TW200909989A - Projection device and heat dissipation method - Google Patents

Abstract

A projection device and a heat dissipation method are provided. The projection device includes a first mechanism, a second mechanism and a connecting mechanism. The first mechanism includes a first casing, an optical element and at least a heat-conduction element. The optical element is disposed in the first casing. The optical element projects an image and generates a heat source. The heat-conduction element is disposed on the optical element for absorbing the heat source. The second mechanism includes a second casing and a heat-dissipation element. The heat-dissipation element is disposed in the second casing. The connecting mechanism is used for connecting the first mechanism and the second mechanism. The connecting mechanism includes at least a heat-conduction pipe. The heat-conduction pipe is connected to the heat-conduction element and the heat-dissipation element to form a close loop. The heat-conduction pipe is used for conducting the heat source to the heat- dissipation element to cool the optical element.

Description

200909989

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a projection apparatus and a heat dissipation method, and more particularly to a projection apparatus and a heat dissipation method for separating a heat dissipating component and an optical component. [Prior Art] The use of the projector is mainly to enlarge the image and project it onto the screen. ί The main components of the projector are the projection lens and the bulb. The light emitted by the bulb projects the image onto the screen via the projection lens. When using the projector, the lamp must continue to illuminate and its illumination must be strong enough to project the magnified image onto the screen. The heat will continue to increase as the bulb continues to illuminate. Therefore, the temperature inside the projector will continue to rise. When the temperature of the projector is too high, the components inside it are very easy to damage, so the heat dissipation design of the projector is very important. Traditionally, the heat dissipation design of the projector is to provide a heat dissipating device in the projector. The heat dissipating device is a cooling fan, and the air inlet and the air outlet are designed on the casing of the projector. With the operation of the cooling fan, the gas introduced into the projector from the air inlet enters the projector to cool the components in the projector, and then the hot air is led out by the air outlet to form an effective gas heat dissipation cycle, so that the projector can remain hot. It works normally. A large amount of noise is generated when the cooling fan is operated, and hot air is generated at the air outlet, so that the user is affected by noise when the projector is running, and an unpleasant feeling when being blown by the hot air. In addition, the air inlet and outlet for the heat dissipation on the projector

Although the U7PA 200909989 port can solve the problem of heat dissipation inside the projector's internal heat source, it is also easy for external dust to enter the projector and affect internal components. SUMMARY OF THE INVENTION The present invention relates to a projection apparatus and a heat dissipation method for connecting a optomechanical component and a heat dissipating component by a connection mechanism to separate the optomechanical component and the heat dissipating component into different mechanisms. According to a first aspect of the present invention, a projection apparatus is provided, the projection apparatus comprising a first mechanism, a second mechanism and a connection mechanism. The first mechanism includes a first housing, a optomechanical component, and at least one thermally conductive component. The optomechanical component is disposed within the first housing, and the optomechanical component projects an image and generates a heat source. A thermally conductive element is disposed on the opto-mechanical component for absorbing the heat source. The second mechanism includes a second housing and a heat dissipating component. The heat dissipating component is disposed in the second housing. The connecting mechanism is for connecting the first mechanism and the second mechanism, wherein the connecting mechanism comprises at least one heat pipe. The heat pipe is connected to the heat conducting element and the heat dissipating component and forms at least one closed loop for conducting a heat source to the heat dissipating component to cool the optoelectronic component. According to a second aspect of the invention, a method of dissipating heat is provided. The heat dissipation method includes the following steps. (a) providing a first mechanism, the first mechanism comprising a optomechanical component, the optomechanical component projecting an image and generating a heat source; (b) providing a second mechanism, the second mechanism comprising a heat dissipating component; Receiving the heat source with a thermally conductive element; and (d) conducting the heat source from the thermally conductive element to the heat dissipating element. In order to make the above contents of the present invention more obvious and easy to understand, the following is particularly preferred 200909989

