CN105716315B - Semiconductor refrigerating equipment - Google Patents
Semiconductor refrigerating equipment Download PDFInfo
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- CN105716315B CN105716315B CN201410711177.2A CN201410711177A CN105716315B CN 105716315 B CN105716315 B CN 105716315B CN 201410711177 A CN201410711177 A CN 201410711177A CN 105716315 B CN105716315 B CN 105716315B
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Abstract
The present invention provides a kind of semiconductor refrigerating equipment, the heat conduction liner being spaced including at least two, it is provided with semiconductor refrigeration module on each heat conduction liner, the semiconductor refrigerating module includes semiconductor refrigerating module, cold end radiator and hot-side heat dissipation device, the cold end radiator is connected to the cold end of the semiconductor refrigerating module, the hot-side heat dissipation device is connected to the hot junction of the semiconductor refrigerating module, and the cold end radiator is also connect with the heat conduction liner.Multi-temperature zone refrigeration is realized to meet the refrigeration requirement of different articles.
Description
Technical field
The present invention relates to refrigerating plant more particularly to a kind of semiconductor refrigerating equipments.
Background technology
Currently, refrigeration equipment（Such as refrigerator, refrigerator, wine cabinet）It is common electric appliance, refrigeration equipment in people's daily life
In usually have refrigeration system, under normal circumstances refrigeration system be made of compressor, condenser and evaporator, can realize relatively low
The refrigeration of temperature.However, with the development of semiconductor refrigerating technology, the refrigeration equipment that is freezed using semiconductor chilling plate also by
It is widely used.Semiconductor refrigerating equipment in the prior art is by the cold end released cold quantity of semiconductor refrigerating module in babinet
Storage space freezes.But in actual use, the cryogenic temperature of semiconductor refrigerating equipment is single, can not achieve
Multi-temperature zone is freezed, and the refrigeration requirement of different articles is cannot be satisfied.How designing one kind can realize multi-temperature zone refrigeration to meet not
The semiconductor refrigerating equipment required with the refrigeration of article is the technical problems to be solved by the invention.
Invention content
The technical problem to be solved by the present invention is to：A kind of semiconductor refrigerating equipment is provided, realizes multi-temperature zone refrigeration with full
The refrigeration requirement of foot difference article.
Technical solution provided by the invention is a kind of semiconductor refrigerating equipment, including at least two heat conduction that are spaced
Liner is each provided with semiconductor refrigeration module on the heat conduction liner, and the semiconductor refrigerating module includes semiconductor system
Chill block, cold end radiator and hot-side heat dissipation device, the cold end radiator are connected to the cold end of the semiconductor refrigerating module, institute
The hot junction that hot-side heat dissipation device is connected to the semiconductor refrigerating module is stated, the cold end radiator also connects with the heat conduction liner
It connects.
Semiconductor refrigerating equipment provided by the invention, by using multiple spaced heat conduction liners, and for each
Heat conduction liner is independently arranged corresponding semiconductor refrigerating module, in the semiconductor refrigerating module course of work, semiconductor refrigerating mould
Group will be to corresponding heat conduction liner released cold quantity, and cold is directly emitted to its internal storage space by heat conduction liner,
Due to mutually isolated between heat conduction liner so that different heat conduction liners, which are formed by storage space, can form independent warm area model
It encloses, so as to control the refrigerating capacity of semiconductor refrigerating module as needed to realize that multi-temperature zone is freezed, meets different articles
Refrigeration requirement.Simultaneously as the cold end radiator of semiconductor refrigerating module is directly formed heat conduction liner by heat conduction liner
Storage space freeze, refrigerating efficiency is more preferable, improves the refrigeration performance of semiconductor refrigerating equipment.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Some bright embodiments for those of ordinary skill in the art without having to pay creative labor, can be with
Obtain other attached drawings according to these attached drawings.
Fig. 1 is the structural schematic diagram of semiconductor refrigerating equipment embodiment of the present invention；
Fig. 2 is the explosive view of semiconductor refrigerating equipment embodiment of the present invention；
Fig. 3 is the structural schematic diagram of semiconductor refrigerating equipment embodiment middle case of the present invention；
Fig. 4 is the partial sectional view of semiconductor refrigerating equipment embodiment middle case of the present invention；
Fig. 5 is the structural schematic diagram of mounting plate in semiconductor refrigerating equipment embodiment of the present invention；
Fig. 6 is the structural schematic diagram of cold end radiator in semiconductor refrigerating equipment embodiment of the present invention；
Fig. 7 is the assembling figure of cold end radiator and heat conduction liner in semiconductor refrigerating equipment embodiment of the present invention；
Fig. 8 is the sectional view of the first heat carrier in semiconductor refrigerating equipment embodiment of the present invention；
Fig. 9 is the assembled relation figure of the first heat carrier and locating piece in semiconductor refrigerating equipment embodiment of the present invention；
Figure 10 is the structural schematic diagram one of hot-side heat dissipation device in semiconductor refrigerating equipment embodiment of the present invention；
Figure 11 is the structural schematic diagram two of hot-side heat dissipation device in semiconductor refrigerating equipment embodiment of the present invention；
Figure 12 is flow principles figure of Figure 11 apoplexy in groups of fins；
Figure 13 is the structural schematic diagram of the second heat carrier in semiconductor refrigerating equipment embodiment of the present invention.
Specific implementation mode
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
The every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
As Figure 1-Figure 2, the present embodiment semiconductor refrigerating equipment, including at least two heat conduction liners that are spaced
100, it each is provided with semiconductor refrigeration module on the heat conduction liner 100, the semiconductor refrigerating module includes semiconductor
Refrigeration module 200, cold end radiator 300 and hot-side heat dissipation device 400, the cold end radiator 300 are connected to the semiconductor system
The cold end of chill block 200, the hot-side heat dissipation device 400 are connected to the hot junction of the semiconductor refrigerating module 200, and the cold end dissipates
Hot device 300 is also connect with the heat conduction liner 100.
Specifically, the present embodiment semiconductor refrigerating equipment includes multiple heat conduction liners 100 and is arranged outside heat conduction liner 100
There is shell 101, insulating layer is provided between shell 101 and heat conduction liner 100, heat conduction liner 100 forms storage space for cold
Tibetan or frozen goods.Wherein, each heat conduction liner 100 is corresponding with semiconductor refrigerating module, and semiconductor refrigerating module will be corresponding
The storage space to freeze in heat conduction liner 100, and in semiconductor refrigerating module the cold end of semiconductor refrigerating module 200 generate it is cold
Amount is transmitted to by cold end radiator 300 on heat conduction liner 100, and rapidly cold will be discharged into it by heat conduction liner 100
Freeze in the storage space of formation, and the heat that the hot junction of semiconductor refrigerating module 200 generates passes through hot-side heat dissipation device 400
Heat dissipation.And be arranged since multiple heat conduction liners 100 are spaced, meanwhile, each heat conduction liner 100 is by corresponding semiconductor refrigerating module
200 carry out independent refrigeration, in actual use, can be freezed according to the article stored in different heat conduction liners 100
It is required that it is different, the cold that corresponding semiconductor refrigerating module 200 discharges adaptive capacity is controlled, realizes multi-temperature zone refrigeration.
