CN116699928A - A waterproof liquid cooling heat dissipation system for a projector - Google Patents

Abstract

The invention relates to a waterproof liquid cooling heat dissipation system for a projector, which includes a sealed casing, a heat dissipation casing, a projection module and a water-cooled and air-cooled integrated heat dissipation module; the water-cooled and air-cooled integrated heat dissipation module includes a heat-absorbing component and a heat-dissipating component ; The heat absorbing assembly includes a first heat absorbing plate, a second heat absorbing plate and a third heat absorbing plate, and the first heat absorbing plate, the second heat absorbing plate and the third heat absorbing plate are respectively arranged in the first One side of the light source, the second light source and the DMD chip assembly, the first heat-absorbing plate, the second heat-absorbing plate and the third heat-absorbing plate are all hollow plates; It communicates with the first heat absorbing plate, the second heat absorbing plate and the third heat absorbing plate, and the heat exhaust fan is arranged on one side of the pump set. The invention has the effect of firstly deriving heat from the closed casing part through the water cooling system, and then discharging the heat out of the projector through air cooling, and then being used to solve the effect of the heat dissipation system of the waterproof projector.

Description

A waterproof liquid cooling heat dissipation system for a projector

technical field

The invention relates to the technical field of projection equipment, in particular to a waterproof liquid cooling system for a projector.

Background technique

A projector, also known as a projector, is a device that can project images or videos onto a screen, and is widely used in homes, offices, schools and entertainment venues.

The higher the lumen of the projector, the higher the power of the internal imaging module laser. The heat generated by the high-power laser and power supply will accumulate in multiple places in the imaging module. If the heat accumulation is excessive, it will affect the normal operation of the module. Influence. In related technologies, a ventilation structure is usually provided on the casing, and a cooling device such as a fan is installed near the heat source of the imaging module in the casing to allow the air inside the casing to flow away heat, thereby cooling down the equipment.

In view of the above-mentioned related technologies, when the projection equipment has high waterproof performance requirements, it is not possible to directly install a ventilation structure on the side wall of the cabinet to keep the air flow in the cabinet, and the heat in the airtight cabinet is easier to accumulate, so it is urgently needed Develop a cooling system suitable for waterproof projectors.

Contents of the invention

In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a waterproof liquid cooling system for a projector, which uses a combination of water cooling and air cooling, and first uses the water cooling system to transfer heat from the closed casing part Export, and then discharge the heat to the outside of the projector through air cooling, and then use it to solve the heat dissipation system of the waterproof projector.

In order to achieve the above object and other related objects, the present invention provides a waterproof liquid cooling heat dissipation system for a projector, which includes a sealed casing, a heat dissipation casing, a projection module, and a water-cooled and air-cooled integrated heat dissipation module; the projection module is set In the sealed casing, the heat dissipation casing is installed on the sealed casing; the projection module includes a first light source, a second light source and a DMD chip assembly; the water-cooled and air-cooled integrated heat dissipation module includes a heat-absorbing component and a Assembly; the heat absorption assembly includes a first heat absorption plate, a second heat absorption plate and a third heat absorption plate, and the first heat absorption plate, the second heat absorption plate and the third heat absorption plate are in one-to-one correspondence It is arranged on one side of the first light source, the second light source and the DMD chip assembly in sequence, and the first heat absorption plate, the second heat absorption plate and the third heat absorption plate are all hollow plates; the heat dissipation assembly includes a pump group and A heat exhaust fan, the pump set communicates with the first heat absorbing plate, the second heat absorbing plate and the third heat absorbing plate respectively through pipes, and the heat exhaust fan is arranged on one side of the pump set.

Further, the heat dissipation assembly also includes a plurality of cold rows, the cold row includes a frame and a plurality of heat dissipation strips, and the plurality of heat dissipation strips are arranged on the inner side of the frame parallel to each other, the frame and the heat dissipation strips are both hollow structures, and The cooling bar communicates with the cavity inside the frame, one end of the cold row in the length direction communicates with the pump unit through a pipe, and the other end communicates with the corresponding first heat absorbing plate, second heat absorbing plate and third heat absorbing plate through a pipe The board is connected.

Further, there are two sets of first light sources, two first heat absorbing plates are set on one side of the two first light sources respectively, and the pump set includes a first circulation pump and a second circulation pump. The cold row is provided with two pumps, which are respectively the first cold row and the second cold row. The first circulation pump communicates with the first heat absorbing plate and the first cold row to form a circulation, and the second circulation pump communicates with the first cold row. The second heat absorbing plate, the third heat absorbing plate and the second cold row communicate and form a circulation.

Further, both the first circulation pump and the second circulation pump are copper water pumps.