The _37PA' embodiment is described in detail with reference to the accompanying drawings. [Embodiment] A projection apparatus and a heat dissipation method of the present invention separate a optomechanical component and a heat dissipating component by a connecting mechanism. The heat source generated by the optomechanical component can be radiated to the heat dissipating component via the connection mechanism to solve the heat source and noise generated by the heat dissipating component. The following is a detailed description of different embodiments with projection devices having different internal structures. First Embodiment Referring to Figure 1A, there is shown a schematic view of a projection apparatus in accordance with a first embodiment. The projection device 100 includes a first mechanism 120, a second mechanism 140, and a connection mechanism 160. The first mechanism 120 includes a first housing 121, a optomechanical element 122, and a plurality of thermally conductive elements 125. The optomechanical component 122 is disposed within the first housing 121. The optomechanical component 122 projects an image and generates a heat source. A plurality of thermally conductive elements 125 are disposed on the opto-mechanical component 122 I for absorbing heat. The second mechanism 140 includes a second housing 141 and a heat dissipating component 144. The heat dissipating member 144 is disposed in the second housing 141. The connecting mechanism 160 is used to connect the first mechanism 120 and the second mechanism 140. In the present embodiment, the connecting mechanism 160 includes a plurality of heat pipes 161. The heat pipe 161 is connected to the heat conducting element 125 and the heat radiating element 144 to form a plurality of closed loops, and the heat pipe 161 is used to conduct a heat source to the heat radiating element 144 to cool the light machine element 122. Please refer to FIG. 1A and FIG. 2 at the same time. FIG. 2 is a flow chart showing a heat dissipation method of the projection mechanism according to the first embodiment of the present invention. First, in step 201 of Fig. 2, a first mechanism 120 is provided, and the first mechanism 120 includes a optomechanical element 122. In the present embodiment, the optomechanical component 122 is disposed in the first housing 121, wherein the optomechanical component 122 includes a lens (Lens) 123 and a light source (Lamp) 124. When the optomechanical element 122 is in operation, the light source 124 emits a light that passes through the lens 123 and is projected to the outside to produce an image. Therefore, the light source 124 and the lens 123 through which the light passes are all generating a heat source. Next, in step 202, a second mechanism 140 is provided, the second mechanism 14A including a heat dissipating component 144. The heat dissipating component 144 is disposed in the second housing 141, and the heat dissipating component 144 is, for example, a heat exchanger. In the present embodiment, the heat exchanger is, for example, an air-cooled heat exchanger or a water-cooled heat exchanger. In addition, the second housing 141 has an opening 142 and the second mechanism 140 further includes a fan 146. The fan 146 is disposed in the second casing 141, and the fan 146 convects the internal airflow of the second mechanism 140 to the outside through the opening 142 to dissipate heat from the heat dissipating component 144. Then, in step 203 of Fig. 2, the heat source is absorbed by the heat conducting element 125. A thermally conductive element 125 is disposed on each of the components of the opto-mechanical component 122 (e.g., lens 123 and a light source 124) to absorb the heat source. Please refer to the first drawing, which shows an enlarged schematic view of the heat pipe and the heat conducting element according to the first drawing. In the present embodiment, the thermally conductive element 125 is preferably a uniform cold wafer (TEC). Due to the thermoelectric energy conversion characteristics of the cooled wafer, different temperatures are generated across the cooled wafer when passing through direct current. In other words, due to its material

• 37PA 200909989. When the cooled wafer is electrically conductive, its surface will cool down and it will be called cold surface 125a, while the other side will heat up and will be called hot surface 125b. Therefore, the cold surface 125a of the heat conducting element 125 is connected to the optomechanical element 122 (the lens 123 or a light source 124, which is taken as an example of the lens 123 in FIG. 1B) for cooling and absorbing the optical component 122 (lens 123). Or a light source 124) generates a heat source. Please refer to both Figure 1A and Figure 1C. Fig. 1C is an enlarged schematic view showing the heat transfer tube according to Fig. 1A. As shown in step 204 of Figure 2, a connection mechanism 160 is provided for connecting the thermally conductive element 125 and the heat dissipating element 144 to form a closed loop. As shown in Fig. 1A, a plurality of heat transfer tubes 161 are connected in parallel with the heat transfer elements 125 and the heat dissipating elements 144 to form a plurality of closed loops. As shown in FIG. 1C, the connection mechanism 160 further includes a heat transfer fluid 162, a plurality of pumps 163 (shown in FIG. 1A), and a circuit 165. The heat transfer fluid 162 is disposed within the heat pipe 161. The pump 163 is used to circulate the heat transfer fluid 162 in the closed loop of the heat pipes 161. The circuit 165 can be disposed in the heat pipe 161 or outside the heat pipe 161. The first mechanism 120 is electrically connected to the second mechanism (140 through the circuit 165. The second mechanism 140 further includes a power supply 143 and a driver. (Driver) 145. The power supply 143 is disposed in the second housing 141 for providing power to the first mechanism 120 and the second mechanism 140. The driver 145 is disposed in the second housing 141 for driving the first The optomechanical component 122 of a mechanism 120. The circuit 165 can transmit power from the power supply 143 of the second mechanism 140 to the first mechanism 120 to provide power to the optomechanical component 122, via which the driver 145 can also pass. The optomechanical element 122 of the first mechanism 120 is driven. 200909989