Wherein, thermal insulating connectors 102, the two neighboring heat conduction are provided between the two neighboring heat conduction liner 100
Liner 100 is linked together by the thermal insulating connectors 102.Specifically, as shown in Figure 3-Figure 5,102 1 side of thermal insulating connectors
Face, which can play, links together two adjacent heat conduction liners 100, on the other hand can also be subtracted by thermal insulating connectors 102
It less or blocks heat transfer occurs between two neighboring heat conduction liner 100, so that each heat conduction liner 100 is formed by warm area
It is more independent.Various ways may be used in thermal insulating connectors 102, such as：The thermal insulating connectors 102 are provided with backwards to arrangement
Slot 1021, the heat conduction liner 100 is inserted in the slot 1021, will be in heat conduction when assembling two heat conduction liners 100
The edge of courage 100 is inserted into slot 1021, realizes that two heat conduction liners 100 link together, and heat conduction liner 100 is inserted in institute
The modes such as gluing, screw fixation may be used after stating in slot 1021 to fasten, it is preferred that the heat conduction liner 100 is installed on slotting
In slot 1021, specifically, the end set that the heat conduction liner 100 is inserted in the slot 1021 has barb structure 1001, it is described
The side wall of slot 1021 is provided with the fixture block 1022 coordinated with the barb structure 1001, and the barb structure 1001 is stuck in described
On fixture block 1022.In addition, horizontal arrangement may be used between multiple heat conduction liners 100 in the present embodiment, it is preferred that Duo Gesuo
The stacked arrangement from top to bottom of heat conduction liner 100 is stated, and semiconductor refrigerating module 200 is respectively positioned on the heat conduction liner of topmost
On 100.Specifically, semiconductor refrigerating module 200 is unified on the heat conduction liner 100 of topmost, and in order to facilitate the installation of
Equal semiconductor refrigerating module 200,100 are provided with mounting plate 103, the semiconductor system on the heat conduction liner of topmost
Chill block 200 is fixed on the mounting plate 103.Heat-barrier material support may be used in mounting plate 103, to avoid heat conduction liner
100 are transmitted by the way that heat occurs between mounting plate 103 and semiconductor refrigerating module 200, and are also provided with and are added in mounting plate 103
Strong plate 1031, enhances the structural strength of mounting plate 103 by reinforcing plate 1031.
In actual use, the existing equipment generally use cooling fin using semiconductor refrigerating carries out forced convertion,
With by cold by being dispersed into storage space, and in order to enable the heat of 200 cold end of semiconductor refrigerating module is more effectively right
Storage space freezes, and ensures being evenly distributed for cold, as shown in Fig. 6-Fig. 9, the cold end heat dissipation in the present embodiment
Device 300 includes the first heat carrier 31 and the first heat pipes of Duo Gen 32, and cavity is formed in first heat carrier 31（It is not shown）, institute
The sealing of the first heat pipe 32 is stated to be inserted in first heat carrier 31 and be connected to the cavity；First heat carrier 31 is attached to institute
The cold end of semiconductor refrigerating module 200 is stated, first heat pipe 32 is attached on the heat conduction liner 100, and the first heat pipe 32 passes through
First heat carrier 31 is realized to be thermally connected with the cold end of semiconductor refrigerating module 200.Specifically, semiconductor refrigerating module 200 is cold
The cold that end generates passes to the first heat pipe 32 by the first heat carrier 31, and the first heat pipe 32 can quickly disperse cold
Onto heat conduction liner 100, cold directly can be discharged into its internal storage space formed and freezed by heat conduction liner 100,
Refrigerating efficiency is effectively raised, the cold for avoiding the cold end generation of semiconductor refrigerating module 200 is dissipated using cooling fin
It is cold and the low phenomenon of refrigerating efficiency occur.Wherein, multiple jacks 311, first heat pipe 32 are offered on the first heat carrier 31
Sealing is inserted in the jack 311, and the first through hole 312, first heat pipe are provided between the two neighboring jack 311
32 ends being inserted in the jack 311 offer the second through hole（It is not shown）, first through hole passes through with described second
Through-hole, which is interconnected, forms channel, and the channel is the cavity.During cold end 300 actual assembled of radiator, the first heat
Pipe 32 is inserted into jack 311, the position of the second through hole in the depth and the first heat pipe 32 by rationally designing jack 311
