CN1523300A - Heat dissipation fins, heat pipe, master board metal integral radiator - Google Patents
Heat dissipation fins, heat pipe, master board metal integral radiator Download PDFInfo
- Publication number
- CN1523300A CN1523300A CNA031026621A CN03102662A CN1523300A CN 1523300 A CN1523300 A CN 1523300A CN A031026621 A CNA031026621 A CN A031026621A CN 03102662 A CN03102662 A CN 03102662A CN 1523300 A CN1523300 A CN 1523300A
- Authority
- CN
- China
- Prior art keywords
- heat pipe
- radiating fin
- fin
- heat
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 22
- 239000002184 metal Substances 0.000 title claims abstract description 22
- 230000017525 heat dissipation Effects 0.000 title description 2
- 239000004065 semiconductor Substances 0.000 claims abstract description 23
- 238000003466 welding Methods 0.000 claims abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 239000004411 aluminium Substances 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 230000004907 flux Effects 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 238000005096 rolling process Methods 0.000 claims description 4
- 238000007665 sagging Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000005057 refrigeration Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 2
- 230000005068 transpiration Effects 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 2
- 239000002470 thermal conductor Substances 0.000 description 2
- 150000001875 compounds Chemical group 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to a radiating fin, heat tube and mother plate metal integrated radiator capable of radiating semiconductor temp.-differece electric device high heat flow density high-power heat quantity, and it is characterized by that it is formed by radiating fin, heat tube and mother plate as three key elements and adopting the processes of arrangement, combination and mutually welding treatment, and can be made into various types of radiating fin, heat tube and mother plate metal integrated radiator having no any mechanical moving component and the goal of refrigeration can be attained. It can be extensively used in the domestic semiconductor refrigerating equipment.
Description
The present invention relates to a kind of heat abstractor that distributes semiconductor temperature difference electrical part heat, especially can distribute the high-power heat of high heat flux and make and self keep radiating fin, heat pipe, the mother board metal integral heat radiator of all low temperature rises.
At present, the known radiator that distributes semiconductor temperature difference electrical part heat, it is the radiating fin radiator of extruding or shaping by stock removal, when distributing the high-power heat of semiconductor temperature difference electrical part high heat flux, because although the radiating fin radiator adopts aluminium or copper good thermal conductor material, when accomplishing enough big area of dissipation, because of being subject to processing in the forming process, it is loose to make solid material density take place, cause the restriction that thermal conductivity reduces or distance is long, and make radiator in position temperature rise near the semiconductor temperature difference electrical part, away from the position temperature rise low, cause radiator self to form the temperature difference, reality does not reach all low temperature rise, or be that wire tube condenser in the similar compressor cooling dispels the heat by heat-pipe radiator, the main effect of heat pipe is to conduct heat, though utilize the rising heat transfer rate of working medium fast, but self can't constitute actual needed area of dissipation, the sufficient heat-sinking capability of Shang Weiyou, thereby after reaching thermal balance, still high near the temperature rise of thermal source position, more than both mutually combine only to have under the condition of two key elements and also can't deal with problems, therefore all can not actually satisfy the requirement of semiconductor temperature difference electrical part distribute heat.
The purpose of this invention is to provide a kind of characteristic at the high-power heat of semiconductor temperature difference electrical part high heat flux, radiating fin with the good thermal conductor high-compactness, heat pipe, motherboard is under the condition that three key elements are arranged, be welded to each other the metal-integral radiator of formation, could avoid the harmful effect that caused because of the density of material step-down fully, and make full use of radiating fin and can free arrangement be combined to form best area of dissipation and adopting heat pipes for heat transfer speed both advantages of combining soon, the motherboard position is in the structure of directly accepting thermal source in addition, cause heat transfer to greatest extent, heat radiation is carried out on radiator integral simultaneously expeditiously, do not produce the tangible temperature difference between the part, make radiator integral reach all low temperature rise, to adapt to the requirement of semiconductor temperature difference electrical part heat dissipation characteristics.