37PA Please refer to Figure 1A again. In step 205 of Figure 2, a thermally conductive fluid 162 is caused to circulate between the thermally conductive element 125 and the heat dissipating element 144. The heat conducting tube 161 is connected to the heat conducting member 125 and the heat dissipating member 144 to form a closed loop, and the heat transfer fluid 162 is disposed in the heat conducting tube 161. The heat transfer fluid 162 can be circulated in the heat pipe 161 via a plurality of pumps 163. Please refer to Figure 1 and Figure 1C. In step 204, a heat source is conducted from the thermally conductive element 125 to the heat dissipating component 144. In the present embodiment, the heat transfer fluid 162 is a fluid having a specific heat equal to or greater than one, such as a refrigerant or pure water, and is effective for conducting a heat source of the heat conductive member 125 to the heat transfer fluid 162. The connecting mechanism 160 preferably includes an exchange groove 164 disposed between the heat conducting element 125 and the heat pipe 161 and the material of the exchange groove 164 is a heat conductive material, which can effectively increase the heat transfer fluid 162 and the heat conductive element 125. The thermal conductivity area to improve thermal conductivity. When the heat transfer fluid 162 absorbs the heat source in the exchange tank 164, it is returned to the heat dissipating member 144 through the closed loop of the heat pipe 161 to dissipate heat. The fan 146 convects a flow of air between the heat dissipating members 144 to accelerate the heat transfer of the heat transfer fluid 162, and accelerates the heat convection speed in the second mechanism 140 through the opening 142 of the second casing 141 to discharge the heat to the second mechanism. 140. When the heat dissipating fluid 162 is dissipated through the heat dissipating component 144, it has an endothermic conduction capability, that is, it can be reflowed to the heat conducting component 125 to absorb the heat source conducted by the heat conducting component 125. The circulation flow thus effectively transmits the heat source generated by the first mechanism 120 to the second mechanism 140 for heat dissipation. In addition, since the heat conducting element 125 is in the same embodiment, the cold crystal 11 is uniform.

437PA 200909989 film. However, the heat conducting element 125 is not limited to the cooling crystal, and the heat source generated by the optomechanical element 22 can be directly conducted to the heat conducting fluid 162 using the heat conducting metal block, and the heat is radiated via the heat conducting fluid i62. In addition, the wall material of the heat pipe 161 is preferably further provided with a heat insulating material to shield the external heat source from the heat transfer fluid 162 and reduce the heat absorbing ability of the heat transfer fluid 162. Furthermore, in the present embodiment, only the optical component 122 is disposed in the first mechanism 12A, and the remaining components (such as the power supply 143) are disposed in the second mechanism 14 (^ such that the volume and weight of the first mechanism 12〇) In order to reduce the space to the minimum, the optical components 1 need to be disposed in the first mechanism 120 and the heat dissipating component 144 and the fan to be disposed outside the second mechanism 140, and the remaining components can be changed according to actual conditions. The position is not limited. Further, since the first mechanism 12 and the second mechanism 140 are connected by the connecting mechanism 丨 60, the first mechanism 120 and the second mechanism 140 are separately disposed at different positions. As shown in FIG. 1A The first mechanism 12 is disposed in the first space R1, and the second mechanism u is disposed in the second space R2. The first space is, for example, a room, and the second space R2 is, for example, an outdoor space, or the second space R1. For example, on a desktop, the second space R2 is, for example, a desktop, etc. By separating the optical component 122 of the first mechanism 12 and the thermal reading 144 of the second mechanism 140, the user can be used to solve the problem. Interference by noise The problem of hot air blowing. In addition, in the present embodiment, the 'heat-conducting tubes 161 are connected in parallel” with the optical element 122 (lens (3) and the light source (3)) generating the heat source, and each of the 12 ϋ7ΡΑ 200909989 is a closed loop. The heat source is transmitted to the heat dissipating component 144 to dissipate heat. The parallel connection method ensures that each of the optoelectronic components 122 has a good heat dissipation effect. For the second embodiment, please refer to FIG. 3, which illustrates a second embodiment of the present invention. The projection device 200 of the second embodiment is not intended to be connected to the heat-conducting element 125 and the heat-dissipating element 144 ′ via the heat pipe 166 to transmit the heat source of the optomechanical element 122 through the heat pipe 166 . The heat sink 166 is different from the projection apparatus 1 of the first embodiment in the arrangement of the heat transfer tubes 166. The heat transfer tubes 161 and heat conduction of the above-described first embodiment The connecting method of the component 125 and the heat dissipating component _144 is a parallel configuration method, as shown in the first drawing. In this embodiment, the heat pipe 166 and the heat conducting component 125 and the heat dissipating component are The 144 series application configuration method in series, the rest of which are not repeated. In the present embodiment, the 'first mechanism 120 includes a plurality of heat conduction elements 125' and the connection mechanism 260 includes a plurality of heat pipes 166. The heat conducting elements 125 and the heat dissipating elements 144 are connected in series to form a closed loop, and the heat conducting fluid 162 (shown in FIG. 1 ) flows in the closed circuit to dissipate the first mechanism 120 In addition, in the present embodiment, the heat pipe 166 is connected in series to the optomechanical element 122 having the heat source, and the heat source is conducted to the heat dissipating component 丨44 in the same closed loop to dissipate heat, thereby reducing the amount of the heat pipe 166. 13 200909989

The 37PA is effective in reducing the space in which the piping is disposed, and the volume of the entire projection device 200 is reduced. In addition, the above two embodiments are respectively described in parallel and in series as different embodiments, respectively, and the two connection modes each have their applicable conditions. Thus, embodiments of the projection device can be selectively used in series, parallel or series/parallel mixing depending on the actual situation. The projection device and the heat dissipation method disclosed in the above embodiments of the present invention separate the optical component and the heat dissipation component by using the connection mechanism, so that the optical component and the heat dissipation component are separated into different spaces, thereby effectively solving the problem when the user uses the projection device. The problem of being disturbed by noise and hot air. In addition, since the first mechanism conducts heat through the connecting mechanism, it does not need to be provided with a fan and an opening, and becomes a closed space, which can effectively isolate external dust, maintain optical quality, and prolong the service life of the optical component. In the above, the present invention has been disclosed in the above preferred embodiments, but it is not intended to limit the present invention. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. 14 200909989

The second embodiment of the present invention is a schematic diagram of a projection device according to the first embodiment; 1 is a schematic enlarged view of a heat transfer tube according to FIG. 1A; FIG. 2 is a flow chart showing a heat dissipation method of a projection mechanism according to a first embodiment of the present invention; and FIG. 3 is a view showing a projection of a second embodiment of the present invention; Schematic diagram of the device. 15 200909989 " [Main component symbol description] 57ΡΑ

·-»- 1 /Hl·.-.»··. — J > X 1 X 100, 200: Projection device 120 First mechanism 121 First housing 122 Optomechanical component 123 Lens 124 Light source 125 Thermally conductive element 125a : cold surface 125b : hot surface 140 : second mechanism 141 : second housing 142 : opening 143 : power supply 144 : heat dissipation element 145 : driver 146 : fan 160 , 260 : connection mechanism 161 , 166 : heat pipe 162 : Heat transfer fluid 163: pump 164: exchange tank 165: circuit R1: first space R2: second space 16

Claims (1)

