CN115068722B - Water tank equipment with double circulation loops - Google Patents
Water tank equipment with double circulation loops Download PDFInfo
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- CN115068722B CN115068722B CN202210678362.0A CN202210678362A CN115068722B CN 115068722 B CN115068722 B CN 115068722B CN 202210678362 A CN202210678362 A CN 202210678362A CN 115068722 B CN115068722 B CN 115068722B
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- heating
- storage tank
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 23
- 239000004065 semiconductor Substances 0.000 claims abstract description 129
- 238000010438 heat treatment Methods 0.000 claims abstract description 73
- 239000007788 liquid Substances 0.000 claims abstract description 61
- 238000005057 refrigeration Methods 0.000 claims abstract description 39
- 230000017525 heat dissipation Effects 0.000 claims abstract description 37
- 238000007599 discharging Methods 0.000 claims abstract description 4
- 238000001816 cooling Methods 0.000 claims description 17
- 239000012530 fluid Substances 0.000 claims description 14
- 230000009977 dual effect Effects 0.000 claims description 13
- 230000002107 myocardial effect Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 8
- 238000007675 cardiac surgery Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005485 electric heating Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 230000036770 blood supply Effects 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 208000010125 myocardial infarction Diseases 0.000 description 1
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Classifications
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
- A61M1/00—Suction or pumping devices for medical purposes; Devices for carrying-off, for treatment of, or for carrying-over, body-liquids; Drainage systems
- A61M1/36—Other treatment of blood in a by-pass of the natural circulatory system, e.g. temperature adaptation, irradiation ; Extra-corporeal blood circuits
- A61M1/3621—Extra-corporeal blood circuits
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
- A61M1/00—Suction or pumping devices for medical purposes; Devices for carrying-off, for treatment of, or for carrying-over, body-liquids; Drainage systems
- A61M1/36—Other treatment of blood in a by-pass of the natural circulatory system, e.g. temperature adaptation, irradiation ; Extra-corporeal blood circuits
- A61M1/369—Temperature treatment
Abstract
The invention discloses a water tank device with double circulation loops, which comprises a first liquid storage tank, first external equipment, a first circulation pump, a second liquid storage tank, second external equipment, a second circulation pump and a heat exchange device, wherein the first liquid storage tank, the first external equipment and the first circulation pump form a first circulation loop; the heat exchange device comprises a heating assembly, a refrigerating assembly, a flow guiding assembly and a heat radiating assembly, wherein the heating assembly is used for heating a first medium in the first liquid storage tank; the refrigeration component adopts a semiconductor sheet to cool a second medium in a second liquid storage tank; the flow guiding component is used for guiding the cold energy generated by the heating component to the refrigerating component along a first direction; the heat dissipation component is used for discharging heat generated by the refrigeration component along a second direction, and the first direction is not opposite to the second direction. The refrigerating effect of the semiconductor piece can be improved by guiding the refrigerating quantity generated by the heating component to the refrigerating component adopting the semiconductor piece and utilizing the property of the semiconductor piece, and the volume and the working noise of the water tank device are reduced.
Description
Technical Field
The invention relates to the technical field of medical equipment, in particular to water tank equipment with double circulation loops.
Background
In extracorporeal circulation operation, the temperature of the extracorporeal circulation loop needs to be controlled so that the temperature of blood after passing through the extracorporeal circulation system is still close to normal body temperature, and simultaneously, low-temperature myocardial stop jump protecting liquid needs to be infused into the heart so as to stop the heart and maintain certain blood supply, thereby preventing myocardial necrosis. In the prior art, the large-sized external circulation cold-hot water tank utilizes a compressor for refrigeration and an electric heating wire for heating, but has the defects of large volume, high noise and high power consumption, and is inconvenient to use in a cardiac surgery operating room with space shortage; the utility model provides an adopt single temperature district external circulation cold and hot water tank, heats or refrigerates through the semiconductor, although reduced the volume, because semiconductor wafer heats effectually, refrigerates effectually, does not generally adopt semiconductor wafer refrigeration.
Disclosure of Invention
The technical problem to be solved by the embodiment of the invention is to provide the water tank equipment with the double circulation loops, which can improve the refrigerating effect of the semiconductor wafer and reduce the volume and the working noise of the water tank equipment by guiding the cold energy generated by the heating assembly to the refrigerating assembly adopting the semiconductor wafer to combine the heating and the refrigerating of the semiconductor wafer.
