201206326 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明係與溫度傳導裝置有關，特別有關於一種具有致 冷晶片的溫度傳導裝置。 【先前技術】 [0002] 傳統空調裝置需使用冷煤，然，冷煤在製造與回收上會 帶來嚴重的環境污染問題，因此已出現有利用熱電致冷 晶片（Thermoelectric Cooling Chip)取代使用冷媒 之空調機的想法。 〇 [0003] 由於熱電致冷晶片（以下簡稱致冷晶片）具有體積小 '無 噪音、不使用冷煤、無環保公害等優點，故已有不少熱 電致冷晶片的應用實例，如將其應用在電腦CPU的冷卻、 除濕箱、車用行動冷藏箱等等裝置上；另外，如中華民 國申請之第1270650號專利，係揭示一種快速致冷雙溫散 熱器件，其具有一致冷晶片、兩導熱塊至少一支以上或 一或兩組若干超導熱管和兩散熱鰭片構成，該致冷晶片 Q 的其中一側產生冷溫溫度，而於另一側則相對產生熱溫 溫度，並分別直接傳導至其兩側的導熱塊上，隨即再傳 導至插裝在各該導熱塊中的超導熱管的先端，將該冷、 熱溫度分別快速導達、移熱至該各超導熱管先端的散熱 鰭片上，俾分別作散熱或冷卻之用。 [0004] 上揭專利係欲以熱電致冷晶片而達到的致冷和散熱效果 ，惟，其致冷和散熱效果不佳的原因在於：該熱電致冷晶 片的溫度無法降低至所要求的溫度，進而無法達到所要 求的散熱要求或致冷溫度。 099124603 表單編號A0101 第5頁/共20頁 0992043253-0 201206326 [0005] [0006] [0007] [0008] [0009] 099124603 有鑑於此，本發明人為改善並解決上述之缺失，乃特潛 〜研九並配合學理之運用，終於提出一種設計合理且有 效改善上述缺失之本發明。 【發明内容】 本發明之一目的，在於提供一種串聯型連續降溫及升溫 裝置，係將複數氣冷式散熱器予以串聯，藉以持續降低 致冷的溫度，進而達到所要求的致冷效果。 本發明之另一目的，在於提供一種串聯型連續降溫及升 /里裝置，係將複數氣冷式散熱器予以串聯，藉以持續提 泰 套 鬲致熱的溫度，進而達到所要求的致熱效果。 為了達成上述之目的，本發明係為一種串聯型連續降溫 及升溫裝置，包括液冷式冷卻器、複數致冷晶片及複數 氣冷式散熱器；液冷式冷卻器包含複數水冷座、連接管 、水冷排及輸水管，各水冷分別具有一出水口及一入水 口，連接管以串聯方式連通任二湘鄰水冷座的出水口和 入水口，水冷排配置在水冷座的一側邊，輸水管連通水 冷座及水冷排；每一致冷晶片具有相對的冷端面及熱端 面，冷端面貼接在水冷座上；氣冷式散熱器對應致冷晶 片配設’每一氣冷式散熱器包含基座超導管及多數鰭 片，基座貼接在熱端面上，超導管固定在基座中，多數 鰭片套接在超導管上。 本發明之再一目的，在於提供一種使用少量電力的串聯 型連續降溫及升溫裴置，其可在一般壓縮機無法使用的 惡劣環境溫度下使用，進而替代冷煤的使用，以徹底解 決因冷煤所造成的環境污染及溫室效應問題，並能大量 表單編號A0101 第6頁/共20頁 0992043253-0 201206326 節省能源。 [0010] ο Ο [0011] [0012] 相較於習知，太级ηη . 發月之串聯型連續降溫及升溫裝置，經 連ϋ以串聯方式連通任二相鄰水冷座的該出水 #入水σ II此持續地降低致冷溫度，進而達到所要 求的致m另—方面，其散熱H將持續升高的致 熱/皿度送出’進而相所要求的致熱效果；再者，其超 導官的超導液體由氫氧化納、鉻酸鉀、乙酵及水等物質 的混合物依不同比例所組成，汽化後係藉由分子間的相 互推擠、碰撞而將熱自熱端傳遞至冷端，使該超導液體 不需回流而無能量損艋;另外，超導液體的能量傳遞快 、能快速帶走致冷晶片大量的熱，故其致冷晶片具有極 佳的致冷效果’進而達到所要求的致冷溫度，增加本發 明之實用性；此外，相較於習知需使用大電量的壓縮機 等元件的空調裝置’本發明僅需提供小量的電力（供置冷 晶片及風扇）即可運作’可節省大量的能源及電費，更符 合環保性及經濟性。 【實施方式】 有關本發明之詳細說明及技術内容，配合圖式說明如下 ，然而所附圖式僅提供參考與說明用，並非用來對本發 明加以限制者。 請參第一圖及第二圖，係分別為本發明串聯型連續降溫 及升溫裝置之立體分解圖及立體外觀示意圖；本發明之 串聯型連續降溫及升溫裝置1係包含一液冷式冷卻器20 、複數致冷晶片l〇a、l〇b及複數氣冷式散熱器30a、 30b 。 099124603 表單編號A0101 第7頁/共20頁 0992043253-0 201206326 [0013] 該液冷式冷卻器20包含複數水冷座2ia、21b及一連接管 22、一水冷排23與一輸水管24，各水冷座21a、21b分別 具有一入水口 211a、211b及一出水口 212a、212b，該 連接管22以串聯方式連通任二相鄰該水冷座的該出水口 和該入水口，本實施例中，該連接管22係穿接水冷座2la 的出水口 212a及另一相鄰水冷座21b的入水口 211b ;此 外，該二水冷座21a、21b的一側邊配置有該水冷排μ， 該水冷排23由複數水冷鰭片231及彎折穿設在該些水冷轉 片231中的一銅管232所組成，該水冷排23具有一入水端 2301及〆出水端2302，其係藉由該輸水管24而與該二水 冷座21a、21b串接連通，該輸水管24中裝填有一冷卻液 體（圖未示），該冷卻液體可作為傳導介質而在該二水冷 座21a、21b及該水冷排23之間流動，另外，該輸水管24 上可加設有一水泵25，用以加壓該冷卻液體，使該冷卻 液體可快速、連續地在該輸水管24中流動。 [0014] 該輸水管24可分為一出水管241及一八水營242，該出水 官241連接該水冷座21 a的入本口 21 la及該水冷排23的出 水端2302，該入水管242則連接該水冷座21b的出水口 212b及該水冷排23的入水端2301，較佳地，該水泵25係 裝設在該出水管241上，然而，裝設在該入水管242上亦 無不可，在該水冷排23的水冷鰭片23〗一侧端上可裝設有 一送冷風扇26，藉由該送冷風扇26可將該些水冷鰭片231 的冷吹送出去。 該致冷晶片IGa、轉換材料所構成，在提供電 流運轉後’其-端面的溫度會升高形成_冷端面，另一 099124603 表單編號A0101 第8頁/共20頁 0992043253-0 [0015] 201206326 端面溫度則降低而形成一熱端面，因此，該致冷晶片10a 具有相對的一冷端面11a及一熱端面12a，同樣地，另一 致冷晶片10b具有相對的一冷端面lib及一熱端面12b， 該二致冷晶片l〇a、l〇b的冷端面11a、lib上分別貼接在 該二水冷座21a、21b上。 [0016] 此外，複數氣冷式散熱器30a、30b係對應該等致冷晶片 10a、10b配設，每一氣冷式散熱器30a、30b的設置皆為 相同，在此以氣冷式散熱器30a為例說明其組合結構，另 一傳導模組30b的組設方式亦為相同，該氣冷式散熱器 30a包含一基座31a、一超導管32a、複數鰭片33a及一風 扇34a，該基座3la貼接在該致冷晶片10a的熱端面12a上 ，該基座31a由導熱性佳的材質構成，其底面設有複數溝 槽311a，該溝槽31 la中嵌設有該超導管32a，該超導管 32a的一端固定在該基座31a，其另一端則穿設在該些鰭 片33a中，此外，該些鰭片33a的一側端上裝設有該風扇 34a，藉由該風扇34a可將該些鰭片33a的熱吹送出去。 [0017] 同理，另一氣冷式散熱器30b的設置方式亦相同，其包含 有一基座31b、一超導管32b、複數鰭片33b及一風扇34b ，其中，該基座31b係貼接在該致冷晶片10b的熱端面 12b 上。 [0018] 請續參第三圖，係為本發明串聯型連續降溫及升溫裝置 之超導管的剖視圖；該超導管32a、32b的結構大致相同 ，在第三圖中以該超導管32a為例而說明其結構，該超導 管32a為一金屬管321a，其材質可由銅或鋁構成，該超導 管32a的内部具有一超導液體322a，該超導液體322a為 099124603 表單編號A0101 第9頁/共20頁 0992043253-0 201206326 氫氧化鈉、鉻酸鉀、乙醇及水等物質的混合物，該超導 液體322a在吸熱汽化後會充滿在該金屬管321a内，藉由 分子間的相互推擠移動而將熱自熱端傳遞至冷端，且因 各混合物之凝結溫度的不同，該超導液體322a不需回流 而以分子碰撞的方式作單向能量傳遞，此外，本發明中 填裝有該超導液體322a的超導管32a可在0°C至-34°C 的環境溫度下不結冰，又，其可運作的環境溫度低於50 °C即可；再者，該超導管32a的内部更可設置一毛細結構 323a，該毛細結構323a可由金屬粉末與一金屬網324a燒 結而成（由銅或鋁所構成），該金屬網324a係置設在該金 屬粉末的内侧，藉由該毛細結構323a的設置，可增加該 超導管32a的傳導效率。 [0019] 請參第四圖，係為本發明串聯式溫度傳導裝置之使用示 意圖；上述串聯型連續降溫及升溫裝置1可應用在冷暖機 、冰淇淋機、或冷藏室等設備内，設置時，該些氣冷式 散熱器30a、30b係設置在設備外部，以作為散熱之用， 並將該送冷風扇26裝設在設備的内部，以持續地將該液 冷式冷卻器20所產生的致冷效果吹送到設備内部，以達 到所要求的冷度，另一方面，該些氣冷式散熱器30a、 30b亦將持續升高的致熱溫度送出，進而達到所要求的致 熱效果。 [0020] 請參第五圖，係為本發明串聯型連續降溫及升溫裝置之 第二實施例；本實施例之串聯型連續降溫及升溫裝置Γ 與第一實施例大致相同，其不同之處係在於該二氣冷式 散熱器30a、30b之間插設有另一氣冷式散熱器30c，以 099124603 表單編號A0101 第10頁/共20頁 0992043253-0 201206326 於該送冷風扇26處送出溫度更低的冷風；該氣冷式散熱 器30c的組合結構與另二氣冷式散熱器30a、30b相同， 包含有一基座31c、一超導管32c、複數鰭片33c及一風 扇34c，此外，該串聯型連續降溫及升溫裝置Γ另包含 有一致冷晶片10c、一水冷座21c及一連接管22a，該二 連接管22、22a分別用以串接相鄰的二水冷座21b、21c 與水冷座21c、21a的出、入水口。 [0021] Ο [0022] [0023] [0024] G [0025] 以上所述僅為本發明之較佳實施例，非用以限定本發明 之專利範圍，其他運用本發明之專利精神之等效變化， 均應倶屬本發明之專利範圍。 【圖式簡單說明】 第一圖係本發明串聯型連續降溫及升溫裝置之立體分 解圖； 第二圖係本發明串聯型連續降溫及升溫裝置之立體外 觀示意； 第三圖係本發明串聯型連續降溫及升溫裝置之超導管 的剖視圖； [0026] [0027] 第四圖係本發明串聯型連續降溫及升溫裝置之使用示 意圖；以及 第五圖係本發明串聯型連續降溫及升溫裝置之第二實 施例。 【主要元件符號說明】 1、Γ串聯型連續降溫及升溫裝置 10a〜10c致冷晶片 099124603 表單編號A0101 第11頁/共20頁 0992043253-0 201206326 1 la、1 lb冷端面 12a、12b熱端面 20液冷式冷卻器 21a〜21c水冷座 211a、211b入水口 212a、212b 出水口 22、22a連接管 23水冷排 2 3 01入水端 2 3 0 2出水端 2 31水冷鰭片 232銅管 24輸水管 241出水管 242入水管 25水泵 2 6送冷風扇 30a〜30c氣冷式散熱器 31 a〜31 c基座 311a溝槽 32a〜32c超導管 321a金屬管 322a超導液體 323a毛細結構 324a金屬網 33a~33c 縛片 099124603 表單編號A0101 第12頁/共20頁 0992043253-0 201206326 34a~34c 風扇201206326 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a temperature conduction device, and more particularly to a temperature conduction device having a refrigerant wafer. [Prior Art] [0002] Conventional air-conditioning units require the use of cold coal. However, cold coal causes serious environmental pollution problems in manufacturing and recycling. Therefore, the use of thermoelectric cooling chips (Thermoelectric Cooling Chip) has replaced the use of refrigerants. The idea of air conditioners. 〇[0003] Since thermoelectrically cooled wafers (hereinafter referred to as cryogenic wafers) have the advantages of small volume, no noise, no use of cold coal, no environmental pollution, etc., there are many application examples of thermoelectrically cooled wafers, such as The utility model relates to a device for cooling, a dehumidification box, a mobile refrigerator and the like of a computer CPU. In addition, as disclosed in the Patent No. 1270650 of the Republic of China, a rapid cooling double temperature