CN215295541U - Single water tank refrigerating device and beverage machine comprising same - Google Patents
Single water tank refrigerating device and beverage machine comprising same Download PDFInfo
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- CN215295541U CN215295541U CN202121421424.7U CN202121421424U CN215295541U CN 215295541 U CN215295541 U CN 215295541U CN 202121421424 U CN202121421424 U CN 202121421424U CN 215295541 U CN215295541 U CN 215295541U
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Abstract
The utility model provides a single water tank refrigerating device, which is used for a beverage machine and comprises a refrigerating water tank, a semiconductor refrigerating sheet and a first radiator, wherein the refrigerating end of the semiconductor refrigerating sheet exchanges heat with water in the refrigerating water tank; the first heat radiation body is arranged outside the refrigerating water tank and exchanges heat with the heating end of the semiconductor, and the first heat radiation body transfers heat out through air or liquid. The single-water-tank refrigerating device exchanges heat with a first heat radiation body outside the refrigerating water tank through the semiconductor refrigerating sheet, and takes away heat on the first heat radiation body in an air heat radiation or liquid heat radiation mode, so that heat exchange is realized; the semiconductor refrigerating sheet is adopted, so that the refrigerating efficiency is improved, and the quick refrigeration is realized; the device only adopts a single refrigeration water tank structure, does not have other large-size boxes for heat exchange, has simple structure and small occupied size, and is suitable for relatively small space in the beverage machine.
Description
Technical Field
The utility model relates to a refrigeration technology field, in particular to single water tank refrigerating plant and contain its drink machine.
Background
The existing refrigeration technology generally adopts a compression type refrigeration principle, occupies a large space and volume, has high noise, and is generally not suitable for products such as coffee machines and the like. At present, the great reason of the efficiency of semiconductor refrigeration is determined by the heat dissipation speed of a heating surface, the fan heat dissipation mode is common in the market, but the fan heat dissipation capacity is limited, some products have more strict requirements on refrigeration, the refrigerating capacity is high, the temperature is low, the time is short, the size is small, the noise is low, the high-power refrigerating piece cannot meet the requirements by simply adopting the fan to dissipate heat, and in order to save space, a refrigerating device needs to be made as small as possible to be arranged in a relatively small space in a beverage machine.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to provide a single water tank refrigerating plant in order to overcome prior art and be used for the refrigerating plant's of drink machine defect that the refrigeration speed is slow, bulky.
The utility model discloses an above-mentioned technical problem is solved through following technical scheme:
a single-water-tank refrigerating device comprises a refrigerating water tank, a semiconductor refrigerating sheet and a first heat radiation body,
the refrigerating end of the semiconductor refrigerating sheet exchanges heat with water in the refrigerating water tank;
the first radiator is arranged outside the refrigeration water tank, the first radiator is connected with the heating end of the semiconductor and performs heat exchange, and the first radiator transmits heat out through air or liquid.
In the scheme, the semiconductor refrigeration piece exchanges heat with a heat radiation body outside the refrigeration water tank, heat on the heat radiation piece is taken away in an air heat radiation or liquid heat radiation mode, and heat of hot water to be refrigerated in the refrigeration water tank is exchanged outside the refrigeration water tank, so that heat exchange is realized; the semiconductor is used as the material of the refrigerating sheet, so that the refrigerating efficiency is improved, and the quick refrigeration is realized; the single refrigeration water tank structure is adopted, other large-volume box bodies are not used for heat exchange, the structure is simple, the occupied size is small, and the refrigeration water tank is suitable for relatively small space in the beverage machine.
Preferably, the refrigerating water tank internally comprises a second radiator, the second radiator is connected with the semiconductor refrigerating sheet and performs heat exchange, and the internal structure of the second radiator is a porous structure or a multi-sheet structure.
In the scheme, the heat radiation area is increased through the heat radiation body with the porous or multi-sheet structure, and the heat exchange efficiency is favorably improved.
