heat dissipation type network server, belonging to the technical field of detection tools, comprising a cabinet, wherein electronic elements in the cabinet are arranged in layers, and each layer of electronic elements is arranged on a heat dissipation component; be equipped with the cabinet door that can open and shut around the rack, the left side of rack is equipped with fan and primary filter, the right side of rack is equipped with the air exit. The utility model arranges the heat dissipation components in the cabinet in a layered way, and the electronic elements arranged on the heat dissipation components dissipate heat and cool through the heat dissipation components; utilize the left fan of rack and right side air exit to form airflow channel, improve the air mobility in the rack, further improve the radiating effect, filter the air that gets into in the rack with the help of the primary filter simultaneously, avoid the dust to get into the rack and adsorb and influence its cooling on the electronic component surface. The utility model discloses can effectively cool down the dust removal to the server, protect the inside electronic component of rack, guarantee server normal operating.

Description

Easy heat dissipation type network server

Technical Field

The utility model belongs to the technical field of the detection instrument, especially, relate to an easy heat dissipation type network server.

Background

With the rapid development of the internet, a large amount of data storage and calculation are required to be completed by an application server. Because server equipment mostly needs 24 hours uninterrupted operation, calorific value is very big conceivably, and the operating efficiency can seriously be influenced to the operating temperature of server too high, and serious can lead to equipment to destroy. At present, the common cooling mode is to utilize an air conditioner to reduce the indoor temperature or improve the indoor layout for reasonable heat dissipation. However, although these cooling measures are adopted, since the server equipment generates high voltage and static electricity during operation, dust in the air can be attracted and covered on the electronic components, so that the heat dissipation capability of the electronic components is reduced, the server still has an over-temperature phenomenon due to long-term accumulation of heat, and once the over-temperature phenomenon occurs, the system is closed, the work task is transferred, and the work efficiency of the server is seriously affected.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing an easy heat dissipation type network server aims at solving the problem among the above-mentioned prior art.

In order to solve the technical problem, the utility model discloses the technical scheme who takes is:

an easy-heat-dissipation network server comprises a cabinet, wherein electronic elements in the cabinet are arranged in a layered mode, and each layer of electronic elements is arranged on a heat dissipation assembly; be equipped with the cabinet door that can open and shut around the rack, the left side of rack is equipped with fan and primary filter, the right side of rack is equipped with the air exit.

Preferably, the radiating component comprises a radiator main body, a liquid inlet header pipe and a liquid outlet header pipe, wherein the liquid inlet header pipe and the liquid outlet header pipe are respectively connected with the refrigerating device, the inner cavity of the radiator main body is provided with a plurality of rows of radiating fins in parallel, the inlet ends of the plurality of rows of radiating fins are communicated with the liquid inlet header pipe, and the outlet ends of the plurality of rows of radiating fins are communicated with the liquid outlet header pipe.

Preferably, the refrigerant main pipe of the refrigerating device is communicated with the liquid inlet main pipe of the multilayer heat dissipation assembly through a refrigerant pump, and the liquid outlet main pipe of the multilayer heat dissipation assembly is communicated with the refrigerating device through a return pipe.

Preferably, the radiating fins are coiled serpentine pipes and are formed by winding copper pipes in a zigzag mode.

Preferably, the outer wall of the serpentine coil is uniformly provided with a plurality of fins.

Preferably, the filter material in the primary filter is a non-woven fabric.

Preferably, the air outlet is formed by superposing and arranging a plurality of rows of louver blades from top to bottom.

Preferably, the louver blades comprise rotating shafts and strip plate-shaped blades, ribs are arranged at the lower ends of the blades, and the ribs of the upper blades are lapped on the outer sides of the rotating shafts of the lower blades.

Preferably, the heat dissipation assembly is a semiconductor refrigeration piece, the hot end of the semiconductor refrigeration piece extends to the outer side of the cabinet, and the cold end of the semiconductor refrigeration piece faces towards the inner cavity of the cabinet.

Preferably, a cabinet door of the cabinet is provided with a hollow interlayer, and sound insulation cotton is filled in the interlayer.

Adopt the produced beneficial effect of above-mentioned technical scheme to lie in: compared with the prior art, the heat dissipation component is arranged in the cabinet in a layered manner, and the electronic elements arranged on the heat dissipation component dissipate heat and cool through the heat dissipation component; utilize the left fan of rack and right side air exit to form airflow channel, improve the air mobility in the rack, further improve the radiating effect, filter the air that gets into in the rack with the help of the primary filter simultaneously, avoid the dust to get into the rack and adsorb and influence its cooling on the electronic component surface. The utility model discloses can effectively cool down the dust removal to the server, protect the inside electronic component of rack, guarantee server normal operating.

Drawings

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

Fig. 1 is a schematic structural diagram of an easy-to-dissipate network server according to an embodiment of the present invention;

FIG. 2 is a top view of FIG. 1;

fig. 3 is a heat dissipation diagram of the heat dissipation assembly of the present invention;

FIG. 4 is a schematic structural diagram of the heat sink assembly of FIG. 3;

FIG. 5 is an enlarged view of a portion of FIG. 1 at A;

FIG. 6 is a right side view of the louvres of FIG. 1;

in the figure: 1-cabinet, 2-heat dissipation assembly, 3-fan, 4-primary filter, 5-radiator body, 6-liquid inlet manifold, 7-liquid outlet manifold, 8-refrigerating device, 9-heat dissipation sheet, 10-refrigerant manifold, 11-refrigerant pump, 12-return pipe, 13-fin, 14-louver, 15-rotating shaft, 16-blade and 17-rib.

Detailed Description

The technical solutions in the embodiments of the present invention are clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1 and 2, the network server with easy heat dissipation includes a cabinet 1, wherein electronic elements in the cabinet 1 are arranged in layers, and each layer of electronic elements is arranged on a heat dissipation assembly 2; be equipped with the cabinet door 101 that can open and close around rack 1, the left side of rack 1 is equipped with fan 3 and primary filter 4, the right side of rack 1 is equipped with the air exit. Electronic elements in the server cabinet are cooled through heat dissipation of the heat dissipation assembly; an airflow channel is formed between the fan on the left side of the cabinet and the air outlet on the right side of the cabinet, so that the air fluidity in the cabinet is improved, and the heat dissipation effect is further improved; the primary filter filters the air entering the cabinet, so that the dust is prevented from entering the cabinet and being adsorbed on the surface of the electronic element to influence the cooling of the electronic element, and the normal operation of the server is ensured.

In the utility model discloses a preferred embodiment, as shown in fig. 3, radiator unit 2 includes radiator main body 5, inlet manifold 6 and play liquid house steward 7, inlet manifold 6 links to each other with refrigerating plant 8 respectively with play liquid house steward 7, 5 inner chambers of radiator main body are equipped with multirow fin 9 side by side, and the entrance point and the inlet manifold 6 intercommunication of multirow fin 9, the exit end and the play liquid house steward 7 intercommunication of multirow fin 9. The refrigerant header pipe 10 of the refrigeration device 8 is communicated with the liquid inlet header pipe 6 of the multilayer heat dissipation assembly 9 through a refrigerant pump 11, and the liquid outlet header pipe 7 of the multilayer heat dissipation assembly 9 is communicated with the refrigeration device 8 through a return pipe 12. The top plate and the bottom plate of the radiator main body are both made of copper plates, a plurality of rows of radiating fins are tightly attached to the top plate and the bottom plate, and heat conduction is realized by using high-temperature-resistant and good-heat-conductivity materials such as the copper plates. Refrigerant enters the radiating fins connected in parallel through the refrigerant header pipe under the action of a refrigerant pump, the electronic element generates a large amount of heat in the operation process and exchanges heat with the refrigerant through the radiator main body, the refrigerant is evaporated into refrigerant vapor when meeting heat in the flowing process of the refrigerant, so that the refrigerant vapor in the rows of radiating fins flows out of the liquid outlet header pipe and enters the refrigerating device through the return pipe to be refrigerated. The refrigeration device usually uses a compressor, a condenser and a throttle valve to realize the refrigeration cycle. Arrows in fig. 1 indicate the flowing direction of the refrigerant, the refrigerant is respectively conveyed to the heat dissipation assemblies connected in parallel through the upper refrigerant header pipe, and the heat dissipation assemblies in each layer flow back to the refrigerating device through the return pipe for circulating refrigeration.

In an embodiment of the present invention, as shown in fig. 4, the heat sink 9 is a serpentine coil pipe formed by winding a copper pipe in a zigzag manner. Wherein, the outer wall equipartition of serpentine coil is equipped with a plurality of fin 13. The serpentine coil with the fins can enlarge the heat dissipation area and further accelerate the heat exchange speed.

Further optimize above-mentioned technical scheme, as shown in fig. 1, 2, the filtering material in the primary filter 4 is the non-woven fabrics, and the non-woven fabrics can be washed repeatedly, conveniently changes increase of service life.