The object of the present invention is achieved like this: a kind of by radiating fin, heat pipe, motherboard is welded to each other the radiating fin of formation as the three elements permutation and combination, heat pipe, the mother board metal integral heat radiator, its radiating fin is folded up with both sides fin parallel mode symmetry two-wire by high-compactness aluminium or copper light sheet material and is formed, similar " U " font, fin coupling part, both sides is rectangular outer folding face, on the folding face various forms of air vents are arranged outside, outward appearance is circle or square opening or shutter or sagging side opening, there are or do not have various forms of air vents on the side of radiating fin, but the side of radiating fin can plane also pressure rolling go out corrugated, to increase area of dissipation, radiating fin bottom is the folded bottom of strip of being rectangle, arch door shape heat pipe passage is arranged on folded bottom, the assembling circular hole that on fin, has heating tube to walk, heat pipe part volt is in the heat pipe passage of fin folded bottom, a part runs in the guide in the assembling circular hole of radiating fin, the tortuous connection between heat pipe, the heat pipe two ends are connected by the working medium return duct, constitute the sealing circulation line, the parallel at certain intervals distribution of some radiating fins, run in the guide in the assembling circular hole on the fin and arrange by heat pipe and combine, heat pipe is walked circuit and is carried out according to the needs of radiator integral Distribution of temperature rise, it is that volt will be directly connected to the lower position of radiator temperature rise in the part of fin folded bottom that its pipeline moves towards general trend, be that the working medium transpiration of being heated will at first promptly be delivered to heat in the fin groups of radiator than far-end, the working medium condensing reflux utilizes gravity to accelerate circulation rate, constitute vertical-horizontal meander configuration and parallel, horizontal meander configuration thus, is heat pipe volt fin folded bottom and the tortuous rectangular-shaped radiating fin grid row who wears the formation working medium closed circuit of fin as above-mentioned permutation and combination to outward appearance, these grid are arranged heat pipe section under all radiating fin folded bottoms and the Fu Zaiqi in the lump on the aluminium by being welded on public high-compactness or the copper motherboard, the motherboard position is according to the assembling needs of semiconductor temperature difference electrical part, can place fin grid row's centre, also can be partial to an end, constitute various types of radiating fins thus, heat pipe, the mother board metal integral heat radiator, in the incorporate one side of mother board metal is solder side, its reverse side can be directly with welding or bonding mode composite semiconductor thermoelectric device as the conducting surface of accepting semiconductor temperature difference electrical part heat.
Owing to adopt such scheme, make this radiator keep all low temperature rise on the whole, can make semiconductor temperature difference electrical part fullest ground form the temperature difference, without any mechanical moving element, just can reach the practical level of refrigeration, can be widely used in the family expenses conductor refrigeration utensil.
The present invention is further described below in conjunction with accompanying drawing and embodiment.
Fig. 1 illustrates for three elements of the present invention.
Fig. 2 is the signal of first embodiment of the invention heat pipe vertical-horizontal meander configuration.
Fig. 3 is the signal of second embodiment of the invention heat pipe parallel, horizontal meander configuration motherboard interposition.
Fig. 4 holds the position signal partially for third embodiment of the invention heat pipe parallel, horizontal meander configuration motherboard.
Among the figure: 1, radiating fin 2, outer folding face 3, air vent 4, circle or square opening 5, shutter 6, the side opening 7 that sink, side 8, corrugation 9, folded bottom 10, heat pipe passage 11, heat pipe 12, assembling circular hole 13, return duct 14, fin grid row 15, motherboard 16, solder side 17, conducting surface
Three elements of the present invention as shown in Figure 1: radiating fin (1) is folded up with both sides fin parallel mode symmetry two-wire by high-compactness aluminium or copper light sheet material and is formed, similar " U " font, fin coupling part, both sides is a rectangular outer folding face (2), various forms of air vents (3) are arranged on the folding face outside, outward appearance is circle or square opening (4) or shutter (5) or sagging side opening (6), there are or do not have various forms of air vents (3) on the side of radiating fin (7), but the side of radiating fin can plane also pressure rolling go out corrugation (8) shape, to increase area of dissipation, radiating fin bottom is the folded bottom (9) of strip of being rectangle, arch door shape heat pipe passage (10) is arranged on folded bottom, the assembling circular hole (12) that on radiating fin, has heating tube (11) to walk, heat pipe part volt is in the heat pipe passage of fin folded bottom, a part runs in the guide in the assembling circular hole of radiating fin, complications couple together and are connected by working medium return duct (13) in its two ends, constitute the sealing circulation line, the mode that heat pipe is walked sees following first for details, description among two embodiment, high-compactness rectangular aluminum or copper motherboard (15) are prepared into one side are metal-integral solder side (16), weld for numerous folded bottoms in the fin groups, its reverse side is a conducting surface (17) of accepting semiconductor temperature difference electrical part heat, can be directly with welding or bonding mode composite semiconductor thermoelectric device.
