TW201734626A - Heat sink and projector - Google Patents
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- TW201734626A TW201734626A TW106121070A TW106121070A TW201734626A TW 201734626 A TW201734626 A TW 201734626A TW 106121070 A TW106121070 A TW 106121070A TW 106121070 A TW106121070 A TW 106121070A TW 201734626 A TW201734626 A TW 201734626A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/16—Cooling; Preventing overheating
Abstract
Description
本發明係關於投影技術領域，尤其涉及一種散熱裝置及投影機，且所述投影機係主要應用於投影系統當中。The present invention relates to the field of projection technology, and in particular, to a heat sink and a projector, and the projector is mainly used in a projection system.
隨著科學技術的發展，投影機在生活和工作中的應用越來越廣泛。其中，投影機是一種將電能轉化爲光能的大功率設備，其組成結構主要包括有多個在工作過程中產生大量熱量的熱源，例如光源模組、色輪和處理晶片等。With the development of science and technology, projectors are becoming more and more widely used in life and work. Among them, the projector is a high-power device that converts electrical energy into light energy, and its composition mainly includes a plurality of heat sources that generate a large amount of heat during work, such as a light source module, a color wheel, and a processing chip.
另一方面，投影機爲了達到較好的防塵效果，結構一般都非常緊密，以至於上述熱源所產生的熱量不能有效地進行散熱，而導致熱量不斷地積聚；並且，一旦熱量積聚過高，將會嚴重影響投影機內的光學器件和電子器件的性能和壽命。On the other hand, in order to achieve better dustproof effect, the structure of the projector is generally so tight that the heat generated by the above heat source cannot be effectively dissipated, resulting in continuous accumulation of heat; and, once the heat buildup is too high, It can seriously affect the performance and life of the optics and electronics inside the projector.
有鑒於此，本發明提供了一種散熱裝置、投影機及投影系統，通過散熱裝置對投影機內的熱源進行散熱冷卻，避免出現熱源產生的大量熱量不能散熱而積聚的情況，並且每個液冷板中的水冷液統一通過熱交換器進行散熱，保證了散熱裝置的佔用體積小。In view of the above, the present invention provides a heat dissipating device, a projector and a projection system. The heat sink is used to dissipate heat from the heat source in the projector, so as to avoid a large amount of heat generated by the heat source, which cannot be dissipated by heat, and each liquid is cooled. The water-cooled liquid in the plate is uniformly radiated through the heat exchanger, ensuring a small volume of the heat sink.
爲實現上述目的，本發明提供的技術方案如下：To achieve the above object, the technical solution provided by the present invention is as follows:
一種散熱裝置，應用於投影機，包括：第一液冷板至第N液冷板、幫浦和熱交換器，N爲不小於2的整數；所述第一液冷板至第N液冷板與所述熱交換器之間相連通，且所述幫浦連接於所述第一液冷板至第N液冷板與所述熱交換器之間。A heat dissipating device is applied to a projector, comprising: a first liquid cooling plate to an Nth liquid cooling plate, a pump and a heat exchanger, wherein N is an integer not less than 2; and the first liquid cooling plate to the Nth liquid cooling plate And communicating with the heat exchanger, and the pump is connected between the first liquid cooling plate to the Nth liquid cooling plate and the heat exchanger.
優選地，所述熱交換器包括：熱交換板，所述熱交換板與所述第一液冷板至第N液冷板之間相連通；以及，固定於所述熱交換板上的至少一個散熱風扇。Preferably, the heat exchanger includes: a heat exchange plate, wherein the heat exchange plate is in communication with the first liquid cooling plate to the Nth liquid cooling plate; and at least fixed to the heat exchange plate A cooling fan.
優選地，所述幫浦的進水口與所述熱交換器的出水口相連通；所述幫浦的出水口與所述第一液冷板至第N液冷板的進水口相連通；以及，所述第一液冷板至第N液冷板的出水口均與所述熱交換器的進水口相連通。Preferably, the water inlet of the pump is in communication with the water outlet of the heat exchanger; the water outlet of the pump is in communication with the water inlet of the first liquid cooling plate to the Nth liquid cooling plate; The water outlets of the first liquid cooling plate to the Nth liquid cooling plate are all connected to the water inlet of the heat exchanger.
優選地，所述幫浦的進水口與所述熱交換器的出水口相連通；所述幫浦的出水口與所述第一液冷板的進水口相連通；以及，所述第一液冷板至第N液冷板中第i液冷板的出水口與第i+1液冷板的進水口相連通，且所述第N液冷板的出水口與所述熱交換器的進水口相連通，i爲不大於N的正整數。Preferably, the water inlet of the pump is in communication with the water outlet of the heat exchanger; the water outlet of the pump is in communication with the water inlet of the first liquid cooling plate; and the first liquid The water outlet of the ith liquid cooling plate in the cold plate to the Nth liquid cooling plate is in communication with the water inlet of the i+1th liquid cooling plate, and the water outlet of the Nth liquid cooling plate and the heat exchanger are advanced. The nozzles are connected, and i is a positive integer not greater than N.
優選地，所述幫浦的出水口與所述熱交換器的進水口相連通；所述幫浦的進水口與所述第一液冷板的出水口相連通；以及，所述第一液冷板至第N液冷板中第i液冷板的進水口與第i+1液冷板的出水口相連通，且所述第N液冷板的進水口與所述熱交換器的出水口相連通，i爲不大於N的正整數。Preferably, the water outlet of the pump is in communication with the water inlet of the heat exchanger; the water inlet of the pump is in communication with the water outlet of the first liquid cooling plate; and the first liquid The water inlet of the ith liquid cooling plate in the cold plate to the Nth liquid cooling plate is in communication with the water outlet of the i+1th liquid cooling plate, and the water inlet of the Nth liquid cooling plate and the heat exchanger The nozzles are connected, and i is a positive integer not greater than N.
