CN210014474U - Radiator, air condensing units and air conditioner - Google Patents

Abstract

The application relates to a radiator, air condensing units and air conditioner, wherein, the radiator includes: the first heat dissipation end comprises a first end of a first working medium loop and a heat dissipation base body in heat conduction contact with the first end, and the second heat dissipation end comprises a second end of the first working medium loop and one or more microchannel heat dissipation pieces in heat conduction contact with the second end; the first working medium loop is arranged to be filled with a first heat exchange working medium, and the microchannel heat sink is arranged to be filled with a second heat exchange working medium. The application provides a radiator has better radiating effect.

Description

Radiator, air condensing units and air conditioner

Technical Field

The present application relates to the field of heat dissipation technologies, and for example, to a heat sink, an outdoor unit of an air conditioner, and an air conditioner.

Background

The temperature of the chip in the electric control box of the outdoor unit of the air conditioner is one of the factors for the normal operation of the air conditioner. The temperature of the chip in the electric control box can rise along with factors such as the extension of working time, the rise of outdoor temperature and the like, and heat generated by the chip in the electric control box needs to be dissipated so as to ensure the normal operation of the air conditioner.

In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art: the existing radiator has poor radiating effect.

SUMMERY OF THE UTILITY MODEL

The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview nor is intended to identify key/critical elements or to delineate the scope of such embodiments but rather as a prelude to the more detailed description that is presented later.

The disclosed embodiment provides a heat sink.

In some optional embodiments, the heat sink comprises: the first heat dissipation end comprises a first end of a first working medium loop and a heat dissipation base body in heat conduction contact with the first end, and the second heat dissipation end comprises a second end of the first working medium loop and one or more microchannel heat dissipation pieces in heat conduction contact with the second end; the first working medium loop is arranged to be filled with a first heat exchange working medium, and the microchannel heat sink is arranged to be filled with a second heat exchange working medium.

The embodiment of the disclosure provides an air conditioner outdoor unit.

In some optional embodiments, the outdoor unit of the air conditioner includes the radiator.

The embodiment of the disclosure provides an air conditioner.

In some optional embodiments, the air conditioner includes the outdoor unit of the air conditioner.

Some technical solutions provided by the embodiments of the present disclosure can achieve the following technical effects:

the radiator provided by the embodiment of the disclosure comprises a first radiating end and a second radiating end, wherein the first radiating end and the second radiating end carry out heat transfer through a first working medium loop. The second heat dissipation end is provided with the micro-channel heat dissipation piece, the micro-channel heat dissipation piece is filled with a second heat exchange working medium, the heat dissipation rate of the second heat dissipation end is improved, the heat dissipation effect of the heat radiator is improved, and the operation reliability of the air conditioner is further improved.

The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.

Drawings

One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the accompanying drawings and not in limitation thereof, in which elements having the same reference numeral designations are shown as like elements and not in limitation thereof, and wherein:

fig. 1 is a schematic structural diagram of a heat sink provided in an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of another heat sink provided in the embodiments of the present disclosure;

fig. 3 is a schematic structural view of a first microchannel heat sink provided by embodiments of the present disclosure;

fig. 4 is a schematic structural view of a second microchannel heat sink provided by embodiments of the present disclosure;

fig. 5 is a schematic structural diagram of a second heat dissipation end of a first heat sink according to an embodiment of the disclosure;

fig. 6 is a schematic structural diagram of a second heat dissipation end of a second heat sink according to an embodiment of the disclosure;

fig. 7 is a schematic structural diagram of a second heat dissipation end of a third heat sink provided in the embodiment of the present disclosure;

fig. 8 is a schematic structural view of a first outdoor unit of an air conditioner according to an embodiment of the present disclosure;

fig. 9 is a schematic structural view of a second outdoor unit of an air conditioner according to an embodiment of the present disclosure;

fig. 10 is another schematic structural view of a second outdoor unit of an air conditioner according to an embodiment of the present disclosure;

fig. 11 is a schematic structural view of a third outdoor unit of an air conditioner according to an embodiment of the present disclosure;

and the number of the first and second groups,

fig. 12 is another schematic structural diagram of an outdoor unit of an air conditioner according to a third embodiment of the present disclosure.

Reference numerals:

1: a first heat dissipation end; 2: a second heat dissipation end; 3: a first working medium circuit; 4: an electronic control box; 5: a fan; 6: a back plate opening; 7: an acoustic panel opening; 21: a microchannel heat sink; 22: a first tube section; 23: a second tube section; 25: a connecting section; 31: a gas line section; 32: a liquid line section; 211: a protrusion; 212: a microchannel heat dissipation tube; 221: a first communication end; 222: a second communication terminal.

Detailed Description

So that the manner in which the features and elements of the disclosed embodiments can be understood in detail, a more particular description of the disclosed embodiments, briefly summarized above, may be had by reference to the embodiments, some of which are illustrated in the appended drawings. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown in simplified form in order to simplify the drawing.

The disclosed embodiment provides a heat sink, including: the first heat dissipation end comprises a first end of the first working medium loop and a heat dissipation base body in heat conduction contact with the first end, and the second heat dissipation end comprises a second end of the first working medium loop and one or more microchannel heat dissipation pieces in heat conduction contact with the second end; the first working medium circuit is arranged to fill a first heat exchange working medium and the microchannel heat sink is arranged to fill a second heat exchange working medium.

The radiator provided by the embodiment of the disclosure, as shown in fig. 1 and fig. 2, includes a first heat dissipation end 1 and a second heat dissipation end 2, the first working medium loop 3 is set to be filled with the first heat exchange working medium, or the first working medium loop 3 is filled with the first heat exchange working medium, the first heat dissipation end 1 and the second heat dissipation end 2 perform heat transfer through the first working medium loop 3, so that the first heat dissipation end 1 and the second heat dissipation end 2 can simultaneously dissipate heat of the same object to be cooled, and the radiator has a high heat dissipation effect. The second heat dissipation end 2 comprises a second end of the first working medium loop 3 and one or more than one microchannel heat dissipation part 21 in heat conduction contact with the second end of the first working medium loop 3, and the microchannel heat dissipation part 21 is set to be filled with a second heat exchange working medium, or the microchannel heat dissipation part 21 is filled with the second heat exchange working medium. Optionally, the first heat exchange working medium is a phase change working medium capable of performing a phase change between a gas state and a liquid state, such as a refrigerant, and similarly, the second heat exchange working medium may also be a phase change working medium capable of performing a phase change between a gas state and a liquid state, such as a refrigerant. The first heat exchange working medium is sealed in the first working medium loop 3, the second heat exchange working medium is sealed in the microchannel heat dissipation part 21, and the first heat exchange working medium and the second heat exchange working medium are not in contact with each other. The first heat exchange working medium in the first working medium loop can be used for transferring the heat of the first heat dissipation end 1 to the second heat dissipation end 2, and optionally, the first working medium loop 3 is a loop heat pipe. Optionally, in the vertical direction, the height of the first heat dissipation end 1 is lower than that of the second heat dissipation end 2, which is beneficial to the circulation flow of the first heat exchange working medium in the first working medium loop 3.

In the radiator provided by the embodiment of the present disclosure, the first working medium circuit 3 includes a first end, a second end, and a gas pipe section 31 and a liquid pipe section 32 communicating the first end and the second end, as shown in fig. 1 and 2. Wherein the first end of the first working medium circuit 3 comprises a first port and a second port and the second end of the first working medium circuit 3 comprises a third port and a fourth port. The connection sequence of the pipe sections of the first working medium circuit 3 can be: the first port of the first end of the first working medium circuit 3 is directly communicated with the third port of the second end of the first working medium circuit 3 through a gas pipe section 31, and the fourth port of the second end of the first working medium circuit 3 is directly communicated with the second port of the first end of the first working medium circuit 3 through a liquid pipe section 32. Optionally, the first port, the second port, the third port and the fourth port may be virtual ports, which are defined for describing each pipe section of the first working medium circuit 3, and the first working medium circuit 3 may be integrally formed.

The method for radiating by adopting the radiator provided by the embodiment of the disclosure can be as follows: the first heat dissipation end 1 is in heat conduction contact with an object to be dissipated, receives heat of the object to be dissipated and dissipates heat, a first heat exchange working medium in a first end of a first working medium loop 3 is heated to become gaseous, the gaseous first heat exchange working medium reaches a second end of the first working medium loop 3 through a gas pipeline section 31, heat dissipation is carried out at a second heat dissipation end 2, a micro-channel heat dissipation piece 21 of the second heat dissipation end 2 is in heat conduction contact with a second end of the first working medium loop 3, a second heat exchange working medium in the micro-channel heat dissipation piece 21 is heated to become gaseous, heat dissipation is carried out, the heat dissipation rate of the second heat dissipation end 2 is improved, and therefore the heat dissipation capacity of the radiator is improved. The object to be radiated can be an electric control box of an air conditioner outdoor unit.

In the process of implementing the embodiments of the present disclosure, it is found that the heat dissipation effect of the existing heat sink is poor, in part because the heat dissipation speed of the existing heat sink is slow. After the first heat dissipation end in heat conduction contact with an object to be dissipated receives heat, the heat conduction rate of the heat pipe is high, the heat is quickly transferred to the second heat dissipation end, the heat dissipation speed of the second heat dissipation end of the existing heat dissipater is limited, heat dissipation cannot be carried out in time, the time for gaseous working media at the condensation end to become liquid is long, the circulation speed of the first heat exchange working media in the first working medium loop 3 is influenced, the heat dissipation rate is low, and the heat dissipation effect of the heat dissipater is influenced.

In the radiator provided by the embodiment of the disclosure, the second heat dissipation end 2 comprises a second end of the first working medium loop 3 and a micro-channel heat dissipation member 21 in heat conduction contact with the second end, the micro-channel heat dissipation member 21 is filled with a second heat exchange working medium, the second heat exchange working medium receives heat of the gaseous first heat exchange working medium, the rate of the first heat exchange working medium becoming liquid is improved, the circulation speed of the first heat exchange working medium in the first working medium loop 3 is improved, thereby the heat dissipation rate of the second heat dissipation end 2 is improved, and the heat dissipation effect of the radiator is improved.

In the heat sink provided by the embodiment of the present disclosure, the microchannel heat sink 21 includes a housing and a microchannel formed inside the housing, and a second heat exchange working medium is filled in the microchannel of the microchannel heat sink 21. The second heat exchange working medium can exchange heat with the first heat exchange working medium in the second end of the first working medium loop 3, and the heat dissipation effect is exerted. Optionally, the housing of the microchannel heat sink 21 is in heat-conducting contact with the second end of the first working medium circuit 3. Optionally, the heat-conducting contact may be achieved by fixedly connecting the casing of the microchannel heat sink 21 to the second end of the first working medium circuit 3, and the connection may be welding. The part of the second end of the first working medium loop 3, which is in contact with the shell of the microchannel heat sink 21, is filled with a soldering tin material to reduce contact thermal resistance. Optionally, the material of the casing of the microchannel heat sink 21 is aluminum or copper.

Optionally, the microchannel heat sink 21 is a microchannel heat sink fin, such as the first middle microchannel heat sink provided in fig. 3. Optionally, the microchannel heat dissipation fin is cuboid, and the thickness of the microchannel heat dissipation fin can be 2-3 mm. The microchannel heat dissipation fin comprises a shell and microchannels which are formed in the shell and are sealed at two ends, and second heat exchange working media are filled in the microchannels. Optionally, the second end of the first working medium loop 3 is provided with more than one microchannel heat dissipation fins in heat conduction contact with the second end, the more than one microchannel heat dissipation fins are arranged in parallel, or arranged in parallel side by side, and the distance between two adjacent microchannel heat dissipation fins is 3-5 mm. The size, the number and the like of the micro-channel radiating fins can be set according to the space size of the position to be installed.

Optionally, as shown in fig. 4, the second microchannel heat dissipation member provided in the embodiment of the present disclosure includes more than one communicated microchannel heat dissipation tubes 212, the more than one communicated microchannel heat dissipation tubes 212 form a second working medium loop, and a second heat exchange working medium is filled in the second working medium loop, as shown in fig. 4 and 5. Optionally, the shape of the microchannel heat dissipation tube 212 is similar to that of the microchannel heat dissipation fin, and the difference is that the microchannel in the microchannel heat dissipation tube 212 is a through tube with openings at two ends, and two ends of the microchannel in the microchannel heat dissipation fin are sealed. Optionally, more than one microchannel heat dissipation tubes 212 are in a serpentine shape, and two ends of the serpentine shape are communicated to form a second working medium loop. Similarly, the thickness of the micro-channel heat pipe 212 may be 2-3mm, more than one micro-channel heat pipe 212 may be arranged in parallel, and the distance between two adjacent micro-channel heat pipes 212 may be 3-5 mm.

