CN218764146U

CN218764146U - Semiconductor refrigeration refrigerator with internal heat exchange enhancement function

Info

Publication number: CN218764146U
Application number: CN202222493711.XU
Authority: CN
Inventors: 姜鹏; 刘国涛; 包信和
Original assignee: Dalian Institute of Chemical Physics of CAS
Current assignee: Dalian Institute of Chemical Physics of CAS
Priority date: 2022-09-20
Filing date: 2022-09-20
Publication date: 2023-03-28
Anticipated expiration: 2032-09-20

Abstract

The utility model discloses an inside semiconductor refrigeration refrigerator of reinforceing heat transfer, the refrigerator includes inside heat transfer device, semiconductor refrigeration module, outside water-cooling heat abstractor, lagging casing and heat preservation door of reinforceing. The internal enhanced heat exchange device comprises a cold guide inner container, a folded fin heat exchanger and a heat exchange fan, wherein the folded fin heat exchanger is welded or fixed on the inner wall of the cold guide inner container, a plurality of inward bulges are processed on the side wall of the cold guide inner container, and the heat exchange fan is a cross flow fan arranged above and below the folded fin heat exchanger or an axial flow fan arranged on the front surface of the folded fin radiator. The technical scheme of the utility model, inside heat transfer means that reinforces passes through folding sheet heat exchanger and protruding structure increase semiconductor refrigerator's in limited space cold area of leading and force convection heat transfer effect, helps the release of semiconductor refrigerator cold energy, has greatly promoted semiconductor refrigerator's efficiency.

Description

Semiconductor refrigeration refrigerator with internal heat exchange enhancement function

Technical Field

The utility model relates to a semiconductor refrigeration refrigerator technical field particularly, especially relates to a semiconductor refrigeration refrigerator of heat transfer is reinforceed to inside.

Background

Compared with the traditional compressor refrigerating refrigerator, the semiconductor refrigerating refrigerator has the advantages of no need of refrigerating working media and mechanical moving parts, environmental protection and no noise.

However, the direct refrigerating area of the semiconductor refrigerating device is small, the refrigerating capacity needs to be quickly and efficiently transferred to the interior of a large-scale refrigerator, the existing semiconductor refrigerating refrigerator technology in the market mostly adopts the form of heat conduction of a metal liner or a heat conduction pipe for heat exchange, and the problems of low conduction efficiency, slow cooling efficiency of the refrigerator or uneven temperature distribution in the refrigerator exist, so that the semiconductor refrigerating refrigerator with the internal heat exchange enhancement is needed.

SUMMERY OF THE UTILITY MODEL

In light of the above-mentioned technical problems in the background art, a semiconductor refrigerator with enhanced heat exchange inside is provided. The utility model discloses mainly set up inside heat transfer device that reinforces to play the cooling efficiency that improves semiconductor refrigeration refrigerator, solve the inhomogeneous problem of inside temperature distribution.

The utility model discloses a technical means as follows:

a semiconductor refrigerator with internal enhanced heat exchange comprises an internal enhanced heat exchange device; the internal heat transfer enhancement device comprises: the cold guide inner container, the folded fin heat exchanger and the heat exchange fan are arranged in the heat exchanger; the cold guide inner container is provided with a plurality of inward protruding structures, and a plurality of semiconductor module mounting grooves are dispersedly formed in the back of the cold guide inner container.

Furthermore, the folded sheet heat exchanger is formed by stacking metal sheets and is welded or fixed on the inner wall of the cold guide inner container through a heat conducting medium; the heat exchange fan is a cross flow fan which is arranged above and below the folded fin heat exchanger to absorb the cold energy of the folded fin heat exchanger and release cold air to the interior of the refrigerator, or the heat exchange fan is an axial flow fan which is arranged on the front side of the folded fin heat radiator to absorb the cold energy of the folded fin heat exchanger and release the cold air to the interior of the refrigerator.

