TW200815968A - Phase change heat dissipation device and method - Google Patents

Phase change heat dissipation device and method Download PDF

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Publication number
TW200815968A
TW200815968A TW095136005A TW95136005A TW200815968A TW 200815968 A TW200815968 A TW 200815968A TW 095136005 A TW095136005 A TW 095136005A TW 95136005 A TW95136005 A TW 95136005A TW 200815968 A TW200815968 A TW 200815968A
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TW
Taiwan
Prior art keywords
heat
working fluid
heat exchange
phase change
unit
Prior art date
Application number
TW095136005A
Other languages
Chinese (zh)
Inventor
Jun-Guang Luo
Original Assignee
Jun-Guang Luo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jun-Guang Luo filed Critical Jun-Guang Luo
Priority to TW095136005A priority Critical patent/TW200815968A/en
Priority to US11/798,434 priority patent/US20080078202A1/en
Priority to BRPI0702368-5A priority patent/BRPI0702368A/en
Priority to KR1020070062934A priority patent/KR20080029756A/en
Priority to JP2007204910A priority patent/JP2008082694A/en
Publication of TW200815968A publication Critical patent/TW200815968A/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Phase change heat dissipation device and method mainly consists of a heat exchange unit, a heated unit and a pipe system. The heat exchange unit executes heat exchange with exterior cool air to make the incoming work fluid to be condensed as liquid phase. The heated unit in which work fluid flows contacts a heat source and let the work fluid absorb heat energy and then vaporize as gas phase. The pipe system connects the heat exchange unit and heated unit to form a close loop. It guides the condensed liquid phase work fluid in the heat exchange unit flowing down to the chamber and guides the vaporized gas phase work fluid in the heated unit diffusing toward low concentration to the heat exchange unit. Therefore, the above mentioned liquid-gas during the phase change process uses the specific physical characteristic of self circulation flow to greatly enhance heat dissipation effect and efficiency.

Description

200815968 九、發明說明： 【發明所屬之技術領域】 本發明是有關於-種散熱裝置與方法，特別是指一種 此散發熱能的相變散熱裝置與方法。 【先前技術】 ,參閱圖1，以公告第M29期號「具致冷晶片的水冷 式散熱系統」新型專利案為例，主要包含有一散熱m、 一致冷晶片12、—增壓裝置13、一水冷頭i4、串連：散熱 裔η、該致冷晶片12、該增壓裝置13與該水冷頭μ的三 輸送管15、串連該散熱m與該水冷頭14的-迴送管= ’及—風扇17。該散熱器u是可與外界村氣進行熱交換 。δ亥增壓裝置13是一種加壓馬達或壓縮機，可以使流體循 環流動於該等輸送管15與該迴送管16。該水冷頭Μ是與 一熱源2(如電腦的中央處理器，cpu)接觸。該風扇17是可 產生冷風吹向該散熱器11。 藉此，當該增壓裝置13加壓流體時，該水冷頭14内 的流體會吸收該熱源2的熱能，並循環至該熱交換器u與 外界冷空氣進行熱交換，達到降溫的效果，如此周而復始 ，使該熱源2達到散熱的目的。惟，前述散熱系統雖然可 以達到散熱的目的，然，其卻於實際使用時，乃存有以下 缺失而亟待解決： 1 ·由於前述水冷式的散熱系統必須仰賴該增壓裝置i 3 加壓流體，才能使流體循環流動，不但元件較多、成本較 南、噪音值高，且在增壓同時也會產生熱能，造成流體溫 200815968 χ不斷提高，而增加冷卻負荷。 ^要的是，流體雖然可以藉由熱能的傳導，吸收該敎 :2的熱能，達到降溫的目的，惟， ： 及氣體分子，因此，力勃補工 狀^文羊逖不 在”、、傳面積有限，且長時間使用後， 以…源2與流體的溫度會 熱效果。 又曰丨現知間增長而棱南，嚴重影響散 、3士再者，若前述流體是水，則在寒帶地區氣溫達到（TC ::::水會結冰，使裝置失效，另一嚴重問題是，水如200815968 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device and method, and more particularly to a phase change heat dissipating device and method for dissipating heat energy. [Prior Art], referring to Figure 1, for example, the new patent case of the M29 issue "Water-cooled heat-dissipating system with cryogenic wafers" mainly includes a heat-dissipating m, a uniform cold wafer 12, a supercharging device 13, and a The water cooling head i4, the series connection: the heat sink η, the cooling chip 12, the three-pipe 15 of the pressurizing device 13 and the water-cooling head μ, the heat dissipation m and the water-cooling head 14-return pipe = ' And - fan 17. The radiator u is heat exchangeable