CN107764113A - Heat-exchanger rig and the semiconductor refrigerating equipment with the heat-exchanger rig - Google Patents
Heat-exchanger rig and the semiconductor refrigerating equipment with the heat-exchanger rig Download PDFInfo
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- CN107764113A CN107764113A CN201610688654.7A CN201610688654A CN107764113A CN 107764113 A CN107764113 A CN 107764113A CN 201610688654 A CN201610688654 A CN 201610688654A CN 107764113 A CN107764113 A CN 107764113A
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- Prior art keywords
- heat
- radiating fin
- radiating
- group
- transfer substrate
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/30—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being attachable to the element
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/003—Details of machines, plants or systems, using electric or magnetic effects by using thermionic electron cooling effects
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a kind of heat-exchanger rig and with the heat-exchanger rig semiconductor refrigerating equipment.The heat-exchanger rig includes：At least one heat transfer substrate, each heat transfer substrate be respectively provided with the hot linked heat-transfer surface of thermal source, with from corresponding thermal source receive heat；At least first heat pipe, the first heat pipe have jointing hot linked with a heat transfer substrate and the radiating section extended by one end of jointing towards the horizontal side of heat transfer substrate；First radiating fin group, it includes multiple first radiating fins of vertically extending and laterally spaced setting, and the first radiating fin group is arranged on the radiating section of the first heat pipe, to distribute the heat from jointing to radiating section transmission；And blower fan, it is arranged on above or below at least one heat transfer substrate and/or the first radiating fin group, is configured to drive in gap of the air-flow between the first adjacent radiating fin of any two and vertically flows.The present invention can reduce the thickness of heat-exchanger rig, and improve its radiating efficiency.
Description
Technical field
The present invention relates to heat transfer technology, more particularly to a kind of heat-exchanger rig and the semiconductor refrigerating with the heat-exchanger rig
Equipment.
Background technology
In recent years, semiconductor refrigerating equipment is widely used due to its superior performance, such as semiconductor freezer,
Semiconductor refrigerating refrigerator-freezer etc..Semiconductor refrigerating equipment realizes system using the automatic pressure-transforming Variable flow control technology of semiconductor chilling plate
It is cold, while radiating is realized by heat pipe and conduction technique, without refrigeration working medium and mechanical moving element.Therefore, semiconductor refrigerating
Equipment does not have the tradition machinery such as Working medium pollution and mechanical oscillation refrigeration plant applying upper a series of problems in application process.
However, while the cold end of semiconductor chilling plate produces cold, its hot junction can produce substantial amounts of heat.Semiconductor system
The heat in cold hot junction is the summation of its cold end refrigerating capacity and electrical power.Simultaneously as the hot junction area of semiconductor chilling plate is very
It is small, cause heat flow density very big.For example conventional TEC1-12708 size is 50*50mm, its maximum thermal power=electrical power
(12V*8A)+69W=165W；In view of mal-condition of environment temperature when high, it is necessary to ensure the heat-sinking capability of radiator at least
1.2~1.5 times of its maximum thermal power, about 198~247.5W.Because semiconductor chilling plate hot junction generates substantial amounts of heat,
To ensure that semiconductor chilling plate is reliably continued for work, it is necessary to be radiated in time to hot junction.
It is strong typically by setting blower fan to carry out radiating fin for the hot-side heat dissipation of semiconductor chilling plate in the prior art
The scheme of heat loss through convection processed, to improve heat exchange efficiency.But the defects of prior art is that radiating fin volume itself is larger, separately
Also axial flow blower need to be set in the side of radiating fin outside, with to the gap blow flow between two adjacent fins, or slave phase
Gap suction airflow between adjacent two fins.The volume of this heat exchanger is bigger, it is necessary to installing space is big, is not suitable for
Installed in less space.In addition, the hot-side heat dissipation of semiconductor chilling plate comes typically by the rotating speed and power of increase blower fan
Reach the purpose of radiating, radiating efficiency difference and the big high energy consumption of noise.
Also, prior art can not effectively solve the heat dissipation problem of the high semiconductor chilling plate of heat flow density, so that can not
Ensure semiconductor refrigerating ability.For example, the volume of conventional semiconductor freezer, which is generally less than, is equal to 50L, in environment temperature
For 32 DEG C when, ice the temperature inside the box can only pull down to 12 DEG C, can not realize lower temperature, lead to not to realize big volume that (volume is big
In 50L) semiconductor freezer.
The content of the invention
One purpose of first aspect present invention is intended to overcome at least one defect of existing heat-exchanger rig, there is provided Yi Zhonghuan
The high heat-exchanger rig of the thermal efficiency.
One of first aspect present invention is further objective is that the uniformity of heat-exchanger rig heat exchange will be improved.
