CN105466261A - Heat exchange device and semiconductor refrigeration refrigerator provided with heat exchange device - Google Patents
Heat exchange device and semiconductor refrigeration refrigerator provided with heat exchange device Download PDFInfo
- Publication number
- CN105466261A CN105466261A CN201510990200.0A CN201510990200A CN105466261A CN 105466261 A CN105466261 A CN 105466261A CN 201510990200 A CN201510990200 A CN 201510990200A CN 105466261 A CN105466261 A CN 105466261A
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- China
- Prior art keywords
- heat
- fins set
- exchanging part
- axial flow
- exchanger rig
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
Abstract
The invention relates to a heat exchange device and a semiconductor refrigeration refrigerator provided with the heat exchange device. Specifically, the invention provides the heat exchange device which comprises a first heat exchange part. The first heat exchange part is provided with two fin sets and an axial flow fan, wherein each fin set is provided with a plurality of parallel fins arranged at intervals, and the two fin sets are arranged in a spaced mode in the length direction of the fins; the rotation axis of the axial flow fan is located between the two fin sets; in addition, the axial flow fan is arranged on the two fin sets in an overlapping mode, so that the axial flow fan blows airflow to the gap between every two adjacent fins in each fin set or sucks airflow from the gap between every two adjacent fins in each fin set. In addition, the invention provides the semiconductor refrigeration refrigerator provided with the heat exchange device. According to the heat exchange device and the semiconductor refrigeration refrigerator, since one axial flow fan is arranged on the two fin sets in the overlapping mode at the same time, the size of the heat exchange device can be reduced, and the heat exchange device is especially suitable for cooling the semiconductor refrigeration refrigerator.
Description
Technical field
The present invention relates to refrigerating equipment, particularly relate to a kind of heat-exchanger rig and there is the semiconductor freezer of this heat-exchanger rig.
Background technology
Semiconductor freezer, is also referred to as thermoelectric refrigerator.It utilizes semiconductor chilling plate to realize refrigeration by heat pipe heat radiation and conduction technique and automatic pressure-transforming Variable flow control technology, without the need to refrigeration working medium and mechanical moving element, solves the application problem of traditional mechanical refrigerator such as medium pollution and mechanical oscillation.But, the cold junction of semiconductor chilling plate is while refrigeration, a large amount of heats can be produced in its hot junction, for ensureing that semiconductor chilling plate reliably carries out work constantly, need to dispel the heat to hot junction in time, but the scheme of by arranging axial flow blower fin being carried out to forced convertion heat radiation in prior art, is generally used for the hot-side heat dissipation of semiconductor chilling plate, to improve heat exchange efficiency, but the volume of radiating fin own is larger; In addition, axial flow blower is set in the side of radiating fin group, with to the gap blow flow between every two adjacent fins, or sucks air-flow from the gap between every two adjacent fins.The volume ratio of this heat exchanger is comparatively large, needs the problems such as installing space is large, is not suitable for installing in less space.In addition, hot-side heat dissipation normally reaches the object of heat radiation by the rotating speed and power increasing blower fan, radiating efficiency is poor and the large energy consumption of noise is high.
Summary of the invention
One object of the present invention is intended at least one defect overcoming existing heat-exchanger rig, provides a kind of heat-exchanger rig of novel structure, and it has less volume, is specially adapted to the heat radiation of semiconductor freezer.
As far as possible a further object of first aspect present invention to reduce the noise of heat-exchanger rig.
An object of second aspect present invention to provide a kind of semiconductor freezer with above-mentioned heat-exchanger rig.
According to an aspect of the present invention, the invention provides a kind of heat-exchanger rig for semiconductor freezer.This heat-exchanger rig comprises the first heat exchanging part, and described first heat exchanging part has:
Two fins set, each described fins set has the fin that multiple parallel interval is arranged, and described two fins set are arranged along the length direction interval of described fin; With
An axial flow blower, the rotation of described axial flow blower is between two described fins set, and described axial flow blower is placed in described two fins set, with the gap blow flow between two adjacent fins every in each described fins set, or the gap from each described fins set between every two adjacent fins sucks air-flow.
Alternatively, described heat-exchanger rig also comprises the second heat exchanging part, is arranged symmetrically with about a geometrical plane with described first heat exchanging part.
