CN105650935A - Assembling technology of semiconductor refrigerating equipment - Google Patents

Abstract

The invention provides an assembling technology of semiconductor refrigerating equipment. The semiconductor refrigerating equipment comprises a shell, heat conduction inner containers and semiconductor refrigerating modules; each semiconductor refrigerating module comprises a semiconductor refrigerating die block, a cold end radiator and a heat end radiator, wherein the heat end radiator is connected to the heat end of the corresponding semiconductor refrigerating die block, the cold heat radiator comprises a heat conduction body and a plurality of heat pipes, the heat conduction body is connected to the cold end of the corresponding semiconductor refrigerating die block, and the heat pipes are bent to extend and are attached to the corresponding heat conduction inner container; positioning parts are arranged at the bend positions of the heat pipes, and are fixed to the heat conduction inner containers; the heat conduction inner containers are located in the shell, and the position between the shell and each heat conduction inner container is filled with a foaming layer; and the heat pipes and the positioning parts are embedded in the foaming layers. The bent heat pipes are positioned through the positioning parts, and therefore the heat pipes can be firmly and reliably mounted and fixed to the heat conduction inner containers, and in the foaming process, the positioning parts can effectively limit the positions of the heat pipes; and it is ensured that after foaming is carried out, the precise positions of the heat pipes keep unchangeable, and the assembling reliability is improved.

Description

The packaging technology of semiconductor refrigerating equipment

Technical field

The present invention relates to refrigerating plant, relate in particular to a kind of packaging technology of semiconductor refrigerating equipment.

Background technology

At present, refrigeration plant (for example refrigerator, refrigerator, wine cabinet) is electrical equipment conventional in people's daily life, in refrigeration plant, conventionally have refrigeration system, generally refrigeration system is made up of compressor, condenser and evaporimeter, can realize the refrigeration of lower temperature. But, along with the development of semiconductor refrigerating technology, adopt the refrigeration plant that semiconductor chilling plate freezes to be also widely used. Semiconductor refrigerating equipment of the prior art is provided with heat-exchange device conventionally by the cold junction of semiconductor refrigerating module, by heat-exchange device, the cold junction released cold quantity of semiconductor refrigerating module is delivered to freezing in the inner bag of casing. Heat-exchange device of the prior art adopts the many heat pipes that link together conventionally, heat pipe is directly bonded on the inner bag in casing, and the end of heat pipe is bonded in the cold junction of semiconductor refrigerating module, in foaming process, easily there is the phenomenon of heat pipe displacement, and affect the assembling quality of semiconductor refrigerating equipment, cause the assembling reliability of semiconductor refrigerating equipment in prior art.

Summary of the invention

Technical problem to be solved by this invention is: a kind of packaging technology of semiconductor refrigerating equipment is provided, reduces heat pipe the phenomenon appearance being shifted occurs, improve the assembling reliability of conductor refrigeration plant.

Technical scheme provided by the invention is, a kind of packaging technology of semiconductor refrigerating equipment, described semiconductor refrigerating equipment comprises shell, heat conduction inner bag and semiconductor refrigerating module, described semiconductor refrigerating module comprises semiconductor refrigerating module, cold junction radiator and hot-side heat dissipation device, and described hot-side heat dissipation device is connected to the hot junction of described semiconductor refrigerating module; Described cold junction radiator comprises heat carrier and Duo Gen heat pipe, and described heat pipe is connected on described heat carrier; Described heat carrier is connected to the cold junction of described semiconductor refrigerating module, and described heat pipe bending is extended and is attached on described heat conduction inner bag; The bending place of described heat pipe is provided with keeper, and described keeper is fixed on described heat conduction inner bag; Described heat conduction inner bag is arranged in described shell, between described shell and described heat conduction inner bag, is filled with foaming layer, and described heat pipe and described keeper are embedded in described foaming layer; Packaging technology is: first by described keeper, the kink of described heat pipe is fastened on heat conduction inner bag, then, between described shell and described heat conduction inner bag, filled with foaming material forms foaming layer, again the cold junction of described semiconductor refrigerating module is connected with described heat carrier, finally, hot-side heat dissipation device is connected with the hot junction of described semiconductor refrigerating module, and described hot-side heat dissipation device is fixed on shell.

