CN105627677B - Refrigeration equipment cabinet and semiconductor refrigerating equipment - Google Patents
Refrigeration equipment cabinet and semiconductor refrigerating equipment Download PDFInfo