In order to solve the technical problems, the invention provides water tank equipment with a double circulation loop, which comprises a first liquid storage tank, first external equipment, a first circulation pump, a second liquid storage tank, second external equipment, a second circulation pump and a heat exchange device;
the first liquid storage tank, the first external equipment and the first circulating pump form a first circulating loop, and the second liquid storage tank, the second external equipment and the second circulating pump form a second circulating loop;
the heat exchange device comprises a heating assembly, a refrigerating assembly, a flow guiding assembly and a heat radiating assembly, wherein the heating assembly is in fluid communication with the first liquid storage tank and is used for heating a first medium in the first liquid storage tank; the refrigeration assembly is in fluid communication with the second liquid storage tank, and the refrigeration assembly cools a second medium in the second liquid storage tank by using a semiconductor wafer; the flow guide assembly is arranged opposite to the heating assembly and is used for guiding the cold energy generated by the heating assembly to the refrigerating assembly along a first direction; the heat dissipation assembly is arranged opposite to the refrigeration assembly and is used for discharging heat generated by the refrigeration assembly along a second direction, and the first direction is not opposite to the second direction.
In a possible implementation manner, the first liquid storage tank is communicated with the first circulating pump through a first pipeline, the first circulating pump is communicated with the first external device through a second pipeline, the first external device is communicated with the first liquid storage tank through a third pipeline, the second pipeline is connected with the first liquid storage tank through a fourth pipeline, and the first circulating pump is used for guiding the first medium into the first external device through the second pipeline and guiding the first medium into the first liquid storage tank through the fourth pipeline;
the heating assembly is connected with the fourth pipeline and is used for heating the first medium flowing through the fourth pipeline.
In a possible implementation, the second tank communicates with the second circulation pump through a fifth pipe, the second circulation pump communicates with the second external device through a sixth pipe, the second external device communicates with the second tank through a seventh pipe, the sixth pipe is connected with the second tank through an eighth pipe, and the second circulation pump is used for guiding the second medium into the second external device through the sixth pipe and into the second tank through the eighth pipe;
the refrigeration assembly is connected with the eighth pipeline and is used for heating the second medium flowing through the eighth pipeline.
In one possible implementation, the heating assembly includes a first semiconductor tile assembly, a second semiconductor tile assembly, a first air fin, a second air fin, and a first waterway heat exchange plate, the first semiconductor tile assembly being disposed opposite the second semiconductor tile assembly, the first waterway heat exchange plate being disposed between the first semiconductor tile assembly and the second semiconductor tile assembly, the first air fin being connected to the first semiconductor tile assembly and being located on a side remote from the first waterway heat exchange plate; the second air radiating fin is connected with the second semiconductor fin assembly and is positioned at one side far away from the first waterway heat exchange plate; the first waterway heat exchange plate is in fluid communication with the fourth tube.
In one possible implementation, the heating assembly further includes a first heat radiating fin connected to the first air heat radiating fin and a second heat radiating fin connected to the second heat radiating fin.
In one possible implementation, the refrigeration assembly includes a third semiconductor tile assembly, a fourth semiconductor tile assembly, a third air fin, a fourth air fin, and a second waterway heat exchanger plate, the third semiconductor tile assembly being disposed opposite the fourth semiconductor tile assembly, the second waterway heat exchanger plate being disposed between the third semiconductor tile assembly and the fourth semiconductor tile assembly, the third air fin being connected to the third semiconductor tile assembly and being located on a side remote from the second waterway heat exchanger plate; the fourth air radiating fin is connected with the fourth semiconductor fin assembly and is positioned at one side far away from the second waterway heat exchange plate; the second waterway heat exchange plate is in fluid communication with the eighth tube.
In one possible implementation, the refrigeration assembly further includes a third heat dissipation fin connected to the third air heat dissipation fin and a fourth heat dissipation fin connected to the fourth air heat dissipation fin.
In one possible implementation, the first semiconductor die assembly includes at least one first semiconductor die and the second semiconductor die assembly includes at least one second semiconductor die;
the third semiconductor die assembly includes at least one third semiconductor die and the fourth semiconductor die assembly includes at least one fourth semiconductor die.
In one possible implementation, the flow guiding component is arranged at one side of the heating component, and the refrigerating component is arranged at the other side of the heating component; the flow guiding assembly comprises at least one first fan, and the air outlet side of the at least one first fan faces the heating assembly.