Compared with the prior art, the utility model has the advantages of it is following:

the utility model discloses inside heat transfer device of reinforceing helps the release of semiconductor refrigeration module cold energy, and the cooling rate that can effectual promotion refrigerator reduces the consumption of electric energy simultaneously. The circular bulge on the cold conduction inner container can greatly increase the heat exchange area of the inner container and does not influence the effective volume in the refrigerator; the folded sheet heat exchanger has light weight, large area and small occupied space, and is matched with a heat exchange fan to pass through two schemes: the heat exchange fan is a cross flow fan which is arranged above and below the folded fin heat exchanger to absorb the cold energy of the folded fin heat exchanger and release cold air to the interior of the refrigerator, or the heat exchange fan is an axial flow fan which is arranged on the front side of the folded fin radiator to absorb the cold energy of the folded fin heat exchanger and release the cold air to the interior of the refrigerator, the heat exchange effect in the interior of the refrigerator is enhanced in a forced convection heat exchange mode, each part in the interior of the refrigerator can be cooled uniformly, and the defects that the cold end of a refrigeration module of the semiconductor refrigeration refrigerator is seriously frosted, the cold energy is slowly accumulated and released, and the temperature in the refrigerator is uneven are overcome;

the water tank of the external water-cooling heat dissipation device is arranged below the refrigerator, the water-cooling rows are arranged on two sides of the water tank, the water-cooling plate and the water pipe are tightly attached to the back of the refrigerator for installation, the occupied space is small, the heat dissipation capability is strong, and compared with an external air-cooling heat dissipation mode, the external water-cooling heat dissipation device can stably control the hot end of the semiconductor refrigeration module at a lower temperature for a long time under various use environments such as high temperature, high humidity and the like, so that the semiconductor refrigeration module is in a high-efficiency refrigeration state;

the utility model relates to an inside semiconductor refrigeration refrigerator of intensifying heat transfer refrigerating capacity is strong, and the refrigeration temperature scope can be low to below 0 ℃, has certain refrigeration effect, and cooling rate is fast.

Drawings

In order to clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive labor.

Fig. 1 is a schematic diagram of the front internal structure of the semiconductor refrigerator with heat exchange enhancement.

Fig. 2 is a schematic diagram of a back structure of the semiconductor refrigerator with heat exchange enhancement inside of the present invention.

Fig. 3 is a schematic side view of the semiconductor refrigerator with heat exchange enhancement in the invention.

Fig. 4 is a schematic view of the structure of the folded fin heat sink of the semiconductor refrigerator with heat exchange enhanced inside.

Fig. 5 is a test result diagram of embodiment 1 of the semiconductor refrigerator with heat exchange enhanced inside according to the present invention.

In the figure: 101. cooling the inner container; 102. a folded sheet heat exchanger; 103. a heat exchange fan; 104. a raised structure on the cold conduction inner container; 201. the external water-cooling heat dissipation device comprises a water-cooling plate 202, a water tank 203, a water pump 204, a water-cooling row 205, a water pipe 300, a semiconductor refrigeration module 400, a heat preservation shell and a heat preservation door.

Detailed Description

In order to make the technical solution of the present invention better understood, the technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.

It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

Example 1

Fig. 1 is a schematic view of the front internal structure of a semiconductor refrigerator with internal heat exchange enhancement according to an embodiment of the present invention, which mainly includes a cold guiding inner container of a 101 internal heat exchange enhancement device, a 102 folded-sheet heat exchanger, a 103 heat exchange fan, and a 104 protruding structure on the cold guiding inner container. Lead cold inner bag and be dark 250mm, wide 250mm, high 320mm, wall thickness 0.5 mm's casing of aluminum alloy material, lead cold inner bag lateral wall punching press and form a plurality of inward circular archs of about 1mm of height, about 18L of the inside effective volume of refrigerator. The aluminum alloy material is light and easy to process, has good cold conduction capability, can rapidly transmit the cold energy of the semiconductor refrigeration module to each part of the inner container, and the circular bulge on the cold conduction inner container can greatly increase the heat exchange area of the inner container and does not influence the effective volume of the refrigerator, thereby strengthening the heat exchange effect inside the refrigerator and more efficiently releasing the cold energy to the air inside the refrigerator and the refrigerated objects. Fig. 4 folding fin heat exchanger is piled up by the punching press of thickness 0.2 mm's aluminum alloy thin slice and forms, length 300mm, width 200mm, height 20mm, the lamination clearance is triangle-shaped, the topside interval is about 6mm, this folding fin radiator quality is light, moreover, the steam generator is stable in structure, heat radiating area is big, glue folding fin heat exchanger on the inner wall of leading cold inner bag through heat conduction silica gel, its scope covers the semiconductor refrigeration module that the back set up, the heat transfer fan is two length 300 mm's crossflow blower, absorb folding fin heat exchanger's cold volume and blow air conditioning to the refrigerator inside and on the refrigerated goods, the heat transfer effect inside the refrigerator is strengthened to the mode through forced convection heat transfer, and make all spaces inside the refrigerator fast, cool down uniformly, the frosting problem does not appear because of cold volume gathering in refrigeration module cold junction.