with the outside village gas. The delta booster unit 13 is a pressurizing motor or compressor that allows fluid to flow through the ducts 15 and the return duct 16. The water-cooled head is in contact with a heat source 2 (such as a computer's central processing unit, cpu). The fan 17 is capable of generating cold air to be blown toward the radiator 11. Thereby, when the pressurizing device 13 pressurizes the fluid, the fluid in the water-cooling head 14 absorbs the heat energy of the heat source 2, and circulates to the heat exchanger u to exchange heat with the outside cold air to achieve the effect of cooling. This cycle is repeated to achieve the purpose of heat dissipation. However, although the above-mentioned heat dissipating system can achieve the purpose of heat dissipation, it has the following shortcomings in practical use and needs to be solved: 1) Since the aforementioned water-cooling heat dissipating system must rely on the supercharging device i 3 to pressurize the fluid In order to make the fluid circulate, not only the components are more, the cost is more south, the noise value is higher, and the heat energy is also generated during the pressurization, which causes the fluid temperature to increase continuously, and the cooling load is increased. ^What is required is that although the fluid can be absorbed by thermal energy, it absorbs the heat energy of the 敎:2, and achieves the purpose of cooling, but: and the gas molecules, therefore, the Libo replenishment is not in the form of The area is limited, and after a long time of use, the temperature of the source 2 and the fluid will have a thermal effect. Moreover, it is known that the growth is between the edges and the south, which seriously affects the dispersion, and the third person is further. If the fluid is water, it is in the cold zone. The temperature in the area reaches (TC :::: water will freeze and the device will be ineffective. Another serious problem is that water is like

Hit形’會使電子線路完全毁損，造成嚴重 失0 、 =得一提的是，雖然氣體的散熱效率較好，惟，目前 7要疋利用空虱對流達到降溫的目的，因&，散熱的效果 往往只在局限在該熱源2的表面，而無法帶走該熱源2内 P的…月b所以，整體而論，氣體的散熱效果反而不及水 冷式散熱系統。 【發明内容】 口此本發明之目的，即在提供一種能降低噪音，並 大巾田k幵政熱效果與散熱效率的相變散熱裝置與方法。 於是，本發明的相變散熱裝置，是架置在至少一熱源 上方，包含一熱交換單元、一受熱單元及一管系。該熱交 換單元是與外界冷空氣進行熱交換，使進入的工作流體冷 滅成液悲。該受熱單元是與一熱源接觸且内部流通有工作 流體，使工作流體吸收熱能後氣化成氣態。該管系是連通 4熱父換單元與該受熱單元形成密閉迴路，可導引該熱交 200815968 換單元内液態工作流體由高處向低處進入該腔體，及導引 該受熱單元内氣態工作流體向低濃度擴散至該熱交換單元 本發明的相變散熱方法，包含下列步驟：步驟一 ··使 工作流體循環於一熱交換空間與至少一熱源間。步驟二： 使工作流體在該熱交換空間内冷凝成液態，並向下流經該 熱源。步驟三：使工作流體吸收熱能後氣化成氣態，並向 低濃度擴散至該熱交換空間内。 本發明的功效是能藉由氣-液兩相變化的工作流體，產 生自體循環的流動效果’進而達到降低噪音、提昇散熱效 果與散熱效率的目的。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之數個較佳實施例的詳細說明中，將可 清楚的呈現。 $閱圖2、圖3及圖4，本發明的相變散熱裝置的一第 較佳實施例是安裝於一電腦主機3内，該主機3具有界 =出一上容室31與一下容室32的一機殼33、固設在該下 :至32内的一機板34,及設置在該機板34上的數個晶片 杈組35。該相變散熱裝置包含：一熱交換單元4、一為埶 單元5及一管系6。 又…The Hit shape will cause the electronic circuit to be completely destroyed, causing a serious loss of 0. It is worth mentioning that although the heat dissipation efficiency of the gas is good, at present, it is necessary to use the air convection to achieve the purpose of cooling, because & The effect is often limited to the surface of the heat source 2, and can not take away the P of the heat source 2 ... so b, as a whole, the heat dissipation effect of the gas is not as good as the water-cooled heat dissipation system. SUMMARY OF THE INVENTION The object of the present invention is to provide a phase change heat sink and method capable of reducing noise, and having a thermal effect and heat dissipation efficiency. Therefore, the phase change heat dissipating device of the present invention is disposed