Alternatively, described heat-exchanger rig also comprises:
Two heat-transfer devices, each described heat-transfer device is symmetrical about described geometrical plane, and
The middle part of each described heat-transfer device is configured to absorb heat or cold from thermal source or low-temperature receiver;
A fins set of described first heat exchanging part and a fins set of described second heat exchanging part are arranged at the two ends of a described heat-transfer device;
Another fins set of described first heat exchanging part and another fins set of described second heat exchanging part are arranged at the two ends of heat-transfer device described in another.
Alternatively, each described heat-transfer device comprises:
Heat-conducting substrate, has and described thermal source or the hot linked heat-transfer surface of low-temperature receiver; With
Many heat carriers, length direction along described fin is spaced, heat carrier described in every root comprise the middle part heat carrier section that is fixed on described heat-conducting substrate and be positioned at heat carrier section both sides, described middle part, perpendicular to the straight heat carrier section in two ends of described geometrical plane, two end straight heat carrier sections of heat carrier described in every root extend respectively through the poling hole of each fin be mounted thereon.
Alternatively, the middle part heat carrier section of heat carrier described in every root comprises: the straight heat carrier section in middle part, and two connection heat carrier sections that the two ends of straight heat carrier section extend to both sides from described middle part respectively; And
In each described heat-transfer device, the straight heat carrier section in multiple described middle part is in same plane, the straight heat carrier section in multiple described end is in same plane, and the distance between every two adjacent middle part straight heat carrier sections is less than the distance between every two adjacent straight heat carrier sections in end, the distance between described middle part straight heat carrier section and described heat-transfer surface is less than the distance between described end straight heat carrier section and described heat-transfer surface.
Alternatively, heat carrier described in every root is heat pipe.
Alternatively, the width of each described fin is 1/7 to 3/7 of its length.
Alternatively, the distance between two fins set of described first heat exchanging part is less than the width of each described fin.
According to a second aspect of the invention, the invention provides a kind of semiconductor freezer, the heat-insulation layer comprising inner bag, semiconductor chilling plate and be arranged on rear side of described inner bag, especially, also comprise:
Back cover, the rear surface of itself and described heat-insulation layer is limited with installing space, and it offers the first air inlet, and is positioned at two the first air outlets of described first air inlet both sides; With
Any one heat-exchanger rig above-mentioned, two fins set of its first heat exchanging part and axial flow blower to be all installed in described installing space and to be between two described first air outlets; And
Two fins set of described first heat exchanging part and the hot junction of described semiconductor chilling plate thermally coupled directly or indirectly;
The axial flow blower of described first heat exchanging part is configured to impel air-flow to enter in described axial flow blower from described first air inlet, rear two fins set flowing to described first heat exchanging part, to carry out heat exchange with the fin of each described fins set, after flow out described installing space from two described first air outlets.
Alternatively, described first air outlet is arranged at the top of the first air outlet described in another;
Described back cover also offers the second air inlet and two the second air outlets, described second air outlet is arranged at the top of the second air outlet described in another, and described second air inlet is arranged between two described second air outlets; And
Two fins set of the second heat exchanging part of described heat-exchanger rig and axial flow blower to be all installed in described installing space and to be between two described second air outlets; And
Two fins set of described second heat exchanging part and the hot junction of described semiconductor chilling plate thermally coupled directly or indirectly;
The axial flow blower of described second heat exchanging part is configured to impel air-flow to enter in described axial flow blower from described second air inlet, rear two fins set flowing to described second heat exchanging part, to carry out heat exchange with the fin of each described fins set, after flow out described installing space from two described second air outlets.
Heat-exchanger rig of the present invention and semiconductor freezer, because use an axial flow blower to be placed on two fins set simultaneously, can reduce the volume of heat-exchanger rig, be specially adapted to the heat radiation of semiconductor freezer.In addition, there are two heat exchanging part and each heat exchanging part has the area of dissipation that two fins set also can improve heat-exchanger rig.Adopt an axial flow blower to make air-flow flow through from two fins set simultaneously, axial flow blower utilization rate can be improved, and the noise of heat-exchanger rig can be reduced.
According to hereafter by reference to the accompanying drawings to the detailed description of the specific embodiment of the invention, those skilled in the art will understand above-mentioned and other objects, advantage and feature of the present invention more.
Accompanying drawing explanation
Hereinafter describe specific embodiments more of the present invention with reference to the accompanying drawings by way of example, and not by way of limitation in detail.Reference numeral identical in accompanying drawing denotes same or similar parts or part.It should be appreciated by those skilled in the art that these accompanying drawings may not be drawn in proportion.In accompanying drawing:
Fig. 1 is the schematic elevational view of heat-exchanger rig according to an embodiment of the invention;
Fig. 2 is the schematic side elevation of heat-exchanger rig according to an embodiment of the invention;
Fig. 3 is the schematic side elevation of semiconductor freezer according to an embodiment of the invention;
Fig. 4 is the schematic rear view of semiconductor freezer according to an embodiment of the invention.