One purpose of second aspect of the present invention is to provide a kind of semiconductor refrigerating equipment with heat-exchanger rig.
According to the first aspect of the invention, there is provided a kind of heat-exchanger rig, including：
At least one heat transfer substrate, each heat transfer substrate be respectively provided with the hot linked heat-transfer surface of thermal source, with from corresponding
Thermal source receive heat；
At least first heat pipe, first heat pipe have jointing hot linked with the heat transfer substrate and
The radiating section extended by one end of the jointing towards the horizontal side of the heat transfer substrate；
First radiating fin group, it includes multiple first radiating fins of vertically extending and laterally spaced setting, described
First radiating fin group is arranged on the radiating section of first heat pipe, to distribute from the jointing to the radiating area
The heat of section transmission；And
Blower fan, it is arranged on above or below at least one heat transfer substrate and/or the first radiating fin group, matches somebody with somebody
It is set to drive in gap of the air-flow between the first adjacent radiating fin of any two and vertically flows.
Alternatively, the first radiating fin component is upper fins group and lower fins group, wherein the upper fins
It is adjacent that horizontal spacing in group between the first adjacent radiating fin of any two is less than any two in the lower fins group
The first radiating fin between horizontal spacing；
The blower fan be configured to drive air-flow from the lower end of the first radiating fin group any two it is adjacent first
Flowed vertically upwards in gap between radiating fin.
Alternatively, the heat-exchanger rig also includes：
At least second heat pipe, second heat pipe have jointing hot linked with the heat transfer substrate and
The radiating section extended by one end of the jointing towards the horizontal opposite side of the heat transfer substrate；With
Second radiating fin group, it includes multiple second radiating fins of vertically extending and laterally spaced setting, described
Second radiating fin group is arranged on the radiating section of second heat pipe, to distribute from the jointing to the radiating area
The heat of section transmission, wherein
The blower fan is arranged on the lower section of at least one heat transfer substrate, is configured to drive air-flow simultaneously from described first
Along perpendicular in gap of the lower end of radiating fin group and the second radiating fin group between the adjacent radiating fin of any two
To flowing up.
Alternatively, the second radiating fin group is also classified into upper fins group and lower fins group, wherein described second dissipates
Horizontal spacing in the upper fins group of hot fins set between the second adjacent radiating fin of any two is less than its underpart fin
Horizontal spacing in group between the second adjacent radiating fin of any two.
Alternatively, the quantity of the heat transfer substrate is two, and two heat transfer substrates are in the first radiating fin group
Vertically it is arranged at intervals between the second radiating fin group；And
Quantity with each hot linked first heat pipe of heat transfer substrate and second heat pipe is multiple.
Alternatively, the upper fins group of the upper fins group of the first radiating fin group and the second radiating fin group
It is separately positioned on first heat pipe hot linked with the heat transfer substrate above and second heat pipe；
The lower fins group of the lower fins group of the first radiating fin group and the second radiating fin group is set respectively
Put with underlying hot linked first heat pipe of heat transfer substrate and second heat pipe.
Alternatively, the radiating section of first heat pipe and the radiating section of second heat pipe prolong in the horizontal direction
Stretch；
With in hot linked first heat pipe of the upper fins group of the first radiating fin group, two adjacent
Vertical spacing between the radiating section of one heat pipe gradually increases from up to down；
With in hot linked first heat pipe of the lower fins group of the first radiating fin group, two adjacent
Vertical spacing between the radiating section of one heat pipe gradually increases from up to down；
With in hot linked second heat pipe of the upper fins group of the second radiating fin group, two adjacent
Vertical spacing between the radiating section of two heat pipes gradually increases from up to down；And
With in hot linked second heat pipe of the lower fins group of the second radiating fin group, two adjacent
Vertical spacing between the radiating section of two heat pipes gradually increases from up to down.
Alternatively, the jointing of first heat pipe and second heat pipe is vertically or horizontal direction is embedded
In the heat transfer substrate；
First heat pipe and the relatively described heat transfer substrate pair of second heat pipe that jointing vertically extends
Claim to set；And
The first radiating fin group and the relatively described heat transfer substrate of the second radiating fin group are symmetrical arranged.
Alternatively, the blower fan is centrifugal blower；
The heat-exchanger rig also includes：Wind-guiding air channel, the air-flow for the blower fan to be blowed are delivered to bottom-uply
The lower end of the first radiating fin group and the second radiating fin group.
According to the second aspect of the invention, there is provided a kind of semiconductor refrigerating equipment, including：
Casing, the storing compartment for storing article is defined in it；
At least one semiconductor chilling plate, its cold end and the storing compartment are thermally coupled, to be provided for the storing compartment
Cold；And
It is preceding it is any as described in heat-exchanger rig, the heat-transfer surface of its at least one heat transfer substrate and at least one semiconductor
The hot junction of cooling piece is thermally coupled, to distribute heat caused by the hot junction.
