CN210112504U - Phase change heat dissipation equipment - Google Patents
Phase change heat dissipation equipment Download PDFInfo
- Publication number
- CN210112504U CN210112504U CN201920084969.XU CN201920084969U CN210112504U CN 210112504 U CN210112504 U CN 210112504U CN 201920084969 U CN201920084969 U CN 201920084969U CN 210112504 U CN210112504 U CN 210112504U
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- Prior art keywords
- heat pipe
- heat
- phase change
- change cavity
- phase
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- 230000008859 change Effects 0.000 title claims abstract description 31
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 18
- 230000005494 condensation Effects 0.000 claims abstract description 15
- 238000009833 condensation Methods 0.000 claims abstract description 15
- 238000001704 evaporation Methods 0.000 claims abstract description 13
- 230000008020 evaporation Effects 0.000 claims abstract description 13
- 238000001816 cooling Methods 0.000 claims abstract description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000007788 liquid Substances 0.000 description 5
- 230000009471 action Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000009835 boiling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to an electronic equipment especially relates to the thermal row that high-power electronic equipment such as server, network equipment, LED lamp produced and looses. A phase-change heat dissipation device comprises a phase-change cavity and a heat pipe, wherein a groove for conveniently installing the heat pipe or a hole for conveniently inserting the heat pipe is formed in the surface of the phase-change cavity. The evaporation end of the heat pipe is mounted on the groove or inserted into the hole. The condensation end of the heat pipe is provided with a radiating fin or an external radiator such as a water cooling component. The water cooling part is installed in such a manner that the condensation end of the heat pipe is attached to the water cooling plate or the condensation end of the heat pipe is inserted into the water cooling channel. The heat pipe can be well contacted with the phase change cavity without being flattened, and the capillary structure of the heat pipe can be protected; under the condition that the heat pipes are inserted into the holes, the area of the phase change cavity occupied by each heat pipe is small, more heat pipes can be inserted, and the space utilization rate of the phase change cavity is improved. Therefore, the device can effectively improve the heat dissipation efficiency and well solve the heat dissipation problem of the high-power chip.
Description
Technical Field
The utility model relates to an electronic equipment especially relates to the thermal row that high-power electronic equipment such as server, network equipment, LED lamp produced and looses.
Background
The heat pipe is a high-efficiency radiator, and the heat is quickly conducted by utilizing the phase change process that a liquid medium is condensed at the cold end after being evaporated at the hot end. The interior of the heat pipe is pumped into a negative pressure state and filled with proper liquid, and the liquid has a low boiling point and is easy to volatilize. The heat pipe is internally provided with a wick which is made of capillary porous materials. When one end of the heat pipe is heated, the liquid in the capillary tube is quickly vaporized, the vapor flows to the other end under the power action of heat diffusion, the vapor is condensed at the cold end to release heat, the liquid flows back to the evaporation end along the porous material under the capillary action, the circulation is not stopped until the temperatures at the two ends of the heat pipe are equal, and the heat diffusion of the vapor is stopped.
The temperature-equalizing plate is a heat pipe with a flat structure, and generally comprises an upper cover and a lower cover, wherein the lower cover of the temperature-equalizing plate is an evaporation end and is in contact with a heating source, the upper cover of the temperature-equalizing plate is a condensation end, and heat-radiating fins are installed on the surface of the temperature-equalizing plate or a flat heat pipe is installed on the surface of the temperature-equalizing plate.
The heat pipes need to be flattened to be in better contact with the temperature-equalizing plate due to the flat structure of the temperature-equalizing plate, the performance of the heat pipes is influenced to a certain degree, each heat pipe needs to occupy a large area of the temperature-equalizing plate, the space utilization rate of the temperature-equalizing plate is not high, and therefore the whole heat dissipation capacity of the radiator is limited.
SUMMERY OF THE UTILITY MODEL
In order to improve the heat dissipation efficiency, the utility model provides a phase transition heat dissipation equipment scheme.
The utility model provides a technical scheme that its technical problem adopted is:
a phase-change heat dissipation device comprises a phase-change cavity and a heat pipe, wherein the phase-change cavity is a sealed cavity manufactured according to the principle of the heat pipe, and the surface of the phase-change cavity is provided with a groove for conveniently mounting the heat pipe or a hole for conveniently inserting the heat pipe. The evaporation end of the heat pipe is mounted on the groove or inserted into the hole. The surface refers to the surface wall of the phase change cavity, and the grooves or holes on the surface of the phase change cavity do not penetrate through the surface wall. The condensation end of the heat pipe is provided with a radiating fin or an external radiator such as a water cooling component. The water cooling part is installed in such a manner that the condensation end of the heat pipe is attached to the water cooling plate or the condensation end of the heat pipe is inserted into the water cooling channel.