above at least one heat source and includes a heat exchange unit, a heat receiving unit and a pipe system. The heat exchange unit exchanges heat with the outside cold air to cool the incoming working fluid into a liquid. The heat receiving unit is in contact with a heat source and has a working fluid circulating therein, so that the working fluid absorbs heat energy and is vaporized into a gaseous state. The pipe system is a connected 4 hot parent changing unit and the heat receiving unit forms a closed circuit, which can guide the liquid working fluid in the heat exchange 200815968 to enter the cavity from a high place to a low place, and guide the gas state in the heat receiving unit. Dispersing the working fluid to a low concentration to the heat exchange unit The phase change heat dissipating method of the present invention comprises the steps of: Step 1. Circulating the working fluid between a heat exchange space and at least one heat source. Step 2: The working fluid is condensed into a liquid state in the heat exchange space and flows downward through the heat source. Step 3: After the working fluid absorbs the heat energy, it is vaporized into a gaseous state and diffused into the heat exchange space to a low concentration. The effect of the present invention is to achieve a self-circulating flow effect by a gas-liquid two-phase changing working fluid, thereby achieving the purpose of reducing noise, improving heat dissipation effect and heat dissipation efficiency. The above and other technical contents, features, and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments. Referring to FIG. 2, FIG. 3 and FIG. 4, a preferred embodiment of the phase change heat sink of the present invention is mounted in a computer mainframe 3, and the host 3 has a boundary = an upper chamber 31 and a lower chamber. A casing 33 of 32, a plate 34 fixed in the lower: to 32, and a plurality of wafer stacks 35 disposed on the plate 34. The phase change heat sink comprises: a heat exchange unit 4, a unit 5 unit 5 and a tube system 6. also…

13亥熱交換單元4是設置在該主機3的上容室31内，並 具有-熱交換器41、一致冷晶片組42、一散熱器43，及二 風扇44。該熱交換器41具有形成在一頂面的—儲氣室“I 7 200815968 、形成在該一底面的一儲液室412，及連通該儲氣室川盥 該儲液室412的數流道413。該致冷晶片組42是藉由電路 控制，具有維持低溫狀態且與該熱交換器儲液室412接 觸的；;冷端面421，及反向於該冷端面切的—熱端面422 ，5亥冷知面421是具有冷滚作用，可以使該儲液室412呈 ΓΓΓ果。該散熱1143是概呈^，且與該致冷晶片組 42的熱端面42 1貼置並盥唁埶六娘 …亥熱又換為'41平行併列。該風扇 疋產生/々風吹向該熱交換器41與該散熱器43。 该受熱單元5具有二妒―si 〃有—月工肢51、52、53。該等腔體51、 …與熱源溫度低、巾、高的晶片模組35接觸。 該管系6具有依序串連該熱交換器41儲液室412 腔體51、該腔體51與該_、該腔體52與該腔體;;， 及該腔體53與該熱交換器，氣室411的四串接管61、 12^64’使該”^ 61〜64與該熱交換器41、該等 U1〜53形成-㈣迴路。藉此，在該等串接管6^64、、 該等腔體叫3與該熱交換器41中抽取真空後，注入工作 流體，使工作流體循環於一直介 例是-種在常溫下為液態的二:：；工：流體在本實施 導液體。 ϋ可以是-種溫度超傳 參閱圖4、圖5及圖6,當該主 模組35即開始產生高溫， 叉 Θ寻曰曰片 說明如下： 17針對本發明相變散熱方法 步驟71 :該腔體51内的 曰片模& 作流體會藉由熱傳導吸收該 )產生的熱能’使部份液態工作流體氣化 200815968 成氣態。 步驟72 :該腔體5 1内的壓力會提昇，使氣態工作流體 隨同液態工作流體經該_接管62進入該腔體52，此時，該 腔體52内的液態工作流體會藉由熱傳導吸收該晶片模組 3 5 (次低溫）產生的熱能，使部份液態工作流體氣化成氣態。 步驟73 :該腔體52内的壓力會愈提昇，使氣態工作流 體隨同液態工作流體經該_接管63進入該腔體53，此時， 該腔體53内的液態工作流體會藉由熱傳導吸收該晶片模組 35(最高溫）產生的熱能，使餘下的液態工作流體氣化成高溫 的氣態工作流體。 藉此，該等腔體的串接數量可依該等晶片模組的數量 而定，使工作流體由最低溫到最高溫依次流經該等腔體。 步驟74 :高溫的氣態工作流體會依循該串接管64向低 濃度擴散至該熱交換器41的儲氣室411内。 步驟75 :氣體因為比重較重、壓力、及地心引力的影 響，開始沿該等流道413下墜，並與該熱交換器41進行熱 交換，且該風扇44會產生冷風吹向該熱交換器41與該散 熱器43，使該熱交換器41、該散熱器43與外界冷空氣進 行熱交換。 步驟76:高溫的氣態工作流體遇冷開始降溫並凝結為 水滴形成液態工作流體。 步驟77 :液態工作流體流入該熱交換器41的儲液室 412内，受該致冷晶片組42冷端面421的冷凍作用，溫度 繼續下降至預設值，而該致冷晶片組42熱端面422會散發 200815968 月1述冷凍作用而產生的熱能，並 空#( i隹广相 咬30。亥政熱态43與外界冷 二巩進仃熱交換，達到散熱的效果。 乂 I 78 ·由於流體具有由高向 、人 门Π低机動的物理特性，因 ~嘁後的液態工作流體會由上向 61 ^ Λ ^ 上向下，再次由該串接管 6丄/爪入该腔體5 1内。 2步驟71〜步驟78,如此週而復始，使前述工作流 二：二父換器4、該等腔體51〜53與該等串接管㈣間 自月旦# %，達到散熱效果。 