In one possible implementation, the heat dissipation component is disposed on one side of the refrigeration component and is remote from the heating component; the heat dissipation assembly comprises at least one second fan, and the air inlet side of the at least one second fan faces the refrigeration assembly.
The implementation of the invention has the following beneficial effects:
the invention provides water tank equipment with double circulation loops, which comprises a first circulation loop formed by a first liquid storage tank, first external equipment and a first circulation pump, a second circulation loop formed by a second liquid storage tank, second external equipment and a second circulation pump, and a heat exchange device, wherein a heating component in the heat exchange device heats a first medium in the first liquid storage tank, a refrigerating component in the heat exchange device cools a second medium in the second liquid storage tank, the refrigerating component adopts a semiconductor sheet, the refrigerating quantity generated by the heating component is guided to the refrigerating component adopting the semiconductor sheet, and the heating and refrigerating of the semiconductor sheet are combined by utilizing the property of the semiconductor sheet, so that the refrigerating effect of the semiconductor sheet can be improved, and the volume and the working noise of the water tank equipment are reduced.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application and do not constitute an undue limitation on the application.
Fig. 1 is a schematic view of a structure of a water tank apparatus of a dual circulation loop according to an embodiment of the present invention;
fig. 2 is a schematic view showing an internal structure of a water tank apparatus of a dual circulation circuit according to an embodiment of the present invention;
FIG. 3 is a schematic illustration of the flow direction of a medium within a tank arrangement of a dual circulation loop according to an embodiment of the present invention;
FIG. 4 is a schematic view of a connection between a flow guiding assembly and a heating assembly according to an embodiment of the present invention;
fig. 5 is a schematic view of a refrigeration assembly according to an embodiment of the present invention.
Reference numerals in the drawings: 101-first tank, 102-first external equipment, 103-first circulation pump, 201-second tank, 202-second external equipment, 203-second circulation pump, 300-heat exchange device, 310-heating assembly, 311-first semiconductor fin assembly, 312-second semiconductor fin assembly, 313-first air fin, 314-second air fin, 315-first waterway heat exchange plate, 316-first heat exchange fin, 317-second heat exchange fin, 320-cooling assembly, 321-third semiconductor fin assembly, 322-fourth semiconductor fin assembly, 323-third air fin, 324-fourth air fin, 325-second waterway heat exchange plate, 326-third heat exchange fin, 327-fourth heat exchange fin, 330-flow guide assembly, 340-heat exchange assembly, 401-first pipe, 402-second pipe, 403-third pipe, 404-fourth pipe, 405-fifth pipe, 406-sixth pipe, 407-seventh pipe, 408-eighth pipe.
Detailed Description
In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the invention, whereby the invention is not limited to the specific embodiments disclosed below.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
When in extracorporeal circulation operation, the room temperature of the operating room is usually 25-28 ℃, the water temperature required by the oxygenator is usually 36-37 ℃, the water temperature is also usually more than 30 ℃ during low-temperature circulation, the liquid in the oxygenator needs to be heated, the liquid in the stop-jump protecting liquid needs to be cooled to be lower than 20 ℃, and the liquid in the stop-jump protecting liquid needs to be cooled. In the prior art, two water tanks are provided, one is a single-temperature-zone external circulation cold and hot water tank, and semiconductor heating or refrigeration is adopted, so that the volume is reduced, but the semiconductor chip heating effect is good, the refrigeration effect is poor, and the semiconductor chip refrigeration is not adopted generally; a large-sized external circulation cold-hot water tank uses a compressor for refrigeration and an electric heating wire for heating, but has the defects of large volume, high noise and high power consumption, and is inconvenient to use in a cardiac surgery room with space shortage.
In order to solve the above-mentioned disadvantages of large volume and poor refrigerating effect by using semiconductor chips, as shown in fig. 1, the present embodiment provides a water tank device with a dual circulation loop, which includes a first liquid storage tank 101, a first external device 102, a first circulation pump 103, a second liquid storage tank 201, a second external device 202, a second circulation pump 203, and a heat exchange device 300;
the first tank 101, the first external device 102, and the first circulation pump 103 constitute a first circulation circuit, and the second tank 201, the second external device 202, and the second circulation pump 203 constitute a second circulation circuit;
the heat exchange device 300 comprises a heating assembly 310, a cooling assembly 320, a flow guiding assembly 330 and a heat dissipating assembly 340, wherein the heating assembly 310 is in fluid communication with the first liquid storage tank 101 and is used for heating the first medium in the first liquid storage tank 101; the refrigeration assembly 320 is in fluid communication with the second tank 201, the refrigeration assembly 320 employing a semiconductor wafer to cool the second medium within the second tank 201; the flow guiding component 330 is disposed opposite to the heating component 310, and is used for guiding the cooling capacity generated by the heating component 310 to the cooling component 320 along the first direction; the heat dissipation assembly 340 is disposed opposite to the refrigeration assembly 320, and is configured to discharge heat generated by the refrigeration assembly 320 along a second direction, where the first direction is not opposite to the second direction.
The heating component 310 heats the first medium in the first liquid storage tank 101, after the first medium reaches the set temperature, the first medium in the first liquid storage tank flows to the first external device 102 through the first circulating pump 103, and is used for heating the liquid in the first external device 102, where in a possible implementation, the heating component 310 may use a semiconductor chip or other heating element, etc., the first medium in the first liquid storage tank 101 may be water or other fluid, and the first external device 102 is an oxygenator.
The refrigeration assembly 320 cools the second medium in the second liquid storage tank 201, and after the second medium reaches the set temperature, the second medium in the second liquid storage tank flows to the second external device 202 through the second circulation pump 203, so as to cool the liquid in the second external device 202, where in a possible implementation, the second medium in the second liquid storage tank 201 may be water or other fluid, and the second external device 202 is a myocardial stop and jump protection liquid device.
The flow guiding component 330 is used for guiding the cold energy generated by the heating component 310 to the refrigerating component 320 along a first direction, the heat dissipating component 340 is used for discharging the heat generated by the refrigerating component 320 along a second direction, the first direction and the second direction are not opposite, the refrigerating component 320 adopts a semiconductor sheet, and the ambient temperature of the hot end of the refrigerating component 320 is reduced by guiding the cold energy generated by the heating component 310 to the refrigerating component 320, so that the temperature of the cold end of the refrigerating component 320 is reduced, and the refrigerating effect of the semiconductor sheet is improved. In one possible implementation, the second direction may be co-directional with the first direction or form an included angle of no more than 90 degrees.
In one possible implementation, as shown in fig. 2 and 3, the first tank 101 is in communication with the first circulation pump 103 through a first pipe 401, the first circulation pump 103 is in communication with the first external device 102 through a second pipe 402, the first external device 102 is in communication with the first tank 101 through a third pipe 403, the second pipe 402 is connected to the first tank 101 through a fourth pipe 404, and the first circulation pump 103 is used to introduce the first medium into the first external device 102 through the second pipe 402 and into the first tank 101 through the fourth pipe 404; the heating assembly 310 is connected to the fourth pipe 404 for heating the first medium flowing through the fourth pipe 404.
Under the drive of the first circulating pump 103, the first medium reaching the set temperature is guided to the first external device 102 through the first pipeline 401 and the second pipeline 402, and the first medium flowing out of the first external device 102 flows back to the first liquid storage tank 101 through the third pipeline 403; the first medium which does not reach the set temperature flows to the heating assembly 310 through the first pipeline 401, the second pipeline 402 and the fourth pipeline 404, and flows to the first liquid storage tank 101 after being heated; in one possible implementation, the first circulation pump 103 may include a first external circulation pump for driving the first medium in the first tank 101 to heat the liquid of the first external device 102 and a first internal circulation pump for driving the heating assembly 310 to heat the first medium flowing through the fourth pipe 404.
In one possible implementation, the second tank 201 is in communication with the second circulation pump 203 via a fifth conduit 405, the second circulation pump 203 is in communication with the second external device 202 via a sixth conduit 406, the second external device 202 is in communication with the second tank 201 via a seventh conduit 407, the sixth conduit 406 is connected to the second tank 201 via an eighth conduit 408, the second circulation pump 203 is for introducing the second medium into the second external device 202 via the sixth conduit 406 and into the second tank 201 via the eighth conduit 408; the refrigeration assembly 320 is coupled to the eighth conduit 408 for heating the second medium flowing through the eighth conduit 408.
