CN2344875Y - Heat pipe radiator for power semiconductor device - Google Patents
Heat pipe radiator for power semiconductor device Download PDFInfo
- Publication number
- CN2344875Y CN2344875Y CN 98231416 CN98231416U CN2344875Y CN 2344875 Y CN2344875 Y CN 2344875Y CN 98231416 CN98231416 CN 98231416 CN 98231416 U CN98231416 U CN 98231416U CN 2344875 Y CN2344875 Y CN 2344875Y
- Authority
- CN
- China
- Prior art keywords
- heat
- radiator
- fin
- exchanger tube
- power semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a heat pipe radiator for a power semiconductor device, which is composed of a heating block, fins, and a heat exchanging pipe. The utility model is characterized in that the heating block, the fins and the heat exchange pipes are connected and solidified by cored solder. The evaporation hole surface of the heating block is three-dimensional coarse, a plurality of fin projections are arranged on the fins, and a conical plug is arranged on the upper end of the heat exchange pipe. Compared with the similar radiator, the utility model has a better heat dissipation effect.
Description
The utility model relates to a kind of power semiconductor heat-pipe radiator, belongs to semiconductor device heat dissipating method and device class.
Along with power electronic equipment develops and the silicon-controlled device of synchronized development to high-power direction, require the power of individual devices control increasing, thereby the dissipation power that causes individual devices self is also increasing, and therefore the heat radiation to device has proposed harsh more requirement.
Some radiators commonly used at present, as the radiator of casting, section bar aluminium radiator and steel radiator, all true body metal heat sink all has a kind of intrinsic defective: promptly along with the increase of radiator volume, though can strengthen outside heat convection, reduced the heat convection thermal resistance, but its thermal conduction resistance can increase synchronously also, under a specific dimensions, these two kinds of effects can be cancelled each other, thereby reach the heat radiation limit of solid metal radiator.In recent years, research and development along with hot pipe technique, a kind of radiator that adopts hot pipe technique has been proposed, at present we domestic what see is the compression joint type heat-pipe radiator, though on heat dispersion, be greatly improved, owing to adopt compression joint type structure, its radiating fin than above-mentioned solid metal radiator, heat exchanger tube and the contact of being heated between the piece three are fully satisfactory inadequately, and the contact heat resistance of Chan Shenging has influenced giving full play to of this heat-pipe type radiator heat sinking function therefrom.
The purpose of the present utility model: aim to provide a kind of heat-pipe radiator of new construction, wish that it can overcome the contact heat resistance that the compression joint type heat-pipe radiator exists between structural member, improve the heat sinking function of radiator biglyyer.
Above invention order is realized by following technical proposals:
This power semiconductor heat-pipe radiator, be made up of the piece that is heated (1), fin (2) and heat exchanger tube (4), it is characterized in that solidifying connection by braze (6) between the described piece that is heated (1), fin (2), heat exchanger tube (4) three: the evaporation apertures surface of the described piece that is heated (1) is three-dimensional roughness element; Described fin (2) is provided with the protruding hole of some wings (5); Described heat exchanger tube (3) top is provided with a conical plug (4).
According to the power semiconductor heat-pipe radiator of such scheme design,, make the heat exchanger tube and the leak rate of be heated piece, port and heat exchanger tube interface not be higher than 10 owing to adopt all-welded structure
-8Pa.m
3/ s, and owing to also connected by braze between fin and the heat exchanger tube, the fin root is fully contacted with heat exchanger tube eliminates or has reduced the contact heat resistance of compression joint type structure in this generation; Make simultaneously the three-dimensional roughness element of evaporating surface of the piece that is heated again and on fin, set up some protruding holes of wing that stop extraneous air-flow; So that entire radiator had both had good heat conduction vaporization function, excellent heat radiation condensation performance is arranged again simultaneously.
Accompanying drawing 1 is an overall structure schematic diagram of the present utility model;
Accompanying drawing 2 is the single heat-sink unit cut-away view of the utility model.
Among the figure: 1, the piece that is heated, 2, fin, 3, heat exchanger tube, 4, conical plug, 5, wing is protruding, 6, braze, 7, working medium liquid.
Below in conjunction with accompanying drawing, further describe the utility model, and provide embodiment.
More than this heat-pipe radiator adopts is all-welded structure, be heat exchanger tube (3) with the junction surface of be heated piece (1) interface, port and heat exchanger tube interface and fin (2) and heat exchanger tube (3) entirely with silver-bearing copper welding rod bonding firmly, vacuumize pour into evaporate working medium liquid (7) after, employing conical plug (4) seals.Adopt as this form of figure at its whole length * wide * thick=3550～450 * 120～190 * 60～75mm, the piece width that is heated is that 70～120mm fin thickness is when being 0.5～0.8mm, this heat radiator thermal resistance can be guaranteed in 0.02 ℃/w, when ambient temperature is 40 ℃, can make rectifying tube pass through 2200A, junction temperature is no more than setting to thyristor by the 1500A electric current.
The operation principle of this heat-pipe radiator is as follows:
The heat that device dissipates is absorbed by the copper piece that is heated (1) again, and importing evaporation apertures, evaporation source in the evaporation apertures sucks heat vaporization (making a gram water vapor must inhale 2257 joule's heat energies at standard atmospheric pressure), working steam after the vaporization passes to fin (2) along heat exchanger tube (3) rising and with heat by the heat exchange tube wall, passes to the heat of fin (2) and is then taken away by the external refrigeration medium air; Working steam then is condensed into liquid in heat exchanger tube (3) inboard complete, flows to admittedly again in the evaporation apertures of the piece that is heated (1) at the effect lower edge of gravity or surperficial fluid power tube wall, and circulation goes round and begins again thus.
The protruding hole of wing on the fin (2) mainly has been the effect that hinders the outside air circulation, makes stream form turbulent flow between fin, can take away the heat between fin more.
Claims (1)
1, a kind of power semiconductor heat-pipe radiator is made up of the piece that is heated (1), fin (2) and heat exchanger tube (4), it is characterized in that solidifying connection by braze between the described piece that is heated (1), fin (2), heat exchanger tube (4) three; The evaporation apertures surface of the described piece that is heated (1) is three-dimensional roughness element; Described fin (2) is provided with some wings protruding (5); Described heat exchanger tube (3) top is provided with a conical plug (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98231416 CN2344875Y (en) | 1998-09-30 | 1998-09-30 | Heat pipe radiator for power semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98231416 CN2344875Y (en) | 1998-09-30 | 1998-09-30 | Heat pipe radiator for power semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2344875Y true CN2344875Y (en) | 1999-10-20 |
Family
ID=33980771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 98231416 Expired - Lifetime CN2344875Y (en) | 1998-09-30 | 1998-09-30 | Heat pipe radiator for power semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2344875Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100358135C (en) * | 2004-02-27 | 2007-12-26 | 鸿富锦精密工业（深圳）有限公司 | Heat elimination module and preparation method |
| CN100402963C (en) * | 2003-02-17 | 2008-07-16 | 深圳市益酷科技有限公司 | Heat dissipation fins, heat pipe, master board metal integral radiator |
-
1998
- 1998-09-30 CN CN 98231416 patent/CN2344875Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100402963C (en) * | 2003-02-17 | 2008-07-16 | 深圳市益酷科技有限公司 | Heat dissipation fins, heat pipe, master board metal integral radiator |
| CN100358135C (en) * | 2004-02-27 | 2007-12-26 | 鸿富锦精密工业（深圳）有限公司 | Heat elimination module and preparation method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |