CN204612555U - Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig - Google Patents
Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig Download PDFInfo
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- CN204612555U CN204612555U CN201520278435.2U CN201520278435U CN204612555U CN 204612555 U CN204612555 U CN 204612555U CN 201520278435 U CN201520278435 U CN 201520278435U CN 204612555 U CN204612555 U CN 204612555U
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Abstract
The utility model provides a kind of heat-exchanger rig and has the semiconductor refrigerating equipment of this heat-exchanger rig.Particularly, the utility model provides a kind of heat-exchanger rig, comprises heat transfer substrate, at least one heat pipe and multiple heat exchange fin.Heat pipe has the end section that with heat transfer substrate hot linked centre portion and two are extended along the length direction of this heat transfer substrate by the two ends of centre portion respectively.Multiple heat exchange fin is arranged in the end section of heat pipe, to distribute the heat transmitted from centre portion to end section.Heat transfer substrate is provided with blower fan, flows towards heat exchange fin to order about air-flow, thus the natural heat-exchange of the forced-convection heat transfer between heat exchange fin and air and heat exchange fin is combined, improve the efficiency of heat-exchanger rig heat exchange.The utility model also provides a kind of semiconductor refrigerating equipment, comprises the casing, semiconductor chilling plate and the heat-exchanger rig hot linked with the hot junction of semiconductor chilling plate that are limited with room between storing.
Description
Technical field
The utility model relates to heat transfer technology, particularly relates to a kind of heat-exchanger rig and has the semiconductor refrigerating equipment of this heat-exchanger rig.
Background technology
In recent years, semiconductor refrigerating equipment is widely used due to its superior performance, such as semiconductor freezer, semiconductor refrigerating refrigerator-freezer etc.Semiconductor refrigerating equipment utilizes the automatic pressure-transforming Variable flow control technology of semiconductor chilling plate to realize refrigeration, realizes heat radiation, without the need to refrigeration working medium and mechanical moving element by heat pipe and conduction technique simultaneously.Therefore, semiconductor refrigerating equipment does not have the series of problems of traditional mechanical refrigeration equipment such as Working medium pollution and mechanical oscillation in application in application process.
But while the cold junction generation cold of semiconductor chilling plate, its hot junction can produce a large amount of heats.In order to ensure that semiconductor chilling plate reliably carries out work constantly, need the heat distributing the generation of its hot junction in time.A kind of radiating mode of the prior art is arrange a heat-radiating substrate in the hot junction of semiconductor chilling plate to dispel the heat, and be embedded with many heat pipes in heat-radiating substrate, the end of many heat pipes is located in heat exchange fin, to carry out natural heat dissipation by heat exchange fin.But, when the power of semiconductor chilling plate is larger, is only suitable for the heat that heat exchange fin is not enough to effectively distribute the generation of semiconductor chilling plate hot junction, thus affects the normal work of semiconductor chilling plate.
Utility model content
An object of the utility model first aspect is intended at least one defect overcoming existing heat-exchanger rig, a kind of heat-exchanger rig is provided, it can realize natural heat-exchange and/or the forced-convection heat transfer of heat exchange fin as required, thus improves the service behaviour of heat-exchanger rig.
A further object of the utility model first aspect to improve the heat exchange efficiency of heat-exchanger rig.
Another further object of the utility model first aspect to improve the uniformity of heat-exchanger rig heat exchange.
An object of the utility model second aspect is to provide a kind of semiconductor refrigerating equipment with heat-exchanger rig.
According to first aspect of the present utility model, the utility model provides a kind of heat-exchanger rig, comprising:
Heat transfer substrate, has the hot linked heat-transfer surface with thermal source, to receive heat from described thermal source;
At least one heat pipe, has the end section extended along the length direction of described heat transfer substrate by the two ends of described centre portion respectively with the hot linked centre portion of described heat transfer substrate and two; And
Multiple heat exchange fin, is arranged in the end section of described heat pipe, to distribute the heat transmitted to described end section from described centre portion; Wherein
Described heat transfer substrate is provided with blower fan, flows towards described heat exchange fin to order about air-flow.
Alternatively, the spacing between adjacent two heat exchange fins in described multiple heat exchange fin is greater than a predetermined minimum spacing threshold value.
Alternatively, in the lamellar body of each described heat exchange fin, be all formed with air vent, and the air vent forward of adjacent two heat exchange fins is relative.
Alternatively, described multiple heat exchange fin is distributed in the two ends of described heat transfer substrate, and to form two independently heat exchange fin modules, described blower fan is configured to simultaneously towards described two heat exchange fin module blow flow.
Alternatively, described heat-exchanger rig also comprises:
At least one other heat transfer substrate, described heat transfer substrate and at least one other heat transfer substrate described side by side and be disposed in the space between described two heat exchange fin modules, described heat transfer substrate and at least one other heat transfer substrate described are provided with a described blower fan.
Alternatively, described heat transfer substrate and at least one other heat transfer substrate described all arrange at least one described heat pipe, and the heat pipe in described heat transfer substrate and at least one other heat transfer substrate described shares described multiple heat exchange fin.
Alternatively, at least one other heat transfer substrate described comprise other heat transfer substrates described in; And
Between two end section of at least one heat pipe of one of them end section in these other heat transfer substrates of heat pipe described at least one of described heat transfer substrate; Between two end section of at least one heat pipe of one of them end section in described heat transfer substrate of heat pipe described at least one of these other heat transfer substrates.
Alternatively, each heat exchange fin module is divided into upper and lower two parts, and the heat pipe end section be located in each part is configured to length direction along described heat exchange fin to be equidistantly spaced.
Alternatively, described blower fan comprises the aerofoil fan for driving air-flow to flow towards described heat exchange fin and is fixed on described heat transfer substrate to hold the casing of described aerofoil fan.
According to second aspect of the present utility model, the utility model additionally provides a kind of semiconductor refrigerating equipment, comprising:
Casing, is limited with room between the storing for stored article in it;
Semiconductor chilling plate, between its cold junction and described storing, room is thermally coupled, thinks that between described storing, room provides cold; And
Arbitrary described heat-exchanger rig above, the heat-transfer surface of its heat transfer substrate is thermally coupled with the hot junction of described semiconductor chilling plate, to distribute the heat of described hot junction generation.
Heat-exchanger rig of the present utility model arranges blower fan owing to being arranged on heat transfer substrate, can to the heat exchange fin blow flow being positioned at heat transfer substrate end, increase the air flow amount of heat exchange fin and improve the air velocity flowing through heat exchange fin, to make to carry out forced-convection heat transfer between air and heat exchange fin, improve the heat exchange efficiency of heat-exchanger rig.When the heat exchange amount of heat-exchanger rig is less, natural heat-exchange can be carried out by means of only heat exchange fin, thus heat-exchanger rig can selects heat exchange mode flexibly, improve its service behaviour.
Further, due in heat-exchanger rig of the present utility model, all air vent is formed with in the lamellar body of heat exchange fin, and the air vent forward of adjacent two heat exchange fins is relative, air can be made to be circulated by the air vent of heat exchange fin, enhance the exchange capability of heat of heat exchange fin, thus improve the heat exchange efficiency of heat-exchanger rig.
Further, due in heat-exchanger rig of the present utility model, the spacing between adjacent two heat exchange fins is greater than a predetermined minimum spacing threshold value, can ensure fully contacting of each heat exchange fin and air, further enhancing the exchange capability of heat of heat exchange fin, improve the heat exchange efficiency of heat-exchanger rig.
Further, due in heat-exchanger rig of the present utility model, multiple heat exchange fin is distributed in the two ends of heat transfer substrate, define two independently heat exchange fin modules, thus the heat in heat transfer substrate can be made to be distributed to equably in two heat exchange fin modules by heat pipe, improve the uniformity of heat-exchanger rig heat exchange.
According to hereafter by reference to the accompanying drawings to the detailed description of the utility model specific embodiment, those skilled in the art will understand above-mentioned and other objects, advantage and feature of the present utility model more.
Accompanying drawing explanation
Hereinafter describe specific embodiments more of the present utility model with reference to the accompanying drawings by way of example, and not by way of limitation in detail.Reference numeral identical in accompanying drawing denotes same or similar parts or part.It should be appreciated by those skilled in the art that these accompanying drawings may not be drawn in proportion.In accompanying drawing:
Fig. 1 is the schematic diagram of the heat-exchanger rig according to the utility model embodiment;
Fig. 2 is the schematic diagram of the heat transfer substrate of heat-exchanger rig according to the utility model embodiment;
Fig. 3 is the schematic diagram of the heat-exchanger rig according to another embodiment of the utility model;
Fig. 4 is the schematic diagram of the heat pipe of heat-exchanger rig according to the utility model embodiment.
Detailed description of the invention
Fig. 1 is the schematic diagram of the heat-exchanger rig according to the utility model embodiment.As shown in Figure 1, heat-exchanger rig 100 comprises: heat transfer substrate 11, at least one heat pipe and multiple heat exchange fin 30.Heat transfer substrate 11 has the hot linked heat-transfer surface with thermal source, to accept heat from thermal source.Heat pipe all has the end section that the centre portion that is connected with heat transfer substrate 11 and two are extended along the length direction of heat transfer substrate 11 by the two ends of centre portion respectively.Multiple heat exchange fin 30 is arranged in the end section of heat pipe, to distribute the heat transmitted from centre portion to end section.Especially, heat transfer substrate 11 is also provided with blower fan 112, flows towards multiple heat exchange fin 30 to order about air-flow, thus make air and multiple heat exchange fin 30 that forced-convection heat transfer occur, improve heat exchange efficiency.Heat-exchanger rig 100 in the utility model embodiment can increase the air flow amount of heat exchange fin 30 by blower fan 112 and improve the air velocity flowing through heat exchange fin 30, to make to carry out forced-convection heat transfer between air and heat exchange fin 30, improve the heat exchange efficiency of heat-exchanger rig 100.When the heat exchange amount of heat-exchanger rig 100 is less, natural heat-exchange can be carried out by means of only heat exchange fin 30, thus heat-exchanger rig 100 can select heat exchange mode flexibly, improves its service behaviour.
In embodiments more of the present utility model, in the lamellar body of each heat exchange fin 30, be all formed with air vent 31, and the air vent forward of adjacent two heat exchange fins 30 is relative.Can be formed with multiple air vent 31 in each heat exchange fin 30, the air vent forward being positioned at same position of adjacent two heat exchange fins 30 is relative.That is, the air vent being positioned at same position of multiple heat exchange fin 30 is located along the same line, so that air is circulated by the air vent of multiple heat exchange fin 30, strengthens the exchange capability of heat of heat exchange fin 30, thus improves the heat exchange efficiency of heat-exchanger rig 100.
Further, heat exchange fin 30 can extend along the width of heat transfer substrate 11, and its place plane is vertical in the heat-transfer surface of heat transfer substrate 11, thus make the air vent in multiple heat exchange fin 30 be positioned at along on heat transfer substrate 11 length direction and on the straight line parallel with heat-transfer surface, so that the blower fan be arranged on heat transfer substrate 11 is along air vent 31 to heat exchange fin 30 blow flow, improve the flow velocity of air-flow, be convenient to carry out forced-convection heat transfer between air and heat exchange fin 30.
In embodiments more of the present utility model, the spacing between adjacent two heat exchange fins in multiple heat exchange fin is greater than a predetermined minimum spacing threshold value.That is, adjacent two heat exchange fins in multiple heat exchange fin 30 keep at a certain distance away setting, to form predetermined gap between adjacent two heat exchange fins.This predetermined minimum spacing threshold value is preferably 10 ~ 20mm.