First embodiment of the invention as shown in Figure 2: with the parallel at certain intervals distribution of some radiating fins (1), walk in the assembling circular hole (12) on the radiating fin and arrange by heat pipe (11) and combine, the tortuous connection between heat pipe, when radiating fin is used in a horizontal manner, it walks heat pipe just perpendicular to horizontal plane, heat pipe is walked route and is carried out according to the needs of radiator integral Distribution of temperature rise, it is that volt will be directly connected to the lower position of radiator temperature rise in the part of fin folded bottom (9) that its pipeline moves towards general trend, be that the working medium transpiration of being heated will at first promptly be delivered to heat in the fin groups of radiator than far-end, the working medium condensing reflux utilizes gravity to accelerate circulation rate, connect by working medium return duct (13) in the heat pipe two ends, constitute the sealing circulation line, so permutation and combination is the rectangular-shaped radiating fin grid rows (14) that heat pipe volt fin folded bottom and vertical-horizontal complications are worn the formation working medium closed circuit of fin to outward appearance, these grid are arranged heat pipe section under all radiating fin folded bottoms and the Fu Zaiqi in the lump by being welded on public aluminium or the copper motherboard (15), just constitute the radiating fin of vertical-horizontal meander configuration, heat pipe, the mother board metal integral heat radiator.
Second embodiment of the invention as shown in Figure 3: with the parallel at certain intervals distribution of some radiating fins (1), walk in the assembling circular hole (12) on the radiating fin and arrange by heat pipe (11) and combine, the tortuous connection between heat pipe, when radiating fin is used with vertical mode, it is walked heat pipe and just is parallel to horizontal plane, heat pipe is walked route and is carried out according to the needs of radiator integral Distribution of temperature rise, it is that volt will be directly connected to the lower position of radiator temperature rise in the part of fin folded bottom (9) that its pipeline moves towards general trend, be that the working medium transpiration of being heated will at first promptly be delivered to heat in the fin groups of radiator than far-end, the working medium condensing reflux utilizes gravity to accelerate circulation rate, connect by working medium return duct (13) in the heat pipe two ends, constitute the sealing circulation line, so permutation and combination is the rectangular-shaped radiating fin grid rows (14) that heat pipe volt fin folded bottom and parallel, horizontal complications are worn the formation working medium closed circuit of fin to outward appearance, these grid are arranged heat pipe section under all radiating fin folded bottoms and the Fu Zaiqi in the lump by being welded on public aluminium or the copper motherboard (15), the motherboard position is positioned in the middle of the fin grid row, just constitutes the radiating fin of parallel, horizontal meander configuration motherboard interposition, heat pipe, the mother board metal integral heat radiator.
Third embodiment of the invention as shown in Figure 4: this embodiment duplicates in second embodiment, do not exist together just constitutes radiating fin, heat pipe, mother board metal integral heat radiator that parallel, horizontal meander configuration motherboard is held the position partially for motherboard (15) position is positioned at fin grid row (14) one ends.
More than each embodiment when when energising the semiconductor temperature difference electrical part start working, the semiconductor temperature difference electrical part just discharges the high-power heat of high heat flux, this heat promptly conducts to whole motherboard by welding on the motherboard conducting surface or bonding compound position, the heat of motherboard conducts in the radiating fin by the weld layer of solder side and folded bottom on the one hand, conduct in the heat pipe with the heat pipe weld layer of volt under folded bottom by solder side on the other hand and absorbed by working medium, be heated transpiration and in the tortuous loop of sealing, conducting among the lower radiating fin group of temperature of working medium by the assembling circular hole on the radiating fin, and heat radiation condensation cycle, remedy the slow deficiency of solid thermal conduction of velocity, the temperature rise that makes whole radiating fins much at one, the surface area that makes whole radiating fins almost side by side participates in the heat exchange with environment, constitute thus can distribute the high-power heat of semiconductor temperature difference electrical part high heat flux and make and self keep all radiating fins of low temperature rise, heat pipe, the mother board metal integral heat radiator.
