CN218214050U

CN218214050U - Computer water-cooling radiator

Info

Publication number: CN218214050U
Application number: CN202222539834.2U
Authority: CN
Inventors: 李红民
Original assignee: Shenzhen Dreis Electronic Technology Co ltd
Current assignee: Shenzhen Dreis Electronic Technology Co ltd
Priority date: 2022-09-26
Filing date: 2022-09-26
Publication date: 2023-01-03
Anticipated expiration: 2032-09-26

Abstract

The utility model discloses a computer water-cooling radiator, including water-cooling piece, pipeline and cold row, the water-cooling piece is including intake zone and play pool, evenly be connected with the raceway between intake zone and the play pool, the raceway outside evenly is connected with first fin, first fan is installed to first fin one side, intake zone is including water intake part and play water portion, it sets up in the top of water intake part to go out the water portion, water intake part bottom is fixed with the heat exchanger fin, the heat exchanger fin top evenly is provided with the water course, the water course top is provided with the baffle, water intake part and play water portion pass through the baffle and separate, raceway bottom intercommunication water portion with the help of set up the air cooling structure on the water-cooling piece, arrange with the help of self simultaneously, realize secondary heat transfer, simple structure, under the condition that the water-cooling piece is different not much, combine together air cooling and water-cooling, through secondary heat transfer and the refrigerated mode of semiconductor refrigeration piece, improve current water-cooling radiator's heat exchange efficiency.

Description

Computer water-cooling radiator

Technical Field

The utility model belongs to the technical field of the liquid cooling radiator, concretely relates to computer water cooling radiator.

Background

The water-cooled radiator circulates the cooling liquid in the radiating pipe by using a pump and radiates heat. The heat absorbing part (called heat absorbing box in liquid cooling system) on the heat radiator is used for absorbing heat from computer CPU, north bridge and display card. The heat absorbed by the heat absorption part is discharged to the outside of the host machine through a radiator designed on the back of the machine body.

The water-cooled radiator mainly comprises a water-cooled block, circulating liquid, a water pump, a pipeline and a cold discharge or heat exchanger. The water cooling block is a metal block with a water channel inside, is made of copper or aluminum, is in contact with the CPU and absorbs the heat of the CPU. The circulating liquid flows in a circulating pipeline under the action of a water pump, and if the liquid is water, the circulating liquid is a water cooling system. The liquid absorbing the heat of the CPU flows away from the water cooling block on the CPU, and the new low-temperature circulating liquid continuously absorbs the heat of the CPU. The conveying pipe is connected with the water pump, the water cooling block and the water tank, and the circulating liquid circularly flows in a closed channel without leaking outside, so that the liquid cooling heat dissipation system works normally. The water tank is used for storing circulating liquid, the cold discharge/heat exchanger is a device similar to a radiating fin, the circulating liquid transfers heat to the radiating fin with a large surface area, and a fan on the radiating fin takes away the heat of inflow air. The size of the existing water-cooled radiator determines the heat dissipation capacity of the water-cooled radiator, but for some cases with narrow space, the size of the water-cooled radiator is limited, and the specific heat capacity of water is large, so that the heat dissipation efficiency of the small-sized water-cooled radiator is poor because the water absorbs heat to raise the temperature.

An effective solution to the problems in the related art has not been proposed yet.

SUMMERY OF THE UTILITY MODEL

In order to solve the above problem, the utility model provides a following technical scheme: the utility model provides a computer water-cooling radiator, includes water-cooling piece, pipeline and cold row, the water-cooling piece is including intaking district and play pool, evenly be connected with the raceway between district and the play pool of intaking, the raceway outside evenly is connected with first fin, first fan is installed to first fin one side, the district of intaking is including the portion of intaking and goes out water portion, it sets up in the top of the portion of intaking to go out water portion, the portion bottom of intaking is fixed with the fin, the fin top evenly is provided with the water course, the water course top is provided with the baffle, the portion of intaking passes through the baffle with play water portion and separates, raceway bottom intercommunication goes out water portion, install the pump body on the pipeline.