heat radiator member having a uniform cold wafer and two The heat conducting block is composed of at least one or more than one or two sets of superconducting heat pipes and two heat dissipating fins, wherein one side of the refrigerating wafer Q generates a cold temperature, and the other side generates a relative temperature and a temperature respectively. Directly conducted to the heat conducting blocks on both sides thereof, and then re-conducted to the tip end of the superconducting heat pipe inserted in each of the heat conducting blocks, and the cold and hot temperatures are respectively quickly guided and transferred to the front ends of the superconducting heat pipes. The heat sink fins are used for heat dissipation or cooling. [0004] The above-mentioned patent is a cooling and heat dissipating effect to be obtained by thermoelectrically cooling a wafer, but the reason why the cooling and heat dissipation effects are not good is that the temperature of the thermoelectrically cooled wafer cannot be lowered to a desired temperature. In turn, the required heat dissipation requirements or cooling temperatures cannot be achieved. 099124603 Form No. A0101 Page 5 / Total 20 Page 0992043253-0 201206326 [0005] [0006] [0007] [0009] 099124603 In view of this, the present inventors have improved and solved the above-mentioned shortcomings, In conjunction with the application of the theory, the present invention finally proposes a invention that is rational in design and effective in improving the above-mentioned deficiency. SUMMARY OF THE INVENTION An object of the present invention is to provide a series-type continuous temperature-lowering and temperature-increasing device in which a plurality of air-cooled radiators are connected in series to continuously reduce the temperature of the refrigeration to achieve the desired cooling effect. Another object of the present invention is to provide a series-type continuous cooling and liter/increment device in which a plurality of air-cooled radiators are connected in series to continuously heat the temperature of the ferrule, thereby achieving the required heating effect. . In order to achieve the above object, the present invention is a series continuous cooling and temperature increasing device, comprising a liquid cooled cooler, a plurality of cryogenic wafers and a plurality of air cooled radiators; the liquid cooled cooler comprises a plurality of water cooling seats and connecting pipes , water-cooled row and water pipe, each water-cooling has a water outlet and a water inlet respectively, the connecting pipe is connected in series to the water outlet and the water inlet of the water-cooling seat of the water-cooled seat, and the water-cooling row is arranged on one side of the water-cooled seat, and the water pipe is connected Water-cooled seat and water-cooled row; each uniform cold wafer has opposite cold end faces and hot end faces, cold end faces are attached to water-cooled seats; air-cooled heat sinks correspond to cryogenic wafers. 