CN205542899U - Semiconductor refrigeration components - Google Patents
Semiconductor refrigeration components Download PDFInfo
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- CN205542899U CN205542899U CN201620123081.9U CN201620123081U CN205542899U CN 205542899 U CN205542899 U CN 205542899U CN 201620123081 U CN201620123081 U CN 201620123081U CN 205542899 U CN205542899 U CN 205542899U
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Abstract
The utility model provides a semiconductor refrigeration components, include: hot junction base plate and liquid cooler spare that the semiconductor galvanic couple links to each other to the hot junction to, the cold junction base plate that links to each other to the cold junction with the semiconductor galvanic couple, with the semiconductor galvanic couple, wherein, the hot junction base plate includes the metal substrate and connects at metal substrate and the semiconductor galvanic couple heat -conduction insulation layer between to, liquid cooler spare includes: the liquid cooling base member that links to each other with the metal substrate, set up on the installation face that the liquid cooling base member links to each other with the metal substrate and put the cistern, it is equipped with mobile cooling liquid to put between cistern and the metal substrate. The utility model provides a semiconductor refrigeration components can improve the semiconductor galvanic couple to the rate of heat removal in hot junction, can realize high -power refrigeration.
Description
Technical field
This utility model relates to semiconductor refrigerating technology, particularly relates to a kind of semiconductor refrigerating assembly.
Background technology
Semiconductor refrigeration chip (TEC, Thermoelectric Cooler) is to utilize Peltier (Peltier)
A kind of refrigeration device that effect is made, its main structure is semi-conductor electricity couple (also referred to as P-N galvanic couple
Right), after adding certain voltage to semi-conductor electricity couple, the cold end of semi-conductor electricity couple and hot junction meeting
Produce certain temperature difference.After the heat in its hot junction is distributed, its cold end can produce certain cold,
Realize refrigeration.
Fig. 1 is the structural representation of existing a kind of semiconductor refrigerating assembly.As it is shown in figure 1, it is existing
A kind of cooling assembly utilizing semiconductor refrigeration chip to make include cold end group plate 11, semi-conductor electricity couple
12 and hot junction substrate 13, wherein, the cold end of semi-conductor electricity couple 12 is by cold terminal electrodes 14 and cold end group
Plate 11 connects, and the hot junction of semi-conductor electricity couple 12 is by the side of hotter side electrode 15 with hot junction substrate 13
Surface connects, and the mode especially by welding is attached.The opposite side surface soldered of hot junction substrate 13 has
Radiator structure, this radiator structure includes heat-radiating substrate 16 and fin 17, and wherein, heat-radiating substrate 16 welds
On hot junction substrate 13.The heat in semi-conductor electricity couple 12 hot junction first conducts to hot junction substrate through solder
13, then conducted to fin 17 by heat-radiating substrate 16, carry out heat friendship by the air of fin 17 with surrounding
Change, the heat in fall semi-conductor electricity couple 12 hot junction.
In above-mentioned cooling assembly, owing to hot junction substrate 13 and heat-radiating substrate 16 are to consolidate by the way of welding
Fixed, the heat in semi-conductor electricity couple 12 hot junction sequentially passes through hot junction substrate 13, solder and heat-radiating substrate
16 conduct, outside the thermal resistance that removing hot junction substrate 13 and heat-radiating substrate 16 are had self, the two
Between solder there is also bigger thermal resistance, had a strong impact on the conduction velocity of heat.Further, fin with
The speed that surrounding air carries out heat exchange is the lowest, have impact on semi-conductor electricity couple the most to a great extent
Distributing of 12 hot junction heats.Therefore, by solder, be there is bigger thermal resistance and fin and carry out heat exchange speed with air
Spending slower impact, existing semiconductor refrigerating assembly is only applicable to small-power refrigeration, and cannot realize big
Power refrigeration.