相應的，本發明還提供了一種投影機，包括熱源模組，所述熱源模組包括有第一熱源至第N熱源，N 爲不小於2的整數，所述投影機還包括散熱裝置，所述散熱裝置包括：第一液冷板至第N液冷板、幫浦和熱交換器，其中，所述第一液冷板至第N液冷板分別與所述第一熱源至第N熱源相接觸設置，所述第一液冷板至第N液冷板與所述熱交換器之間相連通，且所述幫浦連接於所述第一液冷板至第N液冷板與所述熱交換器之間。Correspondingly, the present invention further provides a projector comprising a heat source module, the heat source module comprising a first heat source to an Nth heat source, N being an integer not less than 2, the projector further comprising a heat sink, The heat dissipating device comprises: a first liquid cooling plate to an Nth liquid cooling plate, a pump and a heat exchanger, wherein the first liquid to the Nth liquid cooling plate respectively are opposite to the first to Nth heat sources Contacting, the first liquid cooling plate to the Nth liquid cooling plate are in communication with the heat exchanger, and the pump is connected to the first liquid cooling plate to the Nth liquid cooling plate and Between heat exchangers.
優選地，所述熱交換器包括：熱交換板，所述熱交換板與所述第一液冷板至第N液冷板之間相連通；以及，固定於所述熱交換板上的至少一個散熱風扇。Preferably, the heat exchanger includes: a heat exchange plate, wherein the heat exchange plate is in communication with the first liquid cooling plate to the Nth liquid cooling plate; and at least fixed to the heat exchange plate A cooling fan.
優選地，所述幫浦的進水口與所述熱交換器的出水口相連通；所述幫浦的出水口與所述第一液冷板至第N液冷板的進水口相連通；以及，所述第一液冷板至第N液冷板的出水口均與所述熱交換器的進水口相連通。Preferably, the water inlet of the pump is in communication with the water outlet of the heat exchanger; the water outlet of the pump is in communication with the water inlet of the first liquid cooling plate to the Nth liquid cooling plate; The water outlets of the first liquid cooling plate to the Nth liquid cooling plate are all connected to the water inlet of the heat exchanger.
優選地，所述幫浦的進水口與所述熱交換器的出水口相連通；所述幫浦的出水口與所述第一液冷板的進水口相連通；以及，所述第一液冷板至第N液冷板中第i液冷板的出水口與第i+1液冷板的進水口相連通，且所述第N液冷板的出水口與所述熱交換器的進水口相連通，i爲不大於N的正整數。Preferably, the water inlet of the pump is in communication with the water outlet of the heat exchanger; the water outlet of the pump is in communication with the water inlet of the first liquid cooling plate; and the first liquid The water outlet of the ith liquid cooling plate in the cold plate to the Nth liquid cooling plate is in communication with the water inlet of the i+1th liquid cooling plate, and the water outlet of the Nth liquid cooling plate and the heat exchanger are advanced. The nozzles are connected, and i is a positive integer not greater than N.
優選地，所述幫浦的出水口與所述熱交換器的進水口相連通；所述幫浦的進水口與所述第一液冷板的出水口相連通；以及，所述第一液冷板至第N液冷板中第i液冷板的進水口與第i+1液冷板的出水口相連通，且所述第N液冷板的進水口與所述熱交換器的出水口相連通，i爲不大於N的正整數。Preferably, the water outlet of the pump is in communication with the water inlet of the heat exchanger; the water inlet of the pump is in communication with the water outlet of the first liquid cooling plate; and the first liquid The water inlet of the ith liquid cooling plate in the cold plate to the Nth liquid cooling plate is in communication with the water outlet of the i+1th liquid cooling plate, and the water inlet of the Nth liquid cooling plate and the heat exchanger The nozzles are connected, and i is a positive integer not greater than N.
優選地，靠近所述熱交換器進水口的液冷板所對應的熱源，其產生的熱量大於其餘熱源分別產生的熱量。Preferably, the heat source corresponding to the liquid-cooled plate adjacent to the water inlet of the heat exchanger generates heat greater than that generated by the remaining heat sources.
相應的，本發明還提供了一種投影系統，所述投影系統包括上述的投影機。Accordingly, the present invention also provides a projection system including the projector described above.
相較於現有技術，本發明提供的技術方案至少具有以下優點：Compared with the prior art, the technical solution provided by the present invention has at least the following advantages:
本發明提供了一種散熱裝置、投影機及投影系統，包括熱源模組，所述熱源模組包括有第一熱源至第N熱源，N爲不小於2的整數，所述投影機還包括散熱裝置，所述散熱裝置包括：第一液冷板至第N液冷板、幫浦和熱交換器，其中，所述第一液冷板至第N液冷板分別與所述第一熱源至第N熱源相接觸設置，所述第一液冷板至第N液冷板與所述熱交換器之間相連通，且所述幫浦連接於所述第一液冷板至第N液冷板與所述熱交換器之間。The invention provides a heat dissipating device, a projector and a projection system, comprising a heat source module, the heat source module comprising a first heat source to an Nth heat source, N is an integer not less than 2, and the projector further comprises a heat sink The heat dissipating device includes: a first liquid cooling plate to an Nth liquid cooling plate, a pump and a heat exchanger, wherein the first liquid to the Nth liquid cooling plate and the first heat source to the Nth, respectively The heat source is in contact with the first liquid cooling plate to the Nth liquid cooling plate and the heat exchanger, and the pump is connected to the first liquid cold plate to the Nth liquid cold plate Between the heat exchangers.