The second medium reaching the set temperature is guided to the second external device 202 through the fifth pipe 405 and the sixth pipe 406 under the driving of the second circulation pump 203, and the second medium flowing out of the second external device 202 flows back to the second liquid storage tank 201 through the seventh pipe 407; the second medium which does not reach the set temperature flows to the refrigeration assembly 320 through the fifth pipe 405, the sixth pipe 406 and the eighth pipe 408, and flows to the first liquid storage tank 101 after being cooled; in one possible implementation, the second circulation pump 203 may include a second external circulation pump for driving the second medium in the second tank 201 to cool the liquid of the second external device 202 and a second internal circulation pump for driving the refrigeration assembly 320 to cool the second medium flowing through the eighth conduit 408.
In one possible implementation, as shown in fig. 4, the heating assembly 310 includes a first semiconductor tile assembly 311, a second semiconductor tile assembly 312, a first air fin 313, a second air fin 314, and a first waterway heat exchanger plate 315, the first semiconductor tile assembly 311 being disposed opposite the second semiconductor tile assembly 312, the first waterway heat exchanger plate 315 being disposed between the first semiconductor tile assembly 311 and the second semiconductor tile assembly 312, the first air fin 313 being connected to the first semiconductor tile assembly 311 and being located on a side remote from the first waterway heat exchanger plate 315; the second air heat sink 314 is connected to the second semiconductor fin assembly 312 and is located at a side remote from the first waterway heat exchange plate 315; the first waterway heat exchange plate 315 is in fluid communication with the fourth tube 404. The first semiconductor die assembly 311 comprises at least one first semiconductor die and the second semiconductor die assembly 312 comprises at least one second semiconductor die.
In one possible implementation, the heating assembly 310 further includes a first heat sink fin 316 and a second heat sink fin 317, the first heat sink fin 316 being connected to the first air heat sink fin 313, the second heat sink fin 317 being connected to the second heat sink fin 317.
The side of the first semiconductor fin assembly 311 and the second semiconductor fin assembly 312 connected to the first water channel heat exchange plate 315 is a hot side, and is used for heating the first medium flowing in the first water channel heat exchange plate 315, in one possible implementation manner, a first serpentine coil is disposed in the first water channel heat exchange plate 315, and two ends of the first serpentine coil are communicated with the fourth pipeline 404, and the heat exchange area of the first medium can be increased by the arrangement of the first serpentine coil. The first heat dissipation fins 316 are connected to the cooled surface of the first semiconductor fin assembly 311 through the first air heat dissipation fins 313, the second heat dissipation fins 317 are connected to the cooled surface of the second semiconductor fin assembly 312 through the second air heat dissipation fins 314, the first heat dissipation fins 316 and the second heat dissipation fins 317 can increase heat dissipation area and heat dissipation capacity, and the cold generated by the first semiconductor fin assembly 311 and the second semiconductor fin assembly 312 is guided to the cooling assembly 320 through the guide assembly 330 to reduce the ambient temperature of the cooling assembly 320. In this embodiment, the first semiconductor die assembly 311 includes eight first semiconductor dies and the second semiconductor die assembly 312 includes eight second semiconductor dies.
In one possible implementation, as shown in fig. 5, the refrigeration assembly 320 includes a third semiconductor tile assembly 321, a fourth semiconductor tile assembly 322, a third air heat sink 323, a fourth air heat sink 324, and a second waterway heat exchanger plate 325, the third semiconductor tile assembly 321 being disposed opposite the fourth semiconductor tile assembly 322, the second waterway heat exchanger plate 325 being disposed between the third semiconductor tile assembly 321 and the fourth semiconductor tile assembly 322, the third air heat sink 323 being connected to the third semiconductor tile assembly 321 and being located on a side remote from the second waterway heat exchanger plate 325; fourth air fins 324 are connected to fourth semiconductor fin assembly 322 and are located on a side remote from second waterway heat exchange plate 325; the second waterway heat exchanger plate 325 is in fluid communication with an eighth tube 408. The third semiconductor tile assembly 321 includes at least one third semiconductor tile and the fourth semiconductor tile assembly 322 includes at least one fourth semiconductor tile.
In one possible implementation, the refrigeration assembly 320 further includes a third heat sink fin 326 and a fourth heat sink fin 327, the third heat sink fin 326 being connected to the third air heat sink fin 323, the fourth heat sink fin 327 being connected to the fourth air heat sink fin 324.