Utility model content
This utility model provides a kind of semiconductor refrigerating assembly, for improving dissipating of semi-conductor electricity couple hot junction
Hot speed, it is possible to realize high-power refrigeration.
This utility model provides a kind of semiconductor refrigerating assembly, including: semi-conductor electricity couple and quasiconductor
Cold end group plate, the hot junction substrate being connected with semi-conductor electricity couple hot junction and the liquid that cold end is connected by galvanic couple
Body cooling device；Wherein, described hot junction substrate includes metal basal board and is connected to metal basal board and half
Conductor galvanic couple between thermally conductive insulating layer；
Described liquid chiller part includes: the liquid cooling matrix being connected with metal basal board, described liquid is cold
But offer on the installed surface that matrix is connected with metal basal board and put liquid bath, described in put between liquid bath and metal basal board
It is provided with the cooling liquid of flowing.
Semiconductor refrigerating assembly as above, described liquid cooling matrix is away from the diapire of metal basal board
Surface is provided with at least one dividing plate supported between described diapire inner surface and metal basal board, at least one
Dividing plate is divided into snakelike flow channel for liquids by putting liquid bath, and described cooling liquid flows in described flow channel for liquids.
Semiconductor refrigerating assembly as above, described metal basal board is towards the table of described liquid cooling matrix
Face is provided with pit, and the quantity of described pit is at least two, at least two pit and the position of flow channel for liquids
Put correspondence.
Semiconductor refrigerating assembly as above, on described liquid cooling matrix adjacent with described diapire one
Sidewall is provided with inlet and liquid outlet, described inlet and liquid outlet respectively with beginning of described flow channel for liquids
Hold corresponding with the position of end；It is cold that described inlet also connects formation with outside cooling line with liquid outlet
But loop, described cooling circuit is provided with liquid pump.
Semiconductor refrigerating assembly as above, described cooling circuit is additionally provided with heat exchanger, described heat
The fluid passage connected with described cooling line it is provided with in exchanger.
Semiconductor refrigerating assembly as above, described liquid chiller part also includes for handing over described heat
Parallel operation carries out the cooling fan dispelled the heat.
Semiconductor refrigerating assembly as above, described metal basal board is aluminium base.
Semiconductor refrigerating assembly as above, described metal basal board is towards the table of described liquid cooling matrix
Face is provided with at least two sheet metal spaced apart from each other, and described sheet metal is corresponding with the position of flow channel for liquids,
And each sheet metal extends along the length direction of corresponding flow channel for liquids.
Semiconductor refrigerating assembly as above, described metal basal board is towards the table of described liquid cooling matrix
Face is provided with at least two metal rib protruded from this surface spaced apart from each other, described metal rib with
The position of flow channel for liquids is corresponding.
Semiconductor refrigerating assembly as above, the installed surface of described liquid cooling matrix is additionally provided with sealing
Groove, is provided with sealing ring in described seal groove, is used for sealing between described liquid cooling matrix and metal basal board
Gap.
The technical scheme that the present embodiment uses is by using the hot end surface of liquid cooling matrix and metal basal board
It is connected, and is provided with the cooling liquid of flowing between liquid cooling matrix and metal basal board, this flowing cold
But liquid directly contacts with metal basal board, it is possible to absorb rapidly the heat of metal basal board, reduces metal basal board
Temperature, rapidly reduce the temperature in semi-conductor electricity couple hot junction the most further.
Hot junction substrate is compared with the mode that heat-radiating substrate welds with prior art, and the present embodiment is provided
In technical scheme, the cooling liquid of flowing directly contacts with metal basal board, can dissipate metal basal board rapidly
Heat, on the one hand the hot junction of metal basal board does not exist any such as solder or heat-radiating substrate self institute in prior art
The thermal resistance having, on the other hand the thermal capacity of the cooling liquid of flowing is relatively big, can the most quickly absorb heat,
And then the temperature in semi-conductor electricity couple hot junction can be reduced rapidly, it is advantageously implemented high-power refrigeration.
Accompanying drawing explanation
Fig. 1 is the structural representation of existing a kind of semiconductor refrigerating assembly；
The explosive view of the semiconductor refrigerating assembly that Fig. 2 provides for this utility model embodiment；
The structural representation of the semiconductor refrigerating assembly that Fig. 3 provides for this utility model embodiment；
Fig. 4 is the sectional view of Section A-A in Fig. 3；
The another structural representation of the semiconductor refrigerating assembly that Fig. 5 provides for this utility model embodiment；
The structural representation of metal basal board in the semiconductor refrigerating assembly that Fig. 6 provides for this utility model embodiment
Figure；
Fig. 7 is the sectional view of section B-B in Fig. 6；
The another structure of metal basal board in the semiconductor refrigerating assembly that Fig. 8 provides for this utility model embodiment
Schematic diagram；
Fig. 9 is the sectional view in C-C cross section in Fig. 8；
Another knot of metal basal board in the semiconductor refrigerating assembly that Figure 10 provides for this utility model embodiment
Structure schematic diagram；
Figure 11 is the sectional view in D-D cross section in Figure 10.
Reference:
11-cold end group plate；12-semi-conductor electricity couple；13-hot junction substrate；
14-cold terminal electrodes；15-hotter side electrode；16-heat-radiating substrate；
17-fin；18-metal basal board；21-liquid cooling matrix；
22-puts liquid bath；23-dividing plate；24-inlet；
25-liquid outlet；26-cooling line；27-liquid pump；
28-heat exchanger；29-cools down fan；210-seal groove；
211-sealing ring；31-pit；32-groove；
33-metal rib.
Detailed description of the invention
The explosive view of the semiconductor refrigerating assembly that Fig. 2 provides for this utility model embodiment, Fig. 3 is this
The structural representation of the semiconductor refrigerating assembly that utility model embodiment provides, Fig. 4 is that in Fig. 3, A-A cuts
The sectional view in face.The present embodiment provides a kind of semiconductor refrigerating assembly, including: semi-conductor electricity couple 12,
Cold end group plate 11 that end cold with semi-conductor electricity couple 12 is connected, with semiconductor galvanic 12, hot junction is connected
Hot junction substrate and liquid chiller part.
Wherein, the cold end of semi-conductor electricity couple (also referred to as P-N galvanic couple to) 12 is by cold terminal electrodes 14
It is connected on cold end group plate 11, the most solderable on cold end group plate 11.Cold end group plate 11 can be
Al2O3Ceramic substrate or aluminium base, its area is 70mm × 50mm.The hot junction of semi-conductor electricity couple 12 leads to
Cross hotter side electrode 15 to be connected on the substrate of hot junction, such as, be connected on the substrate of hot junction by the way of welding.
Hot junction substrate include metal basal board 18 and be connected to metal basal board 18 and semi-conductor electricity couple 12 it
Between thermally conductive insulating layer (not shown).Concrete, by metal basal board 18 towards semiconductor galvanic
The surface of 12 is referred to as cold end surface, and the surface deviating from semi-conductor electricity couple 12 is referred to as hot end surface.Lead
Thermal insulation layer is laid in the cold end surface of metal basal board 18.Hot junction is passed through in the hot junction of semi-conductor electricity couple 12
Electrode 15 is connected in thermally conductive insulating layer, it addition, also set between hotter side electrode 15 and thermally conductive insulating layer
It is equipped with conductive layer, becomes for example with copper.
Liquid chiller part includes: the liquid cooling matrix 21 being connected with metal basal board 18 hot end surface,
This liquid cooling matrix 21 is referred to as installed surface towards the surface of metal basal board 18, this installed surface and Metal Substrate
Plate 18 is connected, and offers on this installed surface and put liquid bath 22, puts and sets between liquid bath 22 and metal basal board 18
Have the cooling liquid of flowing, then cooling liquid directly can contact with the hot end surface of metal basal board 18.Cold
But liquid can be the liquefied compound etc. of coolant commonly used in the prior art, such as water or good fluidity,
The present embodiment uses deionized water, and its specific heat is relatively big, and does not have any metal ion, it is to avoid to metal
Substrate 18 produces corrosion.