The heat-exchanger rig of the present invention drives due to being set above or below heat transfer substrate and/or the first radiating fin group
The blower fan that air-flow vertically flows in the gap between the first adjacent radiating fin of any two, make air-flow along the first radiating
The heat-delivery surface of fin vertically flows, and adds the air flow amount of the first radiating fin, improves and flows through the first radiating fin
The air velocity of piece heat exchange surface, so as to carry out forced-convection heat transfer between air and the first radiating fin, improve heat-exchanger rig
Heat exchange efficiency.It is also, middle compared with prior art that blower fan is arranged on biography using the mode blown before and after axial flow blower, the present invention
Above or below hot substrate and/or the first radiating fin group, using upside or downside air supply mode, heat-exchanger rig can be reduced
Front and rear thickness and cumulative volume.Also, the front side or rear side due to heat-exchanger rig are arranged in the equipment residing for thermal source, so that
Gap between equipment residing for heat-exchanger rig and thermal source is smaller, and air supply mode can not be effectively by radiating fin before and after so utilizing
Heat distribute.And the application is by using upside or downside air supply mode, it is possible to provide sufficient air quantity is effectively by radiating fin
The heat of piece distributes, and improves the radiating efficiency of heat-exchanger rig.
Further, the first radiating fin component is upper fins group and lower fins group by the present invention, its middle and upper part wing
It is adjacent that horizontal spacing in piece group between the first adjacent radiating fin of any two is less than any two in lower fins group
Horizontal spacing between first radiating fin；And blower fan is arranged to drive air-flow in office from the lower end of the first radiating fin group
Flowed vertically upwards in gap between two the first adjacent radiating fins of meaning.The present invention sets the first radiating fin component
The structure of upper tightly lower sparse is set to, coordinates the flowing of wind-force, solves the problems, such as the windage between fin, is ensured in the first radiating fin group
The fin in portion and the fin of bottom can obtain effective air blast cooling radiating.
The heat-exchanger rig of the present invention, which has been inventor, solves the heat-exchanger rig in the case of big heat flow density in the prior art
Thickness is big, noise is big, radiating it is uneven the problems such as and it is specially designed.It can reduce heat exchange by using the air-supply of downside centrifugal blower
The space thickness that aerofoil fan occupies when being blown before and after device, so as to reduce the thickness of heat-exchanger rig and volume；Using centrifugation wind
Machine and the wind-guiding air channel air-supply specially set, reduce the noise of heat-exchanger rig, improve heat exchange efficiency.Centrifuged in the present invention
Blower fan substitutes axial flow blower air-supply structure before and after fin, and fins set is adopted in the prior art in fin upper and lower sides air-supply structure
With upper tightly lower sparse structure, can effectively solve heat exchanger thickness in the case of big heat flow density, the problems such as noise is big, radiating is uneven.
Further, heat-exchanger rig of the invention uses the mode of double heat transfer substrates as double semiconductor chilling plates while dissipated
Heat, heat-exchanger rig thickness is small, and is provided with below heat-exchanger rig centrifugal blower and wind-guiding air channel and is blown to low noise and strong
Change radiating；Fin structure uses upper tightly lower sparse mode, solve heat-exchanger rig due to upper fins it is overstocked caused by windage it is excessive,
The problem of upper fins radiating effect is deteriorated.Meanwhile solve top and the bottom fin surface the temperature difference greatly and upper and lower semiconductor refrigerating
The problem of excessive temperature differentials of heat transfer substrate corresponding to piece.The present invention can use an integrated heat exchange device as double semiconductor chilling plates
High efficiency and heat radiation is carried out, and heat-exchanger rig thickness is small, entirety occupies little space, blower fan quantity is few, and noise is small, and air-supply is more uniform.
According to the accompanying drawings will be brighter to the detailed description of the specific embodiment of the invention, those skilled in the art
Above-mentioned and other purposes, the advantages and features of the present invention.
Brief description of the drawings
Some specific embodiments of the present invention are described in detail by way of example, and not by way of limitation with reference to the accompanying drawings hereinafter.
Identical reference denotes same or similar part or part in accompanying drawing.It should be appreciated by those skilled in the art that these
What accompanying drawing was not necessarily drawn to scale.In accompanying drawing：
Fig. 1 is the schematic diagram of heat-exchanger rig according to an embodiment of the invention；
Fig. 2 is the schematic elevational view of heat-exchanger rig shown in Fig. 1；
Fig. 3 is the schematic plan of heat-exchanger rig shown in Fig. 1, and blower fan and wind-guiding air channel are eliminated in figure；
Fig. 4 is the schematic side elevation of semiconductor refrigerating equipment according to an embodiment of the invention.
Embodiment
Fig. 1 is the schematic diagram of heat-exchanger rig 100 according to an embodiment of the invention；Fig. 2 is exchanged heat shown in Fig. 1
The schematic elevational view of device 100；Fig. 3 is the schematic plan of heat-exchanger rig 100 shown in Fig. 1.As shown in Figure 1 to Figure 3, change
Thermal 100 may include：At least one heat transfer substrate, at least first heat pipe 110, the first radiating fin group and blower fan
150。
Heat transfer substrate have with the hot linked heat-transfer surface of thermal source, to receive heat from thermal source.First heat pipe 110 has and one
The hot linked jointing 111 of individual heat transfer substrate and extended towards the horizontal side of heat transfer substrate by one end of jointing 111
Radiate section 112.Jointing 111 and radiating section 112 between can directly transition be connected, can also pass through turning section phase
Even.
First radiating fin group includes vertically extending and laterally spaced setting multiple first radiating fins 310, and first
Radiating fin group is arranged on the radiating section 112 of the first heat pipe 110, is passed with distributing from jointing 111 to radiating section 112
The heat sent.Blower fan 150 may be provided above or below foregoing at least one heat transfer substrate and/or the first radiating fin group.
That is, blower fan 150 may be provided above or below foregoing at least one heat transfer substrate, or it is arranged on the first radiating fin
Above or below piece group；Or it is arranged on above or below heat transfer substrate and the first radiating fin group.Blower fan 150 is configured to
Drive in gap of the air-flow between the first adjacent radiating fin 310 of any two and vertically flow, so that air and
Forced-convection heat transfer occurs for one radiating fin 310, improves heat exchange efficiency.
The heat-exchanger rig 100 of the present invention above or below heat transfer substrate and/or the first radiating fin group due to setting
The blower fan 150 vertically flowed in gap of the air-flow between the first adjacent radiating fin 310 of any two is driven, makes air-flow
Vertically flowed along the heat-delivery surface of the first radiating fin 310, add the air flow amount of the first radiating fin 310, improved
The air velocity of the heat exchange surface of the first radiating fin 310 is flowed through, so as to forced between air and the first radiating fin 310
Heat convection, improve the heat exchange efficiency of heat-exchanger rig 100.It is also, middle using blowing before and after axial flow blower compared with prior art
Blower fan 150 is arranged on above or below heat transfer substrate and/or the first radiating fin group by mode, the present invention, using upside or
Downside air supply mode, the front and rear thickness and cumulative volume of heat-exchanger rig 100 can be reduced.Also, front side due to heat-exchanger rig 100 or
Rear side is arranged in the equipment residing for thermal source, so that the gap between equipment residing for heat-exchanger rig 100 and thermal source is smaller, this
Air supply mode effectively can not distribute the heat of radiating fin before and after sample utilizes.And the application is sent by using upside or downside
Wind mode, it is possible to provide sufficient air quantity effectively distributes the heat of radiating fin.
In some embodiments of the invention, the first radiating fin component is upper fins group 31 and lower fins group 32,
Horizontal spacing wherein in upper fins group 31 between the first adjacent radiating fin 310 of any two is less than lower fins group 32
Horizontal spacing between the first adjacent radiating fin 310 of middle any two.It will be understood by those skilled in the art that the first radiating
Fins set is integral structure, and upper fins group 31 and lower fins group 32 are connected as a single entity, and is not the form being separated.
That is the first radiating fin group is arranged to the form of upper tightly lower sparse, the transverse direction between the fin on the first radiating fin group top
Spacing is smaller, and the horizontal spacing between the fin of the first radiating fin group bottom is larger.Blower fan 150 is configured to drive air-flow from
Flowed vertically upwards in gap between the first adjacent radiating fin 310 of any two the lower end of one radiating fin group.
The embodiment of the present invention coordinates the flowing of wind-force, solved by the way that the first radiating fin component to be arranged to the structure of upper tightly lower sparse
Windage problem between fin, ensure that the fin of the first radiating fin group middle and upper part and the fin of bottom can obtain effectively by force
Wind-cooling heat dissipating processed.
In certain embodiments, the upper fins group 31 of the first radiating fin group and lower fins group 32 are in vertical direction
Height can be with essentially identical.In certain embodiments, the first radiating fin 310 in the first radiating fin group can be arranged to have
There are two kinds of different heights, by shorter the first radiating fin of one or more 310 between two the first higher radiating fins 310
Separate, so that the first radiating fin group has the form of upper tightly lower sparse.Wherein, the top of the first higher radiating fin 310
The first shorter radiating fin 310 forms upper fins group 31, and bottom wing is formed at the bottom of the first higher radiating fin 310
Piece group 32.
