CN105576113A - Semiconductor refrigeration component - Google Patents
Semiconductor refrigeration component Download PDFInfo
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- CN105576113A CN105576113A CN201610087559.1A CN201610087559A CN105576113A CN 105576113 A CN105576113 A CN 105576113A CN 201610087559 A CN201610087559 A CN 201610087559A CN 105576113 A CN105576113 A CN 105576113A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
- H10N19/101—Multiple thermocouples connected in a cascade arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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Abstract
The invention provides a semiconductor refrigeration component, which comprises semiconductor couple pairs, a cold-end substrate, a hot-end substrate and a liquid cooling device, wherein the cold-end substrate is connected with cold ends of the semiconductor couple pair; the hot-end substrate is connected with hot ends of the semiconductor couple pair; the hot-end substrate comprises a metal substrate and a heat-conducting insulating layer; the heat-conducting insulating layer is connected between the metal substrate and the semiconductor couple pair; the liquid cooling device comprises a liquid cooling substrate which is connected with the metal substrate; a liquid tank is formed in the mounting surface, connected with the metal substrate, of the liquid cooling substrate; and a flowing cooling liquid is arranged between the liquid tank and the metal substrate. The semiconductor refrigeration component provided by the invention can improve the cooling rate of the hot ends of the semiconductor couple pairs, and can achieve high-power refrigeration.
Description
Technical field
The present invention relates to semiconductor refrigerating technology, particularly relate to a kind of semiconductor refrigerating assembly.
Background technology
Semiconductor refrigeration chip (TEC, ThermoelectricCooler) be a kind of refrigeration device utilizing Peltier (Peltier) effect to make, its main structure be semi-conductor electricity couple (also referred to as P-N galvanic couple to), after adding certain voltage to semi-conductor electricity couple, the cold junction of semi-conductor electricity couple and hot junction can produce certain temperature difference.After the heat in its hot junction is distributed, its cold junction can produce certain cold, realizes refrigeration.
Fig. 1 is the structural representation of existing a kind of semiconductor refrigerating assembly.As shown in Figure 1, existing a kind of cooling assembly utilizing semiconductor refrigeration chip to make comprises cold junction substrate 11, semi-conductor electricity couple 12 and hot junction substrate 13, wherein, the cold junction of semi-conductor electricity couple 12 is connected with cold junction substrate 11 by cold terminal electrodes 14, the hot junction of semi-conductor electricity couple 12 is connected with a side surface of hot junction substrate 13 by hotter side electrode 15, and the mode especially by welding connects.The opposite side surface soldered of hot junction substrate 13 has radiator structure, and this radiator structure comprises heat-radiating substrate 16 and fin 17, and wherein, heat-radiating substrate 16 is welded on hot junction substrate 13.The heat in semi-conductor electricity couple 12 hot junction first conducts to hot junction substrate 13 through solder, then conducts to fin 17 by heat-radiating substrate 16, carries out heat exchange, fall the heat in semi-conductor electricity couple 12 hot junction by fin 17 and ambient air.
In above-mentioned cooling assembly, because hot junction substrate 13 and heat-radiating substrate 16 are that mode by welding is fixing, the heat in semi-conductor electricity couple 12 hot junction conducts through hot junction substrate 13, solder and heat-radiating substrate 16 successively, outside the thermal resistance that removing hot junction substrate 13 and heat-radiating substrate 16 have self, also there is larger thermal resistance in solder therebetween, has had a strong impact on the conduction velocity of heat.Further, the speed that fin and surrounding air carry out heat exchange is also very low, also have impact on distributing of semi-conductor electricity couple 12 hot junction heat to a great extent.Therefore, have larger thermal resistance and fin and air by solder and carry out the slower impact of rate of heat exchange, existing semiconductor refrigerating assembly is only applicable to small-power refrigeration, and cannot realize high-power refrigeration.
Summary of the invention
The invention provides a kind of semiconductor refrigerating assembly, for improving the rate of heat dispation in semi-conductor electricity couple hot junction, high-power refrigeration can be realized.
The invention provides a kind of semiconductor refrigerating assembly, comprising: semi-conductor electricity couple, the cold junction substrate be connected with semi-conductor electricity couple cold junction, the hot junction substrate be connected with semi-conductor electricity couple hot junction and liquid cools device; Wherein, described hot junction substrate comprises metal substrate and is connected to the thermally conductive insulating layer between metal substrate and semi-conductor electricity couple;
Described liquid cools device comprises: the liquid cools matrix be connected with metal substrate, the installed surface that described liquid cools matrix is connected with metal substrate is offered and puts liquid bath, described in put the cooling liquid being provided with flowing between liquid bath and metal substrate.
Semiconductor refrigerating assembly as above, described liquid cools matrix is provided with away from the diapire inner surface of metal substrate at least one dividing plate supported between described diapire inner surface and metal substrate, at least one dividing plate is divided into snakelike flow channel for liquids by putting liquid bath, and described cooling liquid flows in described flow channel for liquids.
Semiconductor refrigerating assembly as above, described metal substrate is provided with pit towards the surface of described liquid cools matrix, and the quantity of described pit is at least two, and at least two pits are corresponding with the position of flow channel for liquids.
Semiconductor refrigerating assembly as above, a sidewall adjacent with described diapire on described liquid cools matrix is provided with inlet and liquid outlet, and described inlet and liquid outlet are corresponding with the top of described flow channel for liquids and the position of end respectively; Described inlet and liquid outlet are also communicated with the cooling line of outside and form cooling circuit, and described cooling circuit is provided with liquor pump.
Semiconductor refrigerating assembly as above, described cooling circuit is also provided with heat exchanger, is provided with the fluid passage be communicated with described cooling line in described heat exchanger.
Semiconductor refrigerating assembly as above, described liquid cools device also comprises the cooling fan for dispelling the heat to described heat exchanger.
Semiconductor refrigerating assembly as above, described metal substrate is aluminium base.
Semiconductor refrigerating assembly as above, described metal substrate is provided with at least two sheet metals spaced apart from each other towards the surface of described liquid cools matrix, described sheet metal is corresponding with the position of flow channel for liquids, and each sheet metal is along the length direction extension of the flow channel for liquids corresponding with it.
Semiconductor refrigerating assembly as above, described metal substrate is provided with at least two the metal ribs protruded from this surface spaced apart from each other towards the surface of described liquid cools matrix, and described metal rib is corresponding with the position of flow channel for liquids.
Semiconductor refrigerating assembly as above, the installed surface of described liquid cools matrix is also provided with seal groove, is provided with sealing ring in described seal groove, for sealing the gap between described liquid cools matrix and metal substrate.
The technical scheme that the present embodiment adopts is connected with the hot end surface of metal substrate by adopting liquid cools matrix, and between liquid cools matrix and metal substrate, be provided with the cooling liquid of flowing, the cooling liquid of this flowing directly contacts with metal substrate, the heat of metal substrate can be absorbed rapidly, reduce the temperature of metal substrate, also rapidly reduce the temperature in semi-conductor electricity couple hot junction further.
Compared with the mode of welding with hot junction substrate in prior art and heat-radiating substrate, the cooling liquid flowed in the technical scheme that the present embodiment provides directly contacts with metal substrate, can dispel the heat to metal substrate rapidly, on the one hand the hot junction of metal substrate do not exist any as solder in prior art or heat-radiating substrate self the thermal resistance that has, the thermal capacity of the cooling liquid of flowing is larger on the other hand, heat can be absorbed fast in a large number, and then the temperature in semi-conductor electricity couple hot junction can be reduced rapidly, be conducive to realizing high-power refrigeration.