The utility model has the advantages that:
a phase-change heat dissipation device is characterized in that a groove for conveniently installing a heat pipe or a hole for conveniently inserting the heat pipe is formed in the surface of a phase-change cavity, and an evaporation end of the heat pipe is installed on the groove or inserted into the hole. The surface refers to the surface wall of the phase change cavity, the groove or the hole on the surface of the phase change cavity does not penetrate through the surface wall, the air tightness of the phase change cavity is not influenced by the groove or the hole, the reliability of the product is high, the phase change cavity can be produced independently, and the production cost is low. The heat pipe can be well contacted with the phase change cavity without being flattened, and the capillary structure of the heat pipe can be protected; under the condition that the heat pipes are inserted into the holes, the occupied area of each heat pipe is small, more heat pipes can be inserted, and the space utilization rate of the phase change cavity is improved. Therefore, the device can effectively improve the heat dissipation efficiency and well solve the heat dissipation problem of the high-power chip.
Drawings
Fig. 1 is a schematic structural diagram of a phase change heat dissipation apparatus according to the present invention.
Fig. 2 is a perspective view of a phase change heat dissipation device according to the present invention.
Fig. 3 is a schematic perspective view of a phase change cavity of the phase change heat dissipation device according to the present invention.
In the figure, 1 is a phase change cavity, 2 is a heat pipe, 3 is the surface of the phase change cavity, 4 is a round hole, 5 is a heat pipe evaporation end, 6 is a heat pipe condensation end, and 7 is a radiating fin.
Detailed Description
The present invention will be further explained with reference to the drawings and examples.
As shown in fig. 1, 2 and 3: a phase change heat dissipation device comprises a phase change cavity 1 and a heat pipe 2, wherein a round hole 4 for conveniently inserting the heat pipe 2 is formed in the surface 3 of the phase change cavity. The evaporation end 5 of the heat pipe is inserted into the round hole 4. The condensation end 6 of the heat pipe is provided with a heat sink 7.
Claims (8)
1. The phase change heat dissipation equipment is composed of a phase change cavity and a heat pipe, and is characterized in that: the surface of the phase change cavity is provided with a hole for conveniently installing the heat pipe, and the hole does not penetrate through the surface wall of the phase change cavity.
2. The heat dissipating apparatus of claim 1, wherein: the evaporation end of the heat pipe is inserted into the hole, and the condensation end of the heat pipe is provided with a radiating fin.
3. The heat dissipating apparatus of claim 1, wherein: the evaporation end of the heat pipe is inserted into the hole, and the condensation end of the heat pipe is provided with a water cooling plate.
4. The heat dissipating apparatus of claim 1, wherein: the evaporation end of the heat pipe is inserted into the hole, and the condensation end of the heat pipe is inserted into the water cooling channel.
5. The phase change heat dissipation equipment is composed of a phase change cavity and a heat pipe, and is characterized in that: the surface of the phase change cavity is provided with a groove for conveniently installing the heat pipe, and the groove does not penetrate through the surface wall of the phase change cavity.
6. The heat dissipating apparatus of claim 5, wherein: the evaporation end of the heat pipe is arranged on the groove, and the condensation end of the heat pipe is provided with a radiating fin.
7. The heat dissipating apparatus of claim 5, wherein: the evaporation end of the heat pipe is arranged on the groove, and the condensation end of the heat pipe is provided with a water cooling plate.
8. The heat dissipating apparatus of claim 5, wherein: the evaporation end of the heat pipe is arranged on the groove, and the condensation end of the heat pipe is inserted into the water cooling channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920084969.XU CN210112504U (en) | 2019-01-18 | 2019-01-18 | Phase change heat dissipation equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920084969.XU CN210112504U (en) | 2019-01-18 | 2019-01-18 | Phase change heat dissipation equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210112504U true CN210112504U (en) | 2020-02-21 |
Family
ID=69530471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920084969.XU Active CN210112504U (en) | 2019-01-18 | 2019-01-18 | Phase change heat dissipation equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210112504U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465253A (en) * | 2019-01-18 | 2020-07-28 | 周哲明 | A phase change cooling device |
-
2019
- 2019-01-18 CN CN201920084969.XU patent/CN210112504U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465253A (en) * | 2019-01-18 | 2020-07-28 | 周哲明 | A phase change cooling device |
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