The technical scheme that the present embodiment uses is by using the hot end surface of liquid cooling matrix and metal basal board
It is connected, and is provided with the cooling liquid of flowing between liquid cooling matrix and metal basal board, this flowing cold
But liquid directly contacts with metal basal board, it is possible to absorb rapidly the heat of metal basal board, reduces metal basal board
Temperature, rapidly reduce the temperature in semi-conductor electricity couple hot junction the most further.
Hot junction substrate is compared with the mode that heat-radiating substrate welds with prior art, and the present embodiment is provided
In technical scheme, the cooling liquid of flowing directly contacts with metal basal board, can dissipate metal basal board rapidly
Heat, on the one hand the hot junction of metal basal board does not exist any such as solder or heat-radiating substrate self institute in prior art
The thermal resistance having, on the other hand the thermal capacity of the cooling liquid of flowing is relatively big, can the most quickly absorb heat,
And then the temperature in semi-conductor electricity couple hot junction can be reduced rapidly, it is advantageously implemented high-power refrigeration.
Further, in prior art, owing to the laminating type of heat-radiating substrate Yu hot junction substrate belongs to surface-to-surface laminating,
Therefore, when heat-radiating substrate or hot junction substrate generation mechanically deform, even if micro-strain also results in the two
Between thermal contact resistance increase, and then reduce heat conduction efficiency.And the such scheme that the present embodiment provides
In, cooling liquid contacts with the hot end surface of metal basal board and carries out heat exchange, and this surface is plane, the most quite
In liquid and plane contact heat exchange, then the miniature deformation of metallic substrate surfaces will not increase thermal contact resistance, also
Heat exchange efficiency would not be affected, effectively overcome surface-to-surface laminating in prior art and cause thermal contact resistance to increase
Problem, be further equipped with realizing the ability of high-power refrigeration.
It will be appreciated by those skilled in the art that, cooling down at metal basal board 18 and liquid needs between matrix 21
Use certain seal means, it is ensured that cooling liquid will not cool down matrix 21 from metal basal board 18 with liquid
Connection gap in spill.For example with fluid sealant bonding, the mode such as sealing ring or sealing gasket is set.This
In embodiment, as in figure 2 it is shown, arrange seal groove 210 on the installed surface of liquid cooling matrix 21, close
Sealing groove 210 is positioned at the edge putting liquid bath 22, arranges sealing ring 211, for sealing fluid in seal groove 210
Gap between body cooling matrix 21 and metal basal board 18.
For the structure of aforesaid liquid cooling matrix, can there is multiple implementation, such as, can use as follows
Mode:
As shown in Figure 2 and Figure 4, the matrix 21 diapire inner surface away from metal basal board 18 is cooled down at liquid
Be provided with at least one dividing plate 23 supported between diapire inner surface and metal basal board 18, at least one every
Plate 23 is divided into snakelike flow channel for liquids by putting liquid bath 22, and cooling liquid flows in snakelike flow channel for liquids
Dynamic.
Concrete, cooling liquid flows in snakelike flow channel for liquids can be the coldest along the direction flowing set
But liquid is in flow process, all can be fully contacted with the various piece of metal basal board 18, fully to inhale
Receive the heat of metal basal board 18, improve the caloric receptivity of cooling liquid further.
