CN218888895U - Heat sink of IGBT module - Google Patents
Heat sink of IGBT module Download PDFInfo
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- CN218888895U CN218888895U CN202222389389.6U CN202222389389U CN218888895U CN 218888895 U CN218888895 U CN 218888895U CN 202222389389 U CN202222389389 U CN 202222389389U CN 218888895 U CN218888895 U CN 218888895U
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Abstract
The utility model discloses a cooling device of IGBT module, including cold head, cold row and cooling subassembly, wherein, the cold head is located the side of IGBT module, the inside drive pump that sets up of cold head, the inside heat dissipation pipeline that is provided with of cold row, the heat dissipation pipeline is connected with the drive pump, forms the refrigerant passageway; the cooling assembly is located on the side of the cold row and used for cooling the heat dissipation pipeline. The utility model provides a pair of heat sink of IGBT module combines liquid cooling and air-cooled heat dissipation, has improved the radiating efficiency of IGBT module, promotes the system stability of IGBT module.
Description
Technical Field
The utility model relates to a IGBT module cooling field especially relates to a heat sink of IGBT module.
Background
With the increasing year by year of the demand of energy storage, the IGBT module in the energy storage converter has higher power and higher heat productivity, and the traditional air cooling system technology has high cooling energy consumption and low equipment density, so that an ideal cooling effect is difficult to achieve.
The traditional air-cooled heat dissipation principle mainly utilizes air circulation to dissipate heat, because the heat dissipation mode is the flow that sees through the air, blows inside heat to outside, so the size of quick-witted case, the power and the quantity of fan all can produce great influence to the radiating effect. Because the power module is not in direct contact with the heating source, the heat dissipation effect is not good enough, and for the IGBT module which continuously operates, the heat dissipation effect and the heating value do not achieve the mutual offset effect, so that the power module is continuously heated, and the stability of the converter system is seriously influenced.
SUMMERY OF THE UTILITY MODEL
The present invention aims at solving at least one of the problems in the related art to some extent. Therefore, an object of the utility model is to provide a heat sink of IGBT module combines liquid cooling and air-cooled heat dissipation, has improved the radiating efficiency of IGBT module, promotes the system stability of IGBT module.
In order to achieve the purpose, the following technical scheme is adopted in the application: a heat sink for an IGBT module, comprising:
the cold head is positioned on the side edge of the IGBT module, and a driving pump is arranged in the cold head;
the cold row is internally provided with a heat dissipation pipeline, and the heat dissipation pipeline is connected with the driving pump to form a refrigerant channel;
and the cooling assembly is positioned on the side of the cold row and used for cooling the heat dissipation pipeline.
Furthermore, a heat exchange pipeline is further arranged inside the cold head and connected with an inlet and an outlet of the driving pump.
Further, the cold head is abutted with the IGBT module.
The cold head is connected with the cold head through a cold discharge pipe; the liquid outlet pipeline is connected with the inlet of the cold head and the outlet of the cold discharge.
Furthermore, the inlet connection department of inlet conduit and cold row is provided with rotary joint, the exit linkage department of liquid outlet conduit and cold row is provided with rotary joint.
Furthermore, the exit linkage department of feed liquor pipeline and cold head is provided with rotary joint, the exit linkage department of liquid pipeline and cold head is provided with rotary joint.
Furthermore, fins are arranged on the outer side of the radiating pipe.
Furthermore, the cold row is internally provided with a radiating fin and a radiating chamber which are communicated with the radiating pipe.
Furthermore, the cooling component is a fan, and an air outlet of the fan is opposite to the cold air outlet.
Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages: the cold head is located the side of IGBT module in this application, its built-in driving pump, the heat dissipation pipeline in the cold row of driving pump intercommunication, the refrigerant in the cold head is given to the heat transfer of IGBT module effluvium, the driving pump drives the refrigerant and circulates via the cold row in the cold head, when the refrigerant circulates to the cold row in heat dissipation pipeline, the cooling subassembly cools down to the refrigerant in the heat dissipation pipeline, the refrigerant circulation after the cooling absorbs the heat that the IGBT module gived off again in to the cold head, and then realize the effective cooling of IGBT module, this application combines liquid cooling and air cooling heat dissipation, the radiating efficiency of IGBT module has been improved, promote the system stability of IGBT module.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive labor.
