TWI794916B - Liquid cooling module and electronic device including the same - Google Patents

Abstract

A liquid cooling module is presented to solve the problem that the prior liquid cooling module loses its heat dissipation function due to pump failure. This liquid cooling module includes: a plurality of heat absorbers, two pressurizers, two radiators, and two pipeline groups. Each of the plurality of heat absorbers has several liquid cooling chambers. The two pipeline groups form a first circulation flow channel and a second circulation flow channel respectively. The first circulation flow channel and the second circulation flow channel pass through different pressurizers and radiators, with the first circulation flow channel passes through at least one liquid cooling chamber of each of the plurality of heat absorbers, and the second circulation flow channel passes through at least one liquid cooling chamber of each of the plurality of heat absorbers. The liquid cooling chamber passed through by the first circulation flow channel is not communicated with the liquid cooling chamber passed through by the second circulation flow channel. The electronic device with the liquid cooling module is also disclosed.

Description

Liquid-cooled heat dissipation module and electronic device with the liquid-cooled heat dissipation module

The invention relates to a liquid-cooled heat dissipation module and an electronic device, in particular to a liquid-cooled heat dissipation module capable of driving working fluid to cool the heat source of the electronic device, and an electronic device with the liquid-cooled heat dissipation module.

Please refer to Figure 1, which is a known liquid-cooled heat dissipation module 9, which has a heat absorption unit 91, a heat dissipation unit 92, a pump 93 and a pipe fitting group 94. The heat absorbing unit 91 can be attached to the heat source Z of an electronic device, and the pipe assembly 94 is connected in series with the pump 93 , the heat dissipation unit 92 and the heat absorbing unit 91 to form a circulation channel.

According to the aforementioned structure, the pump 93 can drive a working fluid to flow in the tube set 94, and the working fluid that absorbs heat and heats up through the heat-absorbing unit 91 can cool down when passing through the heat-dissipating unit 92, and make the The working fluid is directed to the heat-absorbing unit 91 again; such continuous circulation keeps the heat source Z at an appropriate working temperature and avoids the problem of overheating of the electronic device.

However, when the pump 93 fails, the working fluid cannot continue to be driven by the pump 93 to circulate smoothly, so that the cooling operation of the entire conventional liquid-cooled heat dissipation module 9 is completely stopped, and it cannot continue to effectively help the electronic system. The heat source Z of the device dissipates heat, and the user will not find out until the electronic device is overheated and crashed or even damaged. Not only is the convenience of use not good, but it also causes high maintenance costs that are far greater than the price of a pump 93.

In view of this, there is still a need to improve the conventional liquid cooling heat dissipation module.

In order to solve the above problems, the object of the present invention is to provide a liquid-cooled heat dissipation module, which can pass through different liquid cooling chambers of the same heat absorber through two unconnected circulation channels, so that the two circulation channels can be mutually backup .

Another object of the present invention is to provide a liquid-cooled heat dissipation module, in which the two working fluids flowing in the two circulation channels can alternately flow through the same heat absorber.

Another object of the present invention is to provide a liquid-cooled heat dissipation module, which can maintain stable and uniform heat dissipation to the heat source.

Another object of the present invention is to provide an electronic device having the above-mentioned liquid-cooled heat dissipation module.

Directionality or similar terms used throughout the present invention, such as "front", "rear", "left", "right", "upper (top)", "lower (bottom)", "inner", "outer" , "side", etc., mainly refer to the directions of the attached drawings, and each direction or its approximate terms are only used to assist in explaining and understanding the various embodiments of the present invention, and are not intended to limit the present invention.

The elements and components described throughout the present invention use the quantifier "a" or "an" only for convenience and to provide the usual meaning of the scope of the present invention; in the present invention, it should be interpreted as including one or at least one, and singular The notion of also includes the plural unless it is obvious that it means otherwise.

Approximate terms such as "combination", "combination" or "assembly" mentioned throughout the present invention mainly include forms that can be separated without destroying the components after connection, or that the components cannot be separated after connection, etc., which are common knowledge in the art. One can be selected according to the material of the components to be connected or assembly requirements.

The liquid-cooled heat dissipation module of the present invention includes: several heat absorbers, each having several liquid-cooled chambers, and any one of the several liquid-cooled chambers does not surround the other of the several liquid-cooled chambers; Two pressurizers; two radiators; and two pipeline groups respectively forming a first circulation flow path and a second circulation flow path, the first circulation flow path and the second circulation flow path pass through different pressurizers and a radiator, the first circulating flow channel passes through at least one liquid cooling chamber of the plurality of heat absorbers, the second circulating flow channel passes through at least one liquid cooling chamber of the plurality of heat absorbers, and the first circulating flow The liquid cooling chamber through which the passage passes is not connected with the liquid cooling chamber through which the second circulation flow passage passes.