Further, implementation cooling liquid flowed in flow channel for liquids, it is possibility to have multiple
Implementation, the present embodiment a kind of concrete mode of offer:
The another structural representation of the semiconductor refrigerating assembly that Fig. 5 provides for this utility model embodiment.As
Shown in Fig. 2,3,5, a sidewall adjacent with diapire on liquid cooling matrix 21 is provided with inlet
24 and liquid outlet 25, inlet 24 and liquid outlet 25 respectively with top and the position of end of flow channel for liquids
Corresponding.Further, inlet 24 and liquid outlet 25 also connect formation with outside cooling line 26 and cool back
Road, cooling circuit is provided with liquid pump 27, and liquid pump 27 can use direct current supply or Alternating Current Power Supply.Then
Under the effect of liquid pump 27, cooling liquid can be at cooling line 26 and flow channel for liquids internal circulation flow.
Liquid pump 27 can use centrifugal pump or immersible pump, and its flow is (1-5) L/min, and its flow is the biggest, cold
But the flowing velocity of liquid is the fastest, and radiating effect is the best.
Further, it is also possible to heat exchanger 28 is set on cooling circuit, is provided with in heat exchanger 28
The fluid passage connected with cooling line 26, heat exchanger 28 is provided with multiple louvre.Work as cooling
When liquid travels from liquid cools down the flow channel for liquids in matrix 21, absorb the heat of metal basal board 18；When cold
During fluid passage in but liquid flows through cooling line 26 and heat exchanger 28, carry out heat with extraneous air
Exchange, transfers heat to extraneous air.Heat exchanger 28 specifically can use water commonly used in the prior art
Row's radiator, its area of dissipation can set according to the heat exchange amount needed for semi-conductor electricity couple 12.
In order to strengthen heat exchange, it is also possible to be provided for heat exchanger at the louvre of heat exchanger 28
28 carry out the cooling fan 29 dispelled the heat, the air-out direction of cooling fan 29 can towards heat exchanger 28,
Heat exchanger 28 can also be deviated from, for the purpose of accelerating the air flowing around heat exchanger 28, improve
Cooling liquid and surrounding air carry out the speed of heat exchange.The big I of cooling fan 29 and the water of radiator
Row area match, its air quantity, blast parameter selection can be according to the heat exchange needed for semi-conductor electricity couple 12
The heat dissipation capacity of amount and water row's radiator is set.
Owing to heat exchange amount Q between metal basal board 18 and cooling liquid meets Q=hA Δ T, wherein, h is
The coefficient of heat transfer, A is heat exchange area, and Δ T is the temperature difference between metal basal board 18 and cooling liquid.Therefore,
If desired improving heat exchange amount Q, can set about in terms of two, one is to improve coefficient of heat transfer h, and two is to increase to change
Hot side amasss A.
Therefore, on the basis of technique scheme, in order to increase between cooling liquid and metal basal board 18
Heat exchange area, to improve heat exchange amount, the structure of metal basal board 18 is also improved by the present embodiment, as
Can use following implementation:
One, the knot of metal basal board in the semiconductor refrigerating assembly that Fig. 6 provides for this utility model embodiment
Structure schematic diagram, Fig. 7 is the sectional view of section B-B in Fig. 6.As shown in Figure 6 and Figure 7, metal basal board
18 towards (right lateral surface of metal basal board 18, i.e. metal in Fig. 7 on the surface of liquid cooling matrix 21
The hot end surface of substrate 18) pit 31 is set, pit 31 is depressed in the hot end surface of metal basal board 18,
Be equivalent to increase the heat exchange area that metal basal board 18 contacts with cooling liquid.The quantity of pit 31 is permissible
For at least two, pit 31 is laid in the position corresponding with flow channel for liquids, so that cooling liquid is at liquid
In runner during flowing, it is possible to enter in pit 31, contact with the surface of pit 31, with surface
Metal basal board 18 for plane is compared, and increases the contact area of cooling liquid and metal basal board 18, phase
When in increasing heat exchange area, being conducive to improving heat exchange amount.And, on the above-mentioned surface of metal basal board 18
On pit 31 is set, be equivalent to reduce the thickness of metal basal board 18, reduce thermal-conduction resistance, also can
Enough improve heat transfer effect.