In the drawings:
fig. 1 is a front view of a temperature reducing device of an IGBT module in the present application;
fig. 2 is a top view of a cooling device of an IGBT module according to the present application;
reference numerals: 1. an IGBT module; 2. cooling the head; 31. a liquid inlet pipeline; 32. a liquid outlet pipeline; 4. cold discharging; 5. a fan.
Detailed Description
In order to clearly understand the technical features, objects, and effects of the present invention, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, it should be understood that the directions or positional relationships indicated by "front", "back", "upper", "lower", "left", "right", "longitudinal", "horizontal", "vertical", "horizontal", "top", "bottom", "inner", "outer", "head", "tail", and the like are configured and operated in specific directions based on the directions or positional relationships shown in the drawings, and are only for convenience of description of the present technical solution, and do not indicate that the mechanism or element referred to must have a specific direction, and thus, should not be construed as limiting the present invention.
It is also noted that, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," "disposed," and the like are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. When an element is referred to as being "on" or "under" another element, it can be "directly" or "indirectly" on the other element or intervening elements may also be present. The terms "first", "second", "third", etc. are only for convenience in describing the present technical solution, and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated, whereby the features defined as "first", "second", "third", etc. may explicitly or implicitly include one or more of such features. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, mechanisms, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.
Referring to fig. 1-2, the present application provides a cooling device for an IGBT module, including:
a cold head 2 positioned at the side of the IGBT module 1, a driving pump is arranged in the cold head 2,
the cold row 4 is internally provided with a heat dissipation pipeline, and the heat dissipation pipeline is connected with the driving pump to form a refrigerant channel;
and the cooling assembly is positioned on the side edge of the cold row 4 and used for cooling the heat dissipation pipeline.
Example 1
Referring to fig. 1-2, the cooling device for the IGBT module provided by the present application includes a cold head 2, a cold row 4, and a cooling assembly, wherein the cold head 2 is located at a side of the IGBT module 1, and a driving pump is disposed inside the cold head 2; a heat dissipation pipeline is arranged in the cold row 4 and connected with the driving pump to form a refrigerant channel; the cooling assembly is located on the side edge of the cold row 4 and used for cooling the heat dissipation pipeline.
Specifically, a heat exchange pipeline is further arranged inside the cold head 2 and connected with an inlet and an outlet of the driving pump; the heat exchange pipeline and the heat dissipation pipeline jointly form a refrigerant channel, and specific refrigerants can be water or other liquid or gas with higher specific heat capacity.
It is worth to be noted that, the main function of the cold head 2 in the present application is to accommodate the driving pump, so as to ensure smooth circulation of the refrigerant in the refrigerant channel, the refrigerant in the internal heat exchange pipeline absorbs the heat dissipated by the IGBT module 1 to raise the temperature, and the refrigerant after the temperature is raised is circulated to the cold row 4 for heat dissipation. Cold 4 is the main place of refrigerant cooling in this application, and the cooling subassembly of its side is used for cooling down the refrigerant that the temperature rose in the heat dissipation pipeline.
Specifically, the heat exchange pipeline in the cold head 2 can adopt a super fine liquid flow passage design of 0.2mm, so that the heat exchange is more effective. Meanwhile, the shell structure of the cold head 2 is made of a metal material with good heat conductivity, for example, the upper surface of the cold head 2 is a pure copper metal surface processed by a wire drawing process, and the upper surface of the cold head is adhered to the bottom of the IGBT module 1 through high-temperature glue, so that the heat emitted by the IGBT module 1 can be sufficiently transferred to the inside of the cold head 2 and received by a refrigerant in a heat exchange pipeline.
The driving pump arranged inside the cold head 2 can be a mute water pump, liquid refrigerants are driven to flow, and a high-strength ceramic bearing is adopted as a bearing in the mute water pump, so that the stability of the mute water pump is improved.
As a specific embodiment, the heat dissipation pipeline inside the cooling row 4 of the present application has an effect of performing heat exchange between the refrigerant after temperature rise and the cooling component on the outer side, so that the refrigerant after temperature rise is cooled as much as possible. In order to ensure the cooling effect, this application is snakelike distribution with the heat dissipation pipeline 4 inside cold row, and the length and the area of maximize heat dissipation pipeline for refrigerant after the intensification has sufficient time and space to accomplish the heat exchange.