Another liquid-cooled heat dissipation module of the present invention includes: a heat absorber having several liquid-cooled chambers, and any one of the several liquid-cooled chambers does not surround the other of the several liquid-cooled chambers; Two pressurizers; two radiators; and two pipeline groups respectively forming a first circulation flow path and a second circulation flow path, the first circulation flow path and the second circulation flow path pass through different pressurizers and the radiator, the first circulation channel passes through at least one liquid cooling chamber of the heat absorber, the second circulation channel passes through at least one liquid cooling chamber of the heat absorber, and the first circulation channel passes through the liquid cooling chamber The liquid cooling chamber passing through the second circulation channel is not connected.

The electronic device of the present invention includes: a casing; an electrical module located in the casing and having at least one heat source; and the aforementioned liquid-cooled heat dissipation module, the heat sink thermally connected to the heat source.

Accordingly, in the liquid-cooled heat dissipation module and electronic device of the present invention, the first circulating channel and the second circulating channel can pass through different liquid cooling chambers of the same heat absorber to make the first circulating channel The flow channel and the second circulation flow channel can complement each other. In this way, even if one of the pressurizers fails during operation, the working fluid driven by the other pressurizer can continue to assist the heat source to cool down, ensuring that the electronic device will not be thermally shut down or even damaged. It has the effects of greatly reducing maintenance costs and improving convenience. In addition, the communication between the first circulation channel and the second circulation channel which are not connected can also prevent the working fluid driven by the other pressurizer from splashing during the maintenance process of one of the pressurizers.

Wherein, the two adjacent liquid cooling chambers of the heat absorber are preferably not communicated with each other. In this way, the two working fluids in the first circulation channel and the second circulation channel can flow through the heat absorber alternately, which has the effect of improving the uniform heat dissipation of the auxiliary heat source.

Wherein, the heat absorber may have at least one shell combined with a heat absorbing plate, and a single aforementioned liquid-cooled chamber may be formed in the shell, or several aforementioned liquid-cooled chambers may be separated by at least one partition wall in the shell. . In this way, the structure of the heat sink is simple, which has the effect of improving the convenience of manufacture and assembly.

Wherein, each of the liquid cooling chambers has two flow parts, and the two flow parts may be located on the same side or opposite sides of the casing. In this way, it can meet the pipeline configuration requirements, and has the effect of improving the convenience of connection.

Wherein, a working fluid flows through the first circulation channel and the second circulation channel respectively, and the two pressurizers operate at the same time and can drive the two working fluids to circulate at a predetermined flow rate respectively, or stop at one of the pressurizers During operation, another pressurizer can drive the working fluid to accelerate the circulating flow. In this way, the first circulation channel and the second circulation channel can back up each other, and have the effect of maintaining a predetermined heat dissipation effect on the plurality of heat sources.

Wherein, a working fluid flows through the first circulation channel and the second circulation channel respectively, and the two pressurizers can operate alternately to drive the circulation of the working fluid in the first circulation channel or the second circulation channel in turn. flow. In this way, the first circulation flow channel and the second circulation flow channel can back up each other, and avoid the situation that the parts of the plurality of heat sources are kept at relatively high temperature, which has the effects of saving energy and improving the uniformity of heat dissipation.

Wherein, the pressurizer can have a housing installed and fixed in the casing, the housing has an opening, a cover plate can be detachably combined with the housing to close the opening, the housing can have an inflow portion, An outflow part and a liquid tank, a driving part can be located in the housing seat, and is used to drive a working fluid to flow from the inflow part to the liquid tank, and from the liquid tank to the outflow part to flow out of the housing seat. so much more It is not necessary to disassemble the pipeline group when replacing the drive unit, which can prevent the working fluid in the pipeline group from flowing out and causing damage to the electrical module or wetting the inside of the casing, and even if there is working fluid in the replacement process When it flows out of the liquid tank, the flowing working fluid can also drop into the housing chamber of the housing; in addition, the driving part can be replaced only by opening the cover plate, the operation steps are very simple, and there is almost no need to wipe the leakage liquid Waiting for the aftermath work to improve the convenience and efficiency of replacing the driving unit.

Wherein, the pressurizer can have a sensor electrically connected to a power supply part, and the power supply part is electrically connected to the drive part, and the sensor can be used to sense whether the cover plate closes the opening, if the sensing result is If not, disconnect the power supply from the power supply unit to the drive unit. In this way, the drive unit can automatically stop driving the flow of working fluid when the cover is opened, which has the effects of reducing the loss caused by splashing of the working fluid and improving the convenience of operation; in addition, it can also avoid the influence of current or voltage surges, In the case of continuous operation of the electronic device, the "hot swap" function is supported to enhance the convenience of use.

Wherein, the plurality of heat absorbers can be arranged in an array, and a working fluid flows through the first circulation channel and the second circulation channel respectively, and the two working fluids can respectively pass through several heat absorbers arranged horizontally, or can be First pass through several heat sinks arranged vertically. In this way, it can be changed according to the heat dissipation requirements of several heat sources or the pipeline configuration requirements, which has the effects of improving heat dissipation efficiency and connection convenience.