Fig. 2 is the schematic diagram of the heat transfer substrate of heat-exchanger rig according to the utility model embodiment.Blower fan 112 is identical with other blower fan 122 structure and working principle, and for blower fan 112, as shown in Figure 2, blower fan 112 is arranged on the surface 111 deviating from its heat-transfer surface of heat transfer substrate 11.Particularly, blower fan 112 can comprise the aerofoil fan 1121 for driving air-flow to flow towards heat exchange fin 30 and be fixed on to hold the casing 1122 of aerofoil fan 1121 on heat transfer substrate 11, and casing 1122 is fixed on by the legs 114 of surface 111 protrusions by securing members such as screws.
In embodiments more of the present utility model, as shown in Figure 2, can be provided with at least one perforation 113 running through its width in heat transfer substrate 11, at least part of centre portion of at least one heat pipe is embedded in perforation 113.In the utility model embodiment, heat-exchanger rig 100 comprises many heat pipes, can be provided with multiple perforation running through its width, be embedded wherein for many heat pipes in heat transfer substrate 11.In embodiments more of the present utility model, the plurality of perforation can be disposed adjacent.More having preferred embodiment, the plurality of perforation, to be equidistantly spaced, conveniently can be arranged heat pipe on the one hand, on the other hand, be passed to many heat pipes with can making the even heat in heat transfer substrate 11.The large I of perforation and the external diameter of heat pipe match, to be embedded after in perforation at heat pipe, and the outer surface making heat pipe and the heat transfer substrate close contact being positioned at perforation, thus make the effective transmission realizing heat.
Further, as shown in Figure 2, heat transfer substrate 11 can comprise the two parts combined, and is respectively the upper substrate 11a with the surface 111 and infrabasal plate 11b with heat-transfer surface.The surface that upper substrate 11a is relative with two of infrabasal plate 11b offers the suitable groove of size respectively, when upper substrate 11a and infrabasal plate 11b is close to combination mutually, the groove combination be positioned on both apparent surfaces is formed can the perforation 113 of passing of the centre portion of heating tube.
It will be understood by those skilled in the art that in other embodiment of the utility model, also can offer the card holding trough running through heat transfer substrate 11 width on the heat-transfer surface of heat transfer substrate 11, be embedded at wherein with heating tube.The dimensional configurations of card holding trough becomes to make heat pipe can clamp embedding under external force wherein, and keeps this heat pipe, avoids it to automatically disengage card holding trough.
In embodiments more of the present utility model, as shown in Figure 1, multiple heat exchange fins 30 are distributed in the two ends of heat transfer substrate 11, to form two independently heat exchange fin modules, thus increase the array area of heat exchange fin, ensure effective natural heat dissipation.Heat-exchanger rig 100 comprises at least two heat pipes, and thus, at least two heat pipes be embedded in heat transfer substrate 11 can be divided into along the two groups of heat pipes extended towards heat transfer substrate 11 two ends respectively on heat transfer substrate 11 length direction.The end section often organizing heat pipe is all located in the heat exchange fin module of the respective end being arranged in heat transfer substrate 11, thus is convenient to layout and the installation of at least two heat pipes, also takes full advantage of the heat transfer space between two heat exchange fin modules simultaneously.Further, at least two heat pipes can interlock to intert and arrange in the heat transfer space between two heat exchange fin modules, be covered with this heat transfer space, thus effectively make use of this heat transfer space with irregular or regular form, improve heat transfer effect, decrease heat pipe quantity.
In embodiments more of the present utility model, as shown in Figure 1, heat-exchanger rig 100 also comprises at least one other heat transfer substrate, heat transfer substrate 11 and at least one other heat transfer substrate side by side and be disposed in the space between two heat exchange fin modules, heat transfer substrate 11 and at least one other heat transfer substrate are provided with a blower fan.Further, heat transfer substrate 11 and at least one other heat transfer substrate all arrange at least one heat pipe, and heat transfer substrate 11 shares multiple heat exchange fin 30 with the heat pipe at least one other heat transfer substrate.