Further, there are several heat exhaust fans, and each of the heat exhaust fans is set opposite to and parallel to the corresponding cold row.

Further, the pipes connecting the pump group with the first heat absorbing plate, the second heat absorbing plate and the third heat absorbing plate are all provided with sealing structures where they pass through the sealed casing.

Further, the sealing structure is a sealed water pipe joint, one plug-in end of the sealed water pipe joint is fixedly connected to the casing, and the other plug-in end is detachably connected to the fixedly arranged plug-in end.

Further, the heat dissipation housing is detachably connected to the top of the sealed housing, and several ventilation openings are opened on the shell wall of the heat dissipation housing, and the pump unit and the heat exhaust fan are both arranged in the heat dissipation housing.

As mentioned above, the present invention has at least the following beneficial effects:

1. The heat-conducting medium flows in the liquid path driven by the pump group. When the heat-conducting medium flows through the first heat absorbing plate, the second heat absorbing plate and the third heat absorbing plate, the first light source, the second The heat generated when the light source and DMD chip components work is absorbed, and then the heat transfer medium flows out of the sealed casing along the pipeline and enters the pump unit. The heat exhaust fan blows the air to cool the heat transfer medium outside the sealed casing and take away the heat, thus It ensures the waterproof performance of the sealed shell and realizes efficient heat exchange at the same time;

2. By setting the cold row, when the heat transfer medium flows through the cold row, one end along the length direction of the cold row will flow to the other end of the cold row through each cooling strip, and the air will flow through the gaps between the cooling strips, which improves the temperature of the heat transfer medium. The heat transfer area increases the heat transfer rate;

3. The copper water pump has good thermal conductivity, which helps the heat in the heat transfer medium to flow out;

4. The structure of the pump unit, cold radiator and heat exhaust fan is protected through the heat dissipation shell, and at the same time, it also prevents the user from directly touching the cold radiator and pipeline with heat transfer medium to cause burns.

Description of drawings

FIG. 1 is a schematic structural diagram for embodying the overall structure of a projector cooling system in an embodiment of the present invention.

FIG. 2 is a structural schematic diagram for embodying the internal structure of the heat dissipation housing in an embodiment of the present invention.

FIG. 3 is a schematic diagram of an enlarged structure at point A in FIG. 2 .

Fig. 4 is a schematic diagram for embodying the position structure of the first heat absorbing plate of the sealed casing in the embodiment of the present invention.

Fig. 5 is a schematic diagram for embodying the position structure of the second heat absorbing plate and the third heat absorbing plate in the embodiment of the present invention.

Fig. 6 is a schematic diagram for embodying the circulation pipeline of the second circulation pump in the embodiment of the present invention.

Fig. 7 is a schematic diagram for embodying the circulation pipeline of the first circulation pump in the embodiment of the present invention.

Explanation of reference signs:

1. Sealed shell; 2. Heat dissipation shell; 21. Vent; 3. Projection module; 31. First light source; 32. Second light source; 33. DMD chip component; 4. Water-cooled and air-cooled integrated heat dissipation module ; 41, heat-absorbing assembly; 411, the first heat-absorbing plate; 412, the second heat-absorbing plate; 413, the third heat-absorbing plate; 42, cooling assembly; The second circulation pump; 422, heat exhaust fan; 5, cold row; 51, frame; 52, cooling bar; 6, sealed water pipe joint.

Detailed ways

The implementation of the present invention will be illustrated by specific specific examples below, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

Please refer to Fig. 1 to Fig. 7, the present invention provides a waterproof liquid cooling heat dissipation system for a projector, the projector includes a sealed casing 1, a heat dissipation casing 2, a projection module 3 and a water-cooled and air-cooled integrated heat dissipation module 4, wherein The projection module 3 is arranged in the sealed casing 1, and the projection module 3 is blocked from moisture through the sealed cavity formed by the sealed casing 1 to achieve waterproof performance. The cooling case 2 is detachably mounted on the top of the sealing case 1 , and a plurality of vents 21 are opened on the circumferential side wall of the cooling case 2 .

The projection module 3 includes a first light source 31, a second light source 32 and a DMD chip assembly 33, the first light source 31 is a blue laser light source, and the second light source 32 is a red laser light source.

The water-cooled and air-cooled integrated heat dissipation module 4 includes a heat-absorbing assembly 41 and a heat-dissipating assembly 42. The heat-absorbing assembly 41 includes a first heat-absorbing plate 411, a second heat-absorbing plate 412, and a third heat-absorbing plate 413. The first heat-absorbing plate 411 1. Both the second heat absorbing plate 412 and the third heat absorbing plate 413 are hollow plates, and the material is preferably a solid material with excellent thermal conductivity. In this embodiment, copper is selected as the material of the heat sink plate.