In some embodiments of the invention, heat-exchanger rig 100 may also include：At least second heat pipe 120 and second
Radiating fin group.Second heat pipe 120 has jointing 121 hot linked with a heat transfer substrate and by jointing 121
The radiating section 122 that one end extends towards the horizontal opposite side of heat transfer substrate.Second radiating fin group includes vertically extending and along horizontal stroke
To spaced multiple second radiating fins 410, the second radiating fin group is arranged on the radiating section 122 of the second heat pipe 120
On, to distribute the heat transmitted from jointing 121 to radiating section 122.In such embodiments, blower fan 150 is arranged on
The lower section of foregoing at least one heat transfer substrate, it is configured to drive air-flow simultaneously from the first radiating fin group and the second radiating fin group
Gap of the lower end between the adjacent radiating fin of any two in flow vertically upwards.
In certain embodiments, blower fan 150 is centrifugal blower.Heat-exchanger rig 100 may also include：Wind-guiding air channel 160, is used for
The air-flow that blower fan 150 is blowed is delivered to the lower end of the first radiating fin group and the second radiating fin group bottom-uply, so as to
Realize low noise air-supply and strengthen radiating.
In embodiments of the present invention, the second heat pipe 120 can be identical with the structure of the first heat pipe 110；Second radiating fin group
Structure with the first radiating fin group can be identical.The radiating section 112 of wherein the first heat pipe 110 is located at horizontal the one of heat transfer substrate
Side, correspondingly, the first radiating fin group also are located at the horizontal side of heat transfer substrate；The radiating section of second heat pipe 120 122
In the horizontal opposite side of heat transfer substrate, correspondingly, the second radiating fin group also is located at the horizontal opposite side of heat transfer substrate.Also
It is to say, the radiating radiating fin group of section 112 and first and the radiating section 122 and second of the second heat pipe 120 of the first heat pipe 110
Radiating fin group is located at the both lateral sides of heat transfer substrate respectively.In such embodiments, it can lead to the heat in heat transfer substrate
Cross the first heat pipe 110 and the second heat pipe 120 is equably distributed into two radiating fin groups, improve heat-exchanger rig 100 and exchange heat
Heat exchange efficiency and uniformity.
Similar with the structure of the first radiating fin group, the second radiating fin group can be divided into upper fins group 41 and lower fins
Group 42, wherein the horizontal stroke in the upper fins group 41 of the second radiating fin group between the second adjacent radiating fin 410 of any two
To the horizontal spacing being smaller than between the second adjacent radiating fin 410 of any two in its underpart fins set 42.
In some embodiments of the invention, the quantity of heat transfer substrate is two, and two heat transfer substrates are in the first radiating fin
Vertically it is arranged at intervals between piece group and the second radiating fin group.Two heat transfer substrates can be specially the first heat transfer substrate 10 and
Two heat transfer substrates 20, as shown in figure 1, the first heat transfer substrate 10 is arranged on the top of the second heat transfer substrate 20.
The radiating fin group of radiating section 112 and first of first heat pipe 110 is positioned at the first heat transfer substrate 10 and the second heat transfer
The horizontal side of substrate 20, the radiating fin group of radiating section 122 and second of the second heat pipe 120 are located at the He of the first heat transfer substrate 10
The horizontal opposite side of second heat transfer substrate 20.With 20 hot linked first heat pipe of the first heat transfer substrate 10 and the second heat transfer substrate
110 and second the quantity of heat pipe 120 be multiple.That is, there are multiple first heat pipes 110 and multiple second heat pipes 120 same
When it is thermally coupled with the first heat transfer substrate 10；Have multiple first heat pipes 110 and multiple second heat pipes 120 simultaneously with the second heat transfer substrate
20 is thermally coupled.
The upper fins group 31 of first radiating fin group is arranged on and 10 hot linked first heat pipe 110 of the first heat transfer substrate
On；The upper fins group 41 of second radiating fin group be arranged on on 10 hot linked second heat pipe 120 of the first heat transfer substrate.The
The lower fins group 32 of one radiating fin group be arranged on on 20 hot linked first heat pipe 110 of the second heat transfer substrate；Second dissipates
The lower fins group 42 of hot fins set be arranged on on 20 hot linked second heat pipe 120 of the second heat transfer substrate.In such reality
Apply in example, the radiating fin of upper fins group 31 and second of the heat basic transmission of the first heat transfer substrate 10 to the first radiating fin group
The upper fins group 41 of piece group；The heat basic transmission of second heat transfer substrate 20 to the first radiating fin group lower fins group 32
With the lower fins group 42 of the second radiating fin group.Because the first radiating fin group in the preferred embodiment of the present invention and second radiate
The structure of fins set uses upper tightly lower sparse mode, solve heat-exchanger rig 100 due to upper fins it is overstocked caused by windage it is excessive,
The problem of upper fins radiating effect is deteriorated, it is big to avoid the temperature difference of top and the bottom fin surface, influences to the first heat transfer substrate 10
Radiating.