Detailed description of the invention
Fig. 1 and Fig. 2 is schematic elevational view and the side view of heat-exchanger rig 600 according to an embodiment of the invention respectively.As depicted in figs. 1 and 2, embodiments provide a kind of heat-exchanger rig 600 for semiconductor freezer, it can comprise the first heat exchanging part 610.First heat exchanging part 610 can have two fins set 611 and axial flow blower 612.Each fins set 611 has the fin that multiple parallel interval is arranged, and thermally coupled directly or indirectly with the cold junction/hot junction of the semiconductor chilling plate in semiconductor freezer, and two fins set 611 can be arranged along the length direction interval of fin.The rotation of axial flow blower 612 is between two fins set 611, and axial flow blower 612 is placed in two fins set 611, with the gap blow flow between two adjacent fins every in each fins set, or the gap from each fins set between every two adjacent fins sucks air-flow, thus take away the cold/heat on fin.Two fins set 611 share an axial flow blower 612, and axial flow blower 612 is in relatively special position, and the volume of heat-exchanger rig 600 not only can be made smaller, and can make full use of this axial flow blower 612, reduce the noise of heat-exchanger rig.Preferably, the width of each fin is 1/7 to 3/7 of its length.The width of each fins set 611 is 1/3 to 2/3 of the length of each fin.Distance between two fins set 611 of the first heat exchanging part 610 is less than the width of each fin.
In some embodiments of the invention, as depicted in figs. 1 and 2, heat-exchanger rig 600 also can comprise the second heat exchanging part 610'.Second heat exchanging part 610' also can have two fins set 611, axial flow blower 612, and is arranged symmetrically with about a geometrical plane with the first heat exchanging part 610, to improve heat exchange efficiency further.
In some embodiments of this embodiment, heat-exchanger rig 600 also comprises two heat-transfer devices 630, and each heat-transfer device 630 is symmetrical about above-mentioned geometrical plane, and the middle part of each heat-transfer device 630 is configured to absorb heat or cold from thermal source or low-temperature receiver.A fins set 611 of the first heat exchanging part 610 and a fins set 611 of the second heat exchanging part 610' are arranged at the two ends of a heat-transfer device 630; Another fins set 611 of first heat exchanging part 610 and another fins set 611 of the second heat exchanging part 610' are arranged at the two ends of another heat-transfer device 630.That is, this heat-exchanger rig 600 simultaneously can absorb heats or cold from two thermals source, and the heat of a corresponding thermal source or low-temperature receiver or cold can be passed to a fins set 611 of the first heat exchanging part 610 and a fins set 611 of the second heat exchanging part 610' by each heat-exchanger rig 600.
Particularly, each heat-transfer device 630 comprises heat-conducting substrate 631 and Duo Gen heat carrier 632.Heat-conducting substrate 631 has and thermal source or the hot linked heat-transfer surface of low-temperature receiver.Many heat carriers 632 can be spaced along the length direction of fin.And every root heat carrier 632 can be heat pipe, comprise the middle part heat carrier section that is fixed on heat-conducting substrate 631 and be positioned at heat carrier section both sides, middle part, perpendicular to the straight heat carrier section in two ends of geometrical plane.The middle part heat carrier section of every root heat carrier 632 comprises: the straight heat carrier section in middle part, and two connection heat carrier sections that the two ends of straight heat carrier section extend to both sides from middle part respectively.Two end straight heat carrier sections of every root heat carrier 632 extend respectively through the poling hole of each fin be mounted thereon.
Preferably, in each heat-transfer device 630, the straight heat carrier section in multiple middle part is in same plane, the straight heat carrier section in multiple end is in same plane, and the distance between every two adjacent middle part straight heat carrier sections is less than the distance between every two adjacent straight heat carrier sections in end, the distance between multiple middle part straight heat carrier section and heat-transfer surface is less than the distance between the straight heat carrier section in multiple end and heat-transfer surface.Such setting, can make heat-exchanger rig 600 have special structure, is convenient to heat-exchanger rig 600 to be installed on semiconductor freezer.