It sets so that the first through hole 312 is connected to form channel with the second through hole, alternatively, during actual assembled, the first heat carrier
It is first provided with jack 311 on 31, after the first heat pipe 32 is inserted into jack 311, is opened from the side wall of the first heat carrier 31
Through hole equipped with perforation the first heat carrier 31 and the first heat pipe 32, to form cavity in the first heat carrier 31, then, then will
For in gas-liquid phase transition refrigerant filling in heat pipe to the first heat pipe 32 and cavity so that the first heat pipe 32 has heat pipe speed heat
Performance.And can quickly enter in the first heat pipe 32 and freeze for the ease of the refrigerant after liquefaction, described first
The lower end of heat carrier 31 offers the jack 311.Wherein, it is additionally provided with switchable filling on first heat carrier 31
Mouth 313, the filler 313 is connected to the cavity, can be easily perfused and be made into the first heat pipe 32 by filler 313
Cryogen, and in actual use, in order to avoid causing due to failure makes semiconductor refrigerating module 200 be not normally functioning
The excessive generation bombing of pressure in first heat pipe 32 is additionally provided with safe pressure valve 314, the safety pressure on the first heat carrier 31
Power valve 314 is connected to the cavity, and after the pressure in the first heat pipe 32 is more than setting value, safe pressure valve 314 releases opening
Power is bled off pressure, it is safe to use to ensure.For the refrigerant of perfusion, need that refrigerant working medium is perfused in the first heat pipe 32 can be ice
Case refrigeration system often uses refrigerant, such as R134a, R600a, CO2, and the selection of specific refrigerant working medium can be according to versatility
It is required that, system pressure requirements, cold delivery request, working medium physical property, the combined factors such as environmental protection determine.Preferably, in order to reduce
The quantity of one heat pipe 32, meanwhile, meet cold scattering and uniformly require, cold end radiator 300 includes two first heat pipes 32, institute
It states and is opened up on the first heat carrier 31 there are four the jack 311, the both ends of first heat pipe 32 are inserted in corresponding described
In jack 311；Wherein one first heat pipe 32 is bent the both sides for being distributed in the heat conduction liner 100, another first heat pipe
32 bendings are distributed in the back of the heat conduction liner 100.Specifically, the both ends of the first heat pipe 32 are inserted in jack 311, make
The cold scattering ability that the first heat pipe 32 realizes two heat pipes is obtained, and the bending of wherein one first heat pipe 32 is distributed in heat conduction liner 100
Both sides, another first heat pipe 32 is bent the back for being distributed in heat conduction liner 100, during by the first 32 cold scattering of heat pipe,
The contact area bigger of first heat pipe 32 and heat conduction liner 100 of bending distribution, so that heat conduction liner 100 can more
Even acquisition cold, meanwhile, the both sides and back of heat conduction liner 100 are distributed with the first heat pipe 31 and carry out cold scattering so that lead
Hot liner 100 forms the cold scattering surface of encircling type, so that it is guaranteed that internal storage space refrigeration is uniform.And in order to enable the first heat
Pipe 31, which can quickly extend cold from its end, to be transmitted, and the first heat pipe 32 from its both ends, prolong inclined downward respectively by bending
Stretch, specifically, the refrigerant in the first heat pipe 32 is gasificated into gas being liquefied as liquid after being cooled when heated, pass through by
First heat pipe 32 is extended by the way of bending inclined downward, and during the first 32 cold scattering of heat pipe, liquefied refrigerant
It can flow downward under the effect of gravity, and the refrigerant to gasify can rise to the first heat conduction along inclined first heat pipe 32
Freezing in the cavity that body 31 is formed, wherein the first heat pipe 32 will form straight pipe and bend loss after bending extends, for
The angle of inclination of the straight pipe of first heat pipe 32 is：The pipeline diameter in millimeters of first heat pipe 32（Hereinafter referred to as manage
Diameter）It is configured to the 1.2-1.3 of the inclination angle theta relative to horizontal direction as unit of degree more than or equal to the first heat pipe 32
Times, in actual production, the straight pipe of each first heat pipe 32 is arranged with the angle tilt for being in respect to the horizontal plane 10 ° to 70 °
To ensure that liquid refrigerant flows in it by free gravity, to improve the cold scattering efficiency of the first heat pipe 32.In addition, for list
The first heat pipe of root 32, the both ends of the first heat pipe 32 tilt down bending in symmetric mode and extend.
