201101011 六、發明說明： 【發明所屬之技術領域】 本發明係有關一種多工作流體之散熱器及使用該散熱 器之散熱模組，尤指一種將兩個以上之冷卻循環系統，藉 由一散熱器予以整合之設計者。 【先前技術】 按，電子資訊產品都需要做適當的熱管理（thermal management)來達到溫度控制，以確保系統中所有元件均能 〇 維持在工作溫度範圍内，如此方能有最佳的運作狀況；而 當個人電腦產品持續朝向輕薄、短小、多功能的趨勢演進 時，其内部處理器的運作時脈不斷提升，繼而衍生高耗電 量與高發熱量的問題是不可小覷地；故在1C微型化與高性 能之發展趨勢過程中，晶片發熱密度也隨之提升，傳統散 熱技術將會面臨挑戰。 次按，目前電子資訊產品之散熱技術分為氣冷式、熱 管式、液冷式、熱電製冷以及蒸氣壓縮等；其中，氣冷式 〇 散熱法的結構簡單、價格低廉與安全可靠，但仍有不能將 溫度降至室溫以下以及風扇轉動產生噪音的問題；熱導管 散熱法是目前廣泛應用在筆記型電腦上的散熱技術，是種 十分有效的散熱方式，而熱管鳍片模組已廣泛應用於筆記 型電腦、PDA、GPS等3C電子產品，但是當加熱瓦數過高時， 仍然會有燒乾（dry out)的風險情況發生，因此有其操作上 的界限；水冷散熱法可以充分發揮水冷的優勢，可帶走更 多的熱量；熱電製冷是由半導體所組成的一種冷卻裝置， 201101011 在高熱負載下可以維持一定的溫度，但有性能係數（COP)不 夠高之缺點；蒸氣壓縮循環式系統（Vapor Compression Refrigeration System)之優點為散熱能力遠超過於上述 其它散熱技術，可高達200W以上，並可在高的散熱量下， 仍然將熱源表面維持在低溫的狀態，且其C0P值極高，約 2. 0〜4. 7左右。 再按，中華民國M338390號新型專利，係揭示一種「電 腦冷卻裝置之改良」，包含：一吸熱單元，其具有至少一水 冷頭、與該水冷頭連接之一幫浦、及與該幫浦連接之一散 D 熱排，而該水冷頭、該幫浦及該散熱排流通有一第一工作 流液；以及一冷卻單元，其具有與該散熱排貼附之一蒸發 器、連接該蒸發器之一壓縮機、連接該壓縮機之一冷凝器、 及連接該冷凝器之一膨脹閥，而該蒸發器、該壓縮機、該 冷凝器及該膨脹閥流連通有一第二工作流液；藉此，讓吸 熱單元吸收電腦内部之相關熱源，之後再配合冷卻單元進 行熱交換之散熱動作。於是，該案為了達到快速將熱源之 廢熱散逸而獲得較佳之散熱功效，遂以高C0P值之蒸氣壓 〇 縮循環式系統取代傳統之散熱排及散熱風扇，而將廢熱以 接力之方式散逸至電腦外部。 【發明内容】 本發明之主要目的，係欲提供一種多工作流體之散熱 器及使用該散熱器之散熱模組，而具有散熱效能可視需求 調整之功效。 本發明之另一目的，則具有節能之功效。 為達上述功效，本發明多工作流體之散熱器之結構特 201101011 徵，係將一殼體内部分隔出至少兩腔室，並於每一腔室設 置有流體入口與流體出口，而令每一腔室以其流體入口與 流體出口，各自與不同工作流體所構成之冷卻循環系統連 接者。其中，該腔室之一被另一腔室所包圍；該腔室為婉 蜒之流道或於内部設置有增加工作流體接觸面積之柱體； 該殼體外表面設置有散熱鰭片與散熱風扇。 本發明使用前述散熱器之散熱模組之結構特徵，係包 括有： 〇 一散熱器’將一殼體内部分隔出至少兩腔室，並於每 一腔室設置有流體入口與流體出口； 一第一工作流體循環管，連接於一壓縮機之高、低壓 端’而令第一工作流體由該壓縮機流出，並依序流經一冷 凝器、一膨脹閥與該散熱器之第一腔室之後，再流回該壓 縮機構成一蒸氣壓縮冷卻循環； 一第二工作流體循環管，藉由一幫浦自一流體貯槽抽 吸第二工作流體，而令第二工作流體流經該散熱器之第二 Q 腔室與一冷卻器之後，再流回該流體貯槽構成液冷式冷卻 循環；以及 一控制器，控制該壓縮機與幫浦之運轉狀態者。 此外，該腔室之一被另一腔室所包圍，而該腔室為婉 蜒之流道或於内部設置有增加工作流體接觸面積之柱體’ 另於該殼體外表面設置有散熱鰭片與散熱風扇。再者’該 冷凝器與膨脹閥之間設置有一儲液器與一流量計’該散熱 器之第一腔室與壓縮機之間設置有一液氣分離器。又’該 散熱器之第二腔室與幫浦之間設置有一調整閥與一流量 201101011 計，該第二工作流體循環管進一步增設一與該幫浦並聯之 旁路閥。另，該冷凝器與冷卻器共用一散熱風扇強制散熱， 而該散熱風扇之運轉狀態受到該控制器之控制；然而，該 第一工作流體為環保冷媒，該第二工作流體為奈米冷卻液。 【實施方式】 首先，請參閱第一圖所示，本發明之多工作流體之散 熱器’係將一殼體（10)内部分隔出至少兩腔室（11、12)， 並於每一腔室（11、12)設置有流體入口（ill、121)與流體 出口（112、122)，而令每一腔室（11、12)以其流體入口 (111、121)與流體出口（112、122) ’各自與不同工作流體 所構成之冷卻循環系統連接者。 接著’請參閱第二圖所示’本發明之散熱模組，係包 括有： 一散熱器，將一殼體（10)内部分隔出至少兩腔室（丨1、 12) ’並於每一腔室（11、12)設置有流體入口（in、κι)與 流體出口（112、122); 一第一工作流體循環管（20)，連接於一壓縮機（21)之 高、低壓端，而令第一工作流體由該壓縮機（21)流出，並 依序流經一冷凝器（22)、一膨脹閥（23)與該散熱器之第一 腔室（11)之後’再流回該壓縮機（21)構成一蒸氣壓縮冷卻 循環；另’該冷凝器（22)與膨脹閥（23)之間設置有一儲液 器（24)與一流量計（25)，該散熱器之第一腔室（11)與壓縮 機（21)之間設置有一液氣分離器（26); 一第二工作流體循環管（30)，藉由一幫浦（31)自一流 體貯槽（32)抽吸第二工作流體’而令第二工作流體流經該 -6- 201101011 散熱器之第二腔室（12)與一冷卻器（33)之後，再流回該流 體貯槽（32)構成液冷式冷卻循環；另，該散熱器之第二腔 室（12)與幫浦（31)之間設置有一調整閥（34)與一流量計 (35)，該第二工作流體循環管（3〇)進一步增設一與該幫浦 (31)並聯之旁路閥（36);以及 一控制器（40) ’控制該壓縮機（21)與幫浦（31)之運轉 狀態者。 此外，該腔室（11、12)為蜿蜒之流道或於内部設置有 增加工作流體接觸面積之柱體（113、丨23);又令該腔室（^) 之一被另一腔室（12)所包圍；另於該殼體（1〇)外表面設置 有散熱鰭片與散熱風扇（圖未示）；再者，該冷凝器（22)與 冷卻器（33)共用一散熱風扇（圖未示）強制散熱，而該散熱 風扇之運轉狀態受到該控制器（4〇)之控制；另，該第—工 作流體為環保冷媒，該第二工作流體為奈米冷卻液，而以 與至溫相近的奈米冷卻液包圍著中央低於室溫的環保冷 媒’可以防止結露現象的發生。 基於如是之構成，本發明係將兩個以上之冷卻循環系 統藉由一散熱器予以整合，實施例中乃結合了液冷式冷卻 循環與蒸氣壓縮冷卻循環；其中，液冷式冷卻循環無法以 比室溫更低的溫度來進行熱交換之缺點，可藉由以低於室 溫的低溫溫度進行熱交換之蒸氣壓縮冷卻循環予以彌補； 另一方面，液冷式冷卻循環則改善了蒸氣壓縮冷卻循環， 因冷媒質量流率不夠而無法即時且大量地把熱量帶走之窘 境；於是’當散熱模組處於低負載時，只須開啟液冷式冷 卻循環進行散熱的工作（塵縮機不需運轉俾以節能），而當 201101011 散熱模組處於高負載時，液冷式冷卻循環與蒸氣壓縮冷卻 循環則同時運轉’以達到瞬間可大量排熱之高散熱效能。 是故，現今電腦内部除了令央處理器（CPU)之外，另如 VGACVideo Graphics Array)卡之散熱問題也日益受到重 視’而本發明可將散熱器設置於會製造大量廢熱之主廢熱 源表面（如圖示之CPU，50)，俾以視主廢熱源之負載（散熱 需求）情況，讓第一工作流體所構成之蒸氣壓縮冷卻循環， 以及第二工作流體循環管所構成之液冷式冷卻循環，同時 進行運轉或僅液冷式冷卻循環進行運轉，而具有散熱效能 視需求調整且節能之功效；此外，若另有第二廢熱源（如圖 示之VGA，60)，則可令該第二工作流體循環管（3〇)再繞經 第二廢熱源，或是於第二廢熱源表面設置第二散熱器，而 利用對主廢熱源進行散熱工作之相同冷卻循環，再對第二 廢熱源進行散熱之工作。 