Accompanying drawing explanation
Fig. 1 is the structural representation of existing a kind of semiconductor refrigerating assembly;
The explosive view of the semiconductor refrigerating assembly that Fig. 2 provides for the embodiment of the present invention;
The structural representation of the semiconductor refrigerating assembly that Fig. 3 provides for the embodiment of the present invention;
Fig. 4 is the cutaway view in A-A cross section in Fig. 3;
The another structural representation of the semiconductor refrigerating assembly that Fig. 5 provides for the embodiment of the present invention;
The structural representation of metal substrate in the semiconductor refrigerating assembly that Fig. 6 provides for the embodiment of the present invention;
Fig. 7 is the cutaway view in B-B cross section in Fig. 6;
The another structural representation of metal substrate in the semiconductor refrigerating assembly that Fig. 8 provides for the embodiment of the present invention;
Fig. 9 is the cutaway view in C-C cross section in Fig. 8;
Another structural representation of metal substrate in the semiconductor refrigerating assembly that Figure 10 provides for the embodiment of the present invention;
Figure 11 is the cutaway view in D-D cross section in Figure 10.
Reference numeral:
11-cold junction substrate; 12-semi-conductor electricity couple; 13-hot junction substrate;
14-cold terminal electrodes; 15-hotter side electrode; 16-heat-radiating substrate;
17-fin; 18-metal substrate; 21-liquid cools matrix;
22-puts liquid bath; 23-dividing plate; 24-inlet;
25-liquid outlet; 26-cooling line; 27-liquor pump;
28-heat exchanger; 29-cooling fan; 210-seal groove;
211-sealing ring; 31-pit; 32-groove;
33-metal rib.
Embodiment
The explosive view of the semiconductor refrigerating assembly that Fig. 2 provides for the embodiment of the present invention, the structural representation of the semiconductor refrigerating assembly that Fig. 3 provides for the embodiment of the present invention, Fig. 4 is the cutaway view in A-A cross section in Fig. 3.The present embodiment provides a kind of semiconductor refrigerating assembly, comprising: semi-conductor electricity couple 12, the cold junction substrate 11 be connected with semi-conductor electricity couple 12 cold junction, the hot junction substrate be connected with semiconductor galvanic 12 pairs of hot junctions and liquid cools device.
Wherein, semi-conductor electricity couple (also referred to as P-N galvanic couple to) cold junction of 12 is connected on cold junction substrate 11 by cold terminal electrodes 14, such as, can be welded on cold junction substrate 11.Cold junction substrate 11 can be Al
2o
3ceramic substrate or aluminium base, its area is 70mm × 50mm.The hot junction of semi-conductor electricity couple 12 is connected on the substrate of hot junction by hotter side electrode 15, such as, be connected on the substrate of hot junction by the mode of welding.
Hot junction substrate comprises metal substrate 18 and is connected to the thermally conductive insulating layer (not shown) between metal substrate 18 and semi-conductor electricity couple 12.Concrete, be called cold end surface by metal substrate 18 towards the surface of semi-conductor electricity couple 12, the surface deviating from semi-conductor electricity couple 12 is called hot end surface.Thermally conductive insulating layer is laid in the cold end surface of metal substrate 18.The hot junction of semi-conductor electricity couple 12 is connected in thermally conductive insulating layer by hotter side electrode 15, in addition, is also provided with conductive layer, such as, is made of copper between hotter side electrode 15 and thermally conductive insulating layer.
Liquid cools device comprises: the liquid cools matrix 21 be connected with metal substrate 18 hot end surface, this liquid cools matrix 21 is called installed surface towards the surface of metal substrate 18, this installed surface is connected with metal substrate 18, and this installed surface is offered put liquid bath 22, put the cooling liquid being provided with flowing between liquid bath 22 and metal substrate 18, then cooling liquid directly can contact with the hot end surface of metal substrate 18.Cooling liquid can be cooling agent conventional in prior art, the liquefied compound etc. of such as water or good fluidity, and the present embodiment adopts deionized water, and its specific heat is comparatively large, and does not have any metal ion, avoids producing corrosion to metal substrate 18.