Alternatively, some of the more than one connected microchannel heat pipes 212 are in heat conducting contact with the second end of the first working medium circuit 3, as shown in fig. 4 and 5. The "partial pipe" herein may be several of the more than one microchannel heat dissipation pipes 212, for example, several adjacent microchannel heat dissipation pipes 212 among the more than one microchannel heat dissipation pipes 212 may be communicated, and further, several adjacent microchannel heat dissipation pipes 212 may be selected to contact with the second end of the first operation fluid circuit 3 from one end of the microchannel heat dissipation member 22. Optionally, as shown in fig. 4, the pipes outlined by the dashed lines are in heat-conducting contact with the second end of the first working medium circuit 3, and the pipes not outlined by the dashed lines are not in contact with the first working medium circuit 3.

Alternatively, as shown in fig. 5, the heat dissipation method of the microchannel heat dissipation element formed by more than one communicated microchannel heat dissipation tubes 212 at the second heat dissipation end of the first heat dissipation device may be: the microchannel heat pipe 212, which is in heat conducting contact with the second end of the first working medium circuit 3, is defined as a contact pipe, and the microchannel heat pipe 212, which is not in heat conducting contact with the second end of the first working medium circuit 3, is defined as a non-contact pipe. After the contact tube is in heat conduction contact with the second end of the first working medium loop 3, the second heat exchange working medium in the contact tube is heated to become a gas state, the gas second heat exchange working medium moves to the non-contact tube, is precooled at the non-contact tube and becomes a liquid state, and flows back to the contact tube to perform the next phase change heat dissipation cycle.

Optionally, the inner surface of the microchannel heat sink is provided with one or more protrusions 211, as shown in fig. 3, so that the contact area between the second heat exchange working medium in the microchannel heat sink and the microchannel is increased, and the heat dissipation effect is improved. Optionally, the material of the protrusion 211 is the same as that of the microchannel heat sink, and optionally, the microchannel heat sink and the protrusion 211 inside the microchannel heat sink are integrally formed. Optionally, the protrusion 211 is in the shape of a straight line, and the length is 0.3-0.5 mm.

In the radiator provided by the embodiment of the present disclosure, the second end of the first working medium loop 3 includes a first pipe section, a second pipe section, and a connecting section connecting the first pipe section and the second pipe section, and the first pipe section and the second pipe section are arranged in parallel, or may be described as having a U-shaped second end; or the plane of the first pipe section is intersected with the plane of the second pipe section.

Alternatively, as shown in fig. 6, at the second heat dissipation end of the second heat sink, the plane where the first tube segment 22 is located may be infinitely extended, the plane where the second tube segment 23 is located may be infinitely extended, the first tube segment 22 does not intersect with the second tube segment 23, but the plane where the first tube segment 22 intersects with the second tube segment 23, which may also be described as that the first tube segment 22 and the second tube segment 23 are not parallel and arranged side by side. Optionally, the first pipe section 22 is directly communicated with the gas pipe section 31 of the first working medium circuit 3, the second pipe section 23 is directly communicated with the liquid pipe section 32 of the first working medium circuit 3, the first pipe section 22 includes a first communication end 221 directly communicated with the gas pipe section 31, and a second communication end 222 directly communicated with the connection section 24, and in the vertical direction, the height of the first communication end 221 is lower than that of the second communication end 222, so that the heat dissipation effect of the first pipe section 22 is improved. Optionally, the second tube section 23 is horizontally arranged.

Optionally, the microchannel heat sink is in thermally conductive contact with the first tube segment 22 and the second tube segment 23. Optionally, the microchannel heat sink fins 21 are in vertical heat conduction contact with the first tube segment 22 and the second tube segment 23, as shown in fig. 1 and fig. 2, or the microchannel heat sink fins 21 are in oblique heat conduction contact with the first tube segment 22 and the second tube segment 23, and in the vertical direction, the contact point of the microchannel heat sink fins 21 with the first tube segment 22 is lower than the contact point with the second tube segment 23, as shown in fig. 7, which is the second heat sink end of the third heat sink. The first pipe section 22 is in direct communication with the gas pipe section 31 of the first working medium circuit 3, and the second pipe section 23 is in direct communication with the liquid pipe section 32 of the first working medium circuit 3.

Optionally, when the microchannel heat dissipation fins 21 are in inclined heat-conducting contact with the first tube segment 22 and the second tube segment 23, the heat dissipation method may be: after the microchannel heat dissipation fins 21 exchange heat with the gaseous first heat exchange working medium in the first pipe section 22 and dissipate heat, the second heat exchange working medium is changed into a gaseous state and moves upwards along the inclined microchannel heat dissipation fins 21, the gaseous second heat exchange working medium exchanges heat with the liquid first heat exchange working medium in the second pipe section 23, the gaseous second heat exchange working medium is changed into a liquid state and flows back to the bottom of the microchannel heat dissipation fins 21 to perform next heat exchange and heat dissipation, the heat exchange process causes heat loss due to phase change of a gas phase and a liquid phase, the number of heat exchange times is increased, and the heat dissipation effect of the second heat dissipation end 2 is improved.

In the heat sink provided by the embodiment of the present disclosure, the contact manner of the first end of the first working medium circuit 3 and the heat dissipation substrate in heat conduction contact may be that the heat dissipation substrate is provided with an accommodation space for accommodating the first end of the first working medium circuit 3, optionally, the accommodation space may be a groove, and the first end of the first working medium circuit 3 is embedded in the groove. Optionally, the first end of the first working medium loop 3 is U-shaped, so that the contact area with the heat dissipation substrate is increased, and the heat conduction effect is increased, as shown in fig. 1, or the first end of the first working medium loop 3 is horizontal or vertical "one" shaped, the groove of the heat dissipation substrate is a through groove, the first end of the first working medium loop 3 passes through the through groove, and the circulation fluidity of the first heat exchange working medium in the first working medium loop 3 is increased, as shown in fig. 2. Optionally, the heat dissipation substrate is a heat sink, and the heat dissipation substrate may be made of aluminum or copper.

The embodiment of the disclosure provides an air conditioner outdoor unit comprising the radiator.

The chip in the electric control box of the air conditioner outdoor unit can generate higher heat during working, and is not beneficial to normal operation of the chip in the electric control box, for example, the frequency conversion module, and when the temperature is higher, the frequency conversion module operates in a frequency reduction mode, so that the temperature regulation effect of the air conditioner is influenced. In summer with higher outdoor temperature, if the heat dissipation of the electric control box is not timely, the frequency conversion module operates in a frequency reduction mode, the refrigerating capacity is reduced, and the refrigerating effect is poor.

The radiator provided by the embodiment of the disclosure has higher heat dissipation efficiency, improves the heat dissipation effect of the electric control box of the air conditioner outdoor unit, improves the operation reliability of the chip in the electric control box of the air conditioner outdoor unit, and improves the temperature regulation effect of the air conditioner.

Optionally, the first heat dissipation end or the second heat dissipation end of the heat sink is in heat conduction contact with the electronic control box, or the first heat dissipation end or the second heat dissipation end of the heat sink is in heat conduction contact with the electronic control board in the electronic control box. Optionally, the first heat dissipation end of the heat sink is in heat-conducting contact with the electronic control box.

The method for cooling the electric control box of the air conditioner outdoor unit by adopting the radiator provided by the embodiment of the disclosure can be as follows: the first heat dissipation end 1 or the second heat dissipation end 2 of the heat radiator is in heat conduction contact with the electric control box. Optionally, the first heat dissipation end 1 of the heat sink is in heat conduction contact with the electronic control box, receives heat of the electronic control box, and dissipates heat, the first heat exchange working medium in the first end of the first working medium loop 3 is heated to become gaseous, the gaseous first heat exchange working medium reaches the second end of the first working medium loop 3 through the gas pipeline section 31, and dissipates heat at the second heat dissipation end 2, the microchannel heat dissipation piece of the second heat dissipation end 2 is in heat conduction contact with the second end of the first working medium loop 3, and the second heat exchange working medium in the microchannel heat dissipation piece is heated to become gaseous, and dissipates heat. The radiator provided by the embodiment of the disclosure has a higher radiating effect, and the operation reliability of the air conditioner is improved.

Optionally, as shown in fig. 8, in the first outdoor unit of an air conditioner provided in the embodiment of the present disclosure, the electronic control box 4 is disposed on a sound insulation board of the outdoor unit of the air conditioner, the first heat dissipation end 1 is in heat conduction contact with the electronic control box 4, the second heat dissipation end 2 is disposed on the upper portion of the fan 5, and optionally, the second heat dissipation end 2 is disposed on the upper portion of the fan 5 and is far away from one end of the electronic control box 4. And cold air enters the box body of the air conditioner outdoor unit from the air inlet of the air conditioner outdoor unit and blows away the heat of the second heat dissipation end 2.