The number of the heat dissipation pipelines distributed in the S-shaped mode can be one or a plurality of heat dissipation pipelines connected in parallel, if only one heat dissipation pipeline is arranged, the circulation time of a refrigerant in the refrigerant channel is long, the refrigerant can be fully dissipated, and the heat dissipation efficiency is improved; if the heat dissipation pipeline has many, many heat dissipation pipelines are independent each other, can accelerate refrigerant cycle time, ensure that the intensification refrigerant in the cold head 2 can flow fast, also can improve the radiating efficiency.
In order to further improve heat dispersion, this application can also set up the fin in the outside of cooling tube for increase the heat radiating area of heat dissipation pipeline, improve the radiating efficiency. The fins outside the heat dissipation tube can be high-density red copper fins.
In order to further improve the heat dissipation performance, the cooling fin and the heat dissipation chamber which are communicated with the heat dissipation pipe can be arranged inside the cold row 4, and the principle of the cooling fin and the principle of the heat dissipation chamber are that the cooling fin and the heat dissipation chamber are connected in series in the heat dissipation pipeline and are used for increasing the heat dissipation area of the refrigerant and improving the heat dissipation efficiency.
No matter how many of heat dissipation pipeline are in cold row 4, cold row 4 can set up unified import and export, and cold head 2 also is provided with import and export simultaneously, and the import and the export of cold head 2 are connected to the both ends of actuating pump through heat transfer pipeline. The liquid inlet pipeline 31 is connected with the outlet of the cold head 2 and the inlet of the cold row 4; the liquid outlet pipe 32 is connected with the inlet of the cold head 2 and the outlet of the cold row 4.
The inlet connection of the liquid inlet pipeline 31 and the cold row 4 is provided with a rotary joint, and the outlet connection of the liquid outlet pipeline 32 and the cold row 4 is provided with a rotary joint. Similarly, a rotary joint is arranged at the joint of the inlet pipeline 31 and the outlet of the cold head 2, and a rotary joint is arranged at the joint of the outlet pipeline 32 and the inlet of the cold head 2. The rotary joint is convenient for pipeline trend design, and simultaneously, an industrial-level interface sealing process is adopted at a rotary interface, so that the pipeline sealing performance is ensured, and the refrigerant leakage is prevented.
This application cooling subassembly is located 4 sides on the cold row for carry out the cooling subassembly of cooling to the heat dissipation pipeline. The specific cooling assembly can be a fan 5, and an air outlet of the fan 5 is opposite to the cold row 4, and is used for cooling the refrigerant after being heated in the heat dissipation pipeline. The fan 5 and the drive pump in this application can be supplied power by the PCS inside, driving the system to operate.
Similarly, the cooling subassembly still can be for devices such as the cold source of parcel cold row 4 in this application for cool down to the refrigerant after heating up in the heat dissipation pipeline.
Example 2
Referring to fig. 1-2, the cooling device for the IGBT module provided by the present application includes a cold head 2, a cold row 4 and a cooling assembly, where the cold head 2 is located at a side of the IGBT module 1, and a driving pump is disposed inside the cold head 2; a heat dissipation pipeline is arranged in the cold row 4 and connected with the driving pump to form a refrigerant channel; the fan 5 is located on the side of the cold row 4, and the air outlet of the fan 5 is opposite to the cold row 4, and is used for cooling the refrigerant after being heated in the heat dissipation pipeline. The fan 5 and the drive pump in this application can be supplied power by the PCS inside, drive the system operation. Used for cooling the heat dissipation pipeline. In this embodiment, the cooling medium is water-cooling liquid.
The cold head 2 is also internally provided with a heat exchange pipeline which is connected with an inlet and an outlet of the driving pump; the heat exchange pipeline and the heat dissipation pipeline jointly form a refrigerant channel.
The shell structure of cold head 2 is the better metal material of heat conductivility, and the upper surface of cold head 2 is the pure copper metal face through the wire drawing technology, and its upper surface is pasted in the bottom of IGBT module 1 through high temperature glue, ensures that the heat that IGBT module 1 gived off can fully transmit to inside the cold head 2 to be received by the refrigerant in the heat transfer pipeline.
The heat dissipation pipe is provided with fins on the outer side for increasing the heat dissipation area of the heat dissipation pipe and improving the heat dissipation efficiency. The fins outside the heat dissipation tube can be high-density red copper fins.
The cold row 4 is provided with an inlet and an outlet, the cold head 2 is also provided with an inlet and an outlet, and the inlet and the outlet of the cold head 2 are connected to two ends of the driving pump through heat exchange pipelines. The liquid inlet pipeline 31 is connected with the outlet of the cold head 2 and the inlet of the cold row 4; the liquid outlet pipe 32 is connected with the inlet of the cold head 2 and the outlet of the cold row 4.