〔this invention〕

1: heat sink

1a: heat absorbing plate

1b: Housing

11: Heat-absorbing surface

12: Liquid cooling chamber

13: Circulation Department

14: Fin group

15: partition wall

2: Pressurizer

2a: The first pressurizer

2b: Second pressurizer

21: shell seat

211: opening

212: Inflow part

213: outflow part

214: liquid tank

22: Drive Department

221: Body

222: impeller

23: cover plate

24: Sensor

25: Power supply department

3: Radiator

3a: First radiator

3b: Second radiator

31: Coil

32: Heat sink group

33: fan

4: Pipeline group

4a: The first pipeline group

4b: The second pipeline group

5: Chassis

6:Electrical module

C1: the first circulation channel

C2: Second circulation channel

H: heat source

M: liquid cooling cooling module

N: electronic device

〔usual〕

9: Liquid cooling cooling module

91: endothermic unit

92: cooling unit

93: pump

94:Pipe fitting group

Z: heat source

[Picture 1] A diagram of a conventional liquid-cooled heat dissipation module.

[Fig. 2] It is a schematic diagram of the pipeline assembly of the first embodiment of the liquid-cooled heat dissipation module of the present invention.

[Fig. 3] It is a perspective view of the heat absorber of the first embodiment of the liquid-cooled heat dissipation module of the present invention.

[Fig. 4] An exploded perspective view of the pressurizer of the first embodiment of the liquid-cooled heat dissipation module of the present invention.

[FIG. 5] A schematic diagram of the first embodiment of the electronic device of the present invention.

[FIG. 6] A schematic diagram of the second embodiment of the electronic device of the present invention.

[FIG. 7] A schematic diagram of a third embodiment of the electronic device of the present invention.

[FIG. 8] A schematic diagram of the fourth embodiment of the electronic device of the present invention.

[FIG. 9] A schematic diagram of a fifth embodiment of the electronic device of the present invention.

[Fig. 10] It is a perspective view of the heat absorber of the sixth embodiment of the electronic device of the present invention.

[FIG. 11] A schematic diagram of the sixth embodiment of the electronic device of the present invention.

[FIG. 12] A schematic diagram of the seventh embodiment of the electronic device of the present invention.

In order to make the above-mentioned and other purposes, features and advantages of the present invention more obvious and easy to understand, the preferred embodiments of the present invention are specially cited below, together with the attached drawings, and are described in detail as follows: Please refer to the 2nd figure, It is the first embodiment of the liquid-cooled heat dissipation module M of the present invention, which includes several heat absorbers 1, two pressurizers 2, two radiators 3 and two pipeline groups 4, and the two pipeline groups 4 are connected in series The plurality of heat absorbers 1 , the two pressurizers 2 and the two radiators 3 .

Please refer to Figures 2 and 3, the heat absorber 1 has a heat-absorbing surface 11 and several liquid-cooled chambers 12, and any one of the several liquid-cooled chambers 12 does not surround any of the several liquid-cooled chambers 12. On the other hand, the heat sink 1 can be thermally connected to a heat source through the heat absorbing surface 11 , and the working fluid flowing through the liquid cooling chamber 12 absorbs and takes away the heat energy of the heat source. In this embodiment, the heat absorber 1 can have a heat absorbing plate 1a, and the heat absorbing plate 1a can be made of, for example, copper, aluminum, titanium, stainless steel or other heat conducting materials; a surface of the heat absorbing plate 1a forms the heat absorbing surface 11, and can quickly transfer the thermal energy of the heat source to the other surface of the heat absorbing plate 1a. The heat absorber 1 of this embodiment can also have at least one shell 1b, and the at least one shell 1b can be combined with the other surface of the heat absorbing plate 1a to form the plurality of liquid cooling plates inside the at least one shell 1b. Room 12. For example, a single liquid-cooled chamber 12 can be formed from the inside of a single casing 1b, so the heat-absorbing plate 1a of this embodiment can be combined with several casings 1b to form the several liquid-cooled chambers 12; or, It is also possible to combine a single housing 1b on the heat absorbing plate 1a, and to connect the housing 1b Several liquid-cooled chambers 12 are separated in the inside, which is not limited by the present invention.

Each of the several liquid cooling chambers 12 communicates with two flow parts 13, so that the working fluid can flow into the liquid cooling chamber 12 from one of the flow parts 13 and flow out from the other flow part 13; According to the configuration requirements of the circuit, it is selected to be located on the same side or different sides of the casing 1b, and in this embodiment, each of the two flow parts 13 can be selected to be in the form of a joint for connection. In addition, the heat absorber 1 can also have several fin groups 14, which can be connected to the heat absorbing plate 1a, and are respectively located in the several liquid cooling chambers 12, in principle, each of the liquid cooling chambers can be cooled. There may be at least one fin set 14 in the chamber 12, so that the working fluid flowing through the liquid cooling chamber 12 can contact the fin set 14 to quickly exchange heat with the heat absorbing plate 1a, thereby further improving the heat absorbing Heat absorption and heat dissipation efficiency of plate 1a.