Preferably, the single water tank refrigerating device comprises at least 2 semiconductor refrigerating pieces, the refrigerating end of each semiconductor refrigerating piece is connected with at least one second radiator for heat exchange, and the heating end of each semiconductor refrigerating piece is connected with at least one first radiator.
In the scheme, the number of the semiconductor refrigerating pieces is increased, so that the refrigerating efficiency is improved; the number of radiators is increased, the radiating area is increased, and the radiating efficiency is improved.
Preferably, the single-water-tank refrigerating device further comprises a heat exchanger, wherein the heat exchanger is connected with an external water source and is connected with the heating end of the semiconductor refrigerating sheet and the first heat radiation body; and the water circulating in the heat exchanger exchanges heat between the heating end of the semiconductor refrigerating sheet and the first heat radiator.
In this scheme, between radiator and the semiconductor refrigeration piece outside the refrigeration water tank, set up this heat exchanger, realize liquid heat dissipation, compare in the air cooling, heat exchanger can take away the heat of the refrigeration end of semiconductor refrigeration piece by the water of circulation in it fast, has improved heat exchange efficiency.
Preferably, the single-water-tank refrigerating device further comprises a liquid-cooling circulation pipeline, an inlet and an outlet of the liquid-cooling circulation pipeline are connected with an external water source, and the heat of the heat exchanger is taken away by water circulating in the liquid-cooling circulation pipeline.
In this scheme, through liquid cooling circulating line, circulate hot water to heat exchanger's outside, improved heat exchanger's heat exchange efficiency.
Preferably, the single-tank refrigeration device further comprises a fluid pump, wherein the fluid pump is incorporated into the liquid cooling circulation pipeline and circulates water of an external water source together.
In the scheme, the fluid pump is adopted, so that the water flow in the liquid cooling circulation pipeline can be further accelerated, and the heat exchange is accelerated.
Preferably, the single-water-tank refrigerating device further comprises a temperature sensor, the temperature sensor is connected with the heat exchanger, and the temperature sensor senses the temperature of the heat exchanger and feeds back a temperature signal.
In this scheme, through temperature sensor, monitor heat exchanger's temperature to coordinate the start-up work of fluid pump, make and in time take away heat exchanger's heat, guarantee that the end of heating of the semiconductor refrigeration piece that is connected with heat exchanger can not be too hot, and influence the refrigeration efficiency of its refrigeration end.
Preferably, the single water tank refrigerating device further comprises at least one heat dissipation fan, and the heat dissipation fan dissipates heat of at least one first heat dissipation body.
In the scheme, the air around the heat dissipation body can be accelerated through the heat dissipation fan, heat is taken away, and the heat dissipation speed is improved.
Preferably, the first heat sink includes a first heat sink body and a bottom plate, an internal structure of the first heat sink body is a porous structure or a multi-sheet structure, and the first heat sink body is connected to the bottom plate; the bottom plate is connected with the heating end of the semiconductor refrigerating piece, and the area of the bottom plate is not smaller than that of the semiconductor refrigerating piece.
In this scheme, set up this porous or multichip heat radiation structure, effectively increased heat radiating area, the radiating efficiency is higher. The area relation of the bottom plate is set, so that the heat of the heating end of the semiconductor refrigerating sheet is absorbed to the maximum extent, and the heat conduction speed is facilitated.
Preferably, the second heat dissipation body comprises a second heat dissipation body and a connecting plate, the second heat dissipation body is of a porous structure or a multi-sheet structure, the second heat dissipation body is connected with the connecting plate, and the connecting plate is connected with the refrigerating end of the semiconductor refrigerating sheet; the area of the connecting plate is not smaller than that of the semiconductor refrigerating sheet.
In this scheme, set up the area relation of this connecting plate, guarantee to absorb the heat of the refrigeration end of semiconductor refrigeration piece in the at utmost, be favorable to heat conduction speed.
A beverage machine comprising a single tank refrigeration unit as described above.
In this scheme, this single water tank refrigerating plant is adopted to the drink machine, when realizing quick refrigeration effect, simple structure, occupation space is little, can settle in the drink built-in relatively less space.