And during needing semiconductor refrigerating module 200 being installed to heat conduction liner 100, on heat conduction liner 100
Mounting plate 103 is formed with card slot 1032 again, and the first heat carrier 31 is inserted in slot 1032, and semiconductor refrigerating module 200 and
Heat-conducting silicone grease is set between one heat carrier 31 and is installed on mounting plate 103 by the first heat carrier 31.Preferably, semiconductor system
The periphery of chill block 200 is cased with sealing ring 201, and auxiliary mounting deck 202, auxiliary mounting deck are further fixedly arranged on mounting plate 103
Installing port 2021 is provided on 202, sealing ring 201 is located in installing port 2021, passes through sealing ring 201 and auxiliary mounting deck 202
Can semiconductor refrigerating module 200 be more firmly subjected to installation fixation, meanwhile, sealing ring 201 again can be by semiconductor system
The peripheral sealing of chill block 200 avoids cold from scattering and disappearing from the periphery of semiconductor refrigerating module 200.And in order to the first heat pipe 32
It is positioned, first heat pipe, 32 stress when carrying out foaming processing before to heat conduction liner 100 and shell 101 is avoided to shift, the
The bending place of one heat pipe 32 is provided with locating piece 104, and the locating piece 104 is fixed on the heat conduction liner 100.First heat pipe
32 bending place is positioned by locating piece 104, and locating piece 104 can keep the bending state of the first heat pipe 32 so that
In foaming process and routine use, the flexuosity of the first heat pipe 32 remains unchanged, while avoiding the occurrence of the shifting of the first heat pipe 32
Position.Wherein, locating piece 104 includes locating piece 1041 and connecting pole 1042, and the locating piece 1041 is connected to the connecting pole
On 1042, the connecting pole 1042 is fixed on the heat conduction liner 100, and first heat pipe 32 is wound on the connecting pole 1042
It goes up and is located between the locating piece 1041 and the heat conduction liner 100, in an assembling process, the first heat pipe 32 is wound on connecting pole
1042 bendings, and the bending place of the first heat pipe 32 is clipped between locating piece 1041 and the heat conduction liner 100, for locating piece
Connection between 104 and heat conduction liner 100, on heat conduction liner 100 riveting there is riveting nut 105, the locating piece 104 to offer logical
Hole 1043, the riveting nut 105 are located in the through-hole 1043, and screw 106 is inserted in the through-hole 1043 and is threaded in institute
It states in riveting nut 105.
In actual use, the existing equipment generally use fan using semiconductor refrigerating is to semiconductor refrigeration module
200 hot junction carries out wind-cooling heat dissipating, need to consume a large amount of electric energy and fan operating noise is more serious always, such as Fig. 2 and figure
Shown in 10, the hot-side heat dissipation device 400 in the present embodiment includes the second heat carrier 41, more second heat pipes 42 and groups of fins 43,
Second heat pipe 42 is connected on second heat carrier 41, and the groups of fins 43 is connected on second heat pipe 42.
Specifically, the second heat carrier 41 is attached to the hot junction of semiconductor refrigerating module 200, and groups of fins 43 is attached on shell 101, is partly led
The heat that the hot junction of body refrigeration module 200 generates passes to the second heat pipe 42 by the second heat carrier 41, and the second heat pipe 42 can
Quickly transfer heat in groups of fins 43, and the radiator of larger area can be made in groups of fins 43 as needed,
The heat that groups of fins 43 can be transmitted using itself larger the second heat pipe of heat dissipation area pair 42 carries out rapid cooling, to nothing
It need to directly be radiated to the hot junction of semiconductor refrigeration module 200 by fan.Wherein, in order to adequately utilize each cooling fin
Group 43 radiates, and third heat pipe 44 is also associated on the second heat carrier 41, and described the in any hot-side heat dissipation device 400
Three heat pipes 44 are also connect with the groups of fins 43 in hot-side heat dissipation device 400 described in remaining.In actual use, when each
When the heat that a work of semiconductor refrigerating module 200 generates is identical, each semiconductor refrigerating module 200 passes through respective cooling fin