〜麥閱圖7，是本發明—第二較佳實施例，其與第-較佳 貫轭例大致相同，不同處在於： 5亥管系6具有連通該熱交換器41儲液室412的一分流 器65、分別連通該分流器65與該等腔體51〜53且可導引工 作:體進人該等腔體51〜53内的三併流液接管Μ、連通該 2交換器41館氣室411❺一匯流器67,及分別連通該匯流 器？7與該等腔體51〜53且可導引氣體進入該熱交換器4i 儲氣室411的數併流氣接管68。 在步~ 78中’液態的工作流體是由該分流器65經該 等併机接：66同時進入該腔體5 1〜53内。藉此，步驟71〜 步私73疋同步進行，也就是說，該液態的工作流體同樣會 吸收該等晶片模組35產生的熱能並氣化成氣態工作流體， 在步驟74中’高溫的氣態工作流體是由該等腔體51〜53經 該等併流氣接管68匯集於該匯流器67，向低濃度擴散至該 熱父換器41的儲氣室411内，並依序進行步驟75〜78。如 此週而復始’使前述工作流體在該熱交換器4、該等腔體 10 200815968 疋本發明一第三較佳實施例，其與第一 Z：A j-m m 參閱圖 第 二較佳實施例大致相同，不同處在於·· 本發明的熱交換單元4 ^ , 了以延過5亥官系6以併連（或串 人Μη ΐα^ 54連通，而該等腔體54可以配 合貝務上應用的笏疇，访$ 靶可與各種會產生熱源的電子元件7接 =以=主機_，料電子。元件7以是—财央處 理為、笔源供應哭 g y y 您如日日片杈组、致冷晶片電源供應器··.·等 〇 ，此’本實施例的工作流體同樣可以在前述液體-氣體 相又化的過&巾’以特有的物理特性自體循環流動，並大 幅提昇散熱效果與散熱效率。 當然，本發明的相變散熱裝置與方法也可以擴充使用 在汽車的引擎散熱、或機械上的散熱、或其他需要散埶的 裝置。 ’ 據上所述可知，本發明之相變散熱裝置與方法具有下 列優點及功效： 1·本發明是藉由前述液態-氣態工作流體在二相變化的 過程中’以液態工作流體由高處向低處流動，及氣態工作 流體由濃度高向濃度低流動的物理特性，產生自體循環的 流動效果’不但可以簡化元件、降低成本與噪音，且不會 有額外的熱源產生。 2 ·重要的是’本發明可以藉由液態工作流體以熱傳導的 方式’有效吸收該等晶片模組35的熱能，再變態為氣態工 200815968 作流體與該熱交換單元4 提昇散熱效果與散熱效率外，且藉此’不但能大幅 片組42以電控方式可程 X明可以配合该致冷晶 工制&度，使該液態的工作流體 效果長短’料以維持在特定的溫度，確保散熱 液二再因t二發明所使用的工作流體是冷媒或溫度超傳導 二7: ’在氣溫低於。t時’不會有結冰的現象，可以 會瞬間氣化，不會影響電漏:工作流體也 性。 此有效提昇使用的實用 限定2料只是本發明之較佳實施例而#不能以此 發明=Μ施之範圍’即大凡依本發明尹請專利範圍及 明專心所作之間早的等效變化與修飾，皆仍屬本發 月專利涵蓋之範圍内。 12 200815968The 13H heat exchange unit 4 is disposed in the upper chamber 31 of the main unit 3, and has a heat exchanger 41, a uniform cold chip group 42, a radiator 43, and a second fan 44. The heat exchanger 41 has a gas storage chamber "I 7 200815968 formed on a top surface, a liquid storage chamber 412 formed on the bottom surface, and a plurality of flow passages connecting the gas storage chamber and the liquid storage chamber 412. 413. The cooled wafer set 42 is controlled by a circuit, has a low temperature state and is in contact with the heat exchanger reservoir 412; a cold end surface 421, and a hot end surface 422 that is opposite to the cold end surface. The 5H cold surface 421 has a cold rolling effect, and the liquid storage chamber 412 can be made into a result. The heat dissipation 1143 is an outline and is placed on the hot end surface 42 1 of the cooling chip group 42. Liu Niang...Hai heat is replaced by '41 parallel juxtaposition. The fan 疋 generates / hurricane blows to the heat exchanger 41 and the radiator 43. The heat receiving unit 5 has two 妒 si 〃 — 月 - month limbs 51, 52 The chambers 51 are in contact with the wafer module 35 having a low heat source temperature and a high temperature. The tube system 6 has a chamber 51 in the chamber 41 of the heat exchanger 41 in sequence. 51, the cavity 52 and the cavity; and the cavity 53 and the heat exchanger, the four series of nozzles 61, 12^64' of the gas chamber 411 make the "^61~64" The heat exchanger 41, the U1 to 53 form a - (four) circuit. Thereby, after the vacuum is extracted from the series of tubes 6^64, the chambers 3 and the heat exchanger 41, the working fluid is injected to circulate the working fluid, which is a liquid at normal temperature. The second::; work: fluid in this implementation of the liquid. ϋ can be a kind of temperature super-transfer. Referring to FIG. 4, FIG. 5 and FIG. 6, when the main module 35 starts to generate high temperature, the fork seeker is described as follows: 17 for the phase change heat dissipation method of the present invention, step 71: The slab mold & in the cavity 51 will absorb the heat energy generated by the heat transfer to vaporize part of the liquid working fluid into a gaseous state of 200815968. Step 72: The pressure in the cavity 51 is increased, so that the gaseous working fluid enters the cavity 52 along with the liquid working fluid through the nozzle 62. At this time, the