由上述內容可知，散熱裝置工作過程中，水冷液自熱交換器流入液冷板中，通過液冷板吸收與其接觸的熱源所產生的熱量後，水冷液回流至熱交換器中散熱，達到對熱源散熱的目的。本發明提供的技術方案，通過散熱裝置對投影機內的熱源進行散熱冷卻，避免出現熱源產生的大量熱量不能散熱而積聚的情況，並且每個液冷板中的水冷液統一通過熱交換器進行散熱，保證了散熱裝置的佔用體積小。It can be seen from the above that during the operation of the heat sink, the water-cooled liquid flows from the heat exchanger into the liquid-cooled plate, and after the liquid-cooled plate absorbs the heat generated by the heat source in contact with it, the water-cooled liquid is returned to the heat exchanger for heat dissipation. The purpose of heat source heat dissipation. The technical solution provided by the invention cools and heats the heat source in the projector through the heat dissipating device, avoids the situation that a large amount of heat generated by the heat source cannot be dissipated by heat, and the water-cooled liquid in each liquid-cooled plate is uniformly passed through the heat exchanger. The heat dissipation ensures that the heat sink has a small footprint.
下面將結合本發明實施例中的附圖，對本發明實施例中的技術方案進行清楚、完整地描述，顯然，所描述的實施例僅僅是本發明一部分實施例，而不是全部的實施例。基於本發明中的實施例，本領域普通技術人員在沒有做出創造性勞動前提下所獲得的所有其他實施例，都屬於本發明保護的範圍。The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, but not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.
正如背景技術所述，投影機是一種將電能轉化爲光能的大功率設備，其組成結構包括有多個在工作過程中產生大量熱量的熱源，例如光源模組、色輪和處理晶片等。而投影機爲了達到較好的防塵效果，結構一般都非常緊密，以至於熱源產生的熱量不能及時的散熱而使得熱量不斷積聚。一旦熱量積聚過高，將會嚴重影響投影機內的光學器件和電子器件的性能和壽命。As described in the background art, a projector is a high-power device that converts electrical energy into light energy, and its composition includes a plurality of heat sources that generate a large amount of heat during operation, such as a light source module, a color wheel, and a processing wafer. In order to achieve better dustproof effect, the structure of the projector is generally so tight that the heat generated by the heat source cannot be dissipated in time to cause heat to accumulate. Once the heat buildup is too high, it will seriously affect the performance and life of the optics and electronics inside the projector.
基於此，本申請實施例提供了一種散熱裝置、投影機，且主要應用於投影系統當中，通過散熱裝置對投影機內的熱源進行散熱冷卻，避免出現熱源產生的大量熱量不能散熱而積聚的情況，並且每個液冷板中的水冷液統一通過熱交換器進行散熱，保證了散熱裝置的佔用體積小。爲實現上述目的，本申請實施例提供的技術方案如下，其中，結合圖1至圖4對本申請實施例提供的技術方案進行詳細描述。Based on this, the embodiments of the present application provide a heat dissipating device and a projector, and are mainly used in a projection system, and heat dissipating and cooling the heat source in the projector through a heat dissipating device to avoid a large amount of heat generated by the heat source and not being able to dissipate heat. And the water-cooling liquid in each liquid-cooled plate is uniformly radiated through the heat exchanger, thereby ensuring that the heat-dissipating device has a small occupied volume. The technical solutions provided by the embodiments of the present application are as follows. The technical solutions provided by the embodiments of the present application are described in detail in conjunction with FIG. 1 to FIG.
請參考圖1所示，爲本申請實施例提供的一種散熱裝置的結構示意圖，其中，散熱裝置應用於投影機，並包括有：第一液冷板101至第N液冷板10n (N爲不小於2的整數)、幫浦200以及熱交換器300。Please refer to FIG. 1 , which is a schematic structural diagram of a heat dissipation device according to an embodiment of the present disclosure. The heat dissipation device is applied to a projector, and includes: a first liquid cooling plate 101 to an Nth liquid cooling plate 10 n (N is An integer not less than 2), the pump 200, and the heat exchanger 300.
其中，所述第一液冷板101至第N液冷板10n與所述熱交換器300之間相連通，且所述幫浦200連接於所述第一液冷板101至第N液冷板10n與所述熱交換器300之間。Wherein, the first liquid cooling plate 101 to the Nth liquid cooling plate 10n are in communication with the heat exchanger 300, and the pump 200 is connected to the first liquid cooling plate 101 to the Nth liquid cooling The plate 10n is interposed between the heat exchanger 300.
具體來說，第一液冷板101至第N液冷板10n的不同液冷板之間，以及，液冷板與熱交換器300之間均通過傳輸管道相連通，且幫浦200連接於傳輸管道上，保證液冷板和熱交換器300之間實現水冷液的流通。Specifically, between the different liquid cooling plates of the first liquid cooling plate 101 to the Nth liquid cooling plate 10n, and between the liquid cooling plate and the heat exchanger 300 are connected through a transmission pipe, and the pump 200 is connected to On the transfer pipe, the circulation of the water-cooled liquid between the liquid-cooled plate and the heat exchanger 300 is ensured.
需要說明的是，本申請實施例對於提供的散熱裝置中液冷板、幫浦和熱交換器內流動的冷媒可以爲水，還可以爲液態氮(LN2)等，對此本申請實施例不作具體限制；此外，本申請實施例對於提供的液冷板、熱交換器的熱交換板和傳輸管道的材質不作具體限制，需要根據實際需要進行具體設計。It should be noted that, in the embodiment of the present application, the refrigerant flowing in the liquid cooling plate, the pump, and the heat exchanger in the heat dissipating device may be water, or may be liquid nitrogen (LN2) or the like, which is not specifically described in this embodiment of the present application. In addition, the embodiment of the present application does not specifically limit the materials of the provided liquid-cooled plate, the heat exchange plate of the heat exchanger, and the transmission pipe, and needs to be specifically designed according to actual needs.