Semiconductor refrigerating equipment provided by the invention, by adopting keeper to position the heat pipe of bending, what make that heat pipe can be solid and reliable is fixed on heat conduction inner bag, in foaming process, keeper can effectively limit the position of heat pipe, occur and reduce the phenomenon that heat pipe affects by expanded material to be moved, guarantee that heat pipe keeps invariant position accurately after foaming, improved the assembling reliability of semiconductor refrigerating equipment.

Brief description of the drawings

In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is some embodiments of the present invention, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.

Fig. 1 is the structural representation of semiconductor refrigerating equipment of the present invention;

Fig. 2 is the explosive view of semiconductor refrigerating equipment of the present invention;

Fig. 3 is the structural representation of casing in semiconductor refrigerating equipment of the present invention;

Fig. 4 is the partial sectional view of casing in semiconductor refrigerating equipment of the present invention;

Fig. 5 is the structural representation of installing plate in semiconductor refrigerating equipment of the present invention;

Fig. 6 is the structural representation of cold junction radiator in semiconductor refrigerating equipment of the present invention;

Fig. 7 is the assembly drawing of cold junction radiator and inner bag in semiconductor refrigerating equipment of the present invention;

Fig. 8 is the cutaway view of the first heat carrier in semiconductor refrigerating equipment of the present invention;

Fig. 9 is the assembled relation figure of the first heat carrier and keeper in semiconductor refrigerating equipment of the present invention;

Figure 10 is the structural representation one of hot-side heat dissipation device in semiconductor refrigerating equipment of the present invention;

Figure 11 is the structural representation two of hot-side heat dissipation device in semiconductor refrigerating equipment of the present invention;

Figure 12 is the flow principles figure of Figure 11 apoplexy in groups of fins;

Figure 13 is the structural representation of the second heat carrier in semiconductor refrigerating equipment of the present invention.

Detailed description of the invention

For making object, technical scheme and the advantage of the embodiment of the present invention clearer, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is the present invention's part embodiment, instead of whole embodiment. Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.

As Figure 1-Figure 2, the semiconductor refrigerating equipment that the packaging technology of the present embodiment semiconductor refrigerating equipment uses comprises shell 101, heat conduction inner bag 100 and semiconductor refrigerating module, described semiconductor refrigerating module comprises semiconductor refrigerating module 200, cold junction radiator 300 and hot-side heat dissipation device 400, described cold junction radiator 300 is connected to the cold junction of described semiconductor refrigerating module 200, described hot-side heat dissipation device 400 is connected to the hot junction of described semiconductor refrigerating module 200, as shown in Fig. 6-Fig. 9, described cold junction radiator 300 in the present embodiment comprises the first heat carrier 31 and Duo Gen the first heat pipe 32, in described the first heat carrier 31, be formed with cavity (not shown), described the first heat pipe 32 sealings are inserted in described the first heat carrier 31 and with described cavity and are communicated with, described the first heat carrier 31 is attached to the cold junction of described semiconductor refrigerating module 200, described the first heat pipe 32 is attached on described heat conduction inner bag 100, the first heat pipe 32 is realized with the cold junction of semiconductor refrigerating module 200 thermally coupled by the first heat carrier 31, the first heat pipe 32 bendings are extended and are attached on described heat conduction inner bag 100, and for the first heat pipe 32 is positioned, the stressed displacement of the first heat pipe 32 avoid foaming processing before to heat conduction inner bag 100 and shell 101 time, the bending place of the first heat pipe 32 is provided with keeper 104, described keeper 104 is fixed on described heat conduction inner bag 100, described heat conduction inner bag 100 is arranged in described shell 101, between described shell 101 and described heat conduction inner bag 100, is filled with foaming layer (not shown), and described the first heat pipe 32 and described keeper 104 are embedded in described foaming layer.