綜上所述，本發明所揭示之技術手段，確具「新穎性」、 「進步性」及「可供產業利用」等發明專利要件，祈請鈞 局惠賜專利，以勵發明，無任德感。 惟，上述所揭露之圖式、說明，僅為本發明之較佳實 施例，大凡熟悉此項技藝人士，依本案精神範疇所作之修 飾或等效變化，仍應包括本案申請專利範圍内。 / 201101011 【圖式簡單說明】 第一圖係本發明之散熱器結構剖示圖。 第二圖係本發明之散熱模組結構示意圖。 【主要元件符號說明】201101011 VI. Description of the Invention: [Technical Field] The present invention relates to a heat sink for a multi-working fluid and a heat dissipating module using the same, in particular to a cooling system with more than two cooling cycles The designer of the integration. [Prior Art] Press, electronic information products need to do proper thermal management to achieve temperature control to ensure that all components in the system can be maintained within the operating temperature range, so as to have the best operating conditions. When PC products continue to evolve toward a thin, short, and versatile trend, the internal processor's operating clock continues to increase, and the problem of high power consumption and high heat generation is not to be underestimated; therefore, at 1C In the process of miniaturization and high performance, the heat density of the wafer will also increase, and the traditional heat dissipation technology will face challenges. Sub-press, the current heat dissipation technology of electronic information products is divided into air-cooled, heat pipe, liquid-cooled, thermoelectric refrigeration and vapor compression; among them, the air-cooled heat-dissipation method is simple in structure, low in price and safe and reliable, but still There is a problem that the temperature cannot be lowered below room temperature and the fan rotates to generate noise; the heat pipe heat dissipation method is a heat dissipation technology widely used in notebook computers, and is a very effective heat dissipation method, and the heat pipe fin module has been widely used. It is applied to 3C electronic products such as notebook computers, PDAs, GPS, etc., but when the heating wattage is too high, there is still a risk of dry out, so there is a limit in its operation; the water cooling method can be sufficient Taking advantage of water cooling, it can take more heat; thermoelectric refrigeration is a cooling device composed of semiconductors, 201101011 can maintain a certain temperature under high heat load, but has the disadvantage of not high enough coefficient of performance (COP); vapor compression The advantage of the Vapor Compression Refrigeration System is that the heat dissipation capability is much higher than the other heat dissipation technologies mentioned above. The temperature of the heat source is maintained at a low temperature, and the C0P value is extremely high, about 2. 0 to 4. 7 or so. In addition, the new patent of the Republic of China M338390 discloses a "improvement of a computer cooling device" comprising: a heat absorbing unit having at least one water-cooling head, a pump connected to the water-cooling head, and connected to the pump One of the D heat drains, the water cooling head, the pump and the heat sink are circulated with a first working fluid; and a cooling unit having an evaporator attached to the heat sink and connecting the evaporator a compressor, a condenser connected to the compressor, and an expansion valve connected to the condenser, wherein the evaporator, the compressor, the condenser and the expansion