Group 43 radiates, and when the heat dissipation capacity of some semiconductor refrigerating module 200 is larger, it is connected to the semiconductor refrigerating module
Second heat carrier 41 of 200 heats transfers heat to that other semiconductor refrigerating modules 200 are corresponding to be dissipated by third heat pipe 44
In backing group 43, so as to more efficiently be radiated using whole groups of fins 43；In the design process, each second
Heat carrier 41 can be thermally connected by third heat pipe 44 and remaining groups of fins 43, for dissipating for whole groups of fins 43
Thermal energy power, to realize natural cooling.And in order to enhance the draught capacity of groups of fins 43, groups of fins 43 radiates including multi-disc
Fin 431 is provided with ventilation hole 432 on the radiating fin 431, multiple 432 shapes of the ventilation hole being located on same axis
At air duct, groups of fins 43 also utilizes the formation of ventilation hole 432 other than being aerated using the interval between radiating fin 431
Air duct is aerated, so as to effectively enhance the draught capacity of groups of fins 43.And work as each semiconductor refrigerating module 200
It is run under relatively high power, in order to meet the requirement of high-power heat-dissipation, fan 45 is arranged side by side and is located at groups of fins 43
The side in air duct, the direction outlet air that fan 45 extends towards air duct, the wind that fan 45 is blown out enter in air duct to accelerate air duct
The flowing of apoplexy, and since hot-air is gentlier easy to flow upward, the wind to flow in ventilation hole 432 will make hot-air two
Vortex flow between a radiating fin 431 is radiated using the area of radiating fin 431 to the greatest extent.Such as Figure 10-Figure 12
It is shown, in order to more fully be radiated using radiating fin 431, other than the radiating fin 431 positioned at outside, remaining heat dissipation
Fin 431 opens up jagged 433, is located at the notch 433 on sustained height position and forms auxiliary air duct, radiating fin is vertically arranged
431 are vertically arranged, and radiating fin is vertically arranged 431 and is vertically arranged, and cover body 46, the wind are additionally provided in groups of fins 43
Fan 45 is also located at the inside in auxiliary air duct and is fixed on cover body 46, and cover body 46 covers in groups of fins 43, under cover body 46
End forms air inlet, and the upper end of cover body 46 forms air outlet, and fan 45 is dried after starting into auxiliary air duct, accelerates to dissipate
Air flowing between hot fin 431, and hot-air rises from air outlet output so that air inlet of the extraneous cold air from bottom
It mouthful enters between radiating fin 431 so that cold wind can be from bottom to up in motion process, by the entire of radiating fin 431
Surface, to make full use of the heat-sinking capability of radiating fin 431；And the position on cover body 46 for installing fan 45 be further opened with it is logical
Extraneous wind is further introduced into radiating fin 431 by air port 461, fan 45 by ventilation opening 461.Wherein, Mei Ge
The both sides of two heat carriers 41 are respectively arranged with groups of fins 43, and fan 45 is located between two groups of fins 43 simultaneously.And it is
It is connect with the second heat carrier 41 convenient for heat pipe, as shown in figure 13, multiple mounting holes 410, institute is formed on the second heat carrier 41
It states the second heat pipe 42 and the third heat pipe 44 is inserted in the corresponding mounting hole 410, heat pipe is inserted in can in mounting hole 410
Increase the contact area between the second heat carrier 41, improves heat conduction efficiency；And the second heat carrier 41 is set including two surfaces
Reeded briquetting 411 is set, two briquettings 411 are fixed together, and corresponding two grooves form the peace
Hole 410 is filled, the second heat carrier 41 is formed using two briquettings 411, the assembling that can be convenient between heat pipe and the second heat carrier 41
Connection.
Finally it should be noted that：The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
Present invention has been described in detail with reference to the aforementioned embodiments, it will be understood by those of ordinary skill in the art that：It still may be used
With technical scheme described in the above embodiments is modified or equivalent replacement of some of the technical features；
And these modifications or replacements, various embodiments of the present invention technical solution that it does not separate the essence of the corresponding technical solution spirit and
Range.
