WO2018166301A1

WO2018166301A1 - Heat dissipation system and electronic device

Info

Publication number: WO2018166301A1
Application number: PCT/CN2018/074745
Authority: WO
Inventors: 谭大治; 王磊; 李屹
Original assignee: 深圳市光峰光电技术有限公司
Priority date: 2017-03-15
Filing date: 2018-01-31
Publication date: 2018-09-20
Also published as: CN206674407U

Abstract

A heat dissipation system and an electronic device. The heat dissipation system comprises: an outer shell, an inner shell located within the outer shell and used for supporting a heat generating component, a heat dissipation device, and a fan. A first air flow channel is provided between the outer shell and the inner shell; the inner shell is provided with a second air flow channel, the second air flow channel being communicated with the first air flow channel to form an air circulation channel; the fan is configured to drive air to flow along the air circulation channel; the air circulation channel is configured to pass through the heat generating component and the heat dissipation device; and the heat dissipation device is configured to cool the air within the air circulation channel. The heat dissipation system realizes cooling of the heat generating component; meanwhile, the internal structure of the device is divided by using the inner shell, so that the first air flow channel between the outer shell and the inner shell and the second air flow channel of the inner shell form the air circulation channel, thus simplifying the formation of the air circulation channel. Drawing_references_to_be_translated

Description

Cooling system and electronic equipment

Technical field

The utility model relates to the technical field of heat dissipation of electronic devices, and more particularly to a heat dissipation system and an electronic device.

Background technique

Electronic devices typically have a heat generating component that generates heat during operation, such as a chip of a projector, a control panel of a host, and the like. In order to ensure the normal use of electronic equipment, it is necessary to cool the heat generating components.

Currently, fans are used to directly cool the heating components. In order to achieve the dust-proof requirements of the heat-generating component and improve the cooling effect, a circulation air duct is usually provided, and the heat-generating component is located in the circulation air passage, and the air in the circulation air passage is circulated by the fan, and the radiator cools the air in the circulation air passage to realize the pair. Cooling and cooling of the heating components.

technical problem

The above-mentioned circulating air passage includes a cavity structure for mounting components in the casing and some auxiliary pipes connecting the cavity structures, and in order to ensure the formation of the circulation air passage, the assembly of the entire device is difficult and the assembly efficiency is low.

In summary, how to set the circulation air passage to reduce the assembly difficulty while cooling the heat generating component is a problem to be solved by those skilled in the art.

Technical solution

In view of this, it is an object of the present invention to provide a heat dissipation system to reduce assembly difficulty while cooling a heat generating component. Another object of the present invention is to provide an electronic device having the above heat dissipation system.

In order to achieve the above object, the present invention provides the following technical solutions:

A heat dissipation system comprising:

An outer casing, an inner casing for supporting the heat generating component, a heat sink, and a fan;

Wherein the first air flow passage is formed between the outer casing and the inner casing, the inner casing has a second air flow passage communicating with the first air flow passage and forming a circulation air passage, and the fan is used to drive air along The circulation duct flows for passing through the heat generating component and the heat sink, and the heat sink is for cooling air in the circulation duct.

Preferably, the circulation air passage and the heat generating component are each at least two, and the circulation air passage is in one-to-one correspondence with the heat generating component.

Preferably, the fan is located between the heat sink and the inner casing.

Preferably, the fan is fixedly connected to the heat sink, or the fan is fixedly connected to the inner shell.

Preferably, the fan is fixedly connected to the heat sink, and the fan and the heat sink are of a unitary structure.

Preferably, the heat dissipating device is located inside the outer casing, and the cooling medium inlet pipe and the cooling medium outlet pipe of the heat dissipating device extend out of the outer casing.

Preferably, the heat sink comprises: a first heat sink located within the outer casing, a second heat sink located outside the outer casing and capable of heat exchange with the first heat sink.

Preferably, the first heat sink and the second heat sink perform heat exchange by a thermoelectric cooling sheet.

Preferably, the thermoelectric cooling fin is located inside the outer casing or outside the outer casing.

Preferably, the first heat sink is connected to the outer casing by a heat insulator.

Preferably, the first heat sink and the second heat sink are of a unitary structure.

Preferably, the first heat sink and/or the second heat sink comprise: a heat dissipation plate, and heat dissipation fins disposed on the heat dissipation plate.

Preferably, the first heat sink and/or the second heat sink comprise: a housing, and a cooling flow channel located in the housing and configured to flow a cooling medium.

Preferably, the outer casing is fixedly coupled to the inner casing.

Preferably, the outer casing and the inner casing are of a unitary structure.

Preferably, the outer casing is a sealed casing, or the outer casing forms a closed cavity with the heat sink.

Based on the heat dissipation system provided above, the present invention further provides an electronic device including a heat dissipation system, wherein the heat dissipation system is the heat dissipation system described in any one of the above.

Beneficial effect

The heat dissipation system provided by the utility model has a circulation air passage through the heat generating component and the heat dissipation device, and the fan drives the air to flow along the circulation air channel, the air drives the heat of the heat generating component, and the air with the heat is cooled by the heat dissipation device. The reciprocating cycle realizes cooling of the heat generating component; at the same time, by adding an inner casing for supporting the heat generating component in the outer casing, the inner casing is divided by the inner casing, so that the first airflow passage between the outer casing and the inner casing And the second air flow passage of the inner casing forms a circulation air passage, which simplifies the formation of the circulation air passage, thereby reducing the assembly difficulty and improving the assembly efficiency. Therefore, the above heat dissipation system reduces the assembly difficulty while cooling the heat generating component.

DRAWINGS

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings to be used in the embodiments or the description of the prior art will be briefly described below. Obviously, the drawings in the following description It is merely an embodiment of the present invention, and those skilled in the art can obtain other drawings according to the provided drawings without any creative work.

1 is a schematic structural view of a heat dissipation system according to Embodiment 1 of the present invention;

2 is a schematic structural view of a heat dissipation system according to Embodiment 2 of the present invention;

3 is a schematic structural view of a heat dissipation system according to Embodiment 3 of the present invention;

4 is a schematic structural view of a heat dissipation system according to Embodiment 4 of the present invention;

FIG. 5 is a schematic structural diagram of a first heat sink and/or a second heat sink in a heat dissipation system according to an embodiment of the present invention; FIG.

6 is another schematic structural diagram of a first heat sink and/or a second heat sink in a heat dissipation system according to an embodiment of the present invention;

Figure 7 is a front elevational view of Figure 6;

FIG. 8 is a schematic diagram of the installation of a fan and a first heat sink in a heat dissipation system according to an embodiment of the present invention; FIG.

Figure 9 is a plan view of Figure 8;

FIG. 10 is another schematic structural diagram of a first heat sink and a second heat sink in a heat dissipation system according to an embodiment of the present invention; FIG.

11 is another schematic structural diagram of a first heat sink and/or a second heat sink in a heat dissipation system according to an embodiment of the present invention;

Figure 12 is a perspective view of the heat sink of Figure 11;

FIG. 13 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.

Embodiments of the invention

The technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. example. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

As shown in FIG. 1-4, the heat dissipation system provided by the embodiment of the present invention includes: a casing 1, an inner casing 2, a heat dissipating device 7 and a fan 6; wherein the inner casing 2 is located in the casing 1 and is used for supporting the heat generating component, and the casing There is a first air flow passage between the inner casing 2 and the inner casing 2, and the inner casing 2 has a second airflow passage communicating with the first airflow passage and forming a circulation air passage for passing through the heat generating component and the heat dissipating device 7, and the heat dissipating device 7 It is used to cool the air in the circulation duct, and the fan 6 is used to drive the air to flow along the circulation duct.

It will be appreciated that the heat generating component can be any component, module, or even FRU (Field Replaceable Unit) that requires cooling, and is not limited to the form shown. The circulating air duct is used for passing through the heat generating component and the heat dissipating device 7. It can be seen that the heat generating component can be partially located in the circulating air duct or completely in the circulating air duct; the heat dissipating device 7 can be partially located in the circulating air duct or completely in the circulating air duct.