Optionally, as shown in fig. 9 and 10, in the second outdoor unit of an air conditioner provided in the embodiment of the present disclosure, the electronic control box 4 is disposed on a sound insulation board of the outdoor unit of the air conditioner, and the first heat dissipation end 1 is in heat conduction contact with the electronic control box 4. The air conditioner outdoor unit comprises an air conditioner cabin and a compressor cabin, wherein the compressor cabin comprises a sound insulation board and a back plate, the sound insulation board is a board located between the air conditioner cabin and the compressor cabin, the back plate is a board which is connected with the sound insulation board and used for forming a back plate of the air conditioner outdoor unit, and the back plate is a board opposite to a front panel of the air conditioner outdoor unit. The back plate is provided with a back plate opening 6, and the second heat dissipation end 2 of the air conditioner outdoor unit is arranged at the back plate opening 6 in the compressor cabin. Optionally, the backplate opening 6 is a louvered air inlet opening that is downward-facing, or the backplate opening 6 is located at the upper end of the backplate, as shown in fig. 10.

Optionally, a second heat dissipation method of an outdoor unit of an air conditioner provided in the embodiment of the present disclosure may be: wind enters the compression cabin from the back plate opening 6, flows through the second heat dissipation end 2, takes away heat of the second heat dissipation end 2, and hot wind enters the wind cabin through the sound insulation plate opening 7 and is blown away by the fan 5.

Optionally, as shown in fig. 11 and 12, in the third outdoor unit of an air conditioner provided in the embodiment of the present disclosure, the electronic control box 4 is disposed on a sound insulation board of the outdoor unit of the air conditioner, and the first heat dissipation end 1 is in heat conduction contact with the electronic control box 4. The air conditioner outdoor unit comprises a fan cabin and a compressor cabin, wherein the compressor cabin comprises a sound insulation board and a rear back board, and the sound insulation board is a board located between the fan cabin and the compressor cabin. The sound insulation board is provided with a sound insulation board opening 7, the second heat dissipation end 2 of the air conditioner outdoor unit is arranged at the sound insulation board opening 7 in the compressor cabin, and optionally, the sound insulation board opening 7 is located at the upper end of the sound insulation board.

Optionally, a third heat dissipation method of an outdoor unit of an air conditioner provided in the embodiment of the present disclosure may be: wind enters from the back plate opening 6, flows through the second heat dissipation end 2 positioned at the sound insulation plate opening, takes away heat of the second heat dissipation end 2, and hot wind enters the wind cabin through the sound insulation plate opening 7 and is blown away by the fan 5.

The embodiment of the disclosure also provides an air conditioner comprising the air conditioner outdoor unit.

The present invention is not limited to the structures that have been described above and shown in the drawings, and various modifications and changes can be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

Claims (10)

1. A heat sink, comprising:

a first heat dissipation end comprising a first end of a first working medium loop and a heat dissipation substrate in heat-conducting contact with the first end,

a second heat dissipation end comprising a second end of the first working medium loop and one or more microchannel heat sinks in heat-conducting contact with the second end;

the first working medium loop is arranged to be filled with a first heat exchange working medium, and the microchannel heat sink is arranged to be filled with a second heat exchange working medium.

2. The heat sink of claim 1,

the microchannel heat dissipation piece is a microchannel heat dissipation fin.

3. The heat sink of claim 1,

the microchannel heat dissipation part comprises more than one communicated microchannel heat dissipation pipe, and the more than one communicated microchannel heat dissipation pipe forms a second working medium loop.

4. The heat sink of claim 3,

and part of the more than one communicated microchannel radiating pipes are in heat conduction contact with the second end of the first working medium loop.

5. The heat sink of any one of claims 1-4, wherein the second end of the first working medium circuit comprises:

the first section of the tube is provided with a first opening,

a second pipe section, and

a connecting section connecting the first pipe section and the second pipe section;

wherein the first tube section and the second tube section are arranged in parallel, or,

the plane of the first pipe section is intersected with the plane of the second pipe section.

6. The heat sink of claim 5,

the microchannel heat sink is in thermally conductive contact with the first and second tube segments.

7. The heat sink of claim 1,

the inner surface of the microchannel heat sink is provided with one or more protrusions.

8. An outdoor unit of an air conditioner, comprising the heat sink of any one of claims 1 to 7.

9. The outdoor unit of claim 8, further comprising: an electric control box, an electric control board is arranged in the electric control box,

the first heat dissipation end or the second heat dissipation end is in heat conduction contact with the electric control box; alternatively, the first and second electrodes may be,

the first heat dissipation end or the second heat dissipation end is in heat conduction contact with the electric control board.

10. An air conditioner comprising the outdoor unit of claim 8 or 9.

Images