liquid working fluid in the cavity 52 is absorbed by the heat conduction. The heat generated by the wafer module 35 (sub-low temperature) causes a portion of the liquid working fluid to be vaporized into a gaseous state. Step 73: The pressure in the cavity 52 is increased, so that the gaseous working fluid enters the cavity 53 along with the liquid working fluid through the nozzle 63. At this time, the liquid working fluid in the cavity 53 is absorbed by the heat conduction. The thermal energy generated by the wafer module 35 (the highest temperature) vaporizes the remaining liquid working fluid into a high temperature gaseous working fluid. Thereby, the number of serial connections of the cavities can be determined according to the number of the wafer modules, so that the working fluid flows through the cavities from the lowest temperature to the highest temperature. Step 74: The high temperature gaseous working fluid will diffuse into the gas storage chamber 411 of the heat exchanger 41 in accordance with the series connection pipe 64 to a low concentration. Step 75: The gas begins to fall along the flow passages 413 due to the influence of heavy specific gravity, pressure, and gravity, and exchange heat with the heat exchanger 41, and the fan 44 generates cold air to the heat exchange. The heat exchanger 41 and the heat sink 43 exchange heat with the outside cold air. Step 76: The high temperature gaseous working fluid begins to cool down in the cold and condenses into water droplets to form a liquid working fluid. Step 77: The liquid working fluid flows into the liquid storage chamber 412 of the heat exchanger 41. Due to the freezing action of the cold end surface 421 of the refrigerated wafer group 42, the temperature continues to drop to a preset value, and the hot end face of the refrigerated wafer set 42 422 will distribute the heat generated by the freezing effect of 200815968, and it will be empty #(i隹广相 bit 30. The heat state 43 is in heat exchange with the outside world, to achieve the effect of heat dissipation. 乂I 78 ·Because of the fluid The physical characteristics of the high-direction, low-maneuvering maneuvering, because the liquid working fluid after the helium will go up from 61 ^ Λ ^ up, and then the stringer 6 丄 / claw into the cavity 5 1 again. 2 Step 71 to Step 78, so as to repeat the above, the workflow 2: the second parent converter 4, the chambers 51 to 53 and the series of tubes (four) from the moon #%, to achieve the heat dissipation effect. The present invention is a second preferred embodiment which is substantially the same as the first preferred yoke example, except that: the 5th tube system 6 has a shunt 65 that communicates with the heat storage chamber 412 of the heat exchanger 41, Connecting the shunt 65 and the cavities 51 to 53 respectively and guiding the work: the body 51 is inserted into the cavity 51 a triple parallel liquid connection port ～53, a communication unit 411 ❺ a confluence unit 67 connected to the 2 exchanger 41, and a communication unit 7 and the chambers 51 to 53 respectively and guiding the gas into the heat exchange The gas storage chamber 411 is connected to the gas chamber 68. In step 78, the liquid working fluid is connected by the splitter 65 through the parallel: 66 simultaneously into the chambers 5 1 to 53. Step 71~ Step 73疋 is performed synchronously, that is, the liquid working fluid also absorbs the heat energy generated by the wafer modules 35 and vaporizes into a gaseous working fluid. In step 74, the high temperature gaseous working fluid is The chambers 51 to 53 are collected in