參考圖1所示，對於本申請實施例提供的所述熱交換器300可以爲風冷熱交換器，熱交換器300可以包括：熱交換板301，所述熱交換板301與所述第一液冷板101至第N液冷板10n之間相連通；以及，固定於所述熱交換板301上的至少一個散熱風扇302。Referring to FIG. 1 , the heat exchanger 300 provided in the embodiment of the present application may be an air-cooled heat exchanger, and the heat exchanger 300 may include: a heat exchange plate 301, the heat exchange plate 301 and the first liquid. The cold plate 101 to the Nth liquid cold plate 10n are in communication with each other; and at least one heat radiating fan 302 fixed to the heat exchange plate 301.
其中，水冷液通過幫浦200的牽引回流至熱交換板301中，而後通過散熱風扇302轉動產生的風量與熱交換板301發生強制對流作用將熱量帶走，以對水冷液進行冷卻，而後再次通過幫浦200的牽引流入液冷板中對熱源進行散熱。Wherein, the water-cooled liquid is returned to the heat exchange plate 301 through the traction of the pump 200, and then the air volume generated by the rotation of the heat-dissipating fan 302 and the heat exchange plate 301 are forced to convect to take away the heat to cool the water-cooled liquid, and then again The heat source is dissipated into the liquid cooling plate by the traction of the pump 200.
由上述內容可知，將液冷板與熱源相接觸設置，進而在散熱裝置工作過程中，幫浦200牽引水冷液開始流動，使得水冷液自熱交換器300流入液冷板中，通過液冷板吸收與其接觸的熱源所產生的熱量後，水冷液回流至熱交換器300中散熱，達到對熱源散熱的目的，並且每個液冷板中的水冷液統一通過熱交換器300進行散熱，保證了散熱裝置的佔用體積小。此外，每個液冷板中的水冷液統一通過熱交換器300進行散熱，只需要對一個熱交換器300中設置風扇即可，避免了大量使用風扇而出現噪音過大的情況，同時還降低了功率消耗。It can be seen from the above that the liquid-cooled plate is placed in contact with the heat source, and during the operation of the heat-dissipating device, the pump 200 draws the water-cooled liquid to start flowing, so that the water-cooled liquid flows from the heat exchanger 300 into the liquid-cooled plate through the liquid-cooled plate. After absorbing the heat generated by the heat source in contact with it, the water-cooled liquid is returned to the heat exchanger 300 for heat dissipation to achieve heat dissipation for the heat source, and the water-cooled liquid in each liquid-cooled plate is uniformly radiated through the heat exchanger 300 to ensure heat dissipation. The heat sink has a small footprint. In addition, the water-cooled liquid in each liquid-cooled plate is uniformly radiated through the heat exchanger 300, and only a fan is disposed in one heat exchanger 300, thereby avoiding a large amount of noise caused by using a fan, and also reducing the noise. Power consumption.
本申請實施例提供的散熱裝置中，所有液冷板之間可以相互並聯、且連通於熱交換器，即，參考圖1所示，所述幫浦200的進水口與所述熱交換器300的出水口相連通；且所述幫浦200的出水口與所述第一液冷板101至第N液冷板10n的進水口相連通；以及，所述第一液冷板101至第N液冷板10n的出水口均與所述熱交換器300的進水口相連通。並且，所述液冷板的進水口連通於相鄰液冷板的進水口液冷板，且所述每一個液冷板的出水口係連通於相鄰液冷板的出水口。In the heat dissipation device provided by the embodiment of the present application, all the liquid cooling plates may be connected in parallel with each other and communicate with the heat exchanger, that is, as shown in FIG. 1 , the water inlet of the pump 200 and the heat exchanger 300 The water outlets are connected to each other; and the water outlet of the pump 200 is in communication with the water inlets of the first liquid cooling plate 101 to the Nth liquid cooling plate 10n; and the first liquid cooling plate 101 to the Nth The water outlet of the liquid-cooled plate 10n is in communication with the water inlet of the heat exchanger 300. Moreover, the water inlet of the liquid cooling plate is connected to the water inlet plate of the adjacent liquid cooling plate, and the water outlet of each of the liquid cooling plates is connected to the water outlet of the adjacent liquid cooling plate.
需要說明的是，相較於圖1中幫浦所示的牽引方向，當散熱裝置中所有液冷板之間相互並聯時（即圖1所示的連接結構），其幫浦的牽引方向還可以與圖1中幫浦所示的牽引方向相反。It should be noted that, compared with the traction direction shown by the pump in FIG. 1, when all the liquid-cooled plates in the heat sink are connected in parallel (ie, the connection structure shown in FIG. 1), the traction direction of the pump is also It can be opposite to the traction direction shown by the pump in Figure 1.
其中，幫浦200牽引水冷液自熱交換器300傳輸至每個液冷板中，通過液冷板吸收各自相對應的熱源散發的熱量後，根據幫浦200的牽引方向傳輸至熱交換器300中，熱交換器300對水冷液進行散熱冷卻，而後再次被牽引至液冷板中吸收熱量，如此重複達到對熱源散熱的目的。The pump 200 draws the water-cooled liquid from the heat exchanger 300 to each of the liquid-cooled plates, absorbs the heat radiated by the corresponding heat sources through the liquid-cooled plate, and then transmits the heat to the heat exchanger 300 according to the traction direction of the pump 200. The heat exchanger 300 heat-dissipates the water-cooled liquid, and then is again drawn to the liquid-cooled plate to absorb heat, thus repeating the purpose of dissipating heat to the heat source.
另外，本申請實施例提供的散熱裝置中，所有液冷板之間還可以相互串聯、且連通於熱交換器，即，參考圖2所示，爲本申請實施例提供的另一種散熱裝置的結構示意圖，其中，所述幫浦200的進水口與所述熱交換器300的出水口相連通。In addition, in the heat dissipating device provided by the embodiment of the present application, all the liquid cooling plates may be connected to each other in series and in communication with the heat exchanger, that is, as shown in FIG. 2 , another heat dissipating device provided by the embodiment of the present application is provided. The schematic diagram of the structure, wherein the water inlet of the pump 200 is in communication with the water outlet of the heat exchanger 300.
並且，所述幫浦200的出水口與所述第一液冷板101的進水口相連通；以及，所述第一液冷板101至第N液冷板10n中第i液冷板(i爲不大於N的正整數)的出水口與第i+1液冷板的進水口相連通，且所述第N液冷板10n的出水口與所述熱交換器300的進水口相連通。And the water outlet of the pump 200 is in communication with the water inlet of the first liquid cooling plate 101; and the first liquid cooling plate of the first liquid cooling plate 101 to the Nth liquid cooling plate 10n (i A water outlet of a positive integer of not more than N is in communication with a water inlet of the i+1th liquid cooling plate, and a water outlet of the Nth liquid cooling plate 10n is in communication with a water inlet of the heat exchanger 300.
或者，相較於圖2中幫浦的牽引方向，本申請實施例提供的幫浦的牽引方向還可以與圖2提供的幫浦牽引方向相反，即，參考圖3所示，爲本申請實施例提供的又一種散熱裝置的結構示意圖，所述幫浦200的出水口與所述熱交換器300的進水口相連通。Alternatively, the traction direction of the pump provided by the embodiment of the present application may be opposite to the direction of the pump traction provided in FIG. 2, that is, as shown in FIG. 3, which is implemented in the present application. Another structural diagram of a heat sink provided by the example, the water outlet of the pump 200 is in communication with the water inlet of the heat exchanger 300.
並且，所述幫浦200的進水口與所述第一液冷板101的出水口相連通；以及，所述第一液冷板101至第N液冷板10n中第i液冷板(i爲不大於N的正整數)的進水口與第i+1液冷板的出水口相連通，且所述第N液冷板10n的進水口與所述熱交換器300的出水口相連通。And the water inlet of the pump 200 is in communication with the water outlet of the first liquid cooling plate 101; and the first liquid cooling plate of the first liquid cooling plate 101 to the Nth liquid cooling plate 10n (i The water inlet of the n+1th liquid cooling plate is in communication with the water outlet of the i+1th liquid cooling plate, and the water inlet of the Nth liquid cooling plate 10n is in communication with the water outlet of the heat exchanger 300.
其中，本申請實施例圖2和圖3提供的散熱裝置，熱交換器中300的水冷液通過幫浦200的牽引逐一流過每個液冷板，吸收每個液冷板對應的熱源散發的熱量後，最終流入熱交換器300中進行散熱冷卻，而後再次被牽引至每個液冷板中逐一吸收熱量，如此重複達到對熱源散熱的目的。In the heat dissipating device provided in FIG. 2 and FIG. 3 of the embodiment of the present application, the water-cooled liquid in the heat exchanger 300 passes through the pump 200 to pass through each liquid-cooling plate, and absorbs the heat source corresponding to each liquid-cooled plate. After the heat, it finally flows into the heat exchanger 300 for heat dissipation cooling, and then is again drawn to each liquid-cooled plate to absorb heat one by one, thus repeating the purpose of dissipating heat to the heat source.
相應地，本申請實施例還提供了一種投影機，參考圖4所示，爲本申請實施例提供的一種投影機的結構示意圖，需要說明的是，本申請實施例以熱源模組包括三個熱源爲例進行說明，即N爲3。Correspondingly, the embodiment of the present application further provides a projector. Referring to FIG. 4, it is a schematic structural diagram of a projector according to an embodiment of the present application. It should be noted that the heat source module includes three The heat source is taken as an example, that is, N is 3.
其中，投影機包括投影元件400與熱源模組，所述熱源模組包括有第一熱源101’至第N熱源(N 爲不小於2的整數)（即參考圖4中第一熱源101’、第二熱源102’和第三熱源103’）所述投影機還包括散熱裝置，所述散熱裝置包括：第一液冷板101至第三液冷板103、幫浦200和熱交換器300，其中，所述第一液冷板101至第N液冷板10n分別與所述第一熱源101’至第N熱源相接觸設置（即參考圖4中第一液冷板101與第一熱源101’接觸設置，第二液冷板102與第二熱源102’接觸設置，第三液冷板103和第三熱源103’接觸設置），所述第一液冷板101至第三液冷板103與所述熱交換器300之間相連通，且所述幫浦200連接於所述第一液冷板101至第三液冷板103與所述熱交換器300之間。The projector includes a projection element 400 and a heat source module, and the heat source module includes a first heat source 101' to an Nth heat source (N is an integer not less than 2) (ie, referring to the first heat source 101' in FIG. 4, The second heat source 102' and the third heat source 103') the projector further includes a heat sink, the heat sink comprising: a first liquid cooling plate 101 to a third liquid cooling plate 103, a pump 200, and a heat exchanger 300, The first liquid cooling plate 101 to the Nth liquid cooling plate 10n are respectively disposed in contact with the first heat source 101' to the Nth heat source (ie, referring to the first liquid cooling plate 101 and the first heat source 101 in FIG. 4) 'Contact setting, the second liquid cooling plate 102 is disposed in contact with the second heat source 102', the third liquid cooling plate 103 and the third heat source 103' are in contact with each other, and the first liquid cooling plate 101 to the third liquid cooling plate 103 are provided. The heat exchanger 300 is in communication with the heat exchanger 300, and the pump 200 is connected between the first liquid cooling plate 101 to the third liquid cooling plate 103 and the heat exchanger 300.