The side of the third semiconductor fin assembly 321 and the fourth semiconductor fin assembly 322 connected to the second water channel heat exchange plate 325 is a cold end for heating the second medium flowing in the second water channel heat exchange plate 325, in one possible implementation, a second serpentine coil is disposed in the second water channel heat exchange plate 325, and two ends of the second serpentine coil are communicated with the eighth pipeline 408, where the second serpentine coil is configured to increase the heat exchange area of the second medium. The third heat dissipation fins 326 are connected to the heated surface of the third semiconductor fin assembly 321 through the third air heat dissipation fins 323, the fourth heat dissipation fins 327 are connected to the heated surface of the fourth semiconductor fin assembly 322 through the fourth air heat dissipation fins 324, the third heat dissipation fins 326 and the fourth heat dissipation fins 327 can increase the heat dissipation area and the heat dissipation amount, and the heat generated by the third semiconductor fin assembly 321 and the fourth semiconductor fin assembly 322 is discharged through the heat dissipation assembly 340. The temperature of the cold energy derived from the heating assembly 310 is significantly lower than the room temperature, thus facilitating a rapid decrease in the temperature of the hot ends of the third and fourth semiconductor wafer assemblies 321 and 322, and utilizing the properties of the semiconductors to lower the temperature of the cold end is more efficient than conventional cooling using room temperature air flow. In this embodiment, the third semiconductor tile assembly 321 includes eight third semiconductor tiles and the fourth semiconductor tile assembly 322 includes eight fourth semiconductor tiles.
In one possible implementation, the flow guide assembly 330 is disposed on one side of the heating assembly 310, and the cooling assembly 320 is disposed on the other side of the heating assembly 310; the air guiding component 330 includes at least one first fan, and an air outlet side of the at least one first fan faces the heating component 310.
In one possible implementation, the flow guiding assembly 330 includes two first fans, the air outlet sides of the two first fans face the gaps between the first heat dissipation fins 316 and the second heat dissipation fins 317 of the heating assembly 310, the cold generated by the heating assembly 310 is diffused into the air around the heating assembly 310 through the first heat dissipation fins 316 and the second heat dissipation fins 317, and the cold is blown into the air around the cooling assembly 320 by the rotation of the first fans, so that the ambient temperature of the cooling assembly 320 is reduced, and the cooling efficiency of the third semiconductor fin assembly 321 and the fourth semiconductor fin assembly 322 of the cooling assembly 320 is improved.
In one possible implementation, the heat sink assembly 340 is disposed on one side of the refrigeration assembly 320 and remote from the heating assembly 310; the heat sink assembly 340 includes at least one second fan with an air intake side of the at least one second fan facing the refrigeration assembly 320.
The heat dissipation assembly 340 is disposed on one side of the cooling assembly 320 and is far away from the heating assembly 310, and in one possible implementation, the heat dissipation assembly 340 includes two second fans, and air inlet sides of the two second fans face the gaps between the third heat dissipation fins 326 and the fourth heat dissipation fins 327 of the cooling assembly 320, so that heat generated by the third semiconductor chip assembly 321 and the fourth semiconductor chip assembly 322 can be exhausted, the environmental temperature of the cooling assembly 320 is further reduced, and the cooling effect of the third semiconductor chip assembly 321 and the fourth semiconductor chip assembly 322 is improved.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (10)
1. A water tank device with double circulation loops is characterized in that,
comprises a first liquid storage tank (101), first external equipment (102), a first circulating pump (103), a second liquid storage tank (201), second external equipment (202), a second circulating pump (203) and a heat exchange device (300);
the first liquid storage tank (101), the first external device (102) and the first circulating pump (103) form a first circulating loop, and the second liquid storage tank (201), the second external device (202) and the second circulating pump (203) form a second circulating loop; the first external device (102) is an oxygenator, and the second external device (202) is a myocardial stop-jump protecting liquid device;
the heat exchange device (300) comprises a heating component (310), a refrigerating component (320), a flow guiding component (330) and a heat radiating component (340), wherein the flow guiding component (330) is arranged on one side of the heating component (310), and the refrigerating component (320) is arranged on the other side of the heating component (310); the heat dissipation assembly (340) is arranged at one side of the refrigeration assembly (320) and is far away from the heating assembly (310); the heating assembly (310) is in fluid communication with the first tank (101) for heating a first medium within the first tank (101); the refrigeration assembly (320) is in fluid communication with the second liquid storage tank (201), and the refrigeration assembly (320) adopts a semiconductor chip to cool a second medium in the second liquid storage tank (201); the flow guide assembly (330) is arranged opposite to the heating assembly (310) and is used for guiding the cold energy generated by the heating assembly (310) to the refrigerating assembly (320) along a first direction; the heat dissipation assembly (340) is arranged opposite to the refrigeration assembly (320) and is used for discharging heat generated by the refrigeration assembly (320) along a second direction, and the first direction is not opposite to the second direction.