'Each air-cooled heat sink includes pedestal super The catheter and most of the fins are attached to the hot end face, the supercatheter is fixed in the base, and most of the fins are sleeved on the supercatheter. A further object of the present invention is to provide a series-type continuous cooling and temperature rising device using a small amount of electric power, which can be used in a harsh ambient temperature that cannot be used by a general compressor, thereby replacing the use of cold coal to completely solve the problem of cold. The environmental pollution caused by coal and the greenhouse effect, and can save a lot of energy on the form number A0101 Page 6 of 20 0992043253-0 201206326. [0012] [0012] [0012] Compared to the conventional, the ternary level ηη. The series-type continuous cooling and temperature rising device of the month, connected to the water of any two adjacent water-cooled seats in series by the flail σ II this continuously reduces the cooling temperature, and thus achieves the required m-direction, the heat-dissipating H will continue to increase the heat/dishness to send out the heat effect required by the phase; in addition, its super The superconducting liquid of the guide is composed of a mixture of sodium hydroxide, potassium chromate, ethyl yeast and water in different proportions. After vaporization, the superheated end is transferred to the hot self-heating end by mutual pushing and collision between molecules. The cold end makes the superconducting liquid do not need to be reflowed without energy loss; in addition, the superconducting liquid has fast energy transfer and can quickly take away a large amount of heat of the cooled wafer, so that the cooled wafer has excellent cooling effect. 'In turn, the required refrigeration temperature is increased, and the utility of the present invention is increased; in addition, the air conditioner of the present invention requires only a small amount of electric power (for cooling). Chips and fans) can operate 'can save a lot of Source and electricity, but also complies with environmental protection and the economy. The detailed description and technical contents of the present invention are set forth below with reference to the accompanying drawings. Please refer to FIG. 1 and FIG. 2 respectively, which are respectively a perspective exploded view and a stereoscopic appearance view of the series continuous cooling and temperature increasing device of the present invention; the series continuous cooling and temperature increasing device 1 of the present invention comprises a liquid cooling cooler. 20, a plurality of cooled wafers l〇a, l〇b and a plurality of air-cooled heat sinks 30a, 30b. 099124603 Form No. A0101 Page 7 / Total 20 Page 0992043253-0 201206326 [0013] The liquid-cooled cooler 20 includes a plurality of water-cooled seats 2ia, 21b and a connecting pipe 22, a water-cooling row 23 and a water pipe 24, each water-cooling seat 21a, 21b respectively have a water inlet 211a, 211b and a water outlet 212a, 212b, the connecting pipe 22 is connected in series to the water outlet of the water adjacent seat and the water inlet. In this embodiment, the connection The tube 22 is connected to the water outlet 212a of the water-cooling seat 2la and the water inlet 211b of the other adjacent water-cooling seat 21b. Further, the water-cooling row μ is disposed on one side of the water-cooling seats 21a and 21b, and the water-cooling row 23 is a plurality of water-cooling fins 231 and a copper tube 232 bent through the water-cooling fins 231. The water-cooling row 23 has a water inlet end 2301 and a water outlet end 2302, which are connected by the water conduit 24 The water conduit 24 is filled with a cooling liquid (not shown), and the cooling liquid can serve as a conductive medium between the water-cooling seats 21a and 21b and the water-cooling row 23 Flowing, in addition, a water can be added to the water pipe 24 25, for the pressurized cooling fluid so that the cooling liquid can be quickly and continuously the input flow of the pipe 24. [0014] The water delivery pipe 24 can be divided into an outlet pipe 241 and an eight-water battalion 242. The water outlet 241 is connected to the inlet port 21 la of the water-cooling seat 21 a and the water outlet end 2302 of the water-cooling row 23 . 242 is connected to the water outlet 212b of the water-cooling seat 21b and the water inlet end 2301 of the water-cooling row 23. Preferably, the water pump 25 is installed on the water outlet pipe 241, however, it is not installed on the water inlet pipe 242. No, a cooling fan 26 may be disposed on one side of the water-cooling fin 23 of the water-cooling row 23, and the cooling fan 26 may blow the water-cooling fins 231 coldly. The refrigerant chip IGa and the conversion material are formed, and after the current supply operation, the temperature of the end surface thereof rises to form a cold end surface, and another 099124603 form number A0101 page 8/20 pages 0992043253-0 [0015] 201206326 The end surface temperature is lowered to form a hot end surface. Therefore, the refrigerating wafer 10a has a relatively cold end surface 11a and a hot end surface 12a. Similarly, the other refrigerating wafer 10b has a relatively cold end surface lib and a hot end surface 12b. The cold end faces 11a and 11b of the two cooled wafers l〇a and lb are attached to the two water-cooling seats 21a and 21b, respectively. [0016] In addition, the plurality of air-cooled heat sinks 30a, 30b are disposed corresponding to the equal-cooling wafers 10a, 10b, and the settings of each of the air-cooled heat sinks 30a, 30b are the same, and the air-cooled heat sink is used here. 30a is an example to illustrate the combined structure, and the other conductive module 30b is also configured in the same manner. The air-cooled heat sink 30a includes a base 31a, a supercavity 32a, a plurality of fins 33a and a fan 34a. The pedestal 3a is attached to the hot end surface 12a of the chilled wafer 