The quantity of pit 31, size, shape all can be entered according to the quantity of flow channel for liquids, width and length
Row sets.
The another knot of metal basal board 18 in the semiconductor refrigerating assembly that Fig. 8 provides for this utility model embodiment
Structure schematic diagram, Fig. 9 is the sectional view in C-C cross section in Fig. 8.As shown in Figure 8 and Figure 9, or, can
To arrange groove 32, groove 32 at metal basal board 18 in the hot end surface of liquid cooling matrix 21
Length direction can along flow channel for liquids direction extend.Groove 32 is depressed in the hot junction of metal basal board 18
Surface, is equivalent to increase the heat exchange area that metal basal board 18 contacts with cooling liquid, it is also possible to reach with
The radiating effect that above-mentioned pit 31 is similar.
Its two, metal basal board 18 towards liquid cooling matrix 21 surface at least two metal is set
Sheet, at least two sheet metal is spaced from each other, and sheet metal is laid in the position corresponding with flow channel for liquids.
Then cooling liquid is not only able to contact with the surface of metal basal board 18, additionally it is possible to contact with sheet metal.Due to
The capacity of heat transmission of sheet metal is relatively strong, and therefore, the heat of metal basal board 18 can be the fastest by sheet metal
Pass to cooling liquid fastly, improve heat transfer rate.Sheet metal specifically can use the capacity of heat transmission stronger
Metal is made, such as copper, aluminum.Sheet metal can be arranged on metal basal board to use the modes such as welding or embedding
In the hot end surface of 18.
The program is compared with the such scheme that the present embodiment is provided, although cooling liquid and metal basal board 18
The area of contact decreases, but owing to the capacity of heat transmission of sheet metal is the best, sheet metal is from metal basal board
18 speed absorbing heat are far longer than cooling liquid and absorb the speed of heat from metal basal board 18, then
Cooling liquid absorbs heat from sheet metal again, is equivalent to improve above-mentioned coefficient of heat transfer h, the most just improves
Heat exchange amount Q.
The quantity of sheet metal, size, shape all can be entered according to the quantity of flow channel for liquids, width and length
Row sets.Sheet metal can bonding, weld or use the means laying metal commonly used in the prior art to lay
On the surface that metal basal board 18 contacts with cooling liquid.
Its three, metal basal board 18 in the semiconductor refrigerating assembly that Figure 10 provides for this utility model embodiment
Another structural representation, Figure 11 is the sectional view in D-D cross section in Figure 10.Such as Figure 10 and Figure 11 institute
Show, at metal basal board 18 at least two is set protrudes from the hot end surface of liquid cooling matrix 21
(shape of this metal rib 33 can refer to the shape of fin in prior art to metal rib 33 on this surface
Shape), at least two metal rib 33 is spaced from each other, and metal rib 33 is laid in corresponding with flow channel for liquids
Position.Then cooling liquid is not only able to contact with the surface of metal basal board 18, additionally it is possible to metal ribs
Bar 33 contacts, and metal rib 33 can extend into liquid stream higher than the part on the surface of metal basal board 18
In road, increase the contact area with cooling liquid, be equivalent to increase above-mentioned heat exchange area A, and also
Improve coefficient of heat transfer h, be conducive to improving heat exchange amount Q.
Owing to the capacity of heat transmission of metal rib 33 is relatively strong, therefore, the heat of metal basal board 18 can pass through
Metal rib 33 is quickly transmitted to cooling liquid further, improves heat transfer rate.Metal rib 33
The metal that the capacity of heat transmission is stronger specifically can be used to make, such as gold, copper, aluminum.