Claims (7)
1, a kind of radiating fin that can distribute the high-power heat of semiconductor temperature difference electrical part high heat flux, heat pipe, the mother board metal integral heat radiator, it is characterized in that radiating fin (1), heat pipe (11), motherboard (15) is welded to each other the metal-integral radiator of formation as the three elements permutation and combination, its radiating fin is folded up with both sides fin parallel mode symmetry two-wire by high-compactness aluminium or copper light sheet material and is formed, similar " U " font, fin coupling part, both sides is a rectangular outer folding face (2), various forms of air vents (3) are arranged on the folding face outside, outward appearance is circle or square opening (4) or shutter (5) or sagging side opening (6), there are or do not have various forms of air vents (3) on the side of radiating fin (7), but the side of radiating fin can plane also pressure rolling go out corrugation (8) shape, to increase area of dissipation, radiating fin bottom is the folded bottom (9) of strip of being rectangle, arch door shape heat pipe passage (10) is arranged on folded bottom, the assembling circular hole (12) that on radiating fin, has heating tube (11) to walk, heat pipe part volt is in the heat pipe passage of fin folded bottom, a part runs in the guide in the assembling circular hole of radiating fin, the tortuous connection between heat pipe, the heat pipe two ends are connected by working medium return duct (13), constitute the sealing circulation line, the parallel at certain intervals distribution of some radiating fins, run in the guide in the assembling circular hole on the fin and arrange by heat pipe and combine, heat pipe is walked route and is carried out according to the needs of radiator integral Distribution of temperature rise, constitute vertical-horizontal meander configuration and parallel, horizontal meander configuration thus, is heat pipe volt fin folded bottom and the tortuous rectangular-shaped radiating fin grid rows (14) that wear the formation working medium closed circuit of fin as above-mentioned permutation and combination to outward appearance, these grid are arranged heat pipe section under all radiating fin folded bottoms and the Fu Zaiqi in the lump on the aluminium by being welded on public high-compactness or the copper motherboard (15), the motherboard position is according to the assembling needs of semiconductor temperature difference electrical part, can place fin grid row's centre, also can be partial to an end, constitute various types of radiating fins thus, heat pipe, the mother board metal integral heat radiator, in the incorporate one side of mother board metal is solder side (16), its reverse side can be directly with welding or bonding mode composite semiconductor thermoelectric device as the conducting surface (17) of accepting semiconductor temperature difference electrical part heat.
2, radiating fin according to claim 1, heat pipe, the mother board metal integral heat radiator, it is characterized in that radiating fin (1) folds up formation with both sides fin parallel mode symmetry two-wire, similar " U " font, fin coupling part, both sides is a rectangular outer folding face (2), various forms of air vents (3) are arranged on the folding face outside, outward appearance is circle or square opening (4) or shutter (5) or sagging side opening (6), there are or do not have various forms of air vents (3) on the side of radiating fin (7), but the side of radiating fin can plane also pressure rolling go out corrugation (8) shape, and radiating fin bottom is the folded bottom (9) of strip of being rectangle.
3, radiating fin according to claim 1, heat pipe, mother board metal integral heat radiator, it is characterized in that heat pipe (11) part volt is in the heat pipe passage (10) of radiating fin (1) folded bottom (9), a part runs in the guide in the assembling circular hole (12) of radiating fin, the tortuous connection between heat pipe, the heat pipe two ends are connected by working medium return duct (13), constitute the sealing circulation line.
4, radiating fin according to claim 1, heat pipe, mother board metal integral heat radiator, it is characterized in that the parallel at certain intervals distribution of some radiating fins (1), run in the guide in the assembling circular hole (12) on the radiating fin and arrange to combine by heat pipe (11) and constitute the vertical-horizontal meander configuration and arrange (14) with parallel, horizontal meander configuration radiating fin grid.
5, radiating fin according to claim 1, heat pipe, mother board metal integral heat radiator, it is characterized in that motherboard (15) can place radiating fin grid row's (14) interposition or hold the position partially, the heat pipe section that grid are arranged under all radiating fin folded bottoms and the Fu Zaiqi is welded on the solder side (16) of motherboard in the lump.
6, radiating fin according to claim 1, heat pipe, mother board metal integral heat radiator, the motherboard (15) that it is characterized in that various types of radiating fins (1), the various heat pipe (11) that moves towards meander configuration and diverse location is welded to each other as the three elements permutation and combination and constitutes various types of radiating fins, heat pipe, mother board metal integral heat radiator thus.