The technical scheme that the present embodiment adopts is connected with the hot end surface of metal substrate by adopting liquid cools matrix, and between liquid cools matrix and metal substrate, be provided with the cooling liquid of flowing, the cooling liquid of this flowing directly contacts with metal substrate, the heat of metal substrate can be absorbed rapidly, reduce the temperature of metal substrate, also rapidly reduce the temperature in semi-conductor electricity couple hot junction further.
Compared with the mode of welding with hot junction substrate in prior art and heat-radiating substrate, the cooling liquid flowed in the technical scheme that the present embodiment provides directly contacts with metal substrate, can dispel the heat to metal substrate rapidly, on the one hand the hot junction of metal substrate do not exist any as solder in prior art or heat-radiating substrate self the thermal resistance that has, the thermal capacity of the cooling liquid of flowing is larger on the other hand, heat can be absorbed fast in a large number, and then the temperature in semi-conductor electricity couple hot junction can be reduced rapidly, be conducive to realizing high-power refrigeration.
Further, in prior art, the laminating type due to heat-radiating substrate and hot junction substrate belongs to face-face and fits, therefore, when heat-radiating substrate or hot junction substrate generation mechanical deformation, even if micro-strain also can cause contact heat resistance therebetween to increase, and then reduce heat conduction efficiency.And in the such scheme that the present embodiment provides, cooling liquid contacts with the hot end surface of metal substrate and carries out heat exchange, this surface is plane, then be equivalent to liquid and plane contact heat exchange, then the miniature deformation of metallic substrate surfaces can not increase contact heat resistance, also would not affect heat exchange efficiency, effectively overcome the laminating of face in prior art-face and the problem that causes contact heat resistance to increase, possessed the ability realizing high-power refrigeration further.
It will be appreciated by those skilled in the art that, need to adopt certain seal means between metal substrate 18 and liquid cools matrix 21, guarantee that cooling liquid can not spill from metal substrate 18 and the connection gap of liquid cools matrix 21.Such as adopt fluid sealant bonding, the mode such as sealing ring or sealing gasket is set.In the present embodiment, as shown in Figure 2, the installed surface of liquid cools matrix 21 arranges seal groove 210, seal groove 210 is positioned at the edge putting liquid bath 22, sealing ring 211 is set in seal groove 210, for the gap between seal fluid cooling matrix 21 and metal substrate 18.
For the structure of aforesaid liquid cooling matrix, multiple implementation can be had, such as, can adopt following mode:
As shown in Figure 2 and Figure 4, be provided with away from the diapire inner surface of metal substrate 18 at least one dividing plate 23 supported between diapire inner surface and metal substrate 18 at liquid cools matrix 21, at least one dividing plate 23 is divided into snakelike flow channel for liquids by putting liquid bath 22, and cooling liquid flows in snakelike flow channel for liquids.
Concrete, cooling liquid flows in snakelike flow channel for liquids can along the direction flowing of setting, then cooling liquid is in flow process, all can fully contact with the various piece of metal substrate 18, fully to absorb the heat of metal substrate 18, improve the caloric receptivity of cooling liquid further.
Further, for the implementation that cooling liquid flows in flow channel for liquids, also can have multiple implementation, the present embodiment provides a kind of concrete mode:
The another structural representation of the semiconductor refrigerating assembly that Fig. 5 provides for the embodiment of the present invention.As shown in Fig. 2,3,5, a sidewall adjacent with diapire on liquid cools matrix 21 is provided with inlet 24 and liquid outlet 25, inlet 24 and liquid outlet 25 are corresponding with the top of flow channel for liquids and the position of end respectively.Further, inlet 24 and liquid outlet 25 are also communicated with the cooling line 26 of outside and form cooling circuit, and cooling circuit is provided with liquor pump 27, and liquor pump 27 can adopt direct current supply or Alternating Current Power Supply.Then under the effect of liquor pump 27, cooling liquid can at cooling line 26 and flow channel for liquids internal circulation flow.Liquor pump 27 can adopt centrifugal pump or immersible pump, and its flow is (1-5) L/min, and its flow is larger, and the flowing velocity of cooling liquid is faster, and radiating effect is better.