The embodiment of the present invention is designed using the radiation fin structure and double heat transfer substrates of upper tightly lower sparse, and coordinates the stream of wind-force
It is dynamic, it is ensured that the radiating of two semiconductor chilling plates.Test shows that the heat-exchanger rig 100 of the embodiment of the present invention can ensure always
The heat radiation power of body is 1.2 times to 1.5 times of two semiconductor chilling plate maximum thermal powers, so as to ensure semiconductor chilling plate
Reliably it is continued for work.
The radiating section 122 of the radiating heat pipe 120 of section 112 and second of first heat pipe 110 is horizontally extending.
With in hot linked first heat pipe 110 of upper fins group 31 of the first radiating fin group, two the first adjacent heat pipes 110 dissipate
Vertical spacing between hot-section 112 gradually increases from up to down；Connect in the heat of lower fins group 32 with the first radiating fin group
In the first heat pipe 110 connect, vertical spacing between the radiating section 112 of two the first adjacent heat pipes 110 from up to down by
It is cumulative big.That is, vertically it is smaller than between the radiating section 112 of two adjacent first heat pipes 110 above
Vertical spacing between the radiating section 112 of underlying two adjacent first heat pipes 110.So as to for the first radiating fin
For the upper fins group 31 and lower fins group 32 of piece group, its heat relatively concentrates on top, in the bottom-up flowing of air-flow
During, advantageously in radiating.
Similarly, with hot linked second heat pipe 120 of the upper fins group 41 of the second radiating fin group, two adjacent
The second heat pipe 120 radiating section 122 between vertical spacing gradually increase from up to down；With the second radiating fin group
It is perpendicular between the radiating section 122 of two the second adjacent heat pipes 120 in hot linked second heat pipe 120 of lower fins group 42
Gradually increase from up to down to spacing.That is, the radiating section 122 of two adjacent second heat pipes 120 above it
Between the vertical spacing being vertically smaller than between the radiating section 122 of underlying two adjacent second heat pipes 120, so as to
It is more beneficial for radiating.
The jointing of first heat pipe 110 and the second heat pipe 120 is vertically or horizontal direction is embedded in heat transfer substrate
In；The first heat pipe 110 and the opposing heat transfer substrate of the second heat pipe 120 that jointing vertically extends are symmetrical arranged；Connection
The first horizontally extending heat pipe 110 of section and the second heat pipe 120 neighbouring can be set；First radiating fin group and second dissipates
Hot fins set opposing heat transfer substrate is symmetrical arranged.It will be understood by those skilled in the art that be symmetrical arranged can be with for opposing heat transfer substrate
It is interpreted as being symmetrical arranged relative to the vertical plane in the horizontal dividing heat transfer substrate or so equally.So it is provided with and is beneficial to make first to dissipate
The heat that hot fins set and the second radiating fin group receive is more uniform, is easy to it more uniformly to exchange heat, and improves heat exchange effect
Rate, while also ensure that the overall integral structure of heat-exchanger rig 100 and attractive in appearance.
Referring to Fig. 4, the present invention also provides a kind of semiconductor refrigerating equipment 200, including casing 210, at least one semiconductor
Cooling piece and heat-exchanger rig 100.The storing compartment 211 for storing article is defined in casing 210.Semiconductor chilling plate it is cold
End is thermally coupled with storing compartment 211, to provide cold for the storing compartment 211.At least one heat transfer substrate of heat-exchanger rig 100
Heat-transfer surface and at least one semiconductor chilling plate hot junction it is thermally coupled, to distribute heat caused by the hot junction.
In some embodiments of the invention, the cold end of semiconductor chilling plate can be close to the inwall or outer of storing compartment 211
Wall, the hot junction of semiconductor chilling plate can be close to the heat-transfer surface of heat transfer substrate.Each heat transfer substrate is set towards the side of heat-transfer surface
There is screw fixing hole, for fixing the hot junction of semiconductor chilling plate, ensure the reliable thermally coupled of the hot junction and heat-exchanger rig 100.
In embodiments of the present invention, heat-exchanger rig 100 can be heat abstractor, and in the other embodiments of the present invention, heat-exchanger rig 100 is also
It can be cold scattering device.