Further, in the utility model embodiment, heat-exchanger rig 100 also comprises other heat transfer substrate 12, other heat transfer substrates 12 is provided with other blower fans 122.Length direction, the width of other heat transfer substrates 12 and heat transfer substrate 11 are all consistent.Heat transfer substrate 11 and other heat transfer substrates 12 along heat transfer substrate 11 width side by side and the setting that keeps at a certain distance away.Be embedded at least one end section of the heat pipe in heat transfer substrate 11 between at least two end section being embedded the heat pipe in other heat transfer substrates 12.That is, at least part of heat pipe staggered interspersed setting in the heat transfer space between two heat exchange fin modules being embedded the heat pipe in heat transfer substrate 11 and being embedded in other heat transfer substrates 12.Particularly, in heat transfer substrate 11, be provided with the first heat pipe 21, in other heat transfer substrates 12, be provided with the second heat pipe 22.The end section 212 of the first heat pipe 21 is between the end section 222 and the other end section 223 of the second heat pipe 22, and the end section 222 of the second heat pipe 22 is between the end section 212 and the other end section 213 of the first heat pipe 21.
Fig. 3 is the schematic diagram of the heat-exchanger rig according to another embodiment of the utility model.As shown in Figure 3, in the utility model embodiment, each heat exchange fin module is divided into upper and lower two parts, and the heat pipe end section be located in each part is configured to length direction along heat exchange fin to be equidistantly spaced.That is, each part in each heat exchange fin module can be divided into isometric some parts by heat pipe end section along its length, to be passed to heat exchange fin with making the even heat of heat pipe end section.The heat namely making heat exchange fin receive is more even, is convenient to its heat exchange more equably, improves heat exchange efficiency.Particularly, the upper part heat exchange fin of two heat exchange fin modules is positioned at the two ends, left and right of heat transfer substrate 11, and the lower part heat exchange fin of two heat exchange fin modules is positioned at the two ends, left and right of other heat transfer substrates 12.
Fig. 4 is the schematic diagram of the heat pipe of heat-exchanger rig according to the utility model embodiment.Composition graphs 1 and Fig. 4, first heat pipe 21 and the second heat pipe 22 can all roughly take the shape of the letter U, to make two end section of every root heat pipe be extended in parallel by the two ends of its centre portion in the same direction, and then two end section of every root heat pipe are all located in same heat exchange fin module.Composition graphs 1 and Fig. 4, the end section 212 of the first heat pipe 21 and another end section 213 are extended towards same one end (right-hand member of state shown in Fig. 1) of heat transfer substrate 11 along the length direction of heat transfer substrate 11 by the two ends of its centre portion 211, thus end section 212 and another end section 213 are all located in the heat exchange fin module being arranged in this end.It will be understood by those skilled in the art that in other embodiment of the utility model, the first heat pipe 21 and the second heat pipe 22 also can all roughly in Z-shaped.That is to say, two end section of every root heat pipe are extended towards two different ends of heat transfer substrate 11 along the length direction of heat transfer substrate 11 by the two ends of its centre portion respectively, thus make two end section of every root heat pipe be located in two the heat exchange fin modules being arranged in heat transfer substrate 11 two ends respectively.Certainly, in other embodiment other of the present utility model, the first heat pipe 21 can roughly take the shape of the letter U, and the second heat pipe 22 can roughly in Z-shaped, the first heat pipe 21 and arranging the second heat pipe 22 staggered interting.
Particularly, for the first heat pipe 21, as shown in Figure 3, the centre portion 211 of the first heat pipe 21 has the first linear pattern sub-segments 2111, the second linear pattern sub-segments 2112 and the 3rd linear pattern sub-segments 2113 that the width along heat transfer substrate connects successively.First linear pattern sub-segments 2111, second linear pattern sub-segments 2112 and the 3rd linear pattern sub-segments 2113 can be located on the same line, also can lay respectively on different straight lines, can also have on two straight lines of certain angle for adjacent two sub-segments are positioned at.The length of the first linear pattern sub-segments 2111, second linear pattern sub-segments 2112 and the 3rd linear pattern sub-segments 2113 can be isometric, also can Length discrepancy.
