CN105716365B - Semiconductor wine cabinet - Google Patents
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- CN105716365B CN105716365B CN201410711305.3A CN201410711305A CN105716365B CN 105716365 B CN105716365 B CN 105716365B CN 201410711305 A CN201410711305 A CN 201410711305A CN 105716365 B CN105716365 B CN 105716365B
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Abstract
The present invention provides a kind of semiconductor wine cabinet, include the two heat conduction liners being spaced of shell and setting in the housing, it is provided with wine frame in the heat conduction liner, it is provided with semiconductor refrigeration module on each heat conduction liner, the semiconductor refrigerating module includes semiconductor refrigerating module, cold end radiator and hot-side heat dissipation device, the cold end radiator is connected to the cold end of the semiconductor refrigerating module, the hot-side heat dissipation device is connected to the hot junction of the semiconductor refrigerating module, and the cold end radiator is also connect with the heat conduction liner.The refrigerating capacity of control semiconductor refrigerating module meets the refrigeration requirement of different drinks to realize that multi-temperature zone is freezed as needed.
Description
Technical field
The present invention relates to refrigerating plant more particularly to a kind of semiconductor wine cabinets.
Background technology
Currently, wine cabinet is common electric appliance in people's daily life, usually there is refrigeration system, under normal circumstances in wine cabinet
Refrigeration system is made of compressor, condenser and evaporator, can realize the refrigeration compared with low temperature.However, with semiconductor refrigerating
The development of technology, the wine cabinet to be freezed using semiconductor refrigerating module are also widely used.Semiconductor wine in the prior art
Cabinet freezes to the wine in wine frame in cabinet by the cold end released cold quantity of semiconductor refrigerating module.But in actual use process
In, the cryogenic temperature of semiconductor wine cabinet is single, can not achieve multi-temperature zone refrigeration, cannot be satisfied the refrigeration requirement of different drinks.Such as
What design it is a kind of can realize multi-temperature zone refrigeration with meet different drinks refrigeration require semiconductor wine cabinet be the present invention wanted
The technical issues of solution.
Invention content
The technical problem to be solved by the present invention is to：A kind of semiconductor wine cabinet is provided, realizes multi-temperature zone refrigeration to meet not
With the refrigeration requirement of drinks.
Technical solution provided by the invention is a kind of semiconductor wine cabinet, includes two of shell and setting in the housing
A heat conduction liner being spaced is provided with wine frame in the heat conduction liner, and being provided with half on each heat conduction liner leads
Body refrigeration module, the semiconductor refrigerating module include semiconductor refrigerating module, cold end radiator and hot-side heat dissipation device, described cold
End radiator is connected to the cold end of the semiconductor refrigerating module, and the hot-side heat dissipation device is connected to the semiconductor refrigerating module
Hot junction, the cold end radiator also connect with the heat conduction liner.
Semiconductor wine cabinet provided by the invention by using multiple spaced heat conduction liners, and is directed to each heat conduction
Liner is independently arranged corresponding semiconductor refrigerating module, and in the semiconductor refrigerating module course of work, semiconductor refrigerating module will
To corresponding heat conduction liner released cold quantity, and cold is directly emitted to its internal storage space by heat conduction liner, due to
It is mutually isolated between heat conduction liner so that different heat conduction liners, which are formed by storage space, can form independent warm area range,
So as to control the refrigerating capacity of semiconductor refrigerating module as needed to realize that multi-temperature zone is freezed, the system of different drinks is met
Cold requirement.Simultaneously as the storage that the cold end radiator of semiconductor refrigerating module is directly formed heat conduction liner by heat conduction liner
Object space freezes, and refrigerating efficiency is more preferable, improves the refrigeration performance of semiconductor wine cabinet.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Some bright embodiments for those of ordinary skill in the art without having to pay creative labor, can be with
Obtain other attached drawings according to these attached drawings.
Fig. 1 is the structural schematic diagram of semiconductor wine cabinet embodiment of the present invention；
Fig. 2 is the explosive view of semiconductor wine cabinet embodiment of the present invention；
Fig. 3 is the structural schematic diagram of semiconductor wine cabinet embodiment middle case of the present invention；
Fig. 4 is the partial sectional view of semiconductor wine cabinet embodiment middle case of the present invention；
Fig. 5 is the structural schematic diagram of mounting plate in semiconductor wine cabinet embodiment of the present invention；
Fig. 6 is the structural schematic diagram of cold end radiator in semiconductor wine cabinet embodiment of the present invention；
Fig. 7 is the assembling figure of cold end radiator and heat conduction liner in semiconductor wine cabinet embodiment of the present invention；
Fig. 8 is the sectional view of the first heat carrier in semiconductor wine cabinet embodiment of the present invention；
Fig. 9 is the assembled relation figure of the first heat carrier and locating piece in semiconductor wine cabinet embodiment of the present invention；
Figure 10 is the structural schematic diagram one of hot-side heat dissipation device in semiconductor wine cabinet embodiment of the present invention；
Figure 11 is the structural schematic diagram two of hot-side heat dissipation device in semiconductor wine cabinet embodiment of the present invention；
Figure 12 is flow principles figure of Figure 11 apoplexy in groups of fins；
Figure 13 is the structural schematic diagram of the second heat carrier in semiconductor wine cabinet embodiment of the present invention.
Specific implementation mode
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
The every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
As Figure 1-Figure 2, the present embodiment semiconductor wine cabinet, including shell 101 and be arranged in shell 101 two that
The heat conduction liner 100 at this interval is provided with wine frame in liner 100, and semiconductor system is provided on each heat conduction liner 100
Chill group, the semiconductor refrigerating module include semiconductor refrigerating module 200, cold end radiator 300 and hot-side heat dissipation device 400,
The cold end radiator 300 is connected to the cold end of the semiconductor refrigerating module 200, and the hot-side heat dissipation device 400 is connected to institute
The hot junction of semiconductor refrigerating module 200 is stated, the cold end radiator 300 is also connect with the heat conduction liner 100.
Specifically, the present embodiment semiconductor wine cabinet includes two heat conduction liners 100, shell 101 and heat conduction liner 100 it
Between be provided with insulating layer, heat conduction liner 100 forms storage space for refrigerating or frozen goods.Wherein, each heat conduction liner 100
It is corresponding with semiconductor refrigerating module, semiconductor refrigerating module partly leads the storage space in corresponding refrigeration heat conduction liner 100
The cold that the cold end of semiconductor refrigerating module 200 generates in body refrigeration module is transmitted to heat conduction liner by cold end radiator 300
On 100, rapidly cold will be discharged into the storage space formed in it by heat conduction liner 100 and freezed, and semiconductor
The heat that the hot junction of refrigeration module 200 generates is radiated by hot-side heat dissipation device 400.And since multiple heat conduction liners 100 interval is set
It sets, meanwhile, each heat conduction liner 100 carries out independent refrigeration by corresponding semiconductor refrigerating module 200, in actual use process
In, difference can be required according to the article refrigeration stored in different heat conduction liners 100, control corresponding semiconductor refrigerating module
The cold of 200 release adaptive capacities, realizes multi-temperature zone refrigeration.
Wherein, thermal insulating connectors 102, the two neighboring heat conduction are provided between the two neighboring heat conduction liner 100
Liner 100 is linked together by the thermal insulating connectors 102.Specifically, as shown in Figure 3-Figure 5,102 1 side of thermal insulating connectors
Face, which can play, links together two adjacent heat conduction liners 100, on the other hand can also be subtracted by thermal insulating connectors 102
It less or blocks heat transfer occurs between two neighboring heat conduction liner 100, so that each heat conduction liner 100 is formed by warm area
It is more independent.Various ways may be used in thermal insulating connectors 102, such as：The thermal insulating connectors 102 are provided with backwards to arrangement
Slot 1021, the heat conduction liner 100 is inserted in the slot 1021, will be in heat conduction when assembling two heat conduction liners 100
The edge of courage 100 is inserted into slot 1021, realizes that two heat conduction liners 100 link together, and heat conduction liner 100 is inserted in institute
The modes such as gluing, screw fixation may be used after stating in slot 1021 to fasten, it is preferred that the heat conduction liner 100 is installed on slotting
In slot 1021, specifically, the end set that the heat conduction liner 100 is inserted in the slot 1021 has barb structure 1001, it is described
The side wall of slot 1021 is provided with the fixture block 1022 coordinated with the barb structure 1001, and the barb structure 1001 is stuck in described
On fixture block 1022.In addition, horizontal arrangement may be used between multiple heat conduction liners 100 in the present embodiment, it is preferred that Duo Gesuo
The stacked arrangement from top to bottom of heat conduction liner 100 is stated, and semiconductor refrigerating module 200 is respectively positioned on the heat conduction liner of topmost
On 100.Specifically, semiconductor refrigerating module 200 is unified on the heat conduction liner 100 of topmost, and in order to facilitate the installation of
Equal semiconductor refrigerating module 200,100 are provided with mounting plate 103, the semiconductor system on the heat conduction liner of topmost
Chill block 200 is fixed on the mounting plate 103.Heat-barrier material support may be used in mounting plate 103, to avoid heat conduction liner
100 are transmitted by the way that heat occurs between mounting plate 103 and semiconductor refrigerating module 200, and are also provided with and are added in mounting plate 103
Strong plate 1031, enhances the structural strength of mounting plate 103 by reinforcing plate 1031.
In actual use, the existing equipment generally use cooling fin using semiconductor refrigerating carries out forced convertion,
With by cold by being dispersed into storage space, and in order to enable the heat of 200 cold end of semiconductor refrigerating module is more effectively right
Storage space freezes, and ensures being evenly distributed for cold, as shown in Fig. 6-Fig. 9, the cold end heat dissipation in the present embodiment
Device 300 includes the first heat carrier 31 and the first heat pipes of Duo Gen 32, and cavity is formed in first heat carrier 31（It is not shown）, institute
The sealing of the first heat pipe 32 is stated to be inserted in first heat carrier 31 and be connected to the cavity；First heat carrier 31 is attached to institute
The cold end of semiconductor refrigerating module 200 is stated, first heat pipe 32 is attached on the heat conduction liner 100, and the first heat pipe 32 passes through
First heat carrier 31 is realized to be thermally connected with the cold end of semiconductor refrigerating module 200.Specifically, semiconductor refrigerating module 200 is cold
The cold that end generates passes to the first heat pipe 32 by the first heat carrier 31, and the first heat pipe 32 can quickly disperse cold
Onto heat conduction liner 100, cold directly can be discharged into its internal storage space formed and freezed by heat conduction liner 100,
Refrigerating efficiency is effectively raised, the cold for avoiding the cold end generation of semiconductor refrigerating module 200 is dissipated using cooling fin
It is cold and the low phenomenon of refrigerating efficiency occur.Wherein, multiple jacks 311, first heat pipe 32 are offered on the first heat carrier 31
Sealing is inserted in the jack 311, and the first through hole 312, first heat pipe are provided between the two neighboring jack 311
32 ends being inserted in the jack 311 offer the second through hole（It is not shown）, first through hole passes through with described second
Through-hole, which is interconnected, forms channel, and the channel is the cavity.During cold end 300 actual assembled of radiator, the first heat
Pipe 32 is inserted into jack 311, the position of the second through hole in the depth and the first heat pipe 32 by rationally designing jack 311