Further, can also heat exchanger 28 be set on cooling circuit, be provided with the fluid passage be communicated with cooling line 26 in heat exchanger 28, heat exchanger 28 is provided with multiple louvre.When cooling liquid flows through the flow channel for liquids in liquid cools matrix 21, absorb the heat of metal substrate 18; When cooling liquid flows through the fluid passage in cooling line 26 and heat exchanger 28, carry out heat exchange with extraneous air, transfer heat to extraneous air.Heat exchanger 28 specifically can adopt water row radiator conventional in prior art, and its area of dissipation can the heat exchange amount needed for semi-conductor electricity couple 12 set.
In order to strengthen heat exchange, can also the cooling fan 29 being used for dispelling the heat to heat exchanger 28 be set at the louvre place of heat exchanger 28, the air-out direction of cooling fan 29 can towards heat exchanger 28, also heat exchanger 28 can be deviated from, to accelerate for the purpose of the flowing of heat exchanger 28 ambient air, raising cooling liquid and surrounding air carry out the speed of heat exchange.The large I of cooling fan 29 and the water of radiator are arranged area and are matched, and the selection of its air quantity, blast parameter can the heat dissipation capacity of heat exchange amount needed for semi-conductor electricity couple 12 and water row radiator set.
Because the heat exchange amount Q between metal substrate 18 and cooling liquid meets Q=hA Δ T, wherein, h is heat exchange coefficient, and A is heat exchange area, and Δ T is the temperature difference between metal substrate 18 and cooling liquid.Therefore, if desired improve heat exchange amount Q, can set about from two aspects, one is improve heat exchange coefficient h, and two is increase heat exchange area A.
Therefore, on the basis of technique scheme, in order to increase the heat exchange area between cooling liquid and metal substrate 18, to improve heat exchange amount, the present embodiment also improves the structure of metal substrate 18, as adopted implementation below:
One, the structural representation of metal substrate in the semiconductor refrigerating assembly that Fig. 6 provides for the embodiment of the present invention, Fig. 7 is the cutaway view in B-B cross section in Fig. 6.As shown in Figure 6 and Figure 7, metal substrate 18 is towards (the right lateral surface of metal substrate 18 in Fig. 7 on the surface of liquid cools matrix 21, the i.e. hot end surface of metal substrate 18) pit 31 is set, pit 31 is depressed in the hot end surface of metal substrate 18, is equivalent to increase the heat exchange area that metal substrate 18 contacts with cooling liquid.The quantity of pit 31 can be at least two, pit 31 is laid in the position corresponding with flow channel for liquids, in the process flowed in flow channel for liquids to make cooling liquid, can enter in pit 31, with the surface contact of pit 31, compared with the metal substrate 18 being plane with surface, increase the contact area of cooling liquid and metal substrate 18, be equivalent to increase heat exchange area, be conducive to improving heat exchange amount.And, the above-mentioned surface of metal substrate 18 arranges pit 31, is equivalent to the thickness reducing metal substrate 18, reduces thermal-conduction resistance, also can improve heat transfer effect.
The quantity of pit 31, size, shape all can set according to the quantity of flow channel for liquids, width and length.
The another structural representation of metal substrate 18 in the semiconductor refrigerating assembly that Fig. 8 provides for the embodiment of the present invention, Fig. 9 is the cutaway view in C-C cross section in Fig. 8.As shown in Figure 8 and Figure 9, or can arrange groove 32 in the hot end surface of metal substrate 18 towards liquid cools matrix 21, the length direction of groove 32 can extend along the direction of flow channel for liquids.Groove 32 is depressed in the hot end surface of metal substrate 18, is equivalent to increase the heat exchange area that metal substrate 18 contacts with cooling liquid, also can reaches the radiating effect similar to above-mentioned pit 31.