valve are in communication with a second working fluid; The heat absorbing unit absorbs the relevant heat source inside the computer, and then cooperates with the cooling unit to perform heat exchange for heat exchange. Therefore, in order to achieve a better heat dissipation effect by rapidly dissipating the waste heat of the heat source, the steam replacement system and the heat dissipation fan are replaced by a vapor pressure contraction circulation system with a high COP value, and the waste heat is dissipated to the relay. Outside the computer. SUMMARY OF THE INVENTION The main object of the present invention is to provide a heat sink for a multi-working fluid and a heat dissipation module using the same, which has the effect of adjusting the heat dissipation performance as needed. Another object of the present invention is to have an energy saving effect. In order to achieve the above-mentioned effects, the structure of the heat sink of the multi-working fluid of the present invention is characterized in that the interior of a casing is separated from at least two chambers, and a fluid inlet and a fluid outlet are provided in each chamber, and each The chamber is connected by its fluid inlet and fluid outlet, each of which is connected to a cooling circulation system of different working fluids. Wherein, one of the chambers is surrounded by another chamber; the chamber is a channel of the crucible or is internally provided with a column for increasing the contact area of the working fluid; the outer surface of the housing is provided with a heat dissipating fin and a cooling fan . The structural features of the heat dissipating module of the heat sink of the present invention include: a heat sink 'separating a housing interior from at least two chambers, and each chamber is provided with a fluid inlet and a fluid outlet; a first working fluid circulation pipe is connected to the high and low pressure ends of a compressor to cause the first working fluid to flow out of the compressor, and sequentially flows through a condenser, an expansion valve and a first cavity of the radiator After the chamber, the compressor is recirculated to form a vapor compression cooling cycle; a second working fluid circulation tube, through which a pump draws the second working fluid from a fluid storage tank, and the second working fluid flows through the radiator After the second Q chamber and a cooler, the fluid reservoir is returned to form a liquid-cooled cooling cycle; and a controller controls the operating state of the compressor and the pump. In addition, one of the chambers is surrounded by another chamber, and the chamber is a channel of the crucible or is internally provided with a column for increasing the contact area of the working fluid. Further, the outer surface of the housing is provided with fins. With a cooling fan. Further, a reservoir and a flow meter are disposed between the condenser and the expansion valve. A liquid-gas separator is disposed between the first chamber and the compressor of the radiator. Further, a regulating valve and a flow rate are arranged between the second chamber of the radiator and the pump, and the second working fluid circulation pipe is further provided with a bypass valve connected in parallel with the pump. In addition, the condenser and the cooler share a cooling fan to forcibly dissipate heat, and the