The heat dissipation system provided by the utility model has a circulation air passage passing through the heat generating component and the heat dissipating device 7, and the fan 6 drives the air to flow along the circulation air passage, the air drives the heat of the heat generating component, and the air with the heat is cooled by the heat dissipating device 7. In this reciprocating cycle, the cooling of the heat generating component is realized; at the same time, by adding the inner casing 2 for supporting the heat generating component in the outer casing 1, the inner casing 2 is used to realize the division of the internal structure of the device, so that the outer casing 1 and the inner casing The first air flow passage between the two and the second air flow passage of the inner casing 2 form a circulation air passage, which simplifies the formation of the circulation air passage, thereby reducing the assembly difficulty and improving the assembly efficiency. Therefore, the above heat dissipation system reduces the assembly difficulty while cooling the heat generating component.

When there are two or more heat generating components, it is understood that all of the heat generating components are mounted on the inner casing 2. In order to achieve cooling of each heat generating component and to improve cooling uniformity, the above-mentioned circulating air passages are at least two, and the circulating air passages are in one-to-one correspondence with the heat generating components.

It can be understood that a circulating air passage flows through a heat generating component. Of course, it is also possible to select one circulating air passage to flow through the two heat generating components, and it is also possible to select only one circulating air passage, which is not limited to the above embodiment.

In the above heat dissipation system, the specific position of the fan 6 is designed according to actual needs. In order to facilitate air circulation, the above fan 6 is located between the heat sink 7 and the inner casing 2. Of course, it is also possible to select that the inner casing 2 is located between the fan 6 and the heat sink 7, and is not limited to the above embodiment.

The fan 6 may be fixed to the outer casing 1 or may be fixed to the heat sink 7 or the inner casing 2. In order to facilitate the installation, the fan 6 is preferably fixedly connected to the heat sink 7 or the fan 6 is fixedly connected to the inner casing 2.

Further, when the fan 6 is fixedly connected to the heat sink 7, the fan 6 and the heat sink 7 are of a unitary structure.

Of course, it is also possible to select the fan 6 to be fixedly connected to the inner casing 2 or the heat sink 7 through the connecting member, and is not limited to the above embodiment.

For the type of the fan 6, the selection is made based on the relative positions of the fan 6, the inner casing 2, and the heat sink 7. Preferably, the fan 6 is an axial fan or a centrifugal fan. Of course, the fan 6 can also be selected as a mixed flow fan, and is not limited to the above embodiment.

In the above heat dissipation system, the type and position of the heat sink 7 are designed according to actual needs. For the sake of detailed explanation, the following four examples are given:

Implementation one

As shown in FIG. 1, the heat sink 7 is located inside the casing 1, and the coolant inlet pipe 703 and the coolant outlet pipe 704 of the heat sink 7 extend out of the casing 1.

In the above heat dissipation system, the housing of the heat sink 7 is cooled by the cooling medium, thereby cooling the air and cooling the heat generating component. The structure of the heat sink 7 is as shown in FIGS. 11 and 12.

In the above heat dissipating system, the heat dissipating device 7 is placed inside the outer casing 1, which effectively reduces the space occupied by the heat dissipating system, thereby reducing the space occupied by the electronic device.

The type of the heat dissipating device 7 and the type of the cooling medium are designed according to actual needs. For example, the heat dissipating device 7 is a fluorine-cooled heat exchanger or a water-cooled heat exchanger, which is not limited by the embodiment of the present invention.

Implementation two

As shown in FIG. 2, the heat sink 7 includes a first heat sink 71 located in the outer casing 1, and a second heat sink 72 located outside the outer casing 1 and capable of heat exchange with the first heat sink 71.

In the heat dissipation system provided by the embodiment, the fan 6 draws in cold air, drives the cold air to flow through the heat generating component, the heat generating component is cooled and the air is heated, and the heated air is driven by the fan 6 and flows through the first heat sink 71, The heated first heat sink 71 is in contact with the second heat sink 72 outside the outer casing 1, and after the heat is taken away by the second heat sink 72, it is reciprocated as shown by the arrow line in the figure.