Particularly, in assembling process, packaging technology is: first by described keeper 104, the kink of described the first heat pipe 32 is fastened on heat conduction inner bag 100, then, between described shell 101 and described heat conduction inner bag 100, filled with foaming material forms foaming layer, again the cold junction of described semiconductor refrigerating module 200 is connected with described the first heat carrier 31, finally, hot-side heat dissipation device 400 is connected with the hot junction of described semiconductor refrigerating module 200, and described hot-side heat dissipation device 400 is fixed on shell 101. the bending place of the first heat pipe 32 positions by keeper 104, keeper 104 can keep the bending state of the first heat pipe 32, make in foaming process and routine use, the case of bending of the first heat pipe 32 remains unchanged, and avoids occurring that the first heat pipe 32 is shifted simultaneously. wherein, keeper 104 comprises locating piece 1041 and joint pin 1042, described locating piece 1041 is connected on described joint pin 1042, described joint pin 1042 is fixed on described heat conduction inner bag 100, described the first heat pipe 32 is on described joint pin 1042 and between described locating piece 1041 and described heat conduction inner bag 100, in assembling process, the first heat pipe 32 bends around joint pin 1042, and the bending place of the first heat pipe 32 is clipped between locating piece 1041 and described heat conduction inner bag 100, for being connected between keeper 104 and heat conduction inner bag 100, on heat conduction inner bag 100, riveted joint has riveting nut 105, described keeper 104 offers through hole 1043, described riveting nut 105 is arranged in described through hole 1043, screw 106 is inserted in described through hole 1043 and is threaded in described riveting nut 105.

Wherein, the present embodiment semiconductor refrigerating equipment can comprise multiple heat conduction inner bags 100, each heat conduction inner bag 100 correspondences are provided with semiconductor refrigerating module, between adjacent two described heat conduction inner bags 100, be provided with heat insulation connector 102, adjacent two described heat conduction inner bags 100 link together by described heat insulation connector 102. concrete, as shown in Figure 3-Figure 5, heat insulation connector 102 can play two adjacent heat conduction inner bags 100 are linked together on the one hand, can also reduce or block generation heat conduction between adjacent two heat conduction inner bags 100 by heat insulation connector 102 on the other hand, thereby the warm area that each heat conduction inner bag 100 is formed be more independent. heat insulation connector 102 can adopt various ways, for example: described heat insulation connector 102 is provided with the slot 1021 of arranging dorsad, described heat conduction inner bag 100 is inserted in described slot 1021, in the time of two heat conduction inner bags 100 of assembling, the edge of heat conduction inner bag 100 is inserted in slot 1021, realizing two heat conduction inner bags 100 links together, and heat conduction inner bag 100 can adopt gluing after being inserted in described slot 1021, the modes such as screw is fixing are fastening, preferably, described heat conduction inner bag 100 is installed in slot 1021, concrete, the end that described heat conduction inner bag 100 is inserted in described slot 1021 is provided with hangnail structure 1001, the sidewall of described slot 1021 is provided with the fixture block 1022 coordinating with described hangnail structure 1001, described hangnail structure 1001 is stuck on described fixture block 1022. in addition, between the multiple heat conduction inner bags 100 in the present embodiment, can employing level arrange, preferred, multiple described heat conduction inner bags 100 stacked arrangement from top to bottom, and semiconductor refrigerating module 200 is all positioned on the described heat conduction inner bag 100 of topmost. concrete, semiconductor refrigerating module 200 is unified to be arranged on the heat conduction inner bag 100 of topmost, and for convenient equal semiconductor refrigerating module 200 is installed, and being positioned on the described inner bag of topmost 100 to be provided with installing plate 103, described semiconductor refrigerating module 200 is fixed on described installing plate 103. installing plate 103 can adopt heat-barrier material to support, to avoid heat conduction inner bag 100 by there is heat transmission between installing plate 103 and semiconductor refrigerating module 200, and in installing plate 103, can also be provided with stiffener 1031, strengthen the structural strength of installing plate 103 by stiffener 1031.