Claims (11)
1. a kind of semiconductor refrigerating equipment, which is characterized in that the heat conduction liner being spaced including at least two, it is each described to lead
Semiconductor refrigeration module is provided on hot liner, the semiconductor refrigerating module includes semiconductor refrigerating module, cold end heat dissipation
Device and hot-side heat dissipation device, the cold end radiator are connected to the cold end of the semiconductor refrigerating module, and the hot-side heat dissipation device connects
It is connected on the hot junction of the semiconductor refrigerating module, the cold end radiator is also connect with the heat conduction liner；
The hot-side heat dissipation utensil has more second heat pipes and groups of fins, second heat pipe and the semiconductor refrigerating module
Hot junction be thermally connected, the groups of fins is connected on second heat pipe, and the hot-side heat dissipation device also has third heat pipe, institute
It states third heat pipe and the hot junction of the semiconductor refrigerating module is thermally connected, the third heat pipe in any hot-side heat dissipation device
Also it is connect with the groups of fins in hot-side heat dissipation device described in remaining；
The groups of fins includes multi-disc radiating fin, and ventilation hole, multiple ventilation hole shapes are provided on the radiating fin
At air duct；The hot-side heat dissipation device is additionally provided with fan, and the fan is arranged side by side with the groups of fins and is located at the wind
The side in road；The radiating fin is vertically arranged, and the outer surface of the groups of fins is additionally provided with cover body, the lower end of the cover body
Portion forms air inlet, and the upper end of the cover body forms air outlet；For the single groups of fins, in addition on the outermost side
Outside the radiating fin, opened up on remaining described radiating fin it is jagged, be located at sustained height the notch formed auxiliary wind
Road, the fan are also located at the inside in the auxiliary air duct and are fixed on the cover body；To described auxiliary after the starting fan
It helps in air duct and dries, the air between the radiating fin is accelerated to flow, and hot-air rises from air outlet output so that
Extraneous cold air is entered from the air inlet of bottom between the radiating fin so that cold wind can move from bottom to up
In the process, by the whole surface of the radiating fin.
2. semiconductor refrigerating equipment according to claim 1, which is characterized in that set between the two neighboring heat conduction liner
It is equipped with insulating connector, the two neighboring heat conduction liner is linked together by the insulating connector.
3. semiconductor refrigerating equipment according to claim 1, which is characterized in that multiple heat conduction liners from top to bottom heap
Laying up is set, and the semiconductor refrigerating module is respectively positioned on the heat conduction liner of topmost.
4. according to any semiconductor refrigerating equipments of claim 1-3, which is characterized in that the cold end radiator has more
The first heat pipe of root, first heat pipe and the cold end of the semiconductor refrigerating module are thermally connected, and first heat pipe is attached to described
On heat conduction liner.
5. semiconductor refrigerating equipment according to claim 4, which is characterized in that the cold end radiator includes described in two
First heat pipe, wherein the first heat pipe bending is distributed in the both sides of the heat conduction liner, another first heat pipe is curved
Song is distributed in the back of the heat conduction liner.
6. semiconductor refrigerating equipment according to claim 5, which is characterized in that first heat pipe is distinguished from its both ends
Bending extends inclined downward.
7. semiconductor refrigerating equipment according to claim 6, which is characterized in that the both ends of first heat pipe are in symmetrical
Mode tilts down bending and extends.
8. semiconductor refrigerating equipment according to claim 6, which is characterized in that first heat pipe is in millimeters
Pipeline diameter be configured to the inclination angle theta relative to horizontal direction as unit of degree more than or equal to first heat pipe
1.2-1.3 again.
9. semiconductor refrigerating equipment according to claim 6, which is characterized in that the bending place of first heat pipe is provided with
Locating piece, the locating piece are fixed on the heat conduction liner.
10. semiconductor refrigerating equipment according to claim 1, which is characterized in that the hot-side heat dissipation device includes two and dissipates
Backing group, the fan are located between two groups of fins.
11. semiconductor refrigerating equipment according to claim 1, which is characterized in that be equipped with the fan on the cover body
Position be further opened with ventilation opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410711177.2A CN105716315B (en) | 2014-12-01 | 2014-12-01 | Semiconductor refrigerating equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410711177.2A CN105716315B (en) | 2014-12-01 | 2014-12-01 | Semiconductor refrigerating equipment |
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| CN105716315A CN105716315A (en) | 2016-06-29 |
| CN105716315B true CN105716315B (en) | 2018-09-07 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108800655B (en) * | 2017-04-28 | 2020-09-04 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigerating device |
| CN108800703B (en) * | 2017-04-28 | 2020-12-15 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigeration equipment |
| CN108800656B (en) * | 2017-04-28 | 2020-09-08 | 青岛海尔智能技术研发有限公司 | Semiconductor refrigeration module and refrigeration equipment |
| CN108800711B (en) * | 2017-04-28 | 2020-12-15 | 青岛海尔智能技术研发有限公司 | Double-temperature-zone solid-state refrigeration equipment |
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