Implementation three

As shown in FIG. 3, the heat dissipating device 7 includes: a first heat sink 71 located in the outer casing 1, a second heat sink 72 located outside the outer casing 1 and capable of exchanging heat with the first heat sink 71; wherein, the first heat sink The heater 71 and the second heat sink 72 exchange heat through the thermoelectric cooling fins 73, and the thermoelectric cooling fins 73 are located outside the outer casing 1.

It should be noted that the cold end of the thermoelectric cooling fin 73 is connected to the first heat sink 71, and the hot end of the thermoelectric cooling fin 73 is connected to the second heat sink 72. The second heat sink 72 carries away the heat of the hot end of the thermoelectric cooling fin 73.

In this embodiment, the first heat sink 71 can be fixedly connected to the outer casing 1. In order to prevent the cold end of the thermoelectric cooling fin 73 from cooling the outer casing 1, the first heat sink 71 and the outer casing 1 are preferably connected to each other through the heat insulating member, thereby avoiding The heat exchange between the first heat sink 71 and the outer casing 1 also prevents the cold end of the thermoelectric cooling fins 73 from cooling the outer casing 1, thereby avoiding the influence on the cooling heat generating components and improving the heat dissipation efficiency.

Implementation four

As shown in FIG. 4, the heat dissipating device 7 includes: a first heat sink 71 located in the outer casing 1, a second heat sink 72 located outside the outer casing 1 and capable of heat exchange with the first heat sink 71; wherein, the first heat sink The heater 71 and the second heat sink 72 exchange heat through the thermoelectric cooling fins 73, and the thermoelectric cooling fins 73 are located inside the outer casing 1.

The cold end of the thermoelectric cooling fin 73 is connected to the first heat sink 71, the hot end of the thermoelectric cooling fin 73 is connected to the outer casing 1, and the second heat sink 72 is connected to the outer casing 1. The heat of the hot end of the thermoelectric cooling fin 73 is transferred to the second heat sink 72 through the outer casing 1 such that the second heat sink 72 carries away the heat of the hot end of the thermoelectric cooling fin 73.

Of course, the hot end of the thermoelectric cooling fin 73 can be directly connected to the second heat sink 72, and the second heat sink 72 is fixed to the outer casing 1.

In this embodiment, if the first heat sink 71 is also connected to the outer casing 1, the first heat sink 71 is preferentially connected to the outer casing 1 through the heat insulator.

In the second embodiment, the third embodiment and the fourth embodiment, the fan 6 is preferably fixed to the first heat sink 71. Further, the first heat sink 71 and the fan 6 are of a unitary structure, as shown in FIGS. 8 and 9. In order to ensure the stability, the first heat sink 71 and the fan 6 may be connected to the first heat sink 71 and the fan 6 on the basis of the integrated structure of the first heat sink 71 and the fan 6.

In the second embodiment, the third embodiment and the fourth embodiment, in order to simplify the installation, the first heat sink 71 and the second heat sink 72 may be selected as an integrated structure, as shown in FIG. Of course, the first heat sink 71 and the second heat sink 72 may be selected as a split structure, and are not limited to the above structure.

In the second embodiment, the third embodiment and the fourth embodiment, the specific structures of the first heat sink 71 and the second heat sink 72 are selected according to actual needs. Preferably, the first heat sink 71 and/or the second heat sink 72 include: a heat dissipation plate 701, and heat dissipation fins 702 disposed on the heat dissipation plate 701, as shown in FIGS. 5-7.

Of course, it is also possible to select the first heat sink 71 and/or the second heat sink 72 to include a housing, a cooling flow passage 705 located in the housing and for supplying a cooling medium. It will be understood that the housing has a cooling medium inlet tube 703 and a cooling medium outlet tube 704 that communicate with the cooling flow passage 705, as shown in FIGS. 11 and 12.