operating state of the cooling fan is controlled by the controller; however, the first working fluid is an environmentally friendly refrigerant, and the second working fluid is a nano coolant. . [Embodiment] First, referring to the first figure, the multi-working fluid radiator of the present invention separates a casing (10) from at least two chambers (11, 12) and is in each cavity. The chambers (11, 12) are provided with fluid inlets (ill, 121) and fluid outlets (112, 122), with each chamber (11, 12) having its fluid inlets (111, 121) and fluid outlets (112, 122) 'Connected to the cooling circuit system consisting of different working fluids. Then, please refer to the second embodiment of the present invention. The heat dissipation module of the present invention includes: a heat sink separating a casing (10) from at least two chambers (丨1, 12)' and each The chamber (11, 12) is provided with a fluid inlet (in, κι) and a fluid outlet (112, 122); a first working fluid circulation tube (20) is connected to the high and low pressure ends of a compressor (21), The first working fluid flows out of the compressor (21) and flows through a condenser (22), an expansion valve (23) and the first chamber (11) of the radiator, and then flows back. The compressor (21) constitutes a vapor compression cooling cycle; another 'the condenser (22) and the expansion valve (23) are provided with a reservoir (24) and a flow meter (25), the radiator A liquid gas separator (26) is disposed between a chamber (11) and the compressor (21); a second working fluid circulation pipe (30) is driven from a fluid storage tank (32) by a pump (31) Pumping the second working fluid' and flowing the second working fluid through the second chamber (12) of the radiator of the -6-201101011 and a cooler (33), and then flowing back to the fluid storage tank (32) constituting a liquid-cooled cooling cycle; further, a regulating valve (34) and a flow meter (35) are disposed between the second chamber (12) and the pump (31) of the radiator, the second work The fluid circulation pipe (3〇) further adds a bypass valve (36) connected in parallel with the pump (31); and a controller (40) 'controls the operating state of the compressor (21) and the pump (31) By. In addition, the chamber (11, 12) is a channel of the crucible or is internally provided with a column (113, 丨 23) for increasing the contact area of the working fluid; and one of the chambers (^) is another chamber. The outer surface of the casing (1) is provided with a heat dissipation fin and a heat dissipation fan (not shown); further, the condenser (22) shares a heat dissipation with the cooler (33). A fan (not shown) forcibly dissipates heat, and the operating state of the cooling fan is controlled by the controller (4〇); further, the first working fluid is an environmentally friendly refrigerant, and the second working fluid is a nano coolant, and Condensation can be prevented by encircling the environmentally friendly refrigerant below the room temperature with a nano-coolant that is close to the temperature. Based on the constitution, the present invention integrates two or more cooling circulation systems by a radiator, and the embodiment combines a liquid cooling cooling cycle and a vapor compression cooling cycle; wherein the liquid cooling cooling cycle cannot The disadvantage of heat exchange at a lower temperature than room