Its two, the surface of metal substrate 18 towards liquid cools matrix 21 arranges at least two sheet metals, and at least two sheet metals are spaced from each other, and sheet metal is laid in the position corresponding with flow channel for liquids.Then cooling liquid not only can with the surface contact of metal substrate 18, can also contact with sheet metal.Because the capacity of heat transmission of sheet metal is comparatively strong, therefore, the heat of metal substrate 18 can pass to cooling liquid further rapidly by sheet metal, improves heat transfer rate.Sheet metal specifically can adopt the stronger metal of the capacity of heat transmission to make, such as copper, aluminium.Sheet metal can adopt the modes such as welding or embedding to be arranged in the hot end surface of metal substrate 18.
Compared with the such scheme that the program and the present embodiment provide, although the area that cooling liquid contacts with metal substrate 18 decreases, but because the capacity of heat transmission of sheet metal is very good, sheet metal is far longer than from the speed that metal substrate 18 absorbs heat cooling liquid to absorb heat speed from metal substrate 18, then cooling liquid absorbs heat from sheet metal again, be equivalent to improve above-mentioned heat exchange coefficient h, also just improve heat exchange amount Q.
The quantity of sheet metal, size, shape all can set according to the quantity of flow channel for liquids, width and length.Sheet metal can on bonding, welding or adopt the means of laying metal conventional in prior art to be laid in surface that metal substrate 18 contacts with cooling liquid.
Another structural representation of metal substrate 18 in its three, Figure 10 semiconductor refrigerating assembly provided for the embodiment of the present invention, Figure 11 is the cutaway view in D-D cross section in Figure 10.As shown in Figure 10 and Figure 11, the hot end surface of metal substrate 18 towards liquid cools matrix 21 arranges at least two metal ribs 33 (shape of this metal rib 33 can refer to the shape of fin in prior art) protruded from this surface, at least two metal ribs 33 are spaced from each other, and metal rib 33 is laid in the position corresponding with flow channel for liquids.Then cooling liquid not only can with the surface contact of metal substrate 18, can also contact with metal rib 33, and metal rib 33 can stretch in flow channel for liquids higher than the part on the surface of metal substrate 18, increase the contact area with cooling liquid, be equivalent to increase above-mentioned heat exchange area A, and improve heat exchange coefficient h, be conducive to improving heat exchange amount Q.
Because the capacity of heat transmission of metal rib 33 is comparatively strong, therefore, the heat of metal substrate 18 can pass to cooling liquid further rapidly by metal rib 33, improves heat transfer rate.Metal rib 33 specifically can adopt the stronger metal of the capacity of heat transmission to make, such as gold, copper, aluminium.
Compared with the such scheme that the program and the present embodiment provide, although the area that cooling liquid contacts with metal substrate 18 decreases, but because the capacity of heat transmission of metal rib 33 is very good, metal rib 33 is far longer than from the speed that metal substrate 18 absorbs heat cooling liquid to absorb heat speed from metal substrate 18, then cooling liquid absorbs heat from metal rib 33 again, is equivalent to improve the speed of cooling liquid from metal substrate 18 overall absorption heat.
The quantity of metal rib 33, size, shape all can set according to the quantity of flow channel for liquids, width and length.Metal rib 33 can on bonding, welding or adopt the means of connection metal conventional in prior art to be arranged at surface that metal substrate 18 contacts with cooling liquid.
Except above-mentioned three kinds of modes, those skilled in the art can also adopt other mode to improve metal substrate 18, to improve heat exchange efficiency.
On the basis of technique scheme, the present embodiment also provides a kind of implementation, can improve the heat exchange efficiency of semiconductor refrigerating assembly further.