When the first heat sink 71 and the second heat sink 72 are both configured, the cooling medium in the first heat sink 71 exchanges heat with the air in the circulation air passage to cool the air, and at the same time, the cooling medium The temperature rises; the cooling medium flowing through the second heat sink 72 cools the first heat sink 71 through the housing, thereby cooling the cooling medium in the first heat sink 71, ensuring that the first heat sink 71 can always cool the cycle The air inside the wind tunnel.

It can be understood that the cooling medium in the first heat sink 71 can be circulated through the cooling medium inlet pipe 703 and the cooling medium outlet pipe 704, and the cooling medium inlet pipe 703 and the cooling medium outlet pipe 704 can be blocked to cool. The medium is stored in the housing. As the usage time increases, the cooling medium in the first radiator 71 can be periodically replaced.

The first heat sink 71 and the second heat sink 72 may have the same structure or different structures.

When the first heat sink 71 includes: a heat dissipation plate 701, a heat dissipation fin 702 disposed on the heat dissipation plate 701, the second heat sink 72 includes: a housing, and a cooling flow path 705 for the cooling medium to flow when the housing is located The heat sink 701 and the heat dissipating fins 702 are cooled by the cooling medium flowing through the second heat sink 72 to ensure that the heat sink 701 and the heat dissipating fins 702 cool the air in the circulation duct.

When the second heat sink 72 includes: a heat dissipation plate 701, and heat dissipation fins 702 disposed on the heat dissipation plate 701, the first heat sink 71 includes: a casing, and is located in the casing and is used for the cooling flow path 705 for the cooling medium to flow. The cooling medium flowing through the first radiator 71 cools the air in the circulation duct through the casing, and at the same time, the second radiator 72 cools the casing of the first radiator 71, thereby achieving cooling of the cooling medium in the casing, and ensuring the first A radiator 71 continuously cools the air in the circulation duct.

If the first heat sink 71 and the second heat sink 72 both include: a heat dissipation plate 701, the heat dissipation fins 702 disposed on the heat dissipation plate 701, the second heat sink 72 facilitates heat dissipation of the first heat sink 71 by its own structure to ensure heat dissipation. The first radiator 71 cools the air in the circulation duct.

For the type and distribution of the heat dissipating fins 702, the design is performed according to actual needs. Preferably, the heat dissipating fins 702 are straight fins, as shown in FIGS. 5-10. Of course, the heat dissipating fins 702 may also be selected from other types of fins such as pin fins, such as windowed fins.

Preferably, the heat dissipating fins 702 are distributed along the length direction of the heat dissipating plate 701 as shown in FIG. 5; the heat dissipating fins 702 may also be distributed along the circumferential direction of the heat dissipating plate 701, as shown in FIGS. 6 and 7.

In the above heat dissipation system, in order to prevent the inner casing 2 from being displaced, the outer casing 1 is fixedly connected to the inner casing 2.

Specifically, the outer casing 1 and the inner casing 2 are fixedly connected by a screw connection, or the outer casing 1 and the inner casing 2 are fixedly connected by welding. Of course, it is also possible to select a fixed connection between the outer casing 1 and the inner casing 2 through other connecting members, and is not limited to the above embodiment.

In order to simplify the installation and further reduce the assembly difficulty, the outer casing 1 and the inner casing 2 are of a unitary structure.

Because the heat generating component is cooled and dissipated by air, when the heat generating component is required to be dustproof, the circulating air duct is required to be in a closed space. Specifically, the outer casing 1 is a hermetic casing, or the outer casing 1 and the heat sink 7 form a closed cavity.

The above-mentioned heat dissipation system performs heat dissipation in the case of sealing, and satisfies the requirements of dustproof, waterproof, and heat dissipation.

It can be understood that when the outer casing 1 is a sealed casing, the heat dissipating device 7 is located inside the outer casing 1, and the circulation air passage is located inside the outer casing 1. when the outer casing 1 and the heat dissipating device 7 form a closed cavity, the circulating air passage is closed. Within the cavity, the heat sink 7 can be located within the housing 1, or a portion of the heat sink 7 can be selected to be located inside the housing 1.