The program is compared with the such scheme that the present embodiment is provided, although cooling liquid and metal basal board 18
The area of contact decreases, but owing to the capacity of heat transmission of metal rib 33 is the best, metal rib 33
Absorb the speed of heat from metal basal board 18 to be far longer than cooling liquid and absorb heat from metal basal board 18
Speed, then cooling liquid absorbs heat from metal rib 33 again, is equivalent to improve cooling liquid from gold
Belong to the speed of substrate 18 overall absorption heat.
The quantity of metal rib 33, size, shape all can be according to the quantity of flow channel for liquids, width and length
Degree is set.Metal rib 33 can bonding, weld or use connection metal commonly used in the prior art
Means are arranged on the surface that metal basal board 18 contacts with cooling liquid.
In addition to above-mentioned three kinds of modes, those skilled in the art can be to Metal Substrate in the way of using other
Plate 18 improves, to improve heat exchange efficiency.
On the basis of technique scheme, the present embodiment also provides for a kind of implementation, it is possible to further
Improve the heat exchange efficiency of semiconductor refrigerating assembly.
Metal basal board 18 is set to aluminium base, and the area of aluminium base is 80mm × 90mm, and thickness is 1.3mm
To 1.7mm, preferably 1.5mm.Can use, between aluminium base and liquid cooling matrix 21, the mode being spirally connected
It is attached.In the cold end surface of semi-conductor electricity couple 12, lay thermally conductive insulating layer at aluminium base, lead
Thermal insulation layer can use chemistry and physical method form in the surface-coated of aluminium base or use chemical treatment
And obtain one layer of metal heat-conducting the thinnest and the material of insulation.Further, thermally conductive insulating layer is by chemistry
Engage with hotter side electrode 15 etc. means.Therefore, thermal resistance between hotter side electrode 15 and thermally conductive insulating layer,
And the thermal resistance of aluminium base self is relatively small, it is possible to increase heat conduction efficiency.
The heat that then semi-conductor electricity couple 12 produces on metal basal board 18 can leading through less thermal resistance
Thermal insulation layer is directly conducted to aluminium base, utilizes heat conduction, average temperature performance that aluminium base is good, makes heat fast
Speed conduction is to aluminium base towards the hot end surface of liquid cooling matrix 21, and cooled liquid absorbs, it is possible to
Significantly improve the diffuser efficiency of heat, be advantageously implemented high-power refrigeration.
Compared with prior art, the distribution of its each several part thermal resistance sees the implementation that the present embodiment is provided
Table one.
The semiconductor refrigerating assembly that table one the present embodiment provides and the distribution of thermal resistance in prior art
Wherein, R11=R21, R12=R22, R13=R23, R14=R24, R15=R25.
In the present embodiment, employing aluminium base is as metal basal board 18, and at metal basal board 18 and semi-conductor electricity
Arranging thermally conductive insulating layer between couple 12, thermally conductive insulating layer is connected with hotter side electrode 15, and R26+R27 is remote
Less than R16.And R28 is much smaller than R17+R18, therefore, in the present embodiment, semi-conductor electricity couple 12
Whole thermal resistance sums in hot junction are far smaller than prior art.Reduce thermal resistance, be equivalent to improve heat exchange effect
Rate, is advantageously implemented high-power refrigeration.
The such scheme that the present embodiment is provided, when semi-conductor electricity couple 12 input power is 120W,
Its maximum refrigeratory capacity can reach 60W-70W, it is possible to realizes high-power refrigeration.It addition, partly lead by increasing
Body galvanic couple, to the even logarithm of P-N point in 12 and input power, matches liquid cooling heat transferring part, moreover it is possible to
Enough increase refrigeration work consumption further.
Last it is noted that various embodiments above is only in order to illustrate the technical solution of the utility model, and
Non-to its restriction；Although this utility model being described in detail with reference to foregoing embodiments, ability
The those of ordinary skill in territory is it is understood that it still can be to the technical scheme described in foregoing embodiments
Modify, or the most some or all of technical characteristic is carried out equivalent；And these amendment or
Person replaces, and does not make the essence of appropriate technical solution depart from the model of this utility model each embodiment technical scheme
Enclose.