The cold that the cold junction of semiconductor refrigerating module 200 produces passes to the first heat pipe 32 by the first heat carrier 31, and the first heat pipe 32 can be distributed to cold on heat conduction inner bag 100 fast, heat conduction inner bag 100 can directly be discharged into cold its inner storage space forming and freeze, effectively raise refrigerating efficiency, the cold of having avoided the cold junction of semiconductor refrigerating module 200 to produce adopts fin to carry out cold scattering and occur the phenomenon that refrigerating efficiency is low. wherein, on the first heat carrier 31, offer multiple jacks 311, described the first heat pipe 32 sealings are inserted in described jack 311, between adjacent two described jacks 311, be provided with the first through hole 312, the end that described the first heat pipe 32 is inserted in described jack 311 offers the second through hole (not shown), described the first through hole and described the second through hole formation passage that is interconnected, described passage is described cavity. in cold junction radiator 300 actual assembled processes, the first heat pipe 32 is inserted in jack 311, the position of the second through hole on the degree of depth by appropriate design jack 311 and the first heat pipe 32, the first through hole 312 is communicated with the second through hole and forms passage, or, in actual assembled process, on the first heat carrier 31, be first provided with jack 311, after in the first heat pipe 32 is inserted into jack 311, offer from the sidewall of the first heat carrier 31 through hole that connects the first heat carrier 31 and the first heat pipe 32, to form cavity in the first heat carrier 31, then, to be used for again heat pipe gas-liquid phase transition refrigerant filling in the first heat pipe 32 and cavity, make the first heat pipe 32 there is the performance of heat pipe speed heat. freeze and can enter into fast the first heat pipe 32 for the ease of the cold-producing medium after liquefaction, the bottom of described the first heat carrier 31 offers described jack 311. wherein, on described the first heat carrier 31, be also provided with can switch filler 313, described filler 313 is communicated with described cavity, can in the first heat pipe 32, pour into cold-producing medium easily by filler 313, and in actual use, can not normally move the excessive generation bombing of the pressure causing in the first heat pipe 32 for fear of make semiconductor refrigerating module 200 because of fault, on the first heat carrier 31, be also provided with safe pressure valve 314, described safe pressure valve 314 is communicated with described cavity, when the pressure in the first heat pipe 32 exceedes after setting value, safe pressure valve 314 will be opened release pressure, to guarantee to use safety. for the cold-producing medium of perfusion, in the first heat pipe 32, needing to pour into cold-producing medium working medium can be the conventional cold-producing medium of refrigerator refrigeration system, as R134a, R600a, CO2 etc. all can, the combined factors such as choosing of concrete cold-producing medium working medium can require according to versatility requirement, system pressure, cold delivery request, working medium physical property, environmental protection are determined. preferably, in order to reduce the quantity of the first heat pipe 32, simultaneously, meet the uniform requirement of cold scattering, cold junction radiator 300 comprises two described the first heat pipes 32, on described the first heat carrier 31, offer four described jacks 311, the both ends of described the first heat pipe 32 are all inserted in corresponding described jack 311, wherein one first heat pipe 32 bendings are distributed in the both sides of described heat conduction inner bag 100, and described in another, the first heat pipe 32 bendings are distributed in the back of described heat conduction inner bag 100. concrete, the both ends of the first heat pipe 32 are all inserted in jack 311, make the first heat pipe 32 realize the cold scattering ability of two heat pipes, and wherein one first heat pipe 32 bendings are distributed in the both sides of heat conduction inner bag 100, another the first heat pipe 32 bendings are distributed in the back of heat conduction inner bag 100, in the first heat pipe 32 cold scattering processes of passing through, bending the first heat pipe 32 distributing is larger with the contact area of heat conduction inner bag 100, thereby make heat conduction inner bag 100 can obtain more uniformly cold, simultaneously, the both sides of heat conduction inner bag 100 and back are distributed with the first heat pipe 31 and carry out cold scattering, make heat conduction inner bag 100 form the face of encircling type, thereby guarantee inner storage space refrigeration evenly. and transmit for the first heat pipe 31 can be extended cold fast from its end, the first heat pipe 32 is tilted to respectively and bends extension from its both ends, concrete, cold-producing medium in the first heat pipe 32 is liquefied as liquid after catching a cold, and in the time being heated, be gasificated into gas, by adopting the mode that inclination down bends to extend the first heat pipe 32, and in the first heat pipe 32 cold scattering processes, the cold-producing medium of liquefaction can flow downward under Action of Gravity Field, and the cold-producing medium of gasification can rise in the cavity that the first heat carrier 31 forms along the first heat pipe 32 tilting and freezes, wherein, the first heat pipe 32 will form straight length and bend loss after bending is extended, angle of inclination for the straight length of the first heat pipe 32 is: the 1.2-1.3 that the pipeline diameter taking millimeter as unit (hereinafter to be referred as caliber) of the first heat pipe 32 is configured to the inclination angle theta with respect to horizontal direction taking degree as unit that is more than or equal to the first heat pipe 32 doubly, in actual production, the straight length of each the first heat pipe 32 is obliquely installed to ensure that to be with respect to the horizontal plane the angle of 10 ° to 70 ° liquid refrigerant relies on free gravity to flow therein, to improve the cold scattering efficiency of the first heat pipe 32. in addition, be downward-sloping bending extension of symmetric mode for the both ends of single the first heat pipe 32, the first heat pipes 32.