It sets so that the first through hole 312 is connected to form channel with the second through hole, alternatively, during actual assembled, the first heat carrier
It is first provided with jack 311 on 31, after the first heat pipe 32 is inserted into jack 311, is opened from the side wall of the first heat carrier 31
Through hole equipped with perforation the first heat carrier 31 and the first heat pipe 32, to form cavity in the first heat carrier 31, then, then will
For in gas-liquid phase transition refrigerant filling in heat pipe to the first heat pipe 32 and cavity so that the first heat pipe 32 has heat pipe speed heat
Performance.And can quickly enter in the first heat pipe 32 and freeze for the ease of the refrigerant after liquefaction, described first
The lower end of heat carrier 31 offers the jack 311.Wherein, it is additionally provided with switchable filling on first heat carrier 31
Mouth 313, the filler 313 is connected to the cavity, can be easily perfused and be made into the first heat pipe 32 by filler 313
Cryogen, and in actual use, in order to avoid causing due to failure makes semiconductor refrigerating module 200 be not normally functioning
The excessive generation bombing of pressure in first heat pipe 32 is additionally provided with safe pressure valve 314, the safety pressure on the first heat carrier 31
Power valve 314 is connected to the cavity, and after the pressure in the first heat pipe 32 is more than setting value, safe pressure valve 314 releases opening
Power is bled off pressure, it is safe to use to ensure.For the refrigerant of perfusion, need that refrigerant working medium is perfused in the first heat pipe 32 can be ice
Case refrigeration system often uses refrigerant, such as R134a, R600a, CO2, and the selection of specific refrigerant working medium can be according to versatility
It is required that, system pressure requirements, cold delivery request, working medium physical property, the combined factors such as environmental protection determine.Preferably, in order to reduce
The quantity of one heat pipe 32, meanwhile, meet cold scattering and uniformly require, cold end radiator 300 includes two first heat pipes 32, institute
It states and is opened up on the first heat carrier 31 there are four the jack 311, the both ends of first heat pipe 32 are inserted in corresponding described
In jack 311；Wherein one first heat pipe 32 is bent the both sides for being distributed in the heat conduction liner 100, another first heat pipe
32 bendings are distributed in the back of the heat conduction liner 100.Specifically, the both ends of the first heat pipe 32 are inserted in jack 311, make
The cold scattering ability that the first heat pipe 32 realizes two heat pipes is obtained, and the bending of wherein one first heat pipe 32 is distributed in heat conduction liner 100
Both sides, another first heat pipe 32 is bent the back for being distributed in heat conduction liner 100, during by the first 32 cold scattering of heat pipe,
The contact area bigger of first heat pipe 32 and heat conduction liner 100 of bending distribution, so that heat conduction liner 100 can more
Even acquisition cold, meanwhile, the both sides and back of heat conduction liner 100 are distributed with the first heat pipe 31 and carry out cold scattering so that lead
Hot liner 100 forms the cold scattering surface of encircling type, so that it is guaranteed that internal storage space refrigeration is uniform.And in order to enable the first heat
Pipe 31, which can quickly extend cold from its end, to be transmitted, and the first heat pipe 32 from its both ends, prolong inclined downward respectively by bending
Stretch, specifically, the refrigerant in the first heat pipe 32 is gasificated into gas being liquefied as liquid after being cooled when heated, pass through by
First heat pipe 32 is extended by the way of bending inclined downward, and during the first 32 cold scattering of heat pipe, liquefied refrigerant
It can flow downward under the effect of gravity, and the refrigerant to gasify can rise to the first heat conduction along inclined first heat pipe 32
Freezing in the cavity that body 31 is formed, wherein the first heat pipe 32 will form straight pipe and bend loss after bending extends, for
The angle of inclination of the straight pipe of first heat pipe 32 is：The pipeline diameter in millimeters of first heat pipe 32（Hereinafter referred to as manage
Diameter）It is configured to the 1.2-1.3 of the inclination angle theta relative to horizontal direction as unit of degree more than or equal to the first heat pipe 32
Times, in actual production, the straight pipe of each first heat pipe 32 is arranged with the angle tilt for being in respect to the horizontal plane 10 ° to 70 °
To ensure that liquid refrigerant flows in it by free gravity, to improve the cold scattering efficiency of the first heat pipe 32.In addition, for list
The first heat pipe of root 32, the both ends of the first heat pipe 32 tilt down bending in symmetric mode and extend.