the manifold 67 via the parallel gas nozzles 68, diffused into the gas storage chamber 411 of the heat master 41 at a low concentration, and steps 75 to 78 are sequentially performed. Repeatingly, the working fluid is in the heat exchanger 4, the chambers 10 200815968, and a third preferred embodiment of the present invention, which is substantially the same as the first Z:A jm m with reference to the second preferred embodiment. The difference lies in that the heat exchange unit 4 ^ of the present invention is extended by 5 Parallel (or string of people Μ ΐ ^ α ^ 54 connected, and these cavities 54 can be used in conjunction with the application of the Bayesian domain, access to the target can be connected with a variety of electronic components that will generate heat source = = host _, material electronics The component 7 is processed by the financial center, and the pen source is supplied with crying gyy. If you are a day-to-day film group, a cold chip power supply, etc., the working fluid of the present embodiment can also be in the aforementioned liquid. - The gas phase re-formed & towel's self-circulating flow with unique physical properties, and greatly improved heat dissipation and heat dissipation efficiency. Of course, the phase change heat sink and method of the present invention can also be used to expand the heat dissipation of the engine of the automobile, or mechanical heat dissipation, or other devices that require divergence. According to the above description, the phase change heat dissipating device and method of the present invention have the following advantages and effects: 1. The present invention is a liquid working fluid in the process of two-phase change by the liquid-gas working fluid. Flow to the lower part, and the physical properties of the gaseous working fluid from high concentration to low concentration, resulting in the flow effect of the autogenous circulation' not only can simplify the components, reduce cost and noise, and there is no additional heat source. 2 · It is important that the present invention can effectively absorb the thermal energy of the wafer modules 35 by means of a liquid working fluid in a thermally conductive manner, and then transform the gas into a gas and the heat exchange unit 4 to improve the heat dissipation effect and heat dissipation efficiency. In addition, by this, not only can the large-scale group 42 be electrically controlled, but the liquid working fluid can be matched with the degree of the liquid working fluid to maintain the temperature at a specific temperature. The heat-dissipating fluid is again used by the t-two invention. The working fluid is refrigerant or temperature superconducting two 7: 'At lower temperatures. When t is not icing, it can be vaporized instantaneously, without affecting the electric leakage: the working fluid is also sexual. The practical limitation of the effective use is only a preferred embodiment of the present invention, and # cannot be invented by the scope of the present invention, that is, the early equivalent change between the patent scope and the concentrating of the present invention. Modifications are still within the scope of this patent. 12 200815968