2. The dual circulation loop tank apparatus of claim 1 wherein,
the first liquid storage tank (101) is communicated with the first circulating pump (103) through a first pipeline (401), the first circulating pump (103) is communicated with the first external device (102) through a second pipeline (402), the first external device (102) is communicated with the first liquid storage tank (101) through a third pipeline (403), the second pipeline (402) is connected with the first liquid storage tank (101) through a fourth pipeline (404), and the first circulating pump (103) is used for guiding the first medium into the first external device (102) through the second pipeline (402) and guiding the first medium into the first liquid storage tank (101) through the fourth pipeline (404);
the heating assembly (310) is connected to the fourth pipe (404) for heating the first medium flowing through the fourth pipe (404).
3. A dual circulation loop tank assembly as defined in claim 2, wherein,
the second liquid storage tank (201) is communicated with the second circulating pump (203) through a fifth pipeline (405), the second circulating pump (203) is communicated with the second external device (202) through a sixth pipeline (406), the second external device (202) is communicated with the second liquid storage tank (201) through a seventh pipeline (407), the sixth pipeline (406) is connected with the second liquid storage tank (201) through an eighth pipeline (408), and the second circulating pump (203) is used for guiding the second medium into the second external device (202) through the sixth pipeline (406) and guiding the second medium into the second liquid storage tank (201) through the eighth pipeline (408);
the refrigeration assembly (320) is connected to the eighth conduit (408) for heating the second medium flowing through the eighth conduit (408).
4. A dual circulation loop tank assembly as defined in claim 3, wherein,
the heating assembly (310) comprises a first semiconductor fin assembly (311), a second semiconductor fin assembly (312), a first air radiating fin (313), a second air radiating fin (314) and a first waterway heat exchange plate (315), wherein the first semiconductor fin assembly (311) is arranged opposite to the second semiconductor fin assembly (312), the first waterway heat exchange plate (315) is arranged between the first semiconductor fin assembly (311) and the second semiconductor fin assembly (312), and the first air radiating fin (313) is connected with the first semiconductor fin assembly (311) and is positioned at one side far away from the first waterway heat exchange plate (315); the second air cooling fin (314) is connected with the second semiconductor fin assembly (312) and is positioned at one side far away from the first waterway heat exchange plate (315); the first waterway heat exchange plate (315) is in fluid communication with the fourth tube (404).
5. The dual circulation loop tank apparatus of claim 4 wherein,
the heating assembly (310) further comprises a first radiating fin (316) and a second radiating fin (317), the first radiating fin (316) is connected with the first air radiating fin (313), and the second radiating fin (317) is connected with the second radiating fin (317).
6. The dual circulation loop tank apparatus of claim 4 wherein,
the refrigeration assembly (320) comprises a third semiconductor fin assembly (321), a fourth semiconductor fin assembly (322), a third air radiating fin (323), a fourth air radiating fin (324) and a second waterway heat exchange plate (325), wherein the third semiconductor fin assembly (321) is arranged opposite to the fourth semiconductor fin assembly (322), the second waterway heat exchange plate (325) is arranged between the third semiconductor fin assembly (321) and the fourth semiconductor fin assembly (322), and the third air radiating fin (323) is connected with the third semiconductor fin assembly (321) and is positioned at one side far away from the second waterway heat exchange plate (325); the fourth air radiating fin (324) is connected with the fourth semiconductor fin assembly (322) and is positioned at one side far away from the second waterway heat exchange plate (325); the second waterway heat exchange plate (325) is in fluid communication with the eighth tube (408).
7. The dual circulation loop tank apparatus of claim 6 wherein,
the refrigeration assembly (320) further comprises a third radiating fin (326) and a fourth radiating fin (327), wherein the third radiating fin (326) is connected with the third air radiating fin (323), and the fourth radiating fin (327) is connected with the fourth air radiating fin (324).