And semiconductor refrigerating module 200 need to being installed in the process of heat conduction inner bag 100, installing plate 103 on heat conduction inner bag 100 is formed with again draw-in groove 1032, the first heat carrier 31 is inserted in slot 1032, and heat-conducting silicone grease is set between semiconductor refrigerating module 200 and the first heat carrier 31 and is installed on installing plate 103 by the first heat carrier 31. Preferably, the peripheral sleeve of semiconductor refrigerating module 200 has sealing ring 201, on installing plate 103, be also fixedly installed auxiliary mounting deck 202, on auxiliary mounting deck 202, be provided with installing port 2021, sealing ring 201 is arranged in installing port 2021, can more firmly semiconductor refrigerating module 200 be installed fixing by sealing ring 201 and auxiliary mounting deck 202, simultaneously, sealing ring 201 again can be by the peripheral sealing of semiconductor refrigerating module 200, avoids cold to scatter and disappear from the periphery of semiconductor refrigerating module 200.

In actual use, hot-side heat dissipation device 400 can adopt the mode of the direct wind-cooling heat dissipating of prior art fan, preferably, as shown in Fig. 2 and Figure 10, hot-side heat dissipation device 400 in the present embodiment comprises the second heat carrier 41, many second heat pipes 42 and groups of fins 43, described the second heat pipe 42 is connected on described the second heat carrier 41, and described groups of fins 43 is connected on described the second heat pipe 42. concrete, the second heat carrier 41 is attached to the hot junction of semiconductor refrigerating module 200, and groups of fins 43 is attached on shell 101, the heat that the hot junction of semiconductor refrigerating module 200 produces passes to the second heat pipe 42 by the second heat carrier 41, the second heat pipe 42 can transfer heat in groups of fins 43 fast, and groups of fins 43 can be made larger area radiator as required, groups of fins 43 can utilize the heat that self larger area of dissipation transmits the second heat pipe 42 to carry out quick heat radiating, thereby without directly being dispelled the heat in the hot junction of semiconductor refrigeration module 200 by fan. wherein, dispel the heat in order to utilize fully each groups of fins 43, on the second heat carrier 41, be also connected with the 3rd heat pipe 44, described the 3rd heat pipe 44 in arbitrary described hot-side heat dissipation device 400 is also connected with the described groups of fins 43 in hot-side heat dissipation device 400 described in all the other. in actual use, when the heat that produces when 200 work of each semiconductor refrigerating module is identical, each semiconductor refrigerating module 200 is dispelled the heat by groups of fins 43 separately, and in the time that the heat dissipation capacity of some semiconductor refrigerating modules 200 is larger, the second heat carrier 41 that is connected to these semiconductor refrigerating module 200 heats is delivered to heat in the groups of fins 43 of other semiconductor refrigerating module 200 correspondences by the 3rd heat pipe 44, thereby can utilize whole groups of fins 43 to dispel the heat more efficiently, in design process, each the second heat carrier 41 can be undertaken by the 3rd heat pipe 44 and remaining groups of fins 43 thermally coupled, and