As a preferred technical scheme of the utility model, cold row includes the water tank, the water tank surface evenly is provided with the semiconductor refrigeration piece, water tank one end is connected with outlet pipe and inlet tube respectively.

As an optimal technical scheme of the utility model, semiconductor refrigeration piece hot junction is fixed with the second fin, second fin one side is provided with the second fan.

As a preferred technical scheme of the utility model, the cold junction of semiconductor refrigeration piece is fixed in the surface of water tank one side through the heat-conducting glue.

As a preferred technical scheme of the utility model, the portion one end of intaking is provided with the water inlet, water outlet zone one end is provided with the delivery port.

As an optimal technical scheme of the utility model, the water inlet passes through the outlet pipe of pipe connection water tank, the delivery port passes through the inlet tube of pipe connection water tank.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses with the help of setting up the air cooling structure on the water-cooling piece, with the help of self cold row simultaneously, realize the secondary heat transfer, simple structure under the condition of the almost volume of water-cooling piece, combines together air cooling and water-cooling, through the refrigerated mode of secondary heat transfer and semiconductor refrigeration piece, improves current water-cooling radiator's heat exchange efficiency.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the cross-sectional structure of the middle water intake area of the present invention;

FIG. 3 is a schematic view of the structure of the heat exchanger fins and the water channel of the present invention;

in the figure: 1. a pipeline; 2. a water inlet area; 3. a water outlet area; 4. a water delivery pipe; 5. a first heat sink; 6. a first fan; 7. a water inlet part; 8. a water outlet part; 9. a heat exchanger fin; 10. a water channel; 11. a partition plate; 12. a pump body; 13. a semiconductor refrigerating sheet; 14. a water outlet pipe; 15. a water inlet pipe; 16. a second heat sink; 17. a second fan; 18. a water inlet; 19. a water outlet; 20. a water tank.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Examples

Referring to fig. 1-3, the present invention provides the following technical solutions: the utility model provides a computer water-cooling radiator, includes water-cooling piece, pipeline 1 and cold row, the water-cooling piece is including intake zone 2 and play pool 3, evenly be connected with raceway 4 between intake zone 2 and the play pool 3, raceway 4 outside evenly is connected with first fin 5, first fan 6 is installed to first fin 5 one side, intake zone 2 is including water portion 7 and play water portion 8, it sets up in the top of water portion 7 to go out

water portion

8, 7 bottoms in water portion are fixed with heat exchanger fin 9, heat exchanger fin 9 tops evenly are provided with water course 10, water course 10 tops are provided with baffle 11, water portion 7 and play water portion 8 of intaking separate through

baffle

11, 4 bottoms in the raceway communicate water portion 8, install the pump body 12 on the pipeline 1, in this embodiment, with the help of setting up the air cooling structure on the water-cooling piece, realize secondary heat transfer with the help of self cold row simultaneously, simple structure improves and combines together air cooling and water-cooling through the mode of secondary heat transfer, improves current water-cooling radiator's heat exchange efficiency.

In order to accelerate the liquid heat transfer in the water tank 20, in this embodiment, as the utility model discloses an optimal technical scheme, cold row includes water tank 20, water tank 20 surface evenly is provided with semiconductor refrigeration piece 13, water tank 20 one end is connected with outlet pipe 14 and inlet tube 15 respectively, 7 one end in portion of intaking is provided with

water inlet

18, 3 one ends in play water zone are provided with delivery port 19, water inlet 18 passes through outlet pipe 14 that pipeline 1 connects water tank 20, delivery port 19 passes through pipeline 1 and connects water tank 20's inlet tube 15.

In order to accelerate heat exchange efficiency, in this embodiment, as the utility model discloses a preferred technical scheme, semiconductor refrigeration piece 13's cold junction is fixed in the surface of water tank 20 one side through heat-conducting glue.