The heat dissipation assembly 42 includes a pump set 421, a heat exhaust fan 422 and a cold row 5. The pump set 421 includes a first circulation pump 4211 and a second circulation pump 4212. Both the first circulation pump 4211 and the second circulation pump 4212 are copper water pumps. The cold row 5 is provided with two respectively the first cold row 5 and the second cold row 5. The cold row 5 includes a frame 51 and a heat dissipation strip 52. The frame 51 is a hollow square frame, and a plurality of heat dissipation strips 52 are arranged inside the hollow square frame. The cooling strips 52 are parallel to each other, and gaps are left between adjacent cooling strips 52 . The heat dissipation strips 52 are all hollow metal strips.

The heat exhaust fan 422 is provided with several, and the heat exhaust fan 422 is arranged on one side of each cold row 5 respectively, and the heat exhaust fan 422 and the corresponding cold row 5 are arranged parallel to each other and facing each other, so that the air flow driven by the heat exhaust fan 422 Pass through more efficiently between the cooling strips 52 of the cold row 5 .

The first circulation pump 4211 communicates with the first cold row 5 through a pipeline, and the first cold row 5 communicates with the first heat absorbing plate 411 through a pipeline. The second circulation pump 4212 communicates with the second cold row 5 through pipes, and the second cold row 5 communicates with the second heat absorbing plate 412 and the third heat absorbing plate 413 respectively through pipes.

There are two second cold rows 5 and they are connected in series.

The pipes connecting the pump group 421, the cold row 5, the first heat absorbing plate 411, the second heat absorbing plate 412 and the third heat absorbing plate 413 pass through the sealed casing 1 and are provided with a sealant sealing structure, and the pipes Sealed water pipe joints 6 are provided at places passing through the sealed housing 1, one of the two plug-in ends of the sealed water pipe joint 6 is fixed on the sealed housing 1, and the other is detachably connected to the fixed plug-in end, thereby Easy to repair and replace.

The pump set 421 , the cold row 5 and each heat dissipation fan are located in the heat dissipation casing 2 , and the heat dissipation components are protected by the heat dissipation casing 2 .

There are two first light sources 31 , that is, blue laser light sources, and two first heat-absorbing plates 411 are arranged on one side of a blue light source, close to the first light source 31 . The second heat absorbing plate 412 is disposed close to the second laser light source, and the third heat absorbing plate 413 is disposed on one side of the DMD chip assembly 33 and close to the DMD chip.

The circulation pipeline formed by the first circulation pump 4211 and the second circulation pump 4212 is filled with cooling medium. For the circulation pipeline formed by the first circulation pump 4211, the water outlet direction enters the seal from the output end of the first circulation pump 4211. The casing 1 is connected with a three-way joint, and the two outlet pipes of the three-way joint are respectively connected with two first heat absorbing plates 411 . The water outlet ends of the two first heat absorbing plates 411 are jointly connected to a three-way joint, the output end of the three-way joint passes through the sealed casing 1 and is connected to the first cold row 5, and the output end of the first cold row 5 is connected to The input end of the first circulation pump 4211.

The circulation pipeline formed by the second circulation pump 4212 and the circulation pipeline formed by the first circulation pump 4211 flow through the second heat absorption plate 412, the third heat absorption plate 413, and the second cold row 5, and the flow mode is the same as that of the first circulation. The circulation line of the pump 4211 is the same.

When the heat conduction medium is heated, it partially vaporizes to absorb a large amount of heat, and then the vaporized heat conduction medium is cooled and condensed at the cold row 5 to release a large amount of heat, thereby realizing efficient heat transfer.

The implementation principle of this embodiment is:

Driven by the pump group 421, the heat-conducting medium flows in the liquid circuit. When the heat-conducting medium flows through the first heat-absorbing plate 411, the second heat-absorbing plate 412, and the third heat-absorbing plate 413, the first light source 31 , the second light source 32 and the DMD chip assembly 33 work to absorb the heat generated, and then the heat-conducting medium flows out of the sealed casing 1 along the pipeline and enters the pump unit 421, and the heat exhaust fan 422 blows the airflow to the heat-conducting fluid outside the sealed casing 1. The medium is cooled and the heat is taken away, thereby realizing efficient heat exchange while ensuring the waterproof performance of the sealed shell 1;

By setting the cold row 5, when the heat transfer medium flows through the cold row 5, one end along the length direction of the cold row 5 flows to the other end of the cold row 5 through each cooling strip 52, and the air flows through the gaps between the cooling strips 52 to lift the The area for heat exchange with the heat transfer medium is reduced, and the heat exchange rate is improved;

The copper water pump has good thermal conductivity, which helps the heat in the heat transfer medium to flow out;

The pump unit 421, the cold row 5 and the heat exhaust fan 422 are protected by the heat dissipation housing 2, and the user is also prevented from directly touching the cold row 5 and the pipeline with the heat transfer medium to cause burns.