for the heat-sinking capability of whole groups of fins 43, thereby it is cooling to realize nature. and in order to strengthen the draught capacity of groups of fins 43, groups of fins 43 comprises multi-disc radiating fin 431, on described radiating fin 431, be provided with air vent 432, the multiple described air vent 432 being positioned on same axis forms air channel, groups of fins 43 is except utilizing interval between radiating fin 431 ventilates, also utilize air vent 432 to form air channel and ventilate, thereby can effectively strengthen the draught capacity of groups of fins 43. move under relatively high power and work as each semiconductor refrigerating module 200, in order to meet the requirement of high-power heat-dissipation, fan 45 and groups of fins 43 are arranged side by side and are positioned at a side in air channel, the direction air-out that fan 45 extends towards air channel, the wind that fan 45 blows out enters into air channel to accelerate flowing of air channel apoplexy, and because hot-air flows more upward, in air vent 432, the wind of percolation will make hot-air vortex flow between two radiating fins 431, farthest utilize the area of radiating fin 431 to dispel the heat. as shown in Figure 10-Figure 12, in order to utilize more fully radiating fin 431 to dispel the heat, except being positioned at the radiating fin 431 in outside, all the other radiating fins 431 offer breach 433, be positioned at the locational breach 433 of sustained height and form auxiliary air channel, in groups of fins 43, be also provided with cover body 46, described fan 45 is also positioned at the inner side in auxiliary air channel and is fixed on cover body 46, cover body 46 hides in groups of fins 43, the bottom of cover body 46 forms air inlet, and the upper end of cover body 46 forms air port, fan 45 starts blowing in backward auxiliary air channel, accelerate the Air Flow between radiating fin 431, and hot air rising is exported from air outlet, extraneous cold air is entered between radiating fin 431 from the air inlet of bottom, make cold wind from bottom to up in motion process, through the whole surface of radiating fin 431, to make full use of the heat-sinking capability of radiating fin 431, and also offering ventilating opening 461 for the position of provided with fan 45 on cover body 46, fan 45 is further incorporated into extraneous wind in radiating fin 431 by ventilating opening 461. wherein, the both sides of each the second heat carrier 41 are respectively arranged with groups of fins 43, and fan 45 is simultaneously between two groups of fins 43. and be connected with the second heat carrier 41 for the ease of heat pipe, as shown in figure 13, on the second heat carrier 41, be formed with multiple installing holes 410, described the second heat pipe 42 and described the 3rd heat pipe 44 are inserted in corresponding described installing hole 410, heat pipe is inserted in installing hole 410 can increase the contact area between the second heat carrier 41, improves heat conduction efficiency, and the second heat carrier 41 comprises that two surfaces arrange reeded briquetting 411, two described briquettings 411 are fixed together, two corresponding described grooves form described installing hole 410, adopt two briquettings 411 to form the second heat carrier 41, can be convenient to the assembly and connection between heat pipe and the second heat carrier 41.