Metal substrate 18 is set to aluminium base, and the area of aluminium base is 80mm × 90mm, and thickness is 1.3mm to 1.7mm, is preferably 1.5mm.The mode be spirally connected can be adopted between aluminium base with liquid cools matrix 21 to be connected.The cold end surface of aluminium base towards semi-conductor electricity couple 12 lays thermally conductive insulating layer, the metal heat-conducting that one deck that thermally conductive insulating layer can adopt chemistry and physical method to form or adopt chemical treatment and obtain in the surface-coated of aluminium base is very thin and the material of insulation.Further, thermally conductive insulating layer is engaged with hotter side electrode 15 by means such as chemistry.Therefore, the thermal resistance of the thermal resistance between hotter side electrode 15 and thermally conductive insulating layer and aluminium base self is relatively little, can improve heat conduction efficiency.
The heat that then semi-conductor electricity couple 12 produces on metal substrate 18 can be directly conducted to aluminium base through the thermally conductive insulating layer of less thermal resistance, the heat conduction utilizing aluminium base good, average temperature performance, heat is made to conduct to rapidly the hot end surface of aluminium base towards liquid cools matrix 21, and cooled liquid absorption, the diffuser efficiency of heat can be significantly improved, be conducive to realizing high-power refrigeration.
Compared with prior art, the distribution of its each several part thermal resistance is see table one for the implementation that the present embodiment provides.
The distribution of thermal resistance in the semiconductor refrigerating assembly that table one the present embodiment provides and prior art
Wherein, R11=R21, R12=R22, R13=R23, R14=R24, R15=R25.
Adopt aluminium base as metal substrate 18 in the present embodiment, and arrange thermally conductive insulating layer between metal substrate 18 and semi-conductor electricity couple 12, thermally conductive insulating layer is connected with hotter side electrode 15, and R26+R27 is much smaller than R16.And R28 is much smaller than R17+R18, therefore, in the present embodiment, whole thermal resistance sums in semi-conductor electricity couple 12 hot junction are far smaller than prior art.Reduce thermal resistance, be equivalent to improve heat exchange efficiency, be conducive to realizing high-power refrigeration.
The such scheme that the present embodiment provides, when semi-conductor electricity couple 12 input power is 120W, its maximum refrigeratory capacity can reach 60W-70W, can realize high-power refrigeration.In addition, by increasing the logarithm and input power that in semi-conductor electricity couple 12, P-N point is even, matching liquid cools heat exchanging part, refrigeration work consumption can also be increased further.
Last it is noted that above each embodiment is only in order to illustrate technical scheme of the present invention, be not intended to limit; Although with reference to foregoing embodiments to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein some or all of technical characteristic; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.
Claims (10)
1. a semiconductor refrigerating assembly, is characterized in that, comprising: semi-conductor electricity couple, the cold junction substrate be connected with semi-conductor electricity couple cold junction, the hot junction substrate be connected with semi-conductor electricity couple hot junction and liquid cools device; Wherein, described hot junction substrate comprises metal substrate and is connected to the thermally conductive insulating layer between metal substrate and semi-conductor electricity couple;
Described liquid cools device comprises: the liquid cools matrix be connected with metal substrate, the installed surface that described liquid cools matrix is connected with metal substrate is offered and puts liquid bath, described in put the cooling liquid being provided with flowing between liquid bath and metal substrate.
2. semiconductor refrigerating assembly according to claim 1, it is characterized in that, described liquid cools matrix is provided with away from the diapire inner surface of metal substrate at least one dividing plate supported between described diapire inner surface and metal substrate, at least one dividing plate is divided into snakelike flow channel for liquids by putting liquid bath, and described cooling liquid flows in described flow channel for liquids.
3. semiconductor refrigerating assembly according to claim 2, is characterized in that, described metal substrate is provided with pit towards the surface of described liquid cools matrix, and the quantity of described pit is at least two, and at least two pits are corresponding with the position of flow channel for liquids.