The straight heat carrier section in middle part is fixedly connected with mode and can is with heat-conducting substrate 631: heat-conducting substrate 631 only has a base plate, and it is opposing offers multiple holding tank in heat-transfer surface side; The straight heat carrier section in middle part of many heat carriers 632 is by the embedding holding tank that presses, and this mode connects reliably, thermal resistivity is low.The straight heat carrier section in middle part is fixedly connected with mode and also can is with heat-conducting substrate 631: heat-conducting substrate 631 can have base plate and cover plate, and the opposing of base plate offers multiple holding tank in heat-transfer surface side; The straight heat carrier section in middle part of many heat carriers 632 is by the embedding holding tank that presses; It is opposing in heat-transfer surface side that cover plate is installed on heat-conducting substrate 631, straight for the middle part of many heat carriers 632 heat carrier section to be folded in therebetween with base plate.
In some substituting embodiments, each heat-transfer device 630 can be the heat-conducting plate of strip, and the middle part of one side is heat-transfer surface.Four fins set 611 are arranged at the two ends of two heat-conducting plates respectively, and the fin of each fins set 611 extends from the another side of heat-conducting plate.Heat-conducting plate can be plate-type heat-pipe.In other substituting embodiments, two fins set 611 of the first heat exchanging part 610 can be installed on a heat-transfer device 630, and two fins set 611 of the second heat exchanging part 610' can be installed on another heat-transfer device 630.Particularly, each heat-transfer device 630 can comprise heat-conducting substrate 631 and many single u-shaped heat-conductive thermo tube.The middle part of each U-shaped heat-conductive thermo tube is thermally coupled with the hot junction of semiconductor chilling plate by heat-conducting substrate 631.The two ends of each U-shaped heat-conductive thermo tube are provided with a fins set 611.
Further, the embodiment of the present invention additionally provides a kind of semiconductor freezer using above-mentioned heat-exchanger rig 600, Fig. 3 and Fig. 4 is schematic side elevation and the rearview of semiconductor freezer according to an embodiment of the invention respectively.As shown in Figure 3 to Figure 4, the semiconductor freezer of the present embodiment can comprise semiconductor module 100, inner bag 200, shell, chamber door 300 and heat-insulation layer 400.Storage space is limited with in inner bag 200.Generally there are two kinds of structures in the shell of semiconductor freezer, a kind of be pin-connected panel, be namely assembled into a complete casing by top cover, left side plate, back cover 510, lower shoe etc.Another kind is monoblock type, by top cover and left side plate on request rolling become one to fall " U " font, be called U shell, then be welded into casing with back cover 510, lower shoe point.The semiconductor freezer of the embodiment of the present invention preferably uses monoblock type shell, and namely shell includes U shell and back cover 510.Back cover 510 can be limited with installing space with the rear surface of the heat-insulation layer 400 be positioned on rear side of inner bag 200, and back cover 510 offers the first air inlet, and is positioned at two the first air outlets of the first air inlet both sides.
In this embodiment, the semiconductor module 100 of semiconductor freezer can comprise semiconductor chilling plate, cold junction heat-exchanger rig and hot junction heat-exchanger rig.Heat-insulation layer 400 on rear side of the rear wall of inner bag 200 and inner bag 200 offers installing hole.Cold junction heat-exchanger rig can comprise cool guiding block, cold scattering substrate, the multiple cold scattering fins be formed on cold scattering substrate, and for the cold scattering fan of forced convertion cold scattering.Cool guiding block and semiconductor chilling plate are installed in installing hole, and the cold end surface thermo-contact of the rear surface of cool guiding block and semiconductor chilling plate.
Hot junction heat-exchanger rig can be the heat-exchanger rig 600 in above-mentioned any embodiment, and two fins set 611 of its first heat exchanging part 610 and axial flow blower 612 to be all installed in installing space and to be between two the first air outlets.And two fins set 611 of the first heat exchanging part 610 are thermally coupled directly or indirectly with the hot junction of semiconductor chilling plate.The axial flow blower 612 of the first heat exchanging part 610 is configured to impel air-flow to enter in axial flow blower 612 from the first air inlet, rear two fins set 611 flowing to the first heat exchanging part 610, to carry out heat exchange with the fin of each fins set 611, after from two first air outlets flow out installing spaces.