And during needing semiconductor refrigerating module 200 being installed to heat conduction liner 100, on heat conduction liner 100
Mounting plate 103 is formed with card slot 1032 again, and the first heat carrier 31 is inserted in slot 1032, and semiconductor refrigerating module 200 and
Heat-conducting silicone grease is set between one heat carrier 31 and is installed on mounting plate 103 by the first heat carrier 31.Preferably, semiconductor system
The periphery of chill block 200 is cased with sealing ring 201, and auxiliary mounting deck 202, auxiliary mounting deck are further fixedly arranged on mounting plate 103
Installing port 2021 is provided on 202, sealing ring 201 is located in installing port 2021, passes through sealing ring 201 and auxiliary mounting deck 202
Can semiconductor refrigerating module 200 be more firmly subjected to installation fixation, meanwhile, sealing ring 201 again can be by semiconductor system
The peripheral sealing of chill block 200 avoids cold from scattering and disappearing from the periphery of semiconductor refrigerating module 200.And in order to the first heat pipe 32
It is positioned, first heat pipe, 32 stress when carrying out foaming processing before to heat conduction liner 100 and shell 101 is avoided to shift, the
The bending place of one heat pipe 32 is provided with locating piece 104, and the locating piece 104 is fixed on the heat conduction liner 100.First heat pipe
32 bending place is positioned by locating piece 104, and locating piece 104 can keep the bending state of the first heat pipe 32 so that
In foaming process and routine use, the flexuosity of the first heat pipe 32 remains unchanged, while avoiding the occurrence of the shifting of the first heat pipe 32
Position.Wherein, locating piece 104 includes locating piece 1041 and connecting pole 1042, and the locating piece 1041 is connected to the connecting pole
On 1042, the connecting pole 1042 is fixed on the heat conduction liner 100, and first heat pipe 32 is wound on the connecting pole 1042
It goes up and is located between the locating piece 1041 and the heat conduction liner 100, in an assembling process, the first heat pipe 32 is wound on connecting pole
1042 bendings, and the bending place of the first heat pipe 32 is clipped between locating piece 1041 and the heat conduction liner 100, for locating piece
Connection between 104 and heat conduction liner 100, on heat conduction liner 100 riveting there is riveting nut 105, the locating piece 104 to offer logical
Hole 1043, the riveting nut 105 are located in the through-hole 1043, and screw 106 is inserted in the through-hole 1043 and is threaded in institute
It states in riveting nut 105.
In actual use, the existing equipment generally use fan using semiconductor refrigerating is to semiconductor refrigeration module
200 hot junction carries out wind-cooling heat dissipating, need to consume a large amount of electric energy and fan operating noise is more serious always, such as Fig. 2 and figure
Shown in 10, the hot-side heat dissipation device 400 in the present embodiment includes the second heat carrier 41, more second heat pipes 42 and groups of fins 43,
Second heat pipe 42 is connected on second heat carrier 41, and the groups of fins 43 is connected on second heat pipe 42.