4. semiconductor refrigerating assembly according to claim 3, it is characterized in that, a sidewall adjacent with described diapire on described liquid cools matrix is provided with inlet and liquid outlet, and described inlet and liquid outlet are corresponding with the top of described flow channel for liquids and the position of end respectively; Described inlet and liquid outlet are also communicated with the cooling line of outside and form cooling circuit, and described cooling circuit is provided with liquor pump.
5. semiconductor refrigerating assembly according to claim 4, is characterized in that, described cooling circuit is also provided with heat exchanger, is provided with the fluid passage be communicated with described cooling line in described heat exchanger.
6. semiconductor refrigerating assembly according to claim 5, is characterized in that, described liquid cools device also comprises the cooling fan for dispelling the heat to described heat exchanger.
7. the semiconductor refrigerating assembly according to any one of claim 1-6, is characterized in that, described metal substrate is aluminium base.
8. semiconductor refrigerating assembly according to claim 2, it is characterized in that, described metal substrate is provided with at least two sheet metals spaced apart from each other towards the surface of described liquid cools matrix, described sheet metal is corresponding with the position of flow channel for liquids, and each sheet metal is along the length direction extension of the flow channel for liquids corresponding with it.
9. semiconductor refrigerating assembly according to claim 2, it is characterized in that, described metal substrate is provided with at least two the metal ribs protruded from this surface spaced apart from each other towards the surface of described liquid cools matrix, and described metal rib is corresponding with the position of flow channel for liquids.
10. the semiconductor refrigerating assembly according to any one of claim 1-6, it is characterized in that, the installed surface of described liquid cools matrix is also provided with seal groove, in described seal groove, is provided with sealing ring, for sealing the gap between described liquid cools matrix and metal substrate.
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| CN106435578A (en) * | 2016-11-23 | 2017-02-22 | 哈尔滨工业大学 | Multi-beam coaxial powder feeding type laser cladding nozzle with water cooling protection function |
| CN106435578B (en) * | 2016-11-23 | 2018-10-30 | 哈尔滨工业大学 | A kind of multi-beam coaxial powder-feeding formula laser melting-painting nozzle with water cooling protection |
| CN107246744A (en) * | 2017-07-03 | 2017-10-13 | 楹联新能源科技南通有限公司 | One kind is based on thermoelectricity without substrate TEC device refrigerating plants |
| CN109990630A (en) * | 2017-12-29 | 2019-07-09 | 核工业西南物理研究院 | A kind of suitable high temperature and pressure heat exchange runner structure |
| CN109524741A (en) * | 2018-10-08 | 2019-03-26 | 江苏大学 | A kind of liquid cooling plate of combination cooling piece, power battery heat dissipation liquid cooling system and control method |
| CN109524741B (en) * | 2018-10-08 | 2021-07-20 | 江苏大学 | Liquid cooling plate combined with refrigerating sheet, power battery heat dissipation liquid cooling system and control method |
| CN111457617A (en) * | 2019-01-02 | 2020-07-28 | 江苏中科新源半导体科技有限公司 | Heat exchanger and direct cooling machine for controlling temperature of reaction cavity of semiconductor equipment |
| CN110108061A (en) * | 2019-05-23 | 2019-08-09 | 哈尔滨工业大学 | A kind of small-power multichip semiconductor grade low-temp refrigerating plant |
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| CN113573548B (en) * | 2021-07-07 | 2024-02-02 | 杭州海康威视数字技术股份有限公司 | Heat dissipation assembly and camera |
| CN115164445A (en) * | 2022-07-15 | 2022-10-11 | 中国电子科技集团公司第十研究所 | Semiconductor thermoelectric refrigerator structure and enhanced heat exchange method |
| CN115164445B (en) * | 2022-07-15 | 2023-10-24 | 中国电子科技集团公司第十研究所 | Semiconductor thermoelectric refrigerator structure and enhanced heat exchange method |
| CN115776037A (en) * | 2022-11-28 | 2023-03-10 | 重庆师范大学 | Optical rotation adjusting device utilizing liquid metal for heat conduction |
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