temperature can be compensated by a vapor compression cooling cycle that performs heat exchange at a low temperature below room temperature; on the other hand, a liquid cooled cooling cycle improves vapor compression The cooling cycle, because the refrigerant mass flow rate is not enough, can not bring the heat away in an instant and in a large amount; so when the cooling module is under low load, it only needs to turn on the liquid-cooled cooling cycle to dissipate heat (the dust-reducing machine does not It needs to be operated to save energy. When the 201101011 cooling module is under high load, the liquid-cooled cooling cycle and the vapor-compressed cooling cycle run simultaneously to achieve high heat dissipation performance in a large amount of heat. Therefore, in addition to the central processing unit (CPU), the heat dissipation problem of the VGACVideo Graphics Array card is also receiving more and more attention. The present invention can be used to set the heat sink on the surface of the main waste heat source which will generate a large amount of waste heat. (such as the illustrated CPU, 50), the vapor compression cooling cycle formed by the first working fluid and the liquid cooling type formed by the second working fluid circulation pipe in the case of the load (heat dissipation requirement) of the main waste heat source Cooling cycle, running at the same time or only liquid-cooled cooling cycle, with the effect of cooling efficiency depending on demand and energy saving; in addition, if there is a second waste heat source (such as VGA, 60), The second working fluid circulation pipe (3〇) is further wound around the second waste heat source, or a second heat sink is disposed on the surface of the second waste heat source, and the same cooling cycle is performed for the main waste heat source to perform heat dissipation work, and then The second waste heat source performs heat dissipation work. In summary, the technical means disclosed in the present invention have the invention patents such as "novelty", "progressiveness" and "available for industrial use", and pray for the patent to be invented by the bureau. German sense. The drawings and descriptions disclosed above are only preferred embodiments of the present invention, and those skilled in the art, which are subject to the spirit of the present invention, should be included in the scope of the patent application. / 201101011 [Simple description of the drawings] The first figure is a sectional view of the structure of the heat sink of the present invention. The second figure is a schematic structural view of the heat dissipation module of the present invention. [Main component symbol description]
(10)殼體 (11、12)腔室 (111、121)流體入口 (112、122)流體出口 (113、123)柱體 (20) 第一工作流體循 環管 (21) 壓縮機 (22) 冷凝器 (23) 膨脹閥 (24) 儲液器 (25) 流量計 (26)液氣分離器 (30) 第二工作流體循 環管 (31) 幫浦 (32) 流體貯槽 (33) 冷卻器 (34) 調整閥 (35) 流量計 (36) 旁路閥 (40)控制器 (50)主廢熱源 (60)第二廢熱源(10) Housing (11, 12) Chamber (111, 121) Fluid inlet (112, 122) Fluid outlet (113, 123) Column (20) First working fluid circulation tube (21) Compressor (22) Condenser (23) Expansion valve (24) Reservoir (25) Flow meter (26) Liquid gas separator (30) Second working fluid circulation pipe (31) Pump (32) Fluid storage tank (33) Cooler ( 34) Adjustment valve (35) Flow meter (36) Bypass valve (40) Controller (50) Main waste heat source (60) Second waste heat source