參考圖4所示，本申請實施例提供的投影機中，所述熱交換器300可以爲風冷熱交換器，其中，熱交換器300包括：熱交換板301，所述熱交換板301與所述第一液冷板101至第三液冷板103之間相連通；以及，固定於所述熱交換板301上的至少一個散熱風扇302。Referring to FIG. 4, in the projector provided by the embodiment of the present application, the heat exchanger 300 may be an air-cooled heat exchanger, wherein the heat exchanger 300 includes: a heat exchange plate 301, and the heat exchange plate 301 and the heat exchange plate 301 The first liquid cooling plate 101 to the third liquid cooling plate 103 are in communication with each other; and at least one cooling fan 302 fixed to the heat exchange plate 301.
由上述內容可知，將液冷板與熱源相接觸設置，進而在散熱裝置工作過程中，幫浦牽引水冷液開始流動，使得水冷液自熱交換器流入液冷板中，通過液冷板吸收與其接觸的熱源所產生的熱量後，水冷液回流至熱交換器中散熱，達到對熱源散熱的目的，並且每個液冷板中的水冷液統一通過熱交換器進行散熱，保證了散熱裝置的佔用體積小。此外，每個液冷板中的水冷液統一通過熱交換器進行散熱，只需要對一個熱交換器中設置風扇即可，避免了大量使用風扇而出現噪音過大的情況，同時還降低了功率消耗。It can be seen from the above that the liquid-cooled plate is placed in contact with the heat source, and during the operation of the heat-dissipating device, the pump draws the water-cooled liquid to start flowing, so that the water-cooled liquid flows from the heat exchanger into the liquid-cooled plate, and is absorbed by the liquid-cooled plate. After the heat generated by the heat source is contacted, the water-cooled liquid is returned to the heat exchanger for heat dissipation to achieve heat dissipation for the heat source, and the water-cooled liquid in each liquid-cooled plate is uniformly radiated through the heat exchanger to ensure the use of the heat sink. small volume. In addition, the water-cooled liquid in each liquid-cooled plate is uniformly radiated through the heat exchanger, and only a fan is required to be disposed in one heat exchanger, thereby avoiding excessive noise generation due to a large number of fans, and also reducing power consumption. .
本申請實施例提供的投影機中，其散熱裝置的所有液冷板之間可以相互並聯、且連通於熱交換器，即，所述幫浦的進水口與所述熱交換器的出水口相連通。In the projector provided by the embodiment of the present application, all the liquid cooling plates of the heat dissipating device may be connected in parallel with each other and communicate with the heat exchanger, that is, the water inlet of the pump is connected to the water outlet of the heat exchanger. through.
並且，所述幫浦的出水口與所述第一液冷板至第N液冷板的進水口相連通；以及，所述第一液冷板至第N液冷板的出水口均與所述熱交換器的進水口相連通。And the water outlet of the pump is connected to the water inlet of the first liquid cooling plate to the N liquid cooling plate; and the water outlets of the first liquid cooling plate to the N liquid cooling plate are both The water inlet of the heat exchanger is connected.
需要說明的是，散熱裝置中所有液冷板之間相互並聯時，其幫浦的牽引方向還可以與上述所述幫浦的牽引方向相反。It should be noted that when all the liquid-cooled plates in the heat sink are connected in parallel with each other, the pulling direction of the pump may be opposite to the pulling direction of the above-mentioned pump.
其中，幫浦牽引水冷液自熱交換器傳輸至每個液冷板中，通過液冷板吸收各自相對應的熱源散發的熱量後，根據幫浦的牽引方向傳輸至熱交換器中，熱交換器對水冷液進行散熱冷卻，而後再次被牽引至液冷板中吸收熱量，如此重複達到對熱源散熱的目的。Wherein, the pump traction water cooling liquid is transferred from the heat exchanger to each liquid cooling plate, and the liquid cooling plate absorbs the heat radiated by the corresponding heat source, and then is transferred to the heat exchanger according to the traction direction of the pump, and the heat exchange is performed. The device cools and cools the water-cooled liquid, and then is pulled to the liquid-cooled plate to absorb heat again, thus repeating the purpose of dissipating heat to the heat source.
另外，本申請實施例提供的投影機中，其散熱裝置的所有液冷板之間還可以相互串聯、且連通於熱交換器，即，所述幫浦的進水口與所述熱交換器的出水口相連通。In addition, in the projector provided by the embodiment of the present application, all the liquid cooling plates of the heat dissipating device may be connected to each other in series and communicate with the heat exchanger, that is, the water inlet of the pump and the heat exchanger. The water outlets are connected.
此外，所述幫浦的出水口與所述第一液冷板的進水口相連通；以及，所述第一液冷板至第N液冷板中第i液冷板的出水口與第i+1液冷板的進水口相連通，且所述第N液冷板的出水口與所述熱交換器的進水口相連通，i爲不大於N的正整數。Further, the water outlet of the pump is in communication with the water inlet of the first liquid cooling plate; and the water outlet of the first liquid cooling plate in the first liquid cooling plate to the Nth liquid cooling plate and the i The water inlet of the +1 liquid cold plate is in communication, and the water outlet of the Nth liquid cold plate is connected to the water inlet of the heat exchanger, and i is a positive integer not greater than N.