In order to assist the heat dissipation of semiconductor refrigeration piece 13 hot junction, in this embodiment, as the utility model discloses an optimal technical scheme, semiconductor refrigeration piece 13 hot junction is fixed with second fin 16, second fin 16 one side is provided with second fan 17.

In the embodiment, the semiconductor cooling plate 13 is a known technology widely used in daily life, and the semiconductor cooler is a device for producing cooling energy by using a thermoelectric effect of a semiconductor, which is also called a thermoelectric cooler. When two different metals are connected by a conductor and direct current is applied, the temperature at one junction is reduced and the temperature at the other junction is increased.

In conclusion, with the help of the above-mentioned technical scheme of the utility model, with the fixed and contact CPU surface of heat exchanger fin 9, semiconductor refrigeration piece 13 circular telegram back, the cold junction carries out the heat transfer to the water in the water tank 20, rivers after the cooling pass through outlet pipe 14 and pipeline 1 with the help of pump body 12, with cooling water pump sending to in the portion 7 of intaking, the water course 10 that 9 tops of heat exchanger fin evenly set up, dispersible rivers, the contact surface heat transfer with higher speed of increase and cooling water, rivers pass through 11 one end of baffle, get into water outlet 8, and send into out water zone 3 by raceway 4, at this in-process, raceway 4 carries out the heat transfer with the heat of aquatic and the first fin 5 of 4 pipe shaft, discharge the heat through first fan 6 at last, carry out the first heat transfer, the water of sending into water zone 3 carries out the secondary heat transfer in the water tank 20 is being got into again with the help of pipeline 1 and 12 through delivery port 19.

Finally, it should be noted that: in the present invention, unless otherwise explicitly specified or limited, the terms "mounted", "disposed", "connected", "fixed", "screwed" and the like are to be understood broadly, and may be, for example, a fixed connection, a detachable connection, or an integral body; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a computer water-cooling radiator, includes water-cooling piece, pipeline (1) and cold row, its characterized in that: the water-cooling piece is including intaking district (2) and play pool (3), it evenly is connected with raceway (4) to intake between district (2) and the play pool (3), raceway (4) outside evenly is connected with first fin (5), first fan (6) are installed to first fin (5) one side, intake district (2) including the portion of intaking (7) and play water portion (8), it sets up in the top of the portion of intaking (7) to go out water portion (8), portion of intaking (7) bottom is fixed with heat transfer piece (9), heat transfer piece (9) top evenly is provided with water course (10), water course (10) top is provided with baffle (11), portion of intaking (7) and play water portion (8) separate through baffle (11), raceway (4) bottom intercommunication play water portion (8), install the pump body (12) on pipeline (1).

2. The computer water-cooling heat sink of claim 1, wherein: the cold row includes water tank (20), water tank (20) surface evenly is provided with semiconductor refrigeration piece (13), water tank (20) one end is connected with outlet pipe (14) and inlet tube (15) respectively.

3. The computer water-cooling heat sink of claim 2, wherein: and a second radiating fin (16) is fixed at the hot end of the semiconductor refrigerating fin (13), and a second fan (17) is arranged at one side of the second radiating fin (16).

4. The computer water-cooling heat sink of claim 3, wherein: the cold end of the semiconductor refrigeration sheet (13) is fixed on the surface of one side of the water tank (20) through heat-conducting glue.

5. The computer water-cooling heat sink of claim 2, wherein: one end of the water inlet part (7) is provided with a water inlet (18), and one end of the water outlet area (3) is provided with a water outlet (19).

6. The computer water-cooling heat sink of claim 5, wherein: the water inlet (18) is connected with a water outlet pipe (14) of the water tank (20) through a pipeline (1), and the water outlet (19) is connected with a water inlet pipe (15) of the water tank (20) through the pipeline (1).