【圖式簡單說明;I 圖1是一立體圖 圖2是本發3月_ 例的一立體圖； ，說明專利號數第M295424號案； 相變散熱裝置與方法一第一較佳實施 圖3是該第—較佳實施例的-部份剖視圖； 圖4f該ί—較佳實施例安裝在-主機的一正視圖 圖: :二鉸佳貫施例與該主機的一側視圖； 圖6疋帛車交佳實施例的一流程圖； 圖7疋本發明一相變散熱裝置與方法一 例的一立體圖；及 圖8是本發明-相變散熱裝置與方法一 例的一配置示意圖。 第二較佳實施 第三較佳實施 13 200815968 【主要元件符號說明】 3…… *…主機 44···· • ·…風扇 31 ·…· •…上容室 5 .···· …··受熱單元 32♦•… •…下容室 51 ···· ••…腔體 33*·… …·機殼 52.… ••…腔體 34·…· …·機板 53…· ••…腔體 35"… •…晶片模組 54•… •…·腔體 4 ****** 热父換早兀 ..... 0 ……官糸 4 j ..... •…熱交換器 61 ···· •…·串接管 411… …·儲氣至 62·… ••…串接管 412… …·儲液室 63 ••… …··串接管 413… •…流道 64····. •…串接管 42**"· ----致冷晶片組 65 …·. * * * /；IL 421… •…冷端面 66••… —併流液接管 422… •…熱端面 67··.·· …·匯流器 43…… …*散熱器 68••… •…併流氣接管 14BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a third embodiment of the present invention; FIG. 2 is a perspective view of the patent number No. M295424; a phase change heat sink and a first preferred embodiment of FIG. A partial cross-sectional view of the first preferred embodiment; FIG. 4f is a front view of the preferred embodiment mounted on the mainframe: a side view of the two hinges and a side view of the main body; FIG. 7 is a perspective view showing an example of a phase change heat dissipation device and method of the present invention; and FIG. 8 is a schematic view showing an arrangement of an embodiment of the phase change heat dissipation device and method of the present invention. Second Preferred Embodiment Third Preferred Embodiment 13 200815968 [Description of main component symbols] 3... *... Host 44·······...fan 31 ·...· •...capturing room 5 .······· · Heat receiving unit 32♦•... •... Lower chamber 51 ···· ••...cavity 33*·...·enclosure 52.... ••...cavity 34·...·...·machine plate 53...· •...cavity 35"...•...chip module 54•... •...·cavity 4 ****** Hot father change early 兀..... 0 ...... bureaucracy 4 j ..... • ...heat exchanger 61 ·······Splicer 411...··Storage to 62·...••...Splicer 412...··Liquid chamber 63 ••...··Splicer 413... •...flow Road 64····.•...Splicer 42**"· ----Cold chip set 65 ...·. * * * /; IL 421... •...cold end face 66••... —Co-current nozzle 422 ... •...Hot end face 67·······Converter 43... ...* Radiator 68••... •...and air connection 14

Claims (1)

200815968 十、申請專利範圍： 1. 一種相變散熱裝置，是架置在至少一熱源上方，包含： 熱父換單元’疋與外界冷空氣進行熱交換，使進 入的工作流體冷凝成液態； 一受熱單元，是與該熱源接觸且内部流通有工作流 體’使工作流體吸收熱能後氣化成氣態；及200815968 X. Patent application scope: 1. A phase change heat dissipating device is placed above at least one heat source, comprising: a hot parent changing unit '疋 heat exchange with external cold air to condense the incoming working fluid into a liquid state; The heat receiving unit is in contact with the heat source and has a working fluid flowing therein to make the working fluid vaporize into a gaseous state after absorbing heat energy; 2. 3. 4.2. 3. 4. 一管系，是連通該熱交換單元與該受熱單元形成密 閉迴路，可導引該熱交換單元内液態工作流體由高處向 低處進入該腔體，及導引該受熱單元内氣態工作流體向 低濃度擴散至該熱交換單元。 依據申請專利範圍第1項所述之相變散熱裝置，其中， 該熱交換單元具有一熱交換器〃該熱交換器具有形成在 —頂面的一儲氣室、形成在該一底面的_儲液室，及連 通該儲氣室與該儲液室的數流道。 依據申請專利範圍第2項所述之相變散熱裝置，其中， =熱父換單it更具有-致冷晶片組及—散熱器，該致冷 曰曰片組具有與該熱交換器儲液室接觸的一冷端面，及反 向於該冷端面的一熱端面，該散熱器是與該致冷晶片組 的熱端面貼置且與該熱交換器平行併列。 二據申巧專利範圍第3項所述之相變散熱裝置，其中， ::熱交換單元更具有一風扇’該風扇是可產生冷風吹向 5亥熱交換器與該散熱器。 依據申請專利範圍第"員所述之相變散熱裝置，其中， σ亥叉熱單元具有數腔體。 15 200815968 6·依據U利範圍第5項所述之相變散熱裝置，其中， 該管系具有串連該熱交換單元與該等腔體的數串接管。 依據申明專利範圍第5項所述之相變散熱裝置，其中， =系具有連通該熱交換單元的-分流器、分別連通該 分流器與該等腔體且可導引液態工作流體進入該腔體的 數併流液接管、連通該熱交換單元的—匯流器，及分別 連j该匯流器與該等腔體且可導引氣態工作流體進入該 熱父換為'的數併流氣接管。 8. 依據申D月專利範圍第i項所述之相變散熱裝置，其中， 該工作流體可以是冷媒、溫度超傳導液體其中一種。 9. 依據中請專利範圍第丨.項所述之相變散熱裝置，其中， 該熱交換單元、該受熱單元與該管系所形成的迴路是呈 真空狀態。 10. 一種相，交散熱方法，包含下列步驟： V私 ·使工作流體循環於一熱交換空間與至少 熱源間； ，步驟二：使工作流體在該熱交換空間内冷凝成液態 ，並向下流經該熱源； γ私一 ·使工作流體吸收熱能後氣化成氣態，並向 低濃度擴散至該熱交換空間内。 η.依據申請專利範圍第10項所述之相變散熱方法，其中， 工作流體可以是冷媒、溫度超傳導液體其中一種。 12.依據申請專利範圍第1〇項所述之相變散熱方法，其中， 工作流體是在真空環境中循環。 