10a. The pedestal 31a is made of a material having good thermal conductivity, and the bottom surface thereof is provided with a plurality of grooves 311a, and the supercatheter is embedded in the groove 31la. 32a, one end of the supercatheter 32a is fixed to the base 31a, and the other end is disposed in the fins 33a. Further, the fan 34a is mounted on one end of the fins 33a. The fan 34a can blow out the heat of the fins 33a. [0017] Similarly, the other air-cooled heat sink 30b is disposed in the same manner, and includes a base 31b, a supercavity 32b, a plurality of fins 33b, and a fan 34b, wherein the base 31b is attached thereto. The cold end face 12b of the cooled wafer 10b is placed. [0018] Please refer to the third drawing, which is a cross-sectional view of the supercatheter of the series continuous cooling and temperature increasing device of the present invention; the superconducting tubes 32a, 32b have substantially the same structure, and in the third figure, the supercatheter 32a is taken as an example. The superconducting tube 32a is a metal tube 321a made of copper or aluminum. The superconducting tube 32a has a superconducting liquid 322a inside. The superconducting liquid 322a is 099124603. Form No. A0101 Page 9/ A total of 20 pages 0992043253-0 201206326 a mixture of sodium hydroxide, potassium chromate, ethanol and water, the superconducting liquid 322a will be filled in the metal tube 321a after endothermic vaporization, and moved by intermolecular push And transferring the hot self-heating end to the cold end, and the superconducting liquid 322a is unidirectional energy transfer in a molecular collision manner without reflux due to the difference in the condensation temperature of each mixture, and further, the present invention is filled with the The superconducting tube 32a of the superconducting liquid 322a can be ice-free at an ambient temperature of 0 ° C to -34 ° C, and its operable ambient temperature is lower than 50 ° C; further, the supercatheter 32 a A capillary structure 323a can be arranged inside. The capillary structure 323a may be formed by sintering a metal powder and a metal mesh 324a (made of copper or aluminum). The metal mesh 324a is disposed inside the metal powder, and the capillary structure 323a is provided to increase the The conduction efficiency of the supercatheter 32a. [0019] Please refer to the fourth drawing, which is a schematic diagram of the use of the serial temperature conduction device of the present invention; the serial continuous cooling and temperature increasing device 1 can be applied to equipment such as a heating and cooling machine, an ice cream machine, or a refrigerating room. The air-cooled heat sinks 30a, 30b are disposed outside the apparatus for heat dissipation, and the cooling fan 26 is installed inside the apparatus to continuously generate the liquid-cooled cooler 20. The cooling effect is blown into the interior of the apparatus to achieve the desired degree of cooling. On the other hand, the air-cooled