8. The dual circulation loop tank apparatus of claim 6 wherein,
the first semiconductor die assembly (311) includes at least one first semiconductor die, and the second semiconductor die assembly (312) includes at least one second semiconductor die;
the third semiconductor die assembly (321) includes at least one third semiconductor die and the fourth semiconductor die assembly (322) includes at least one fourth semiconductor die.
9. The dual circulation loop tank apparatus of claim 1 wherein,
the flow guiding assembly (330) comprises at least one first fan, and the air outlet side of the at least one first fan faces the heating assembly (310).
10. The dual circulation loop tank apparatus of claim 9 wherein,
the heat dissipation assembly (340) includes at least one second fan with an air intake side of the at least one second fan facing the refrigeration assembly (320).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210678362.0A CN115068722B (en) | 2022-06-16 | 2022-06-16 | Water tank equipment with double circulation loops |
| PCT/CN2022/108163 WO2023240754A1 (en) | 2022-06-16 | 2022-07-27 | Water tank device having double circulation loops |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210678362.0A CN115068722B (en) | 2022-06-16 | 2022-06-16 | Water tank equipment with double circulation loops |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115068722A CN115068722A (en) | 2022-09-20 |
| CN115068722B true CN115068722B (en) | 2023-05-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210678362.0A Active CN115068722B (en) | 2022-06-16 | 2022-06-16 | Water tank equipment with double circulation loops |
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| Country | Link |
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| CN (1) | CN115068722B (en) |
| WO (1) | WO2023240754A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115653897B (en) * | 2022-11-15 | 2023-10-24 | 山东泰展机电科技股份有限公司 | Vortex line based air pump |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004028576A (en) * | 2003-06-27 | 2004-01-29 | Sanyo Electric Co Ltd | Air conditioning refrigerating device |
| CN101592417B (en) * | 2008-05-28 | 2012-07-04 | 吕瑞强 | Cooling and heating system with cooling-heating source complementor |
| CN101592416B (en) * | 2008-05-28 | 2012-05-23 | 吕瑞强 | Cooling and heating system with cooling-heating source complementing loop |
| CN101581515B (en) * | 2009-06-16 | 2011-06-29 | 李隆 | Heat pump type refrigerating and heating equipment and hot water pool and cold water pool |
| CN104390391B (en) * | 2014-11-14 | 2017-06-06 | 合肥美的暖通设备有限公司 | Energy exchanger, heat refrigerating all-in-one machine and energy exchange control method |
| CN107519550B (en) * | 2016-07-29 | 2018-12-18 | 伟闻胡 | It is a kind of to stop jumping the cold-heat exchange system that operation uses for multiple departments of cardiac surgery simultaneously |
| CN107596472B (en) * | 2016-07-29 | 2018-10-12 | 伟闻胡 | A kind of cold-heat exchange system stoping jumping operation for department of cardiac surgery |
| DE102017003508A1 (en) * | 2017-04-11 | 2018-10-11 | Fresenius Medical Care Deutschland Gmbh | Apparatus for extracorporeal blood treatment and method for operating an extracorporeal blood treatment apparatus |
| WO2019086631A1 (en) * | 2017-11-06 | 2019-05-09 | MAQUET CARDIOPULMONARY GmbH | Extracorporeal blood heating and cooling system and method of operating and maintaining same |
| CN113476678A (en) * | 2021-07-06 | 2021-10-08 | 山东大学齐鲁医院 | Temperature control system and method for ECMO treatment of cardiopulmonary failure |
| CN114344594A (en) * | 2021-12-23 | 2022-04-15 | 北京航天长峰股份有限公司 | Heat exchange water tank and temperature control method thereof |
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| WO2023240754A1 (en) | 2023-12-21 |
| CN115068722A (en) | 2022-09-20 |
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Effective date of registration: 20231110 Address after: 201210 room 107, building 3, No. 608, shengxia Road, China (Shanghai) pilot Free Trade Zone, Pudong New Area, Shanghai Patentee after: Shanghai saitengyuanyan Medical Technology Co.,Ltd. Address before: Building 36, Dongjing industrial square, No.9, Dongfu Road, Suzhou Industrial Park, Jiangsu Province, 215000 Patentee before: JIANGSU SAITENG MEDICAL TECHNOLOGY Co.,Ltd. |
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