Therefore, the present invention effectively overcomes various shortcomings in the prior art and has high industrial application value.

The above-mentioned embodiments only illustrate the principles and effects of the present invention, but are not intended to limit the present invention. Anyone skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical ideas disclosed in the present invention should still be covered by the claims of the present invention.

Claims (8)

1. A waterproof liquid cooling system of projector, its characterized in that: the projection device comprises a sealing shell (1), a radiating shell (2), a projection module (3) and a water-cooling and air-cooling integrated radiating module (4);

the projection module (3) is arranged in the sealed shell (1), and the heat dissipation shell (2) is arranged on the sealed shell (1);

the projection module (3) comprises a first light source (31), a second light source (32) and a DMD chip assembly (33);

the water-cooling and air-cooling integrated heat dissipation module (4) comprises a heat absorption component (41) and a heat dissipation component (42);

the heat absorbing assembly (41) comprises a first heat absorbing plate (411), a second heat absorbing plate (412) and a third heat absorbing plate (413), the first heat absorbing plate (411), the second heat absorbing plate (412) and the third heat absorbing plate (413) are respectively and correspondingly arranged on one side of the first light source (31), one side of the second light source (32) and one side of the DMD chip assembly (33) in sequence, and the first heat absorbing plate (411), the second heat absorbing plate (412) and the third heat absorbing plate (413) are hollow plates;

the heat radiation assembly (42) comprises a pump group (421) and a heat extraction fan (422), the pump group (421) is respectively communicated with the first heat absorption plate (411), the second heat absorption plate (412) and the third heat absorption plate (413) through pipelines, and the heat extraction fan (422) is arranged on one side of the pump group (421).

2. The waterproof liquid-cooled heat dissipation system of a projector as set forth in claim 1, wherein: the heat dissipation assembly (42) further comprises a plurality of cold rows (5), each cold row (5) comprises a frame (51) and a plurality of heat dissipation strips (52), the heat dissipation strips (52) are arranged on the inner side of the frame (51) in parallel, gaps are reserved between the adjacent heat dissipation strips (52), the frame (51) and the heat dissipation strips (52) are of hollow structures, the heat dissipation strips (52) are communicated with the cavities inside the frame (51), one end of the length direction of each cold row (5) is communicated with the pump group (421) through a pipeline, and the other end of each cold row is communicated with the corresponding first heat absorption plate (411), second heat absorption plate (412) and third heat absorption plate (413) through pipelines.

3. The waterproof liquid-cooled heat dissipation system of a projector as set forth in claim 2, wherein: the first light sources (31) are provided with two groups, the first heat absorbing plates (411) are provided with two blocks and are respectively arranged on one sides of the two first light sources (31), the pump group (421) comprises a first circulating pump (4211) and a second circulating pump (4212), the cold rows (5) are provided with two cold rows (5) and second cold rows (5) respectively, the first circulating pump (4211) is communicated with the first heat absorbing plates (411) and the first cold rows (5) to form circulation, and the second circulating pump (4212) is communicated with the second heat absorbing plates (412), the third heat absorbing plates (413) and the second cold rows (5) to form circulation.

4. A water-resistant liquid-cooled heat sink system for a projector as set forth in claim 3, wherein: the first circulating pump (4211) and the second circulating pump (4212) are copper water pumps.

5. The waterproof liquid-cooled heat dissipation system of a projector as set forth in claim 2, wherein: the heat exhausting fans (422) are arranged in a plurality, and each heat exhausting fan (422) is arranged opposite to and parallel to the corresponding cold row (5).

6. The waterproof liquid-cooled heat dissipation system of a projector as set forth in claim 1, wherein: and sealing structures are arranged at the positions, penetrating through the sealing shell (1), of pipelines which are used for communicating the pump group (421) with the first heat absorbing plate (411), the second heat absorbing plate (412) and the third heat absorbing plate (413).

7. The waterproof liquid-cooled heat dissipation system of a projector as set forth in claim 6, wherein: the sealing structure is a sealing water pipe joint (6), one plug-in end of the sealing water pipe joint (6) is fixedly connected with the shell, and the other plug-in end is detachably connected with the fixedly arranged plug-in end.

8. The waterproof liquid-cooled heat dissipation system of a projector as set forth in claim 1, wherein: the heat dissipation shell (2) is detachably connected to the top of the sealing shell (1), a plurality of ventilation openings (21) are formed in the shell wall of the heat dissipation shell (2), and the pump group (421) and the heat exhausting fan (422) are arranged in the heat dissipation shell (2).