The utility model discloses an actively advance the effect and lie in: this single water tank refrigerating plant and contain its drink machine has realized quick refrigerated effect to the structure is simple relatively, and occupation space is little, is applicable to the relatively less space in the drink machine.
Drawings
Fig. 1 is a schematic structural view of a single water tank refrigeration device according to embodiment 1 of the present invention.
Fig. 2 is a top view of fig. 1.
Fig. 3 is a cross-sectional view taken along a-a of fig. 1.
Fig. 4 is an enlarged view of a portion D in fig. 3.
Fig. 5 is a sectional view taken along the direction B-B of fig. 2.
Fig. 6 is a cross-sectional view taken along the direction C-C of fig. 2.
Fig. 7 is a schematic structural view of a single water tank refrigeration device according to embodiment 2 of the present invention.
Fig. 8 is an internal structural schematic diagram of the refrigeration water tank according to embodiment 2 of the present invention.
Fig. 9 is a sectional view taken along the direction E-E of fig. 8.
Fig. 10 is a left side view of fig. 8.
Description of reference numerals:
a refrigerating water tank 1, a semiconductor refrigerating sheet 4, a refrigerating end 41, a heating end 42,
the first heat radiating body 2, the second heat radiating body 3, the heat radiating fin 5, the bottom plate 51, the connecting plate 52, the pipe hole 53,
Detailed Description
The present invention will be more clearly and completely described below with reference to the accompanying drawings.
Example 1
As shown in fig. 1 and fig. 2, the present invention provides a single water tank refrigeration device, which is characterized in that it includes a refrigeration water tank 1, a semiconductor refrigeration sheet 4, a first heat dissipation body 2 and a heat exchanger 10, in this embodiment, the first heat dissipation body 2 is a heat dissipation body with a multi-sheet structure, and includes a plurality of heat dissipation sheets 5 and a bottom plate 51; the refrigerating end 41 of the semiconductor refrigerating sheet 4 exchanges heat with the water in the refrigerating water tank 1; the first heat radiator 2 is arranged outside the refrigeration water tank 1, the plurality of heat radiating fins 5 of the first heat radiator 2 exchange heat with one side of the heat exchanger 10, then the other side of the heat exchanger 10 is connected with the heating end 42 of the semiconductor to exchange heat, and the heat radiating fins 5 transmit heat out through air or liquid.
The semiconductor refrigerating sheet 4 exchanges heat with a plurality of radiating fins 5 outside the refrigerating water tank 1, and the heat on the radiating fins 5 is taken away through air heat dissipation or liquid, so that the heat of hot water to be refrigerated in the refrigerating water tank 1 is exchanged outside the refrigerating water tank 1, and the heat exchange is realized; the semiconductor is used as the material of the refrigerating sheet, so that the refrigerating efficiency is improved, and the quick refrigeration is realized; through single refrigeration water tank structure, and do not have the box of other bulky for the heat exchange, simple structure occupies smallly, more is applicable to the less space relatively in the drink machine. In other embodiments, the first heat dissipation body 2 may also be porous or have other structural forms capable of achieving a heat dissipation effect.
As shown in fig. 2 to 4, the cooling water tank 1 includes 1 second heat sink 3, the second heat sink 3 is connected to the semiconductor cooling fin 4 and performs heat exchange, in this embodiment, the second heat sink 3 is a heat sink with a multi-sheet structure, and includes a plurality of heat dissipation fins 5 and a connection plate 52, and through the multi-sheet structure, the heat dissipation area is increased, which is beneficial to improving the heat exchange efficiency. Of course, in other embodiments, the internal structure of the second heat sink 3 may also be a porous structure or other structural forms capable of achieving a heat dissipation effect.