Fig. 2 is a schematic view of an external back structure of a semiconductor refrigerator with internal heat exchange enhancement according to an embodiment of the present invention, which mainly includes a water cooling plate 201 of an external water cooling device, a 202 water tank, a 203 water pump, a 204 water cooling row, and a 205 water pipe. The volume of the water tank is about 12L, the semiconductor refrigeration module can be suitable for various cooling liquids, tap water is used as cooling water in the embodiment, the cooling water is lifted into a water cooling plate attached to the hot end of the semiconductor refrigeration module through an 8W water pump, heat generated by the semiconductor refrigeration module is absorbed, the cooling water flows through a water cooling drain at the bottom of the refrigerator and then returns into the water tank for next circulation, a radiating grid is arranged on the side face of the refrigerator at the installation position of the water cooling drain, the cooling liquid can rapidly release heat in a long water pipe and the water cooling drain, the hot end of the semiconductor refrigeration module can be stably controlled at a low temperature for a long time at a high environmental temperature, and the cooling liquid in the water tank can be maintained within 35 ℃ in the whole working period of the refrigerator at the room temperature of 25-32 ℃, so that the semiconductor refrigeration module is in an efficient refrigeration state, and the refrigeration capacity cannot be weakened due to temperature fluctuation of the hot end.

Fig. 3 is a schematic side view of the semiconductor refrigerator with heat exchange enhancement inside of the present invention, which mainly comprises a 300 semiconductor refrigeration module, a 400 thermal insulation casing and a thermal insulation door. The 300 semiconductor refrigeration module is formed by connecting four 4cm multiplied by 4cm semiconductor refrigeration devices in series in the embodiment, the four semiconductor refrigeration devices are divided into an upper group and a lower group, each group comprises two pieces, the two pieces are installed in an installation groove in the back of the cold conduction inner container, in order to enable the refrigeration module to work efficiently, heat conduction silicone grease is evenly coated on the cold end and the hot end of the refrigeration module to reduce interface thermal resistance, and the cold conduction inner container, the refrigeration module and the water cooling plate are tightly installed through bolts. The 400 heat preservation shell and the heat preservation door are made of aluminum alloy structures as shells in the embodiment, and a heat preservation layer is formed between the shells and the outer wall of the cold conduction inner container through filling foaming materials.