Claims (10)
1. a semiconductor refrigerating assembly, it is characterised in that including: semi-conductor electricity couple and quasiconductor
Cold end group plate, the hot junction substrate being connected with semi-conductor electricity couple hot junction and the liquid that cold end is connected by galvanic couple
Body cooling device；Wherein, described hot junction substrate includes metal basal board and is connected to metal basal board and half
Conductor galvanic couple between thermally conductive insulating layer；
Described liquid chiller part includes: the liquid cooling matrix being connected with metal basal board, described liquid is cold
But offer on the installed surface that matrix is connected with metal basal board and put liquid bath, described in put between liquid bath and metal basal board
It is provided with the cooling liquid of flowing.
Semiconductor refrigerating assembly the most according to claim 1, it is characterised in that described liquid cools down
Matrix is provided with away from the diapire inner surface of metal basal board and supports between described diapire inner surface and metal basal board
At least one dividing plate, at least one dividing plate is divided into snakelike flow channel for liquids, described cooling by putting liquid bath
Liquid flows in described flow channel for liquids.
Semiconductor refrigerating assembly the most according to claim 2, it is characterised in that described metal basal board
Being provided with pit towards the surface of described liquid cooling matrix, the quantity of described pit is at least two, extremely
Few two pits are corresponding with the position of flow channel for liquids.
Semiconductor refrigerating assembly the most according to claim 3, it is characterised in that described liquid cools down
A sidewall adjacent with described diapire on matrix is provided with inlet and liquid outlet, described inlet and go out liquid
Mouth is corresponding with the position at the top of described flow channel for liquids and end respectively；Described inlet and liquid outlet also with
Outside cooling line connection forms cooling circuit, and described cooling circuit is provided with liquid pump.
Semiconductor refrigerating assembly the most according to claim 4, it is characterised in that described cooling circuit
On be additionally provided with heat exchanger, be provided with the fluid passage connected with described cooling line in described heat exchanger.
Semiconductor refrigerating assembly the most according to claim 5, it is characterised in that described liquid cools down
Device also includes the cooling fan for dispelling the heat described heat exchanger.
7. according to the semiconductor refrigerating assembly described in any one of claim 1-6, it is characterised in that described
Metal basal board is aluminium base.
Semiconductor refrigerating assembly the most according to claim 2, it is characterised in that described metal basal board
It is provided with at least two sheet metal spaced apart from each other, described metal towards the surface of described liquid cooling matrix
Sheet is corresponding with the position of flow channel for liquids, and each sheet metal is along the length direction of corresponding flow channel for liquids
Extend.
Semiconductor refrigerating assembly the most according to claim 2, it is characterised in that described metal basal board
It is provided with at least two protruded from this surface spaced apart from each other towards the surface of described liquid cooling matrix
Metal rib, described metal rib is corresponding with the position of flow channel for liquids.
10. according to the semiconductor refrigerating assembly described in any one of claim 1-6, it is characterised in that institute
State and be additionally provided with seal groove on the installed surface of liquid cooling matrix, be provided with sealing ring in described seal groove, be used for
Seal the gap between described liquid cooling matrix and metal basal board.
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| CN201620123081.9U CN205542899U (en) | 2016-02-16 | 2016-02-16 | Semiconductor refrigeration components |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105576113A (en) * | 2016-02-16 | 2016-05-11 | 广东富信科技股份有限公司 | Semiconductor refrigeration component |
| CN110701924A (en) * | 2019-10-18 | 2020-01-17 | 宁波江丰电子材料股份有限公司 | Cooling plate body |
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2016
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105576113A (en) * | 2016-02-16 | 2016-05-11 | 广东富信科技股份有限公司 | Semiconductor refrigeration component |
| CN110701924A (en) * | 2019-10-18 | 2020-01-17 | 宁波江丰电子材料股份有限公司 | Cooling plate body |
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