As shown in Figure 4, the pressurizer 2 can have a housing 21, and the housing 21 can have an opening 211 communicating with the inside, an inflow portion 212 and an outflow portion 213, and the housing base 21 can also be A liquid groove 214 is formed, and the liquid groove 214 communicates with the inflow portion 212 and the outflow portion 213 .

The pressurizer 2 can have a driving part 22 located in the housing 21, the driving part 22 can be used to drive a working fluid from the inflow part 212 to the liquid tank 214, and from the liquid tank 214 to the outflow part 213 to flow out of the shell seat 21. Wherein, the inflow portion 212 and the outflow portion 213 can be selected to be located on the same side or different sides of the housing base 21 according to the pipeline configuration requirements, and in this embodiment, the inflow portion 212 and the outflow portion 213 can also be selected separately It is in the form of a joint for taking over, but is not limited to this form. On the other hand, the driving part 22 of this embodiment may have a body 221 and an impeller 222 , and the impeller 222 is connected to the body 221 and substantially opposite to the liquid tank 214 . When the stator group in the body 221 is powered, the impeller 222 can be driven to rotate in the liquid tank 214 to drive the liquid in the liquid tank 214 to flow, so that the working fluid from the inflow part 212 can pass through the drive part 22 to flow to the outflow portion 213 and flow out of the housing 21 .

The pressurizer 2 can have a cover plate 23, the cover plate 23 is detachably combined with the housing 21 to close the opening 211; the present invention does not limit the manner in which the cover plate 23 is combined with the housing base 21, nor does it limit the type of the cover plate 23. The pressurizer 2 can also have a sensor 24 electrically connected to a power supply part 25, and the power supply part 25 is electrically connected to the drive part 22 to supply power to the body 221 of the drive part 22 to drive the impeller 222 to rotate. . The sensor 24 can be, for example, a micro switch (Limit Switch), and the sensor 24 can be installed on the housing 21, the driving part 22 or the cover plate 23, and is used to sense whether the cover plate 23 closes the opening. 211 ; if the sensing result is negative, disconnect the power supply from the power supply unit 25 to the drive unit 22 , and then stop the impeller 222 from rotating and driving the working fluid.

Please refer to FIG. 2 again, the radiator 3 can have a coil 31 thermally connected to a cooling fin set 32 , and preferably also has a fan 33 to guide the air flow through the cooling fin set 32 . In this way, when the working fluid flows through the inside of the coil 31 , it can exchange heat with the coil 31 , and the heat absorbed by the coil 31 can be transferred to the cooling fin group 32 and guided by the fan 33 The passing airflow helps the heat sink set 32 to dissipate heat energy.

The pipeline group 4 is used to connect the heat absorber 1 , the pressurizer 2 and the radiator 3 in series to form a circulation channel for the working fluid to circulate continuously. In this embodiment, the two pipeline groups 4 respectively form a first circulation channel C1 and a second circulation channel C2, and the first circulation channel C1 and the second circulation channel C2 are pressurized through different 2 and radiator 3; more importantly, the first circulation channel C1 passes through at least one liquid cooling chamber 12 of the plurality of heat absorbers 1, and the second circulation channel C2 also passes through the plurality of heat absorbers 1 Each of the at least one liquid cooling chamber 12, and the liquid cooling chamber 12 through which the first circulation flow channel C1 passes is not connected with the liquid cooling chamber 12 through which the second circulation flow channel C2 passes. In other words, each circulation channel of this embodiment will pass through several heat absorbers 1 in the path for the working fluid to circulate once, instead of only passing through a single heat absorber 1, so that a single circulation channel can treat different The heat absorber 1 dissipates heat.

More specifically, in this embodiment, the number of the heat absorbers 1 can be set to two, and each of the two heat absorbers 1 can have two liquid cooling chambers 12; 2a and the second pressurizer 2b, said the two radiators 3 as the first radiator 3a and the second radiator 3b, called the The two pipeline groups 4 are the first pipeline group 4 a and the second pipeline group 4 b for illustration. The first pipeline group 4a can connect the outflow portion 213 of the first pressurizer 2a with one of the liquid cooling chambers 12 of one of the heat absorbers 1 (for example, the upper liquid cooling chamber 12 of the left heat absorber 1 in Figure 2) , and then connect one of the liquid cooling chambers 12 of one of the heat absorbers 1 to one of the liquid cooling chambers 12 of the other heat absorber 1 (for example, the lower liquid cooling chamber 12 of the right heat absorber 1 in Figure 2), and then from One of the liquid cooling chambers 12 of the other heat absorber 1 is connected to the first radiator 3a, and the first radiator 3a is connected to the inflow portion 212 of the first pressurizer 2a to form the first cycle Runner C1. Similarly, the second pipeline group 4b can be connected in series with the second pressurizer 2b and another liquid cooling chamber 12 of one of the heat absorbers 1 (for example, the upper liquid cooling chamber of the right heat absorber 1 in Figure 2 12), another liquid cooling chamber 12 of the other heat absorber 1 (such as the lower liquid cooling chamber 12 of the left heat absorber 1 in Figure 2) and the second radiator 3b, and then connect back to the second pressurizer 2b to form the second circulation channel C2.