The working method and the refrigerating effect of the semiconductor refrigerator with the internal heat transfer enhancement function are as follows: the power supply of the refrigerator is switched on, the semiconductor refrigeration module, the water pump and the heat exchange fan work simultaneously, wherein the power of the semiconductor refrigeration module is 100W, the power of the water pump is 8W, the power of the heat exchange fan is 2.4W, and 10 bottles of 380ml mineral water in each bottle are placed in the refrigerator as a measured object. Inside the refrigerator, the cold volume that semiconductor refrigeration module cold junction produced at first leads cold inner bag and folding fin radiator transmission to the aluminum alloy with heat-conduction form, makes the two temperature reduce rapidly, and the cold volume is released to refrigerator inner space to the protruding structure on metal leads cold inner bag and, secondly, folding fin radiator is under the blowing of heat transfer fan with the heat transfer of force convection mode strengthening the inside heat transfer of refrigerator, blows the cold gas to the inside determinand of refrigerator, makes the inside cooling of refrigerator rapidly, even. Outside the refrigerator, the cooling water in the water tank is driven by the water pump to flow through the water cooling plate, the heat generated at the hot end of the semiconductor refrigeration module is taken away, the heated circulating water flows through the water cooling plate again to dissipate heat and cool, and finally flows back to the water tank to dissipate heat in the next circulation. Therefore, the temperature in the refrigerator is rapidly reduced, the inner wall of the cold conducting inner container in the refrigerator, the folded fin radiator and the measured object can be reduced to 0 ℃, the external water-cooling heat dissipation device is always maintained at 35 ℃ to keep the semiconductor refrigeration module always in a good working state with the power of 100W, the performance attenuation is avoided, the test result of the refrigerator is shown in figure 5, 10L of the measured object can be reduced to 5 ℃ from 27 ℃ within 2.5 hours, and can be reduced to below 0 ℃ within 6 hours, and the temperature reduction effect is extremely strong.

The above embodiment numbers of the present invention are only for description, and do not represent the advantages and disadvantages of the embodiments.

In the above embodiments of the present invention, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to the related descriptions of other embodiments. In the embodiments provided in the present application, it should be understood that the disclosed technology can be implemented in other ways.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.

Claims

1. The semiconductor refrigeration refrigerator with the internal enhanced heat exchange is characterized by comprising an internal enhanced heat exchange device;

the internal heat transfer enhancement device comprises: the cold guide inner container, the folded fin heat exchanger and the heat exchange fan are arranged in the heat exchanger;

the cooling guide inner container is provided with a plurality of inward protruding structures, and the back of the cooling guide inner container is provided with a plurality of semiconductor module mounting grooves in a dispersed manner;

the folded sheet heat exchanger is formed by stacking metal sheets and is welded or fixed on the inner wall of the cold guide inner container through a heat conducting medium;

the heat exchange fan is a cross flow fan which is arranged above and below the folded sheet heat exchanger to absorb the cold energy of the folded sheet heat exchanger and release cold air to the interior of the refrigerator, or the heat exchange fan is an axial flow fan which is arranged on the front side of the folded sheet heat exchanger to absorb the cold energy of the folded sheet heat exchanger and release the cold air to the interior of the refrigerator.

2. The semiconductor refrigeration refrigerator with the internal heat exchange enhancement function according to claim 1, wherein the semiconductor refrigeration refrigerator is further provided with an external water-cooling heat dissipation device;

the external water-cooling heat dissipation device comprises: water-cooling board, water-cooling row, water tank, water pump and water pipe.

3. The semiconductor refrigeration refrigerator with the internal heat exchange enhancement function according to claim 1, wherein the semiconductor refrigeration refrigerator is further provided with a semiconductor refrigeration module; the semiconductor refrigeration module is arranged in a mounting groove at the back of the cold guide inner container, the cold end of the semiconductor refrigeration module is attached to the cold guide inner container, and the hot end of the semiconductor refrigeration module is attached to a water cooling plate of an external water-cooling heat dissipation system.

4. The semiconductor refrigeration refrigerator with the internal heat exchange enhancement function according to claim 1, wherein the semiconductor refrigeration refrigerator is further provided with a heat preservation shell; the heat preservation shell is made of heat insulation plastic and filled with foaming agent, and a heat preservation layer is formed between the cold guide inner containers of the internal reinforced heat exchange device.

5. The semiconductor refrigeration refrigerator with the internal heat exchange enhancement function as claimed in claim 2, wherein a water tank of the external water-cooling heat dissipation device is arranged below the cold guide inner container, the water-cooling rows are arranged on two sides of the water tank, and a water-cooling heat dissipation grid is arranged on a lower shell of the refrigerator at a position corresponding to the water-cooling rows.

6. The semiconductor refrigeration refrigerator with the internal heat exchange enhancement function as claimed in claim 2, wherein the water pump of the external water-cooling heat dissipation device is externally arranged at the bottom of the water tank, and the water pipe is arranged in the heat preservation layer at the back of the refrigerator.