或者，所述幫浦的出水口與所述熱交換器的進水口相連通；所述幫浦的進水口與所述第一液冷板的出水口相連通；以及，所述第一液冷板至第N液冷板中第i液冷板的進水口與第i+1液冷板的出水口相連通，且所述第N液冷板的進水口與所述熱交換器的出水口相連通，i爲不大於N的正整數。Or the water outlet of the pump is in communication with the water inlet of the heat exchanger; the water inlet of the pump is in communication with the water outlet of the first liquid cooling plate; and the first liquid cooling The water inlet of the ith liquid cooling plate in the plate to the Nth liquid cooling plate is in communication with the water outlet of the i+1th liquid cooling plate, and the water inlet of the Nth liquid cooling plate and the water outlet of the heat exchanger Connected, i is a positive integer not greater than N.
進一步的，在所有液冷板之間相互串聯時，靠近所述熱交換器進水口的液冷板所對應的熱源，其產生的熱量大於其餘熱源分別產生的熱量。即，水冷液最後流過產生熱量較大的熱源，避免出現先流過該熱源時水冷液吸收足夠熱量而不能再次對其他熱源產生的熱量進行吸收的情況，保證散熱裝置對每個熱源均能夠進行散熱冷卻。具體的，當熱源模組包括有光源模組、色輪和處理晶片時，可以將發熱量較大的光源模組與靠近熱交換器進水口的液冷板接觸設置，而將發熱量較小的處理晶片與靠近熱交換器出水口的液冷板接觸設置，且將色輪設置於上述兩個液冷板之間。其中，本申請實施例提供的處理晶片可以爲DMD（Digital Micromirror Device，數位微鏡器件）晶片。Further, when all the liquid-cooled plates are connected in series with each other, the heat source corresponding to the liquid-cooled plate near the water inlet of the heat exchanger generates more heat than the heat generated by the remaining heat sources. That is, the water-cooled liquid finally flows through the heat source that generates a large amount of heat, thereby avoiding the case where the water-cooled liquid absorbs enough heat when the heat source flows first, and the heat generated by the other heat sources cannot be absorbed again, thereby ensuring that the heat sink can be used for each heat source. Cooling down. Specifically, when the heat source module includes the light source module, the color wheel and the processing chip, the light source module with a larger heat quantity can be contacted with the liquid cooling plate near the water inlet of the heat exchanger, and the heat generation amount is smaller. The processing wafer is disposed in contact with the liquid cooling plate adjacent to the water outlet of the heat exchanger, and the color wheel is disposed between the two liquid cooling plates. The processing chip provided by the embodiment of the present application may be a DMD (Digital Micromirror Device) wafer.
除此之外，本發明所述之投影機係主要應用於投影系統當中。本申請實施例提供了一種散熱裝置、投影機，包括熱源模組，所述熱源模組包括有第一熱源至第N熱源，N 爲不小於2的整數，所述投影機還包括散熱裝置，所述散熱裝置包括：第一液冷板至第N液冷板、幫浦和熱交換器，其中，所述第一液冷板至第N液冷板分別與所述第一熱源至第N熱源相接觸設置，所述第一液冷板至第N液冷板與所述熱交換器之間相連通，且所述幫浦連接於所述第一液冷板至第N液冷板與所述熱交換器之間。In addition, the projector of the present invention is mainly used in a projection system. The embodiment of the present application provides a heat dissipating device and a projector, including a heat source module, the heat source module includes a first heat source to an Nth heat source, N is an integer not less than 2, and the projector further includes a heat sink. The heat dissipating device includes: a first liquid cooling plate to an Nth liquid cooling plate, a pump and a heat exchanger, wherein the first to Nth liquid cooling plates and the first to Nth heat sources respectively Provided in contact with each other, the first liquid cooling plate to the Nth liquid cooling plate are in communication with the heat exchanger, and the pump is connected to the first liquid cooling plate to the Nth liquid cooling plate and the Between the heat exchangers.
由上述內容可知，散熱裝置工作過程中，水冷液自熱交換器流入液冷板中，通過液冷板吸收與其接觸的熱源所產生的熱量後，水冷液回流至熱交換器中散熱，達到對熱源散熱的目的。本申請實施例提供的技術方案，通過散熱裝置對投影機內的熱源進行散熱冷卻，避免出現熱源產生的大量熱量不能散熱而積聚的情況，並且每個液冷板中的水冷液統一通過熱交換器進行散熱，保證了散熱裝置的佔用體積小。It can be seen from the above that during the operation of the heat sink, the water-cooled liquid flows from the heat exchanger into the liquid-cooled plate, and after the liquid-cooled plate absorbs the heat generated by the heat source in contact with it, the water-cooled liquid is returned to the heat exchanger for heat dissipation. The purpose of heat source heat dissipation. The technical solution provided by the embodiment of the present application cools and heats the heat source in the projector through the heat dissipation device, so as to avoid the situation that a large amount of heat generated by the heat source cannot be dissipated by heat, and the water-cooled liquid in each liquid-cooled plate is uniformly exchanged through heat exchange. The heat is dissipated to ensure that the heat sink has a small footprint.