16a pipe system connecting the heat exchange unit and the heat receiving unit to form a closed circuit, guiding the liquid working fluid in the heat exchange unit to enter the cavity from a high place to a low place, and guiding the gaseous working fluid in the heat receiving unit Diffusion to a low concentration to the heat exchange unit. The phase change heat dissipating device according to claim 1, wherein the heat exchange unit has a heat exchanger, the heat exchanger has a gas storage chamber formed on the top surface, and is formed on the bottom surface. a liquid storage chamber, and a plurality of flow passages connecting the gas storage chamber and the liquid storage chamber. According to the phase change heat dissipating device of claim 2, wherein the = hot parent exchange order has a -cooling chip set and a heat sink, and the refrigerant chip set has a liquid storage with the heat exchanger A cold end surface of the chamber contact, and a hot end surface opposite to the cold end surface, the heat sink is placed adjacent to the hot end surface of the refrigerated wafer set and juxtaposed parallel to the heat exchanger. 2. The phase change heat sink according to claim 3, wherein the :: heat exchange unit further has a fan, wherein the fan is capable of generating cold air to the 5H heat exchanger and the heat sink. According to the phase change heat dissipating device described in the patent application scope, the σHei fork thermal unit has a plurality of cavities. The phase change heat sink of the fifth aspect of the invention, wherein the pipe system has a series of connecting pipes in series with the heat exchange unit and the cavities. The phase change heat dissipating device according to claim 5, wherein the system has a shunt connected to the heat exchange unit, respectively communicates the shunt and the chambers, and can guide the liquid working fluid into the chamber. The number of the fluid is connected to the manifold, the manifold that communicates with the heat exchange unit, and the manifold and the chambers respectively, and the gaseous working fluid can be guided into the number of parallel gas inlets. 8. The phase change heat sink according to the invention of claim D, wherein the working fluid may be one of a refrigerant and a temperature superconducting liquid. 9. The phase change heat sink according to the above paragraph, wherein the heat exchange unit, the heat receiving unit and the circuit formed by the piping are in a vacuum state. 10. A phase, cross-heating method comprising the steps of: V privately circulating a working fluid between a heat exchange space and at least a heat source; and step 2: condensing the working fluid into a liquid state in the heat exchange space and flowing downward Through the heat source; γ private one, the working fluid absorbs thermal energy, gasifies into a gaseous state, and diffuses into the heat exchange space to a low concentration. The phase change heat dissipation method according to claim 10, wherein the working fluid may be one of a refrigerant and a temperature superconducting liquid. 12. The phase change heat dissipation method according to claim 1, wherein the working fluid is circulated in a vacuum environment. 16
TW095136005A 2006-09-28 2006-09-28 Phase change heat dissipation device and method TW200815968A (en)

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TW095136005A TW200815968A (en) 2006-09-28 2006-09-28 Phase change heat dissipation device and method
US11/798,434 US20080078202A1 (en) 2006-09-28 2007-05-14 Heat dissipating system and method
BRPI0702368-5A BRPI0702368A (en) 2006-09-28 2007-05-29 heat dissipation system and method
KR1020070062934A KR20080029756A (en) 2006-09-28 2007-06-26 Heat dissipation system, computer module and heat dissipation method
JP2007204910A JP2008082694A (en) 2006-09-28 2007-08-07 Cooling method and cooling device thereby

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