The utility model also provides a kind of semiconductor refrigerating equipment, comprises casing, semiconductor chilling plate and heat-exchanger rig 100.Room between the storing for stored article is limited with in casing.Between the cold junction of semiconductor chilling plate and storing, room is thermally coupled, thinks that between this storing, room provides cold.The heat-transfer surface of the heat transfer substrate 11 of heat-exchanger rig 100 and the hot junction of semiconductor chilling plate thermally coupled, with distribute this hot junction produce heat.
In embodiments more of the present utility model, the cold junction of semiconductor chilling plate can be close to inwall or the outer wall of room between storing, and the heat-transfer surface of heat transfer substrate 11 can be close in the hot junction of semiconductor chilling plate.Heat transfer substrate 11 is provided with screw fixing hole towards the side of heat-transfer surface, for the hot junction of fixing semiconductor chilling plate, ensures the reliably thermally coupled of this hot junction and heat-exchanger rig 100.In the utility model embodiment, heat-exchanger rig 100 can be heat abstractor, and in other embodiment of the utility model, heat-exchanger rig 100 also can be cold scattering device.
It will be understood by those skilled in the art that the semiconductor refrigerating equipment that relates in the utility model embodiment can for refrigerator, refrigerator-freezer, freezing and refrigeration tank or other utilize semiconductor chilling plate to carry out the equipment freezed.
Those skilled in the art will also be understood that, in case of no particular description, alleged by the utility model " on ", D score, "left", "right", " front " and " afterwards " are all normal operating conditions of the heat-exchanger rig 100 be arranged in semiconductor refrigerating equipment be benchmark.
So far, those skilled in the art will recognize that, although multiple exemplary embodiment of the present utility model is illustrate and described herein detailed, but, when not departing from the utility model spirit and scope, still can directly determine or derive other modification many or amendment of meeting the utility model principle according to content disclosed in the utility model.Therefore, scope of the present utility model should be understood and regard as and cover all these other modification or amendments.
Claims (10)
1. a heat-exchanger rig, is characterized in that, comprising:
Heat transfer substrate, has the hot linked heat-transfer surface with thermal source, to receive heat from described thermal source;
At least one heat pipe, has the end section extended along the length direction of described heat transfer substrate by the two ends of described centre portion respectively with the hot linked centre portion of described heat transfer substrate and two; And
Multiple heat exchange fin, is arranged in the end section of described heat pipe, to distribute the heat transmitted to described end section from described centre portion; Wherein
Described heat transfer substrate is provided with blower fan, flows towards described heat exchange fin to order about air-flow.
2. heat-exchanger rig according to claim 1, is characterized in that,
Spacing between adjacent two heat exchange fins in described multiple heat exchange fin is greater than a predetermined minimum spacing threshold value.
3. heat-exchanger rig according to claim 1, is characterized in that,
All be formed with air vent in the lamellar body of each described heat exchange fin, and the air vent forward of adjacent two heat exchange fins is relative.
4. heat-exchanger rig according to claim 1, is characterized in that,
Described multiple heat exchange fin is distributed in the two ends of described heat transfer substrate, and to form two independently heat exchange fin modules, described blower fan is configured to simultaneously towards described two heat exchange fin module blow flow.
5. heat-exchanger rig according to claim 4, is characterized in that, also comprises:
At least one other heat transfer substrate, described heat transfer substrate and at least one other heat transfer substrate described side by side and be disposed in the space between described two heat exchange fin modules, described heat transfer substrate and at least one other heat transfer substrate described are provided with a described blower fan.
6. heat-exchanger rig according to claim 5, is characterized in that,
Described heat transfer substrate and at least one other heat transfer substrate described all arrange at least one described heat pipe, and the heat pipe in described heat transfer substrate and at least one other heat transfer substrate described shares described multiple heat exchange fin.