Specifically, the second heat carrier 41 is attached to the hot junction of semiconductor refrigerating module 200, and groups of fins 43 is attached on shell 101, is partly led
The heat that the hot junction of body refrigeration module 200 generates passes to the second heat pipe 42 by the second heat carrier 41, and the second heat pipe 42 can
Quickly transfer heat in groups of fins 43, and the radiator of larger area can be made in groups of fins 43 as needed,
The heat that groups of fins 43 can be transmitted using itself larger the second heat pipe of heat dissipation area pair 42 carries out rapid cooling, to nothing
It need to directly be radiated to the hot junction of semiconductor refrigeration module 200 by fan.Wherein, in order to adequately utilize each cooling fin
Group 43 radiates, and third heat pipe 44 is also associated on the second heat carrier 41, and described the in any hot-side heat dissipation device 400
Three heat pipes 44 are also connect with the groups of fins 43 in hot-side heat dissipation device 400 described in remaining.In actual use, when each
When the heat that a work of semiconductor refrigerating module 200 generates is identical, each semiconductor refrigerating module 200 passes through respective cooling fin
Group 43 radiates, and when the heat dissipation capacity of some semiconductor refrigerating module 200 is larger, it is connected to the semiconductor refrigerating module
Second heat carrier 41 of 200 heats transfers heat to that other semiconductor refrigerating modules 200 are corresponding to be dissipated by third heat pipe 44
In backing group 43, so as to more efficiently be radiated using whole groups of fins 43；In the design process, each second
Heat carrier 41 can be thermally connected by third heat pipe 44 and remaining groups of fins 43, for dissipating for whole groups of fins 43
Thermal energy power, to realize natural cooling.And in order to enhance the draught capacity of groups of fins 43, groups of fins 43 radiates including multi-disc
Fin 431 is provided with ventilation hole 432 on the radiating fin 431, multiple 432 shapes of the ventilation hole being located on same axis
At air duct, groups of fins 43 also utilizes the formation of ventilation hole 432 other than being aerated using the interval between radiating fin 431
Air duct is aerated, so as to effectively enhance the draught capacity of groups of fins 43.And work as each semiconductor refrigerating module 200
It is run under relatively high power, in order to meet the requirement of high-power heat-dissipation, fan 45 is arranged side by side and is located at groups of fins 43
The side in air duct, the direction outlet air that fan 45 extends towards air duct, the wind that fan 45 is blown out enter in air duct to accelerate air duct
The flowing of apoplexy, and since hot-air is gentlier easy to flow upward, the wind to flow in ventilation hole 432 will make hot-air two
Vortex flow between a radiating fin 431 is radiated using the area of radiating fin 431 to the greatest extent.Such as Figure 10-Figure 12
It is shown, in order to more fully be radiated using radiating fin 431, other than the radiating fin 431 positioned at outside, remaining heat dissipation
Fin 431 opens up jagged 433, is located at the notch 433 on sustained height position and forms auxiliary air duct, is also set in groups of fins 43
It is equipped with cover body 46, the fan 45 is also located at the inside in auxiliary air duct and is fixed on cover body 46, and cover body 46 is covered in cooling fin
In group 43, the lower end of cover body 46 forms air inlet, and the upper end of cover body 46 forms air outlet, to auxiliary after the startup of fan 45
It dries in air duct, accelerates the air flowing between radiating fin 431, and hot-air rises from air outlet output so that it is extraneous
Cold air is entered from the air inlet of bottom between radiating fin 431 so that cold wind can pass through from bottom to up in motion process
The whole surface of radiating fin 431, to make full use of the heat-sinking capability of radiating fin 431；And for installing fan on cover body 46
45 position is further opened with ventilation opening 461, and extraneous wind is further introduced into radiating fin by fan 45 by ventilation opening 461
In 431.Wherein, the both sides of each second heat carrier 41 are respectively arranged with groups of fins 43, and fan 45 is dissipated positioned at two simultaneously
Between backing group 43.And connect with the second heat carrier 41 for the ease of heat pipe, as shown in figure 13, it is formed on the second heat carrier 41
Multiple mounting holes 410, second heat pipe 42 and the third heat pipe 44 are inserted in the corresponding mounting hole 410, and heat pipe is inserted
The contact area between the second heat carrier 41 can be increased in mounting hole 410, improve heat conduction efficiency；And the second heat carrier
41 include that reeded briquetting 411 is arranged in two surfaces, and two briquettings 411 are fixed together, corresponding two institutes
It states groove and forms the mounting hole 410, form the second heat carrier 41 using two briquettings 411, can be led with second convenient for heat pipe
Assembly and connection between hot body 41.