In order to improve heat exchange efficiency, heat-exchanger rig 600 comprises the second heat exchanging part 610' further.First air outlet is arranged at the top of another the first air outlet.Back cover 510 also offers the second air inlet and two the second air outlets, second air outlet is arranged at the top of another the second air outlet, and the second air inlet is arranged between two the second air outlets.First air inlet and the second air inlet are in sustained height place, and the first air outlet and the second air outlet are in sustained height place.Two fins set 611 of the second heat exchanging part 610' of heat-exchanger rig 600 and axial flow blower 612 to be all installed in installing space and to be between two the second air outlets.And two fins set 611 of the second heat exchanging part 610' are thermally coupled directly or indirectly with the hot junction of semiconductor chilling plate; The axial flow blower 612 of the second heat exchanging part 610' is configured to impel air-flow to enter in axial flow blower 612 from the second air inlet, rear two fins set flowing to the second heat exchanging part, to carry out heat exchange with the fin of each fins set, after from two second air outlets flow out installing spaces.
In this embodiment, semiconductor module 100 can be two, and vertically interval is arranged, to improve refrigerating efficiency.Heat-exchanger rig 600 also can comprise two heat-transfer devices 630.The heat-transfer surface of the heat-conducting substrate 631 of each heat-transfer device 630 and the hot junction of a semiconductor chilling plate contact against, the heat of each semiconductor chilling plate to be passed to the first heat exchanging part 610 and the second heat exchanging part 610'.
So far, those skilled in the art will recognize that, although multiple exemplary embodiment of the present invention is illustrate and described herein detailed, but, without departing from the spirit and scope of the present invention, still can directly determine or derive other modification many or amendment of meeting the principle of the invention according to content disclosed by the invention.Therefore, scope of the present invention should be understood and regard as and cover all these other modification or amendments.
Claims (10)
1. for a heat-exchanger rig for semiconductor freezer, it is characterized in that comprising the first heat exchanging part, described first heat exchanging part has:
Two fins set, each described fins set has the fin that multiple parallel interval is arranged, and described two fins set are arranged along the length direction interval of described fin; With
An axial flow blower, the rotation of described axial flow blower is between two described fins set, and described axial flow blower is placed in described two fins set, with the gap blow flow between two adjacent fins every in each described fins set, or the gap from each described fins set between every two adjacent fins sucks air-flow.
2. heat-exchanger rig according to claim 1, is characterized in that, also comprises:
Second heat exchanging part, is arranged symmetrically with about a geometrical plane with described first heat exchanging part.
3. heat-exchanger rig according to claim 2, is characterized in that, also comprises:
Two heat-transfer devices, each described heat-transfer device is symmetrical about described geometrical plane, and
The middle part of each described heat-transfer device is configured to absorb heat or cold from thermal source or low-temperature receiver;
A fins set of described first heat exchanging part and a fins set of described second heat exchanging part are arranged at the two ends of a described heat-transfer device;
Another fins set of described first heat exchanging part and another fins set of described second heat exchanging part are arranged at the two ends of heat-transfer device described in another.
4. heat-exchanger rig according to claim 3, is characterized in that, each described heat-transfer device comprises:
Heat-conducting substrate, has and described thermal source or the hot linked heat-transfer surface of low-temperature receiver; With
Many heat carriers, length direction along described fin is spaced, heat carrier described in every root comprise the middle part heat carrier section that is fixed on described heat-conducting substrate and be positioned at heat carrier section both sides, described middle part, perpendicular to the straight heat carrier section in two ends of described geometrical plane, two end straight heat carrier sections of heat carrier described in every root extend respectively through the poling hole of each fin be mounted thereon.
5. heat-exchanger rig according to claim 4, is characterized in that,
The middle part heat carrier section of heat carrier described in every root comprises: the straight heat carrier section in middle part, and two connection heat carrier sections that the two ends of straight heat carrier section extend to both sides from described middle part respectively; And
In each described heat-transfer device, the straight heat carrier section in multiple described middle part is in same plane, the straight heat carrier section in multiple described end is in same plane, and the distance between every two adjacent middle part straight heat carrier sections is less than the distance between every two adjacent straight heat carrier sections in end, the distance between described middle part straight heat carrier section and described heat-transfer surface is less than the distance between described end straight heat carrier section and described heat-transfer surface.
6. heat-exchanger rig according to claim 4, is characterized in that,
Heat carrier described in every root is heat pipe.
7. heat-exchanger rig according to claim 1, is characterized in that,
The width of each described fin is 1/7 to 3/7 of its length.
8. heat-exchanger rig according to claim 1, is characterized in that,
Distance between two fins set of described first heat exchanging part is less than the width of each described fin.