The heat dissipation system provided by the above embodiment is suitable for the case where the heat generating component cannot be in direct contact with the heat sink or the outer casing 1.

Based on the heat dissipation system provided by the above embodiments, the embodiment of the present invention further provides an electronic device, where the electronic device includes a heat dissipation system, and the heat dissipation system is the heat dissipation system described in the foregoing embodiment.

The electronic device provided by the embodiment of the present invention has the above-mentioned technical effects, and the electronic device provided by the embodiment of the present invention also has corresponding technical effects, which will not be further described herein.

The type of the electronic device can be selected according to actual needs. For example, the electronic device is a projector or other display device, a host device, etc., and the type of the electronic device is not limited in the embodiment of the present invention.

Preferably, the above electronic device is a projector. Further, the above projector is a 3LCD projector. The English version of LCD is Liquid Crystal Display.

As shown in FIG. 13 , the principle of the 3LCD projector is that the three color lights are respectively irradiated to the corresponding first heat generating component 41 (liquid crystal display) and the second through the first convex mirror 51 , the second convex mirror 52 and the third convex mirror 43 . On the heat generating component 42 and the third heat generating component 43, the processed light passes through the condensing prism 3 to direct the light signals of the three light emitting components to the lens to form an image. At this time, the heat generating component is a liquid crystal display.

It should be noted that the diagram shown in FIG. 13 is a plan view of the projector, and the diagrams shown in FIG. 1-4 are schematic diagrams of the heat dissipation system in the rear view of the projector.

The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments are obvious to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention is not intended to be limited to the embodiments shown herein, but the scope of the invention.

Claims

A heat dissipation system, comprising:

2. The heat dissipation system according to claim 1, wherein each of the circulation air passage and the heat generating component are at least two, and the circulation air passage is in one-to-one correspondence with the heat generating component.

3. The heat dissipation system of claim 1 wherein said fan is located between said heat sink and said inner casing.

The heat dissipation system according to claim 1, wherein the fan is fixedly connected to the heat sink, or the fan is fixedly connected to the inner casing.

The heat dissipation system according to claim 4, wherein the fan is fixedly connected to the heat sink, and the fan and the heat sink are of a unitary structure.

6. The heat dissipation system according to claim 1, wherein the heat dissipating device is located inside the outer casing, and a cooling medium inlet pipe and a cooling medium outlet pipe of the heat dissipating device extend outward from the outer casing.

7. The heat dissipation system according to claim 1, wherein the heat dissipating device comprises: a first heat sink located in the outer casing, located outside the outer casing and capable of exchanging heat with the first heat sink The second radiator.

8. The heat dissipation system according to claim 7, wherein the first heat sink and the second heat sink perform heat exchange by a thermoelectric cooling sheet.

9. The heat dissipation system according to claim 8, wherein the thermoelectric cooling fin is located inside the outer casing or outside the outer casing.

10. The heat dissipation system according to claim 8, wherein the first heat sink is connected to the outer casing by a heat insulator.

11. The heat dissipation system according to claim 7, wherein the first heat sink and the second heat sink are of a unitary structure.

The heat dissipation system according to claim 7, wherein the first heat sink and/or the second heat sink comprises: a heat dissipation plate, and heat dissipation fins disposed on the heat dissipation plate.

13. The heat dissipation system according to claim 7, wherein the first heat sink and/or the second heat sink comprise: a housing, and the housing and for flowing a cooling medium Cool the flow path.

14. The heat dissipation system of claim 1 wherein said outer casing is fixedly coupled to said inner casing.

15. The heat dissipation system according to claim 14, wherein the outer casing and the inner casing are of a unitary structure.

16. The heat dissipation system of claim 1 wherein the outer casing is a closed casing or the outer casing forms a closed cavity with the heat sink.

17. An electronic device comprising a heat dissipation system, characterized in that the heat dissipation system is a heat dissipation system according to any one of claims 1-16.