A rotary joint is arranged at the joint of the inlet of the liquid inlet pipeline 31 and the inlet of the cold bar 4, and a rotary joint is arranged at the joint of the outlet of the liquid outlet pipeline 32 and the outlet of the cold bar 4. Similarly, a rotary joint is arranged at the joint of the outlet of the liquid inlet pipeline 31 and the outlet of the cold head 2, and a rotary joint is arranged at the joint of the inlet of the liquid outlet pipeline 32 and the cold head 2. The rotary joint is convenient for pipeline trend design, and an industrial-grade interface sealing process is adopted at a rotary interface, so that the pipeline sealing performance is ensured, and the refrigerant leakage is prevented.
The working principle of the application is as follows:
when the system at IGBT module 1 place starts, IGBT module 1 moves and generates heat, driving pump and fan 5 move this moment, heat conduction to the liquid cooling with IGBT module 1 module gives off is 2 cold heads with IGBT module 1 contact, the liquid cooling is under the effect of driving pump, circulate to the heat dissipation pipeline in the cold row 4 through the heat transfer pipeline, the heat dissipation pipeline can increase the area of contact of liquid cooling and air, just cool down the liquid cooling in the heat dissipation pipeline to fan 5 of cold row 4 simultaneously, liquid cooling after the cooling recycles to in the cold head 2, thereby realize heat transfer circulation, reach high-efficient radiating effect.
It is to be understood that the foregoing examples merely represent preferred embodiments of the present invention, and that the description thereof is more specific and detailed, but not intended to limit the scope of the invention; it should be noted that, for those skilled in the art, the above technical features can be freely combined, and several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention; therefore, all changes and modifications that come within the meaning and range of equivalency of the claims are to be embraced within their scope.
Claims (9)
1. The utility model provides a heat sink of IGBT module which characterized in that includes:
the cold head is positioned on the side edge of the IGBT module, and a driving pump is arranged in the cold head;
the cold row is internally provided with a heat dissipation pipeline, and the heat dissipation pipeline is connected with the driving pump to form a refrigerant channel;
and the cooling assembly is positioned on the side of the cold row and used for cooling the heat dissipation pipeline.
2. The temperature reduction device for the IGBT module as claimed in claim 1, wherein a heat exchange pipeline is further arranged inside the cold head, and the heat exchange pipeline is connected with an inlet and an outlet of the driving pump.
3. The IGBT module cooling device of claim 1, wherein the cold head abuts the IGBT module.
4. The cooling device for the IGBT module according to claim 1, further comprising a liquid inlet pipeline and a liquid outlet pipeline, wherein the liquid inlet pipeline is connected with an outlet of the cold head and an inlet of the cold drain; the liquid outlet pipeline is connected with the inlet of the cold head and the outlet of the cold discharge.
5. The cooling device for the IGBT module as claimed in claim 4, wherein a rotary joint is arranged at the inlet connection of the liquid inlet pipeline and the cold drain, and a rotary joint is arranged at the outlet connection of the liquid outlet pipeline and the cold drain.
6. The cooling device for the IGBT module as claimed in claim 4, wherein a rotary joint is disposed at the outlet connection of the liquid inlet pipeline and the cold head, and a rotary joint is disposed at the inlet connection of the liquid outlet pipeline and the cold head.
7. The cooling device for the IGBT module according to claim 1, wherein fins are disposed on the outer side of the heat dissipation pipe.
8. The cooling device for the IGBT module as claimed in claim 1, wherein the cooling tube and the cooling chamber are further disposed inside the cold row.
9. The cooling device for the IGBT module according to claim 1, wherein the cooling component is a fan, and an air outlet of the fan faces the cold bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222389389.6U CN218888895U (en) | 2022-09-08 | 2022-09-08 | Heat sink of IGBT module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222389389.6U CN218888895U (en) | 2022-09-08 | 2022-09-08 | Heat sink of IGBT module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218888895U true CN218888895U (en) | 2023-04-18 |
Family
ID=85939036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222389389.6U Active CN218888895U (en) | 2022-09-08 | 2022-09-08 | Heat sink of IGBT module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218888895U (en) |
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2022
- 2022-09-08 CN CN202222389389.6U patent/CN218888895U/en active Active
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