radiators 30a, 30b also deliver a continuously elevated heating temperature to achieve the desired heating effect. [0020] Referring to FIG. 5, it is a second embodiment of the series continuous cooling and temperature increasing device of the present invention; the series continuous cooling and temperature increasing device of the present embodiment is substantially the same as the first embodiment, and the difference is the same. The air-cooled heat sink 30c is interposed between the two air-cooled heat sinks 30a and 30b, and the temperature is sent to the cooling fan 26 at 099124603, form number A0101, page 10/20 pages 0992043253-0 201206326. a lower cold air; the air-cooled heat sink 30c has the same structure as the other air-cooled heat sinks 30a, 30b, and includes a base 31c, a super duct 32c, a plurality of fins 33c, and a fan 34c. The series-type continuous cooling and temperature increasing device further comprises a uniform cold chip 10c, a water-cooling seat 21c and a connecting pipe 22a, wherein the two connecting pipes 22, 22a are respectively connected to the adjacent two water-cooling seats 21b, 21c and the water-cooling seat. 21c, 21a out, water inlet. [0022] [0024] [0024] The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the patent of the present invention, and other equivalents of the patent spirit of the present invention. Variations are all within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a perspective exploded view of the series continuous cooling and temperature increasing device of the present invention; the second drawing is a three-dimensional appearance of the series continuous cooling and temperature increasing device of the present invention; A cross-sectional view of a superconducting tube of a continuous cooling and temperature increasing device; [0026] [0027] FIG. 4 is a schematic view showing the use of the series continuous cooling and temperature increasing device of the present invention; and a fifth drawing of the series continuous cooling and temperature increasing device of the present invention Two embodiments. [Main component symbol description] 1. Γ series continuous cooling and temperature rising device 10a~10c chilled wafer 099124603 Form No. A0101 Page 11 / Total 20 pages 0992043253-0 201206326 1 la, 1 lb cold end face 12a, 12b hot end face 20 Liquid-cooled coolers 21a to 21c Water-cooled seats 211a, 211b Water inlets 212a, 212b Water outlets 22, 22a Connection pipes 23 Water-cooled rows 2 3 01 Water inlets 2 3 0 2 Water outlets 2 31 Water-cooled fins 232 Copper pipes 24 Water pipes 241 outlet pipe 242 inlet pipe 25 water pump 2 6 delivery cooling fan 30a to 30c air-cooled radiator 31 a to 31 c base 311a groove 32a to 32c superconductor 321a metal pipe 322a superconducting liquid 323a capillary structure 324a metal mesh 33a ~33c Binder 099124603 Form No. A0101 Page 12 / Total 20 Page 0992043253-0 201206326 34a~34c Fan
099124603 表單編號A0101 第13頁/共20頁 0992043253-0099124603 Form No. A0101 Page 13 of 20 0992043253-0