In a preferred embodiment, the quantity of semiconductor chilling plate and heat transfer substrate is two.Two heat transfer substrates exist
Vertically it is arranged at intervals between first radiating fin group and the second radiating fin group, respectively a semiconductor chilling plate radiating.
Heat transfer substrate is close to the hot junction of semiconductor chilling plate during work, and heat is quickly delivered on radiating fin by heat pipe and carried out
Radiating；Then wind is radially sent in wind-guiding air channel 160 by axial air draught by centrifugal blower, wind-guiding air channel 160 is by wind water conservancy diversion
At left and right sides of to heat transfer substrate in the gap of fin, accelerate air current flow between fin, improve fin efficiency.In the preferred reality
Apply in example, the structure of heat-exchanger rig 100 can realize that the radiating of the big heat flow density and higher calorific power of double semiconductor chilling plates is asked
Topic, can be by the expanded in volume of refrigerator compartment to 50L to 200L.When environment temperature is 32 DEG C, the refrigerating capacity of refrigerator can be by ice
The indoor temperature of case pulls down to 5 DEG C, meets the temperature of refrigerating chamber, realizes the big volume refrigerator of double semiconductor chilling plates.
It will be understood by those skilled in the art that the semiconductor refrigerating equipment 200 being related in the embodiment of the present invention can be refrigerator,
Refrigerator-freezer, freezing and refrigeration tank or other equipment freezed using semiconductor chilling plate.
It should also be understood by those skilled in the art that the heat-exchanger rig 100 of the embodiment of the present invention is except can be used for semiconductor system
Outside cool equipment, the cooling application occasion such as LED or IGBT can be used for.
So far, although those skilled in the art will appreciate that detailed herein have shown and described multiple showing for the present invention
Example property embodiment, still, still can be direct according to present disclosure without departing from the spirit and scope of the present invention
It is determined that or derive many other variations or modifications for meeting the principle of the invention.Therefore, the scope of the present invention is understood that and recognized
It is set to and covers other all these variations or modifications.
Claims (10)
1. a kind of heat-exchanger rig, including：
At least one heat transfer substrate, each heat transfer substrate be respectively provided with the hot linked heat-transfer surface of thermal source, with from corresponding heat
Source receives heat；
At least first heat pipe, first heat pipe have jointing hot linked with the heat transfer substrate and by institutes
State the radiating section that one end of jointing extends towards the horizontal side of the heat transfer substrate；
First radiating fin group, it includes multiple first radiating fins of vertically extending and laterally spaced setting, and described first
Radiating fin group is arranged on the radiating section of first heat pipe, is passed with distributing from the jointing to the radiating section
The heat sent；And
Blower fan, it is arranged on above or below at least one heat transfer substrate and/or the first radiating fin group, is configured to
Drive in gap of the air-flow between the first adjacent radiating fin of any two and vertically flow.
2. heat-exchanger rig according to claim 1, wherein
The first radiating fin component is upper fins group and lower fins group, wherein any two in the upper fins group
Horizontal spacing between the first adjacent radiating fin is less than the first radiating fin that any two is adjacent in the lower fins group
Horizontal spacing between piece；
The blower fan is configured to drive air-flow from the lower end of the first radiating fin group in the first adjacent radiating of any two
Flowed vertically upwards in gap between fin.
3. heat-exchanger rig according to claim 1 or 2, in addition to：
At least second heat pipe, second heat pipe have jointing hot linked with the heat transfer substrate and by institutes
State the radiating section that one end of jointing extends towards the horizontal opposite side of the heat transfer substrate；With
Second radiating fin group, it includes multiple second radiating fins of vertically extending and laterally spaced setting, and described second
Radiating fin group is arranged on the radiating section of second heat pipe, is passed with distributing from the jointing to the radiating section
The heat sent, wherein
The blower fan is arranged on the lower section of at least one heat transfer substrate, is configured to drive air-flow simultaneously from the described first radiating
In gap of the lower end of fins set and the second radiating fin group between the adjacent radiating fin of any two vertically to
Upper flowing.
4. heat-exchanger rig according to claim 3, wherein
The second radiating fin group is also classified into upper fins group and lower fins group, wherein the second radiating fin group is upper
Horizontal spacing in portion's fins set between the second adjacent radiating fin of any two is less than any two in the fins set of its underpart
Horizontal spacing between the second adjacent radiating fin.
5. heat-exchanger rig according to claim 4, wherein
The quantity of the heat transfer substrate is two, and two heat transfer substrates dissipate in the first radiating fin group and described second
Vertically it is arranged at intervals between hot fins set；And
Quantity with each hot linked first heat pipe of heat transfer substrate and second heat pipe is multiple.