As shown in fig. 1, the single-water-tank refrigerating device comprises 2 semiconductor refrigerating fins 4 and 2 first heating bodies 2, wherein a refrigerating end 41 of each semiconductor refrigerating fin 4 is connected with a second heating body 3 of a multi-sheet structure for heat exchange, a heating end 42 of each semiconductor refrigerating fin 4 is connected with one side of a heat exchanger 10, and then the other side of the heat exchanger 10 is connected with the 2 first heating bodies 2. Compared with the situation that only a single semiconductor refrigerating sheet 4 and a single heat radiation body are adopted, 2 semiconductor refrigerating sheets 4 are preferably adopted in the embodiment, and the improvement of the refrigerating efficiency is facilitated; correspondingly, the first radiator 2 and the second radiator 3 adopt a plurality of radiating fins 5, so that the radiating area is increased, and the radiating efficiency is improved. In other embodiments, the number of the semiconductor cooling fins 4, the number of the first cooling bodies 2, the number of the cooling fins 5 thereof, the number of the second cooling bodies 3 and the number of the cooling fins 5 thereof can be adjusted accordingly according to the cooling efficiency, the cooling speed and the installation space size. Of course, the case of using a single semiconductor cooling plate 4, a single first heating body 2 or a single heat sink 5 in other embodiments is not excluded.
As shown in fig. 1 and 2, the water flowing through the heat exchanger 10 exchanges heat between the heating end 42 of the semiconductor cooling fin 4 and the plurality of fins 5 of the first radiator 2. On the basis of realizing air heat dissipation through the cooling fin 5, this embodiment preferably increases and sets up this heat exchanger 10 between cooling fin 5 and the semiconductor refrigeration piece 4 outside the refrigeration water tank 1, further adopts liquid heat dissipation, and it can take away the heat of the refrigeration end 41 of semiconductor refrigeration piece 4 by the water that circulates in it fast, has improved heat exchange efficiency.
As shown in fig. 1, the single-water-tank refrigerating device further comprises a liquid cooling circulation pipeline 6, an inlet 61 and an outlet 62 of the liquid cooling circulation pipeline 6 are connected with an external water source, and the heat of the heat exchanger is taken away by the water circulating in the liquid cooling circulation pipeline 6. The hot water is circulated to the outside of the heat exchanger 10 through the liquid cooling circulation line 6, thereby improving the heat exchange efficiency of the heat exchanger 10.
As shown in fig. 1, the single-tank cooling device further includes a fluid pump 7, and the fluid pump 7 is incorporated in the liquid-cooling circulation line 6 and circulates water of an external water source together. The fluid pump 7 is adopted to further accelerate the water flow in the liquid cooling circulation pipeline 6 and accelerate the heat exchange. In the present embodiment, the fluid pump 7 is a water pump, but in other embodiments, the medium circulating through the heat exchanger 10, the liquid cooling circulation line 6, and the fluid pump 7 may be other liquid medium that can achieve a better cooling effect, and therefore, the fluid pump 7 may also be a pump for other liquid medium.
As shown in fig. 1, the single-water-tank refrigerating device further comprises a temperature sensor 8, wherein the temperature sensor 8 is arranged between the heat exchanger 10 and the plurality of cooling fins 5 of the first cooling body 2 and is connected with the heat exchanger 10; the temperature sensor 8 senses the temperature of the heat exchanger 10 and feeds back a temperature signal. In implementation, the cooling efficiency of the semiconductor cooling plate 4 is mainly limited by the heating end 42 thereof, and the temperature of the heating end 42 exceeds the indoor temperature by 5-10 ℃, which will affect the cooling end 41. Therefore, by arranging the temperature sensor 8 on the heat exchanger 10, the temperature of the heat exchanger 10 is monitored, and the starting operation of the fluid pump 7 is coordinated, so that the heat of the heat exchanger 10 can be taken away in time, and the heating end 42 of the semiconductor refrigeration piece 4 connected with the heat exchanger 10 is ensured not to be too hot to influence the refrigeration efficiency of the refrigeration end 41 thereof.