Finally it should be noted that：The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
Present invention has been described in detail with reference to the aforementioned embodiments, it will be understood by those of ordinary skill in the art that：It still may be used
With technical scheme described in the above embodiments is modified or equivalent replacement of some of the technical features；
And these modifications or replacements, various embodiments of the present invention technical solution that it does not separate the essence of the corresponding technical solution spirit and
Range.
Claims (22)
1. a kind of semiconductor wine cabinet, which is characterized in that led including what two of shell and setting in the housing were spaced
Hot liner is provided with wine frame in the heat conduction liner, and semiconductor refrigeration module is provided on each heat conduction liner, described
Semiconductor refrigerating module includes semiconductor refrigerating module, cold end radiator and hot-side heat dissipation device, and the cold end radiator is connected to
The cold end of the semiconductor refrigerating module, the hot-side heat dissipation device is connected to the hot junction of the semiconductor refrigerating module, described cold
End radiator is also connect with the heat conduction liner, and the cold end radiator includes the first heat pipe of the first heat carrier and Duo Gen, described
Cavity is formed in first heat carrier, the first heat pipe sealing is inserted in first heat carrier and is connected to the cavity；
First heat carrier is attached to the cold end of the semiconductor refrigerating module, and first heat pipe is attached on the heat conduction liner, institute
It states and offers multiple jacks on the first heat carrier, the first heat pipe sealing is inserted in the jack, the two neighboring jack
Between be provided with the first through hole, the end that first heat pipe is inserted in the jack offers the second through hole, described
One through hole is interconnected with second through hole and forms channel, and the channel is the cavity；
From its both ends, bending extends first heat pipe inclined downward respectively, and the bending place of first heat pipe, which is provided with, determines
Position part, the locating piece includes locating piece and connecting pole, and the locating piece is connected on the connecting pole, and the connecting pole is fixed
On the heat conduction liner, first heat pipe be wound on the connecting pole and positioned at the locating piece and the heat conduction liner it
Between；In an assembling process, first heat pipe is wound on the connecting pole bending, and the bending place of first heat pipe is clipped in positioning
Between block and the heat conduction liner.
2. semiconductor wine cabinet according to claim 1, which is characterized in that be provided between two heat conduction liners heat-insulated
Connector, two heat conduction liners are linked together by the thermal insulating connectors.
3. semiconductor wine cabinet according to claim 1, which is characterized in that two heat conduction liner stacked on top arrangements.
4. semiconductor wine cabinet according to claim 3, which is characterized in that the semiconductor refrigerating module is respectively positioned on top
On the heat conduction liner.
5. semiconductor wine cabinet according to claim 1, which is characterized in that the lower end of first heat carrier opens up
State jack.
6. semiconductor wine cabinet according to claim 1, which is characterized in that be additionally provided on first heat carrier switchable
Filler, the filler is connected to the cavity.
7. semiconductor wine cabinet according to claim 1, which is characterized in that be additionally provided with safe pressure on first heat carrier
Power valve, the safe pressure valve are connected to the cavity.
8. semiconductor wine cabinet according to claim 1, which is characterized in that the cold end radiator includes two described first
Heat pipe opens up on first heat carrier there are four the jack, and the both ends of first heat pipe are inserted in corresponding described
In jack；Wherein one first heat pipe is bent the both sides for being distributed in the heat conduction liner, and another first heat pipe is distributed in institute
State the back of heat conduction liner.
9. semiconductor wine cabinet according to claim 1, which is characterized in that the both ends of first heat pipe are in symmetric mode
Bending is tilted down to extend.