In this way, the working fluid in the first circulation channel C1 can be driven by the first pressurizer 2a, and flow through the two heat absorbers 1 to absorb heat energy, and when flowing through the first radiator 3a Release heat and cool down, and then flow back to the first pressurizer 2a to prepare for the next cycle. The working fluid in the second circulation flow channel C2 can also flow through the two heat absorbers 1 successively, so the liquid-cooled heat dissipation module M of this embodiment, even if a failure of one of the pressurizers 2 occurs, can also The working fluid driven by the other pressurizer 2 continues to provide the effect of assisting the cooling of the two heat absorbers 1 . In addition, the disconnected first circulation channel C1 and the second circulation channel C2 can also prevent the working fluid spray driven by the other pressurizer 2 during the maintenance process of one of the pressurizers 2. splash. In addition, in this embodiment, the first pipeline group 4a can also be selected to connect the upper liquid cooling chamber 12 of the second heat absorber 1 in the second figure in series, and the second pipeline group 4b can be used to connect the two heat absorbers in series in the second figure. The lower liquid cooling chamber 12 of the device 1 is not limited by the present invention, and does not necessarily have to be connected in staggered series as shown in FIG. 2 .

Please refer to FIG. 5 , this embodiment can also provide an electronic device N, the electronic device N includes a casing 5 , an electrical module 6 and the aforementioned liquid-cooled heat dissipation module M. Should The electrical module 6 is located in the casing 5 and has two heat sources H. One of the heat sinks 1 of the liquid-cooled heat dissipation module M is thermally connected to one of the heat sources H by its heat absorbing plate 1a, and the other heat sink 1 is connected by its heat sink 1a. The heat absorbing plate 1a is thermally connected to another heat source H. Wherein the heat absorbing plate 1 a is in direct contact with the heat source H, for example, or indirect contact with a heat conducting material such as a thermal pad.

Accordingly, during the operation of the electrical module 6, when the temperature of the two heat sources H rises, the heat energy of the two heat sources H can be respectively absorbed by the two heat sinks 1, so that the heat can circulate in the first circulation channel C1 The working fluid can absorb heat and heat up when flowing through the two heat absorbers 1, then quickly dissipate heat and cool down when flowing through the first radiator 3a, and then flow back to the first pressurizer 2a; in the second circulation channel The working fluid circulating in C2 also absorbs heat and heats up when flowing through the second heat absorber 1 , then quickly dissipates heat and cools down when flowing through the second heat sink 3 b, and then flows back to the second pressurizer 2 b. Therefore, the electronic device N can use the two working fluids continuously circulating in the first circulation channel C1 and the second circulation channel C2 to jointly take away the heat energy of the two heat sources H to help the electrical module 6 Heat dissipation to maintain proper operating temperature.

It can be seen that, even if one of the pressurizers 2 fails during the operation of the electronic device N with the liquid-cooled heat dissipation module M, it can be continuously assisted by the working fluid driven by the other pressurizer 2. The temperature of the two heat sources H is lowered. With this backup effect, it can be ensured that none of the heat sources H will be overheated due to the failure of the pressurizer 2 , so as to prevent the electronic device N from thermally crashing or even being damaged.

Furthermore, when the two pressurizers 2 operate simultaneously, the two working fluids circulating in the first circulation channel C1 and the second circulation channel C2 can be driven to circulate at the same or different predetermined flow rates respectively. When one of the pressurizers 2 stops running, the other pressurizer 2 can drive the working fluid to accelerate the circulation flow, so that the liquid-cooled heat dissipation module M can maintain a predetermined heat dissipation effect on the two heat sources H; The heat dissipation effect of the two heat sources H is not likely to decrease due to the stoppage of one of the pressurizers 2 .

On the other hand, when the temperature of the two heat sources H is relatively low (such as when the electronic device N is in a standby state), one of the pressurizers 2 can be controlled to stop running, and only the first circulation channel C1 or the second The working fluid in the circulation flow channel C2 assists the second heat source H to dissipate heat, so as to achieve the effect of energy saving. Preferably, it is also possible to choose to control the two pressurizers 2 to operate alternately, for example, one of the pressurizers 2 is suspended after running for a predetermined time, and the other pressurizer 2 is operated for a predetermined time, so that the two pressurizers are driven alternately. The circulating flow of the working fluid in the first circulation channel C1 or the second circulation channel C2 is used to prevent the two heat sources H from being kept at a relatively high temperature locally, thereby achieving both energy saving and uniform heat dissipation.