As shown in fig. 1, the single water tank cooling device further includes 2 heat dissipation fans 9, wherein the 2 heat dissipation fans 9 respectively dissipate heat from the 2 first heat dissipation bodies 2, and a temperature signal fed back by the temperature sensor 8 is also used for coordinating the start or acceleration of the heat dissipation fans 9. In the present embodiment, 2 heat dissipation fans 9 are preferably used, which can accelerate the air around the heat dissipation fins 5, take away heat, and increase the heat dissipation speed, compared with the case of a single heat dissipation fan. Of course, in other embodiments, a single heat dissipation fan may be used to satisfy the heat dissipation effect.
As shown in fig. 2 and 5, in the first heat radiator 2, a plurality of heat radiation fins 5 are arranged in parallel and at intervals therebetween, and are all connected to the bottom plate 51; the area of the bottom plate 51 is as large as possible, contributing to heat exchange efficiency; the first heat sink 2 is provided with the porous or multi-piece heat dissipation structure, so that the heat dissipation area is effectively increased, and the heat dissipation efficiency is higher. In the present embodiment, the bottom plate 51 is connected to the heat exchanger 10 to perform heat exchange, but in other embodiments, there may be a case where the heat exchanger 10 is not provided and heat is radiated only by using the plurality of first radiators 2, in this case, the bottom plate 51 is connected to the heating end 42 of the semiconductor cooling sheet 4, and the area of the bottom plate 51 is not smaller than the area of the heating section 42 of the semiconductor cooling sheet 4. The area relation of the bottom plate 51 is set to ensure that the heat of the heating end 42 of the semiconductor chilling plate 4 is absorbed to the maximum extent, which is beneficial to the heat conduction speed.
As shown in fig. 2, 4 and 6, in the second heat radiating body 3, a plurality of heat radiating fins 5 are connected with a connecting plate 52, and the connecting plate 52 is connected with the cooling end 41 of the semiconductor cooling fin 4; the area of the connecting plate 52 is not smaller than the area of the cooling end 41 of the semiconductor cooling plate 4. The area relation of the connecting plate 52 is set to ensure that the heat of the refrigerating end 41 of the semiconductor refrigerating sheet 4 is absorbed to the maximum extent, which is beneficial to the heat conduction speed.
In this embodiment, the first heat sink 2 and the second heat sink 3 are both made of metal, but in other embodiments, other materials capable of achieving a heat dissipation effect may also be used.
In this embodiment, the operation steps and the refrigeration principle of the single-water-tank refrigeration device may be as follows:
when the semiconductor refrigerating sheet 4 starts to work, the cooling fan 9 is started, the fluid pump 7 does not start to work at the moment, when the temperature sensor 8 shows that the temperature of the heat exchanger 10 is higher than the room temperature by 5 ℃, the rotating speed of the cooling fan 9 is increased, the fluid pump 7 is started to work, the flow speed is increased along with the temperature rise, and water in the heat exchanger 10 flows in a circulating manner to take away heat on the heat exchanger 10.
Example 2
The difference between this example and example 1 is:
as shown in fig. 7 to 10, the internal structure of the second heat sink 3 is a porous structure, the second heat sink 3 includes a plurality of tube holes 53 and a connecting plate 52, the cooling water tank 1 includes 2 second heat sinks 3 having such porous structures, each second heat sink 3 is respectively connected to one semiconductor cooling plate 4 for heat exchange, and the heat sink having a porous structure can increase the heat dissipation area and is beneficial to improving the heat exchange efficiency.
In the embodiment, the heat exchanger 10, the liquid cooling circulation pipeline 6 and the fluid pump 7 are not provided, but 2 first heat dissipation bodies 2 are adopted for air heat dissipation, each first heat dissipation body 2 comprises a plurality of heat dissipation fins 5, the number of the heat dissipation fins 5 can be correspondingly adjusted according to heat dissipation requirements, and the heat dissipation structure is suitable for the situation that the heat dissipation requirements are not high.
In this embodiment, there is no heat dissipation fan 9, and of course, in the implementation, the heat dissipation fans 9 may be added as needed, and the number of the heat dissipation fans 9 may be adjusted.