10. semiconductor wine cabinet according to claim 1, which is characterized in that first heat pipe in millimeters
Pipeline diameter is configured to the inclination angle theta relative to horizontal direction as unit of degree more than or equal to first heat pipe
1.2-1.3 again.
11. semiconductor wine cabinet according to claim 1, which is characterized in that riveting has riveting nut on the heat conduction liner, institute
It states connecting pole and offers through-hole, the riveting nut is located in the through-hole, and screw is inserted in the through-hole and is threaded in described
In riveting nut.
12. according to any semiconductor wine cabinets of claim 1-4, which is characterized in that the hot-side heat dissipation device includes second
Heat carrier, more second heat pipes and groups of fins, second heat pipe are connected on second heat carrier, the groups of fins
It is connected on second heat pipe.
13. semiconductor wine cabinet according to claim 12, which is characterized in that be also associated with third on second heat carrier
Heat pipe, the third heat pipe in a hot-side heat dissipation device also connect with the groups of fins in another hot-side heat dissipation device
It connects.
14. semiconductor wine cabinet according to claim 12, which is characterized in that the groups of fins includes multi-disc radiating fin
Piece, ventilation hole is provided on the radiating fin, and multiple ventilation holes form air ducts；The hot-side heat dissipation device is additionally provided with wind
Fan, the fan are arranged side by side with the groups of fins and are located at the side in the air duct.
15. semiconductor wine cabinet according to claim 14, which is characterized in that the hot-side heat dissipation device includes two cooling fins
Group, the fan and second heat carrier are located between two groups of fins.
16. semiconductor wine cabinet according to claim 14, which is characterized in that the radiating fin is vertically arranged, described to dissipate
The outer surface of backing group is additionally provided with cover body, and the lower end of the cover body forms air inlet, and the upper end of the cover body is formed out
Air port.
17. semiconductor wine cabinet according to claim 16, which is characterized in that for the single groups of fins, in addition to position
It is jagged in outside the outermost radiating fin, being opened up on remaining described radiating fin, it is located at the notch of sustained height
Auxiliary air duct is formed, the fan is also located at the inside in the auxiliary air duct and is fixed on the cover body.
18. semiconductor wine cabinet according to claim 17, which is characterized in that be equipped with the portion of the fan on the cover body
Position is further opened with ventilation opening.
19. semiconductor wine cabinet according to claim 13, which is characterized in that be formed with multiple peaces on second heat carrier
Hole is filled, second heat pipe and the third heat pipe are inserted in the corresponding mounting hole.
20. semiconductor wine cabinet according to claim 19, which is characterized in that second heat carrier is set including two surfaces
Reeded briquetting is set, two briquettings are fixed together, and corresponding two grooves form the mounting hole.
21. semiconductor wine cabinet according to claim 2, which is characterized in that the thermal insulating connectors are provided with backwards to arrangement
Slot, the heat conduction liner is inserted in the slot.
22. semiconductor wine cabinet according to claim 21, which is characterized in that the heat conduction liner is inserted in the end of the slot
Portion is provided with barb structure, and the side wall of the slot is provided with the fixture block coordinated with the barb structure, the barb structure card
On the fixture block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410711305.3A CN105716365B (en) | 2014-12-01 | 2014-12-01 | Semiconductor wine cabinet |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410711305.3A CN105716365B (en) | 2014-12-01 | 2014-12-01 | Semiconductor wine cabinet |
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| CN105716365A CN105716365A (en) | 2016-06-29 |
| CN105716365B true CN105716365B (en) | 2018-09-07 |
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| CN201410711305.3A Active CN105716365B (en) | 2014-12-01 | 2014-12-01 | Semiconductor wine cabinet |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108800656B (en) * | 2017-04-28 | 2020-09-08 | 青岛海尔智能技术研发有限公司 | Semiconductor refrigeration module and refrigeration equipment |
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