As a preferable scheme, as shown in fig. 1, 5 and 6, the air outlet is formed by stacking and arranging a plurality of rows of louvers 14 from top to bottom. The louver 14 comprises a rotating shaft 15 and a strip-shaped plate-shaped vane 16, wherein a rib 17 is arranged at the lower end of the vane 16, and the rib 17 of the upper vane 16 is lapped outside the rotating shaft 15 of the lower vane 16. After the fan is started, the air flow in the cabinet is accelerated, the air flow enters from the left side of the cabinet and is discharged from the right side air outlet, and the louver blades are opened under the action of the air flow, so that the heat dissipation efficiency of the electronic element is further improved; when the fan stops operating, under the action of gravity, the adjacent blades are sequentially lapped, so that external sundries can be prevented from entering the server cabinet, and internal electronic elements are effectively protected.

The utility model discloses a in another embodiment, radiator unit 2 is the semiconductor refrigeration piece, the hot junction of semiconductor refrigeration piece extends to the outside of rack, the cold junction of semiconductor refrigeration piece is towards 1 inner chamber of rack. The semiconductor refrigerating sheet can share a power supply with the fan, and the semiconductor refrigerating sheet utilizes the Peltier effect of semiconductor materials, so that when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, and the aim of refrigeration is fulfilled. In order to reach lower temperature, the fan can be installed on the side wall of the cabinet between the cold end and the hot end of the semiconductor refrigeration piece, the fan is started, the air flow rate inside and outside the cabinet can be accelerated, the heat dissipation speed of the hot end is improved, and then the purpose of low temperature is achieved by reducing the temperature of the hot end of the semiconductor refrigeration piece.

The server can produce very big noise at the operation in-process, has the cavity intermediate layer with cabinet door 101 design of rack 1 to pack soundproof cotton in the intermediate layer, come noise absorption with the help of soundproof cotton, reduce the noise pollution to the surrounding environment.

In the above description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be implemented in other ways different from the one described herein, and those skilled in the art may similarly generalize the present invention without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed above.

Claims

1. The utility model provides an easy heat dissipation type network server which characterized in that: the electronic components in the cabinet are arranged in layers, and each layer of electronic components is arranged on the heat dissipation assembly; be equipped with the cabinet door that can open and shut around the rack, the left side of rack is equipped with fan and primary filter, the right side of rack is equipped with the air exit.

2. The easy heat dissipation type network server according to claim 1, characterized in that: the heat dissipation assembly comprises a radiator main body, a liquid inlet header pipe and a liquid outlet header pipe, wherein the liquid inlet header pipe and the liquid outlet header pipe are respectively connected with the refrigerating device, a plurality of rows of cooling fins are arranged in the inner cavity of the radiator main body in parallel, the inlet ends of the plurality of rows of cooling fins are communicated with the liquid inlet header pipe, and the outlet ends of the plurality of rows of cooling fins are communicated with the liquid outlet header pipe.

3. A heat dissipating network server as recited in claim 2, wherein: the refrigerant main pipe of the refrigerating device is communicated with the liquid inlet main pipe of the multilayer heat dissipation assembly through a refrigerant pump, and the liquid outlet main pipe of the multilayer heat dissipation assembly is communicated with the refrigerating device through a return pipe.

4. A heat dissipating network server as recited in claim 2, wherein: the radiating fins are coiled serpentine pipes and are formed by winding copper pipes in a zigzag mode.

5. The easy-to-dissipate network server of claim 4, wherein: and a plurality of fins are uniformly distributed on the outer wall of the serpentine coil.

6. The easy heat dissipation type network server according to claim 1, characterized in that: the filtering material in the primary filter is non-woven fabric.

7. The easy heat dissipation type network server according to claim 1, characterized in that: the air outlet is formed by superposing and arranging a plurality of rows of louver blades from top to bottom.

8. A heat dissipating network server as recited in claim 7, wherein: the louver blades comprise rotating shafts and strip plate-shaped blades, convex edges are arranged at the lower ends of the blades, and the convex edges of the upper blades are in lap joint with the rotating shafts of the lower blades.

9. The easy heat dissipation type network server according to claim 1, characterized in that: the heat radiation assembly is a semiconductor refrigeration piece, the hot end of the semiconductor refrigeration piece extends to the outer side of the cabinet, and the cold end of the semiconductor refrigeration piece faces towards the inner cavity of the cabinet.

10. A heat dissipating network server as recited in any of claims 1-9 wherein: the cabinet door of the cabinet is provided with a hollow interlayer, and sound insulation cotton is filled in the interlayer.