Although specific embodiments of the present invention have been described above, it will be understood by those skilled in the art that this is by way of example only and that the scope of the invention is defined by the appended claims. Various changes and modifications to these embodiments may be made by those skilled in the art without departing from the spirit and the principles of the present invention, and these changes and modifications are all within the scope of the present invention.
Claims (11)
1. A single water tank refrigerating device is characterized by comprising a refrigerating water tank, a semiconductor refrigerating sheet and a first heat radiation body,
the refrigerating end of the semiconductor refrigerating sheet exchanges heat with water in the refrigerating water tank;
the first radiator is arranged outside the refrigeration water tank, the first radiator is connected with the heating end of the semiconductor and performs heat exchange, and the first radiator transmits heat out through air or liquid.
2. The single-tank refrigeration device according to claim 1, wherein the refrigeration tank includes a second heat sink, the second heat sink is connected to the semiconductor refrigeration sheet and performs heat exchange with the semiconductor refrigeration sheet, and an internal structure of the second heat sink is a porous structure or a multi-sheet structure.
3. The single-water-tank refrigerating device as claimed in claim 2, wherein the single-water-tank refrigerating device comprises at least 2 semiconductor refrigerating fins, the refrigerating end of each semiconductor refrigerating fin is connected with at least one second heat radiating body for heat exchange, and the heating end of each semiconductor refrigerating fin is connected with at least one first heat radiating body.
4. The single-water-tank refrigerating device as claimed in claim 1, further comprising a heat exchanger connected to an external water source and connected to the heating end of the semiconductor chilling plate and the first heat radiating body; and the water circulating in the heat exchanger exchanges heat between the heating end of the semiconductor refrigerating sheet and the first heat radiator.
5. The single tank chiller according to claim 4 further comprising a liquid cooling circuit, said liquid cooling circuit having an inlet and an outlet connected to an external source of water, said liquid cooling circuit having water circulating therein to remove heat from said heat exchanger.
6. The single tank chiller according to claim 5 further comprising a fluid pump incorporated into said liquid-cooled circulation line for circulating water from an external source.
7. The single tank chiller according to claim 6 further comprising a temperature sensor coupled to said heat exchanger, said temperature sensor sensing the temperature of said heat exchanger and feeding back a temperature signal.
8. The single-tank cooling device as claimed in claim 1, further comprising at least one heat dissipation fan for dissipating heat from at least one of the first heat dissipation bodies.
9. The single-water-tank refrigerating device according to claim 1, wherein the first heat sink includes a first heat sink body and a bottom plate, an internal structure of the first heat sink body is a porous structure or a multi-sheet structure, and the first heat sink body is connected to the bottom plate; the bottom plate is connected with the heating end of the semiconductor refrigerating piece, and the area of the bottom plate is not smaller than that of the semiconductor refrigerating piece.
10. The single-water-tank refrigerating device as recited in claim 2, wherein the second heat dissipating body comprises a second heat dissipating body and a connecting plate, the second heat dissipating body is of a porous structure or a multi-sheet structure, the second heat dissipating body is connected with the connecting plate, and the connecting plate is connected with a refrigerating end of the semiconductor refrigerating sheet; the area of the connecting plate is not smaller than that of the semiconductor refrigerating sheet.
11. A beverage machine, characterized in that it comprises a single tank refrigeration device according to any one of claims 1-10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121421424.7U CN215295541U (en) | 2021-06-24 | 2021-06-24 | Single water tank refrigerating device and beverage machine comprising same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121421424.7U CN215295541U (en) | 2021-06-24 | 2021-06-24 | Single water tank refrigerating device and beverage machine comprising same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215295541U true CN215295541U (en) | 2021-12-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121421424.7U Active CN215295541U (en) | 2021-06-24 | 2021-06-24 | Single water tank refrigerating device and beverage machine comprising same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215295541U (en) |
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2021
- 2021-06-24 CN CN202121421424.7U patent/CN215295541U/en active Active
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