6. heat-exchanger rig according to claim 5, wherein
The upper fins group of the upper fins group of the first radiating fin group and the second radiating fin group is separately positioned on
With on hot linked first heat pipe of the heat transfer substrate above and second heat pipe；
The lower fins group of the lower fins group of the first radiating fin group and the second radiating fin group is separately positioned on
With on underlying hot linked first heat pipe of heat transfer substrate and second heat pipe.
7. heat-exchanger rig according to claim 6, wherein
The radiating section of first heat pipe and the radiating section of second heat pipe are horizontally extending；
With in hot linked first heat pipe of the upper fins group of the first radiating fin group, two adjacent first heat
Vertical spacing between the radiating section of pipe gradually increases from up to down；
With in hot linked first heat pipe of the lower fins group of the first radiating fin group, two adjacent first heat
Vertical spacing between the radiating section of pipe gradually increases from up to down；
With in hot linked second heat pipe of the upper fins group of the second radiating fin group, two adjacent second heat
Vertical spacing between the radiating section of pipe gradually increases from up to down；And
With in hot linked second heat pipe of the lower fins group of the second radiating fin group, two adjacent second heat
Vertical spacing between the radiating section of pipe gradually increases from up to down.
8. heat-exchanger rig according to claim 7, wherein
The jointing of first heat pipe and second heat pipe is vertically or horizontal direction is embedded in the heat transfer base
In plate；
First heat pipe and the relatively described heat transfer substrate of second heat pipe that jointing vertically extends symmetrically are set
Put；And
The first radiating fin group and the relatively described heat transfer substrate of the second radiating fin group are symmetrical arranged.
9. heat-exchanger rig according to claim 3, wherein
The blower fan is centrifugal blower；
The heat-exchanger rig also includes：Wind-guiding air channel, the air-flow for the blower fan to be blowed are delivered to described bottom-uply
The lower end of first radiating fin group and the second radiating fin group.
10. a kind of semiconductor refrigerating equipment, including：
Casing, the storing compartment for storing article is defined in it；
At least one semiconductor chilling plate, its cold end and the storing compartment are thermally coupled, to provide cold for the storing compartment；
And
Heat-exchanger rig any one of claim 1 to 9, the heat-transfer surface of its at least one heat transfer substrate and described at least one
The hot junction of individual semiconductor chilling plate is thermally coupled, to distribute heat caused by the hot junction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610688654.7A CN107764113A (en) | 2016-08-17 | 2016-08-17 | Heat-exchanger rig and the semiconductor refrigerating equipment with the heat-exchanger rig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610688654.7A CN107764113A (en) | 2016-08-17 | 2016-08-17 | Heat-exchanger rig and the semiconductor refrigerating equipment with the heat-exchanger rig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107764113A true CN107764113A (en) | 2018-03-06 |
Family
ID=61262428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610688654.7A Pending CN107764113A (en) | 2016-08-17 | 2016-08-17 | Heat-exchanger rig and the semiconductor refrigerating equipment with the heat-exchanger rig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107764113A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110749123A (en) * | 2019-10-10 | 2020-02-04 | 青岛海尔智能技术研发有限公司 | Radiator and refrigeration equipment |
| CN110749122A (en) * | 2019-10-10 | 2020-02-04 | 青岛海尔智能技术研发有限公司 | Radiator and refrigeration equipment |
| CN111623551A (en) * | 2020-06-12 | 2020-09-04 | 广东奥达信制冷科技有限公司 | Refrigerating system and refrigerating equipment |
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| CN105258382A (en) * | 2015-09-29 | 2016-01-20 | 青岛海尔特种电冰箱有限公司 | Heat exchange device and semiconductor refrigerator provided with same |
| CN105466261A (en) * | 2015-12-24 | 2016-04-06 | 青岛海尔电冰箱有限公司 | Heat exchange device and semiconductor refrigeration refrigerator provided with heat exchange device |
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| RU2219441C2 (en) * | 2001-12-21 | 2003-12-20 | Канюков Владимир Николаевич | Air conditioner |
| CN202254504U (en) * | 2011-08-02 | 2012-05-30 | 合肥雪祺电气有限公司 | Fin evaporator for refrigerator |
| CN105258382A (en) * | 2015-09-29 | 2016-01-20 | 青岛海尔特种电冰箱有限公司 | Heat exchange device and semiconductor refrigerator provided with same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110749123A (en) * | 2019-10-10 | 2020-02-04 | 青岛海尔智能技术研发有限公司 | Radiator and refrigeration equipment |
| CN110749122A (en) * | 2019-10-10 | 2020-02-04 | 青岛海尔智能技术研发有限公司 | Radiator and refrigeration equipment |
| CN111623551A (en) * | 2020-06-12 | 2020-09-04 | 广东奥达信制冷科技有限公司 | Refrigerating system and refrigerating equipment |
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