Finally it should be noted that: above embodiment only, in order to technical scheme of the present invention to be described, is not intended to limit; Although the present invention is had been described in detail with reference to previous embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned each embodiment is modified, or part technical characterictic is wherein equal to replacement; And these amendments or replacement do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.

Claims (9)

1. the packaging technology of a semiconductor refrigerating equipment, it is characterized in that, described semiconductor refrigerating equipment comprises shell, heat conduction inner bag and semiconductor refrigerating module, described semiconductor refrigerating module comprises semiconductor refrigerating module, cold junction radiator and hot-side heat dissipation device, and described hot-side heat dissipation device is connected to the hot junction of described semiconductor refrigerating module; Described cold junction radiator comprises heat carrier and Duo Gen heat pipe, and described heat pipe is connected on described heat carrier; Described heat carrier is connected to the cold junction of described semiconductor refrigerating module, and described heat pipe bending is extended and is attached on described heat conduction inner bag; The bending place of described heat pipe is provided with keeper, and described keeper is fixed on described heat conduction inner bag; Described heat conduction inner bag is arranged in described shell, between described shell and described heat conduction inner bag, is filled with foaming layer, and described heat pipe and described keeper are embedded in described foaming layer; Packaging technology is: first by described keeper, the kink of described heat pipe is fastened on heat conduction inner bag, then, between described shell and described heat conduction inner bag, filled with foaming material forms foaming layer, again the cold junction of described semiconductor refrigerating module is connected with described heat carrier, finally, hot-side heat dissipation device is connected with the hot junction of described semiconductor refrigerating module, and described hot-side heat dissipation device is fixed on shell.

2. the packaging technology of semiconductor refrigerating equipment according to claim 1, it is characterized in that, described keeper comprises locating piece and joint pin, described locating piece is connected on described joint pin, described joint pin is fixed on described heat conduction inner bag, and described heat pipe is on described joint pin and between described locating piece and described heat conduction inner bag.

3. the packaging technology of semiconductor refrigerating equipment according to claim 2, it is characterized in that, on described heat conduction inner bag, riveted joint has riveting nut, and described joint pin offers through hole, described riveting nut is arranged in described through hole, and screw is inserted in described through hole and is threaded in described riveting nut.

4. the packaging technology of semiconductor refrigerating equipment according to claim 1, is characterized in that, in described heat carrier, is formed with cavity, and described heat pipe sealing is inserted in described heat carrier and with described cavity and is communicated with.

5. the packaging technology of semiconductor refrigerating equipment according to claim 4, it is characterized in that, on described heat carrier, offer multiple jacks, described heat pipe sealing is inserted in described jack, between adjacent two described jacks, be provided with the first through hole, the end that described heat pipe is inserted in described jack offers the second through hole, described the first through hole and described the second through hole formation passage that is interconnected, and described passage is described cavity.

6. the packaging technology of semiconductor refrigerating equipment according to claim 5, is characterized in that, the both ends of described heat pipe are all inserted in corresponding described jack, and described heat pipe down bends extension from its sloped-end.

7. the packaging technology of semiconductor refrigerating equipment according to claim 6, is characterized in that, described cold junction radiator comprises two described heat pipes, offers four described jacks on described heat carrier, and the both ends of described heat pipe are all inserted in corresponding described jack; Wherein a heat pipe bending is distributed in the both sides of described heat conduction inner bag, and described in another, heat pipe is distributed in the back of described heat conduction inner bag.

8. the packaging technology of semiconductor refrigerating equipment according to claim 7, is characterized in that, the both ends of every described heat pipe are downward-sloping bending extension of symmetric mode.

9. the packaging technology of semiconductor refrigerating equipment according to claim 8, it is characterized in that, the pipeline diameter taking millimeter as unit of described heat pipe be configured to be more than or equal to described heat pipe the inclination angle theta with respect to horizontal direction taking degree as unit 1.2-1.3 doubly.