對所公開的實施例的上述說明，使本領域專業技術人員能夠實現或使用本發明。對這些實施例的多種修改對本領域的專業技術人員來說將是顯而易見的，本文中所定義的一般原理可以在不脫離本發明的精神或範圍的情況下，在其它實施例中實現。因此，本發明將不會被限制於本文所示的這些實施例，而是要符合與本文所公開的原理和新穎特點相一致的最寬的範圍。The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments are obvious to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but the scope of the invention is to be accorded
101‧‧‧第一液冷板
102‧‧‧第二液冷板
103‧‧‧第三液冷板
10n‧‧‧第N液冷板
200‧‧‧幫浦
301‧‧‧熱交換板
302‧‧‧散熱風扇
300‧‧‧熱交換器
101’‧‧‧第一熱源
102’‧‧‧第二熱源
103’‧‧‧第三熱源
400‧‧‧投影元件101‧‧‧First liquid cold plate
102‧‧‧Second liquid cold plate
103‧‧‧ third liquid cold plate
10n‧‧‧Nth liquid cold plate
200‧‧‧ pump
301‧‧‧Heat Exchange Board
302‧‧‧ cooling fan
300‧‧‧ heat exchanger
101'‧‧‧First heat source
102'‧‧‧second heat source
103'‧‧‧ third heat source
400‧‧‧Projection components
圖1爲本申請實施例提供的一種散熱裝置的結構示意圖； 圖2爲本申請實施例提供的另一種散熱裝置的結構示意圖； 圖3爲本申請實施例提供的又一種散熱裝置的結構示意圖； 圖4爲本申請實施例提供的一種投影機的結構示意圖。1 is a schematic structural view of a heat dissipating device according to an embodiment of the present disclosure; FIG. 2 is a schematic structural view of another heat dissipating device according to an embodiment of the present disclosure; FIG. 4 is a schematic structural diagram of a projector according to an embodiment of the present application.
101‧‧‧第一液冷板 101‧‧‧First liquid cold plate
102‧‧‧第二液冷板 102‧‧‧Second liquid cold plate
10n‧‧‧第N液冷板 10n‧‧‧Nth liquid cold plate
200‧‧‧幫浦 200‧‧‧ pump
301‧‧‧熱交換板 301‧‧‧Heat Exchange Board
302‧‧‧散熱風扇 302‧‧‧ cooling fan
300‧‧‧熱交換器 300‧‧‧ heat exchanger
Claims (5)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510859550.3A CN106814525A (en) | 2015-11-30 | 2015-11-30 | A kind of heat abstractor, projector and optical projection system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201734626A true TW201734626A (en) | 2017-10-01 |
Family
ID=58796335
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106121070A TW201734626A (en) | 2015-11-30 | 2016-11-18 | Heat sink and projector |
| TW105137821A TWI595305B (en) | 2015-11-30 | 2016-11-18 | Heat sink and projector |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105137821A TWI595305B (en) | 2015-11-30 | 2016-11-18 | Heat sink and projector |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN106814525A (en) |
| TW (2) | TW201734626A (en) |
| WO (1) | WO2017092664A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108121423A (en) * | 2018-01-30 | 2018-06-05 | 深圳市智通电子有限公司 | A kind of server liquid-cooling heat radiator |
| CN109709755A (en) * | 2019-03-09 | 2019-05-03 | 泉州市新锐极光科技有限公司 | A kind of ultra short focal projector structure and its heat sink conception |
| US11520219B2 (en) | 2019-08-04 | 2022-12-06 | Coretronic Corporation | Heat dissipating module and projection device |
| CN113741126A (en) * | 2020-05-29 | 2021-12-03 | 中强光电股份有限公司 | Heat dissipation system and projection device |
| CN113286494A (en) * | 2021-05-18 | 2021-08-20 | 合肥恒诚智能技术有限公司 | Low oxygen generation all-in-one radiating component |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4262535B2 (en) * | 2003-06-20 | 2009-05-13 | 株式会社日立製作所 | LCD projector |
| JP4492174B2 (en) * | 2004-03-26 | 2010-06-30 | 株式会社日立製作所 | Liquid crystal display |
| JP2005321525A (en) * | 2004-05-07 | 2005-11-17 | Seiko Epson Corp | Projector |
| JP4227969B2 (en) * | 2005-03-17 | 2009-02-18 | Ｎｅｃディスプレイソリューションズ株式会社 | Projection display |
| TWM317151U (en) * | 2007-03-08 | 2007-08-11 | Man Zai Ind Co Ltd | Liquid cooling type heat dissipating device |
| TW200909989A (en) * | 2007-08-20 | 2009-03-01 | Benq Corp | Projection device and heat dissipation method |
| CN101546105B (en) * | 2008-03-24 | 2010-11-10 | 精工爱普生株式会社 | Projector |
| CN203673211U (en) * | 2013-12-18 | 2014-06-25 | 广东威创视讯科技股份有限公司 | Projector heat radiator |
| CN203688975U (en) * | 2013-12-20 | 2014-07-02 | 广东威创视讯科技股份有限公司 | Projector heat dissipation system |
| CN205281101U (en) * | 2015-11-27 | 2016-06-01 | 深圳市绎立锐光科技开发有限公司 | Integrated type liquid cooling system and projection equipment |
| CN205301790U (en) * | 2015-11-30 | 2016-06-08 | 深圳市光峰光电技术有限公司 | Heat abstractor , projector and projecting system |
-
2015
- 2015-11-30 CN CN201510859550.3A patent/CN106814525A/en active Pending
-
2016
- 2016-11-18 TW TW106121070A patent/TW201734626A/en unknown
- 2016-11-18 TW TW105137821A patent/TWI595305B/en active
- 2016-11-30 WO PCT/CN2016/107921 patent/WO2017092664A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017092664A1 (en) | 2017-06-08 |
| TW201719268A (en) | 2017-06-01 |
| TWI595305B (en) | 2017-08-11 |
| CN106814525A (en) | 2017-06-09 |
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