7. heat-exchanger rig according to claim 6, is characterized in that,
At least one other heat transfer substrate described comprise other heat transfer substrates described in; And
Between two end section of at least one heat pipe of one of them end section in these other heat transfer substrates of heat pipe described at least one of described heat transfer substrate; Between two end section of at least one heat pipe of one of them end section in described heat transfer substrate of heat pipe described at least one of these other heat transfer substrates.
8. heat-exchanger rig according to claim 7, is characterized in that,
Each heat exchange fin module is divided into upper and lower two parts, and the heat pipe end section be located in each part is configured to length direction along described heat exchange fin to be equidistantly spaced.
9. heat-exchanger rig according to claim 1, is characterized in that,
Described blower fan comprises the aerofoil fan for driving air-flow to flow towards described heat exchange fin and is fixed on described heat transfer substrate to hold the casing of described aerofoil fan.
10. a semiconductor refrigerating equipment, is characterized in that, comprising:
Casing, is limited with room between the storing for stored article in it;
Semiconductor chilling plate, between its cold junction and described storing, room is thermally coupled, thinks that between described storing, room provides cold; And
Heat-exchanger rig described in any one of claim 1-9, the heat-transfer surface of its heat transfer substrate and the hot junction of described semiconductor chilling plate thermally coupled, with distribute described hot junction produce heat.
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CN201520278435.2U CN204612555U (en) | 2015-04-30 | 2015-04-30 | Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig |
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CN201520278435.2U CN204612555U (en) | 2015-04-30 | 2015-04-30 | Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105466100A (en) * | 2015-12-24 | 2016-04-06 | 青岛海尔电冰箱有限公司 | Heat exchanging device and semiconductor cooling refrigerator comprising same |
CN105466261A (en) * | 2015-12-24 | 2016-04-06 | 青岛海尔电冰箱有限公司 | Heat exchange device and semiconductor refrigeration refrigerator provided with heat exchange device |
CN105485969A (en) * | 2015-12-24 | 2016-04-13 | 青岛海尔电冰箱有限公司 | Heat exchange device and semiconductor refrigeration refrigerator with same |
CN105910477A (en) * | 2016-05-06 | 2016-08-31 | 刘少春 | Air-cooling-type cooler |
WO2016173231A1 (en) * | 2015-04-30 | 2016-11-03 | 青岛海尔智能技术研发有限公司 | Heat exchange device and semiconductor refrigeration equipment having the heat exchange device |
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2015
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2016173231A1 (en) * | 2015-04-30 | 2016-11-03 | 青岛海尔智能技术研发有限公司 | Heat exchange device and semiconductor refrigeration equipment having the heat exchange device |
CN106197099A (en) * | 2015-04-30 | 2016-12-07 | 青岛海尔智能技术研发有限公司 | Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig |
CN105466100A (en) * | 2015-12-24 | 2016-04-06 | 青岛海尔电冰箱有限公司 | Heat exchanging device and semiconductor cooling refrigerator comprising same |
CN105466261A (en) * | 2015-12-24 | 2016-04-06 | 青岛海尔电冰箱有限公司 | Heat exchange device and semiconductor refrigeration refrigerator provided with heat exchange device |
CN105485969A (en) * | 2015-12-24 | 2016-04-13 | 青岛海尔电冰箱有限公司 | Heat exchange device and semiconductor refrigeration refrigerator with same |
CN105485969B (en) * | 2015-12-24 | 2018-10-12 | 青岛海尔电冰箱有限公司 | Heat-exchanger rig and semiconductor freezer with the heat-exchanger rig |
CN105466100B (en) * | 2015-12-24 | 2018-10-12 | 青岛海尔电冰箱有限公司 | Heat-exchanger rig and semiconductor freezer with the heat-exchanger rig |
CN105910477A (en) * | 2016-05-06 | 2016-08-31 | 刘少春 | Air-cooling-type cooler |
CN105910477B (en) * | 2016-05-06 | 2017-11-21 | 刘少春 | Air cooled chiller |
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