7, radiating fin according to claim 1, heat pipe, mother board metal integral heat radiator is characterized in that the conducting surface (17) of motherboard (15) can be directly with welding or bonding mode composite semiconductor thermoelectric device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031026621A CN100402963C (en) | 2003-02-17 | 2003-02-17 | Heat dissipation fins, heat pipe, master board metal integral radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031026621A CN100402963C (en) | 2003-02-17 | 2003-02-17 | Heat dissipation fins, heat pipe, master board metal integral radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1523300A true CN1523300A (en) | 2004-08-25 |
| CN100402963C CN100402963C (en) | 2008-07-16 |
Family
ID=34281846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031026621A Expired - Fee Related CN100402963C (en) | 2003-02-17 | 2003-02-17 | Heat dissipation fins, heat pipe, master board metal integral radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100402963C (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105716319A (en) * | 2014-12-01 | 2016-06-29 | 青岛海尔特种电冰柜有限公司 | Heat radiating device and semiconductor refrigerating equipment |
| CN105716365A (en) * | 2014-12-01 | 2016-06-29 | 青岛海尔特种电冰柜有限公司 | Semiconductor wine cabinet |
| CN105716315A (en) * | 2014-12-01 | 2016-06-29 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigeration equipment |
| CN105716317A (en) * | 2014-12-01 | 2016-06-29 | 青岛海尔特种电冰柜有限公司 | Cooling device and semiconductor refrigeration equipment |
| CN108235461A (en) * | 2018-02-24 | 2018-06-29 | 宁波巨凰暖通设备有限公司 | Manufacturing method, heats and the electric heating radiator of heats |
| CN105716320B (en) * | 2014-12-01 | 2019-05-28 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigerating equipment |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06268123A (en) * | 1993-03-16 | 1994-09-22 | Toshiba Corp | Heat-pipe radiator for semiconductor element |
| JPH11121667A (en) * | 1997-10-20 | 1999-04-30 | Fujitsu Ltd | Heat pipe type cooling device |
| CN2344875Y (en) * | 1998-09-30 | 1999-10-20 | 铁道部株洲电力机车研究所 | Heat pipe radiator for power semiconductor device |
| CN2409612Y (en) * | 2000-01-29 | 2000-12-06 | 鞍山鞍明热管技术有限公司 | Power device and power module heat tube radiator |
| CN2469555Y (en) * | 2001-01-02 | 2002-01-02 | 吴鸿平 | Metal integrated radiator with fined folded bottom |
-
2003
- 2003-02-17 CN CNB031026621A patent/CN100402963C/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105716319A (en) * | 2014-12-01 | 2016-06-29 | 青岛海尔特种电冰柜有限公司 | Heat radiating device and semiconductor refrigerating equipment |
| CN105716365A (en) * | 2014-12-01 | 2016-06-29 | 青岛海尔特种电冰柜有限公司 | Semiconductor wine cabinet |
| CN105716315A (en) * | 2014-12-01 | 2016-06-29 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigeration equipment |
| CN105716317A (en) * | 2014-12-01 | 2016-06-29 | 青岛海尔特种电冰柜有限公司 | Cooling device and semiconductor refrigeration equipment |
| CN105716315B (en) * | 2014-12-01 | 2018-09-07 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigerating equipment |
| CN105716365B (en) * | 2014-12-01 | 2018-09-07 | 青岛海尔特种电冰柜有限公司 | Semiconductor wine cabinet |
| CN105716319B (en) * | 2014-12-01 | 2019-03-05 | 青岛海尔特种电冰柜有限公司 | Radiator and semiconductor refrigerating equipment |
| CN105716317B (en) * | 2014-12-01 | 2019-03-05 | 青岛海尔特种电冰柜有限公司 | Radiator and semiconductor refrigerating equipment |
| CN105716320B (en) * | 2014-12-01 | 2019-05-28 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigerating equipment |
| CN108235461A (en) * | 2018-02-24 | 2018-06-29 | 宁波巨凰暖通设备有限公司 | Manufacturing method, heats and the electric heating radiator of heats |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100402963C (en) | 2008-07-16 |
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Owner name: SHENZHEN CITY YIKU SCIENCE CO., LTD. Free format text: FORMER OWNER: WU HONGPING Effective date: 20050429 |
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