200909989 2;* 乂7PA' X. Patent application scope: 1. A projection device comprising: a first mechanism comprising: a first housing; a optomechanical component disposed in the first housing, the The optomechanical component projects an image and generates a heat source; and at least one heat conducting component is disposed on the optomechanical component for absorbing the heat source; a second mechanism comprising: a second housing; and a heat dissipating component, The second mechanism is disposed in the second housing; and a connecting mechanism is configured to connect the first mechanism and the second mechanism, and the method includes: at least one heat pipe connected to the heat conducting component and the heat dissipating component, and forming at least one A closed circuit is configured to conduct the heat source to the heat dissipating component to cool the optoelectronic component. 2. The projection device of claim 1, wherein the connecting mechanism further comprises: at least one heat transfer fluid disposed in the heat pipe; and at least one pump to allow the heat transfer fluid to be in the heat pipe The closed loop circulates. 3. The projection device of claim 2, wherein the connecting mechanism further comprises: an exchange slot disposed between the heat conducting component and the heat pipe to 17 200909989 7ΡΛ—wu — - - - ' *· 'The heat transfer fluid is exchanged. 4. The projection device of claim 3, wherein the material of the exchange groove is a heat conductive material. 5. The projection device of claim 2, wherein the thermally conductive flow system is a fluid having a specific heat greater than or equal to one. 6. The projection device of claim 5, wherein the heat transfer flow system is a refrigerant or pure water. 7. The projection device of claim 1, wherein the wall of the heat pipe is made of a heat insulating material. 8. The projection device of claim 1, wherein the first mechanism comprises a plurality of heat conducting elements, the connecting mechanism comprising a plurality of heat conducting tubes, wherein the heat conducting tubes are connected in parallel with the heat conducting elements and the heat dissipating component To form a plurality of closed loops. 9. The projection device of claim 8, wherein the connecting mechanism further comprises: a plurality of heat transfer fluids disposed in the heat pipes; and a plurality of pumps to allow the heat transfer fluids to The closed loops of the heat pipes are circulated. 10. The projection device of claim 1, wherein the first mechanism comprises a plurality of thermally conductive elements connected in series with the thermally conductive elements and the heat dissipating elements to form the closed loop. 11. The projection device of claim 1, wherein the second housing has an opening, the second mechanism further comprising: a fan disposed in the second housing, wherein the fan is through the opening 18 200909989 ___........ ί7ΡΑ Convect the internal airflow of the second mechanism to the outside to dissipate the heat dissipating component. 12. The projection device of claim 1, wherein the connection mechanism further comprises: a circuit electrically connecting the first mechanism and the second mechanism. 13. The projection device of claim 12, wherein the second mechanism further comprises: a power supply disposed in the second housing for providing the first mechanism and the second mechanism The power supply. 14. The projection device of claim 12, wherein the second mechanism further comprises: a driver disposed in the second housing for driving the opto-mechanical component of the first mechanism. 15. The projection device of claim 1, wherein the thermally conductive element is a Thermoelectric Cooling (TEC). The projection device of claim 15, wherein both ends of the refrigerating wafer are a hot surface and a cold surface, wherein the cold surface is connected to the optical component, the thermal surface system Connected to the heat pipe. 17. The projection apparatus of claim 1, wherein the optomechanical component comprises: a lens (Lens); and a light source (Lamp) that emits a light to the lens. The projection device of claim 1, wherein the thermal element is a heat exchanger. 19. The projection farm according to claim 18, wherein the parent exchanger is an air-cooled heat exchanger or a water-cooled heat exchanger. The projection device of claim 1, wherein the first mechanism is a closed space. Λ 21· A heat dissipation method comprising: (a·) providing a first mechanism, the first mechanism comprising a optomechanical component, the optomechanical component projecting an image and generating a heat source; (b) k for a younger brother a mechanism, the second mechanism including a heat dissipating component; (c) absorbing the heat source with a heat conducting component; and (d) conducting the heat source from the heat conducting component to the heat dissipating component. 22. The heat dissipation method of claim 21, wherein the step (d) further comprises: (dl) pushing a heat transfer fluid to circulate between the heat conducting element and the heat sink element. People 20