It is worth mentioning that, please refer to Figures 4 and 5, the casing 21 of the pressurizer 2 can be installed and fixed in the casing 5, when the driving part 22 of the pressurizer 2 fails and needs to be replaced, Just open the cover plate 23 to disassemble and take out the faulty drive unit 22, and then insert and assemble a new drive unit 22. The pipeline group 4 does not need to be dismantled during the process, and the operation is very convenient. In addition, if the pressurizer 2 has the sensor 24, the driving part 22 will automatically stop driving the working fluid to flow when the cover plate 23 is opened, which helps to improve the convenience of operation. Moreover, as long as the driving part 22 stops operating, the working fluid will not splash and cause loss during the process of opening the cover plate 23 and replacing the old and new driving parts 22, which can greatly reduce the amount of working fluid inside the casing 5. The chance of getting wet will naturally cause the electrical module 6 to be short-circuited. Therefore, when the electronic device N adopting the liquid-cooled heat dissipation module M needs to replace the driving part 22, it is not necessary to adopt the mode of overall shutdown to avoid short circuiting of the electrical module 6; that is, the The Booster 2 series can support "hot swapping" to significantly improve the convenience of use. On the other hand, when the failure of the drive unit 22 is due to factors other than inability to operate, such as too much noise, if the operation of the drive unit 22 cannot be stopped first before replacement, in addition to the problem of working fluid splashing When unplugging the electrical connection relationship between the driving part 22 and the power supply part 25 rashly, it is also easy to generate a current or voltage surge and cause damage to the electrical module 6, so stopping the power supply to the driving part 22 is also for the pressurization The device 2 has the requirements of the "hot swap" function.

Please refer to Figure 6, which is the second embodiment of the liquid-cooled heat dissipation module M of the present invention. In this embodiment, the number of the heat sinks 1 can be four, and the four heat sinks 1 can be in the form of Two in the horizontal direction and two in the vertical direction are arranged in an array, and each of the four heat absorbers 1 may have two liquid cooling chambers 12 .

In the electronic device N having the liquid-cooled heat dissipation module M of this embodiment, the first pipeline group 4a can be selected to be connected in series with the upper liquid cooling chamber 12 of the upper left heat absorber 1 in Figure 6 and the upper right heat absorber. The lower liquid cooling chamber 12 of 1, the upper liquid cooling chamber 12 of the lower left heat absorber 1, and the lower liquid cooling chamber 12 of the lower right heat absorber 1; in addition, the second pipeline group 4b is sequentially connected to the upper right heat absorber in Figure 6 The upper liquid cooling chamber 12 of the device 1, the lower liquid cooling chamber 12 of the left upper heat absorber 1, the upper liquid cooling chamber 12 of the right lower heat absorber 1 and the lower liquid cooling chamber 12 of the left lower heat absorber 1. The working fluid first passes through the two heat absorbers 1 arranged horizontally in the upper row, and then passes through the two heat absorbers 1 arranged horizontally in the lower row.

Please refer to Figure 7, which is the third embodiment of the liquid-cooled heat dissipation module M of the present invention. This embodiment is similar to the aforementioned second embodiment. The main difference is that this embodiment chooses to make the third embodiment The working fluid in the first circulating flow channel C1 first passes through the second heat absorber 1 on the left, and then passes through the second heat absorber 1 on the right; and the working fluid in the second circulating flow channel C2 first passes through the second heat absorber 1 arranged longitudinally on the right , and then pass through the two heat absorbers 1 arranged vertically on the left side. Moreover, in other embodiments, a "diagonal" configuration can also be formed, for example, the working fluid in the first circulation channel C1 passes through the upper left, lower right, upper right, and lower left heat sinks 1 sequentially; and The working fluid in the second circulation channel C2 passes through the upper right, lower left, upper left and lower right heat absorbers 1 in sequence.

Please refer to Figures 6 and 7, the foregoing second and third embodiments are intended to reveal that when the number of heat sources H of the electrical module 6 of the electronic device N is multiple, the number of the heat sinks 1 can correspond to Depending on the number of heat sources H, each heat source H can be thermally connected to one heat sink 1 . And, whether it is the first circulation flow channel C1 or the second circulation flow channel C2, each circulation flow channel will pass through all the heat absorbers 1 in the path for the working fluid to circulate once, instead of only passing through a single a suck The heat sink 1 is used to dissipate heat from different heat absorbers 1 through a single circulation channel. In contrast, the manner in which the first pipeline set 4a and the second pipeline set 4b are connected in series is not intended to be limited by the present invention. In addition, the number of the heat source H and the heat sink 1 can also be an odd number, and they are connected in series according to the aforementioned principle, which is understood by those skilled in the art and will not be described in detail here.

Also, please refer to Figures 5-7, in the aforementioned first to third embodiments, the heat absorber 1 and the pressurizer 2 of the liquid-cooled heat dissipation module M can be installed on the electronic device N In the casing 5, and choose to make the radiator 3 be arranged outside the casing 5. Compared with this, please refer to Fig. 8, which is the fourth embodiment of the liquid-cooled heat dissipation module M of the present invention. Both the compressor 2 and the heat sink 3 can be disposed in the case 5 of the electronic device N. In addition, the pressurizer 2 of this embodiment can be directly connected to the radiator 3 instead of connecting through the pipeline set 4 .

Please refer to Figure 9, which is the fifth embodiment of the liquid-cooled heat dissipation module M of the present invention. The heat sink 1 remains in the case 5 of the electronic device N, and the pressurizer 2 and the heat sink 3 are selected to be placed outside the case 5 . Accordingly, the heat sink 1 can be located in an open space to help improve the heat dissipation efficiency of the heat sink 1 .

Please refer to Figures 10 and 11, which are the sixth embodiment of the liquid-cooled heat dissipation module M and electronic device N of the present invention. In this embodiment, the number of heat sinks 1 can be single; that is, In this embodiment, two pressurizers 2 , two radiators 3 and two pipeline groups 4 jointly dissipate heat from a single heat absorber 1 .

Specifically, the heat absorber 1 of this embodiment can be combined with several shells 1b on a heat absorbing plate 1a, and at least two liquid cooling chambers 12 are separated by at least one partition wall 15 in each of the shells 1b. Taking the formation of four liquid cooling chambers 12 as an example, the number of housings 1b on the heat absorbing plate 1a can be two, and a partition wall 15 can be used to separate two adjacent and disconnected liquid cooling chambers in each of the housings 1b. cold room12. in other realities In the embodiment, a single casing 1b can also be selected to be combined on the heat absorbing plate 1a, and four liquid cooling chambers 12 etc. are separated in the casing 1b by three parallel partition walls 15, and the present invention does not be restricted.

During assembly, the first pipeline group 4a can be connected in series with the first pressurizer 2a, the second liquid cooling chamber 12 of the heat absorber 1 and the first radiator 3a, and then connected back to the first pressurizer 2a , to form the first circulation channel C1. Similarly, the second pipeline group 4b can be connected in series with the second pressurizer 2b, the other two liquid cooling chambers 12 of the heat absorber 1 and the second radiator 3b, and then connected back to the second pressurizer 2b to form the second circulation channel C2. In this way, the working fluid in the first circulation channel C1 can be driven by the first pressurizer 2a, and flow through the two liquid cooling chambers 12 of the heat absorber 1 to absorb heat energy, and then flow through the The first radiator 3a releases heat and cools down, and then flows back to the first pressurizer 2a for the next cycle. The working fluid in the second circulation channel C2 can also flow through the other two liquid cooling chambers 12 of the heat absorber 1 successively, so the liquid-cooled heat dissipation module M of this embodiment, even if one of the pressurizers 2 In case of failure, the working fluid driven by another pressurizer 2 can also continuously provide the effect of assisting the cooling of the heat absorber 1 .

Wherein, after the heat absorber 1 is connected with the two pipeline groups 4 , it is preferable to make the two adjacent liquid cooling chambers 12 of the heat absorber 1 not communicate with each other. That is, the several liquid-cooled chambers 12 are communicated at intervals, for example, the first and third liquid-cooled chambers 12 are connected by the first pipeline group 4a, and the second and third liquid-cooled chambers 12 are connected by the second pipeline group 4b. The fourth liquid cooling chamber 12, but the first and second liquid cooling chamber 12 are not connected, the second and third liquid cooling chamber 12 are not connected, and the third and fourth liquid cooling chamber 12 are not connected. In this way, the two working fluids in the first circulation channel C1 and the second circulation channel C2 can flow through the heat absorber 1 alternately; when one of the pressurizers 2 fails, the other pressurizer The working fluid driven by 2 can still flow through the heat absorber 1 relatively evenly, instead of passing through the upper half or the lower half of the heat absorber 1 concentratedly, so that the heat source H can be evenly dissipated.

Please refer to Figure 12, which is the seventh embodiment of the liquid-cooled heat dissipation module M and electronic device N of the present invention. In this embodiment, the number of heat sinks 1 can be several, so as to be suitable for There is an electronic device N with several heat sources H, and the structure of each heat absorber 1 can be the same as that of the aforementioned fifth embodiment; The circuit group 4 jointly dissipates heat to several heat sinks 1 .

Taking two heat absorbers 1 as an example, the first pipeline group 4a can first communicate with the first and third liquid cooling chambers 12 of one heat absorber 1, and then communicate with the first and third liquid cooling chambers 12 of the other heat absorber 1. a liquid cooling chamber 12; the second pipeline group 4b can communicate with the second and fourth liquid cooling chambers 12 of the other heat absorber 1 first, and then communicate with the second and fourth liquid cooling chambers 12 of one of the heat absorbers 1 Liquid cooling chamber12. But the present invention is not limited to this connection method, as long as the two working fluids in the first circulation channel C1 and the second circulation channel C2 can be circulated through all the heat absorbers 1 instead of only through a single one. One heat sink 1 is enough.