9. a semiconductor freezer, the heat-insulation layer comprising inner bag, semiconductor chilling plate and be arranged on rear side of described inner bag, is characterized in that, also comprises:
Back cover, the rear surface of itself and described heat-insulation layer is limited with installing space, and it offers the first air inlet, and is positioned at two the first air outlets of described first air inlet both sides; With
Heat-exchanger rig according to any one of claim 1 to 8, two fins set of its first heat exchanging part and axial flow blower to be all installed in described installing space and to be between two described first air outlets; And
Two fins set of described first heat exchanging part and the hot junction of described semiconductor chilling plate thermally coupled directly or indirectly;
The axial flow blower of described first heat exchanging part is configured to impel air-flow to enter in described axial flow blower from described first air inlet, rear two fins set flowing to described first heat exchanging part, to carry out heat exchange with the fin of each described fins set, after flow out described installing space from two described first air outlets.
10. semiconductor freezer according to claim 9, is characterized in that,
Described first air outlet is arranged at the top of the first air outlet described in another;
Described back cover also offers the second air inlet and two the second air outlets, described second air outlet is arranged at the top of the second air outlet described in another, and described second air inlet is arranged between two described second air outlets; And
Two fins set of the second heat exchanging part of described heat-exchanger rig and axial flow blower to be all installed in described installing space and to be between two described second air outlets; And
Two fins set of described second heat exchanging part and the hot junction of described semiconductor chilling plate thermally coupled directly or indirectly;
The axial flow blower of described second heat exchanging part is configured to impel air-flow to enter in described axial flow blower from described second air inlet, rear two fins set flowing to described second heat exchanging part, to carry out heat exchange with the fin of each described fins set, after flow out described installing space from two described second air outlets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510990200.0A CN105466261A (en) | 2015-12-24 | 2015-12-24 | Heat exchange device and semiconductor refrigeration refrigerator provided with heat exchange device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510990200.0A CN105466261A (en) | 2015-12-24 | 2015-12-24 | Heat exchange device and semiconductor refrigeration refrigerator provided with heat exchange device |
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| Publication Number | Publication Date |
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| CN105466261A true CN105466261A (en) | 2016-04-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510990200.0A Pending CN105466261A (en) | 2015-12-24 | 2015-12-24 | Heat exchange device and semiconductor refrigeration refrigerator provided with heat exchange device |
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| CN (1) | CN105466261A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107764113A (en) * | 2016-08-17 | 2018-03-06 | 青岛海尔智能技术研发有限公司 | Heat-exchanger rig and the semiconductor refrigerating equipment with the heat-exchanger rig |
| CN107796140A (en) * | 2016-08-31 | 2018-03-13 | 青岛海尔智能技术研发有限公司 | Hot junction heat-exchanger rig and semiconductor refrigerating equipment for semiconductor refrigerating equipment |
| CN110361555A (en) * | 2018-03-26 | 2019-10-22 | 成都深迈瑞医疗电子技术研究院有限公司 | Load reagents component, sample reagent loading attachment and chemical illumination immunity analysis instrument |
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| CN201548015U (en) * | 2009-12-09 | 2010-08-11 | 奇鋐科技股份有限公司 | Heat exchanger |
| CN204612555U (en) * | 2015-04-30 | 2015-09-02 | 青岛海尔智能技术研发有限公司 | Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig |
| CN205537254U (en) * | 2015-12-24 | 2016-08-31 | 青岛海尔电冰箱有限公司 | Heat transfer device and have this heat transfer device's semiconductor refrigeration refrigerator |
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| CN2236638Y (en) * | 1995-09-05 | 1996-10-02 | 白雪 | Heat pipe radiator |
| US20040108100A1 (en) * | 2002-11-20 | 2004-06-10 | Sunonwealth Electric Machine Industry Co., Ltd. | Heat dissipator |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107764113A (en) * | 2016-08-17 | 2018-03-06 | 青岛海尔智能技术研发有限公司 | Heat-exchanger rig and the semiconductor refrigerating equipment with the heat-exchanger rig |
| CN107796140A (en) * | 2016-08-31 | 2018-03-13 | 青岛海尔智能技术研发有限公司 | Hot junction heat-exchanger rig and semiconductor refrigerating equipment for semiconductor refrigerating equipment |
| CN110361555A (en) * | 2018-03-26 | 2019-10-22 | 成都深迈瑞医疗电子技术研究院有限公司 | Load reagents component, sample reagent loading attachment and chemical illumination immunity analysis instrument |
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