To sum up, in the liquid-cooled heat dissipation module and electronic device of the present invention, the first circulation channel and the second circulation channel that are not connected can pass through different liquid cooling chambers of the same heat absorber, so that the second circulation channel A circulation channel and the second circulation channel can back up each other. In this way, even if one of the pressurizers fails during operation, the working fluid driven by the other pressurizer can continue to assist the heat source to cool down, ensuring that the electronic device will not be thermally shut down or even damaged , which has the effects of greatly reducing maintenance costs and improving the convenience of use. In addition, the communication between the first circulation channel and the second circulation channel which are not connected can also prevent the working fluid driven by the other pressurizer from splashing during the maintenance process of one of the pressurizers.

Although the present invention has been disclosed by using the above-mentioned preferred embodiments, it is not intended to limit the present invention. It is still within the scope of this invention for anyone skilled in the art to make various changes and modifications relative to the above-mentioned embodiments without departing from the spirit and scope of the present invention. The technical scope protected by the invention, therefore, the scope of protection of the present invention should be defined by the scope of the appended patent application.

1: heat sink

1a: heat absorbing plate

1b: Housing

12: Liquid cooling chamber

13: Circulation Department

14: Fin group

2: Pressurizer

2a: The first pressurizer

2b: Second pressurizer

212: Inflow part

213: outflow part

3: Radiator

3a: First radiator

3b: Second radiator

31: Coil

32: Heat sink group

33: fan

4: Pipeline group

4a: The first pipeline group

4b: The second pipeline group

5: Chassis

6:Electrical module

C1: the first circulation channel

C2: Second circulation channel

H: heat source

M: liquid cooling cooling module

N: electronic device

Claims (11)

A liquid-cooled heat dissipation module, comprising: several heat absorbers, each having several liquid-cooled chambers; in each of the several heat-absorbers, any one of the several liquid-cooled chambers does not surround the several liquid-cooled The other in the chamber; two pressurizers; two radiators; The channels pass through different pressurizers and radiators, the first circulation channel passes through at least one liquid cooling chamber of the several heat absorbers, and the second circulation channel passes through at least one liquid cooling chamber of the several heat absorbers , and the liquid cooling chamber through which the first circulation channel passes is not in communication with the liquid cooling chamber through which the second circulation channel passes. A liquid-cooled heat dissipation module, comprising: a heat absorber with several liquid-cooled chambers, any one of the several liquid-cooled chambers does not surround the other of the several liquid-cooled chambers; two pressurizers ; two radiators; and two pipeline groups, respectively forming a first circulation flow path and a second circulation flow path, the first circulation flow path and the second circulation flow path pass through different pressurizers and radiators, The first circulation channel passes through at least one liquid cooling chamber of the heat absorber, the second circulation channel passes through at least one liquid cooling chamber of the heat absorber, and the liquid cooling chamber through which the first circulation channel passes is connected to the second The liquid cooling chamber through which the circulation channel passes is not connected. The liquid-cooled heat dissipation module according to claim 1 or 2, wherein the two adjacent liquid-cooled chambers of the heat sink are not connected to each other. The liquid-cooled heat dissipation module according to claim 1 or 2, wherein the heat absorber has at least one shell combined with a heat-absorbing plate, and a single aforementioned liquid cooling chamber is formed in the shell, or in the shell Several aforementioned liquid cooling chambers are separated by at least one partition wall. The liquid cooling heat dissipation module according to claim 4, wherein each of the liquid cooling chambers has two flow parts, and the two flow parts are located on the same side or opposite sides of the casing. An electronic device, comprising: a casing; an electrical module located in the casing and having at least one heat source; and a liquid-cooled heat dissipation module according to any one of claims 1 to 5, the heat sink heats Connect the heat source. The electronic device according to claim 6, wherein a working fluid flows through the first circulation channel and the second circulation channel respectively, and the two pressurizers operate simultaneously to drive the two working fluids to circulate at predetermined flow rates respectively, or When one of the pressurizers stops running, the other pressurizer drives the working fluid to speed up the circulating flow. The electronic device according to claim 6, wherein a working fluid flows through the first circulation channel and the second circulation channel respectively, and the two pressurizers operate alternately to drive the first circulation channel or the second circulation channel in turn. The working fluid in the circulation channel circulates. The electronic device according to claim 6, wherein, the pressurizer has a shell seat installed and fixed in the casing, the shell seat has an opening, a cover plate is detachably combined with the shell seat to close the opening, the shell seat It has an inflow part, an outflow part and a liquid tank, and a driving part is located in the shell seat, used to drive a working fluid to flow from the inflow part to the liquid tank, and flow from the liquid tank to the outflow part to flow out of the shell seat. The electronic device according to claim 9, wherein the pressurizer has a sensor electrically connected to a power supply part, the power supply part is electrically connected to the driving part, and the sensor is used to sense whether the cover plate closes the opening, If the sensing result is negative, disconnect the power supply from the power supply unit to the drive unit. The electronic device according to claim 6, wherein the plurality of heat absorbers are arranged in an array, a working fluid flows through the first circulation flow channel and the second circulation flow channel respectively, and the two working fluids respectively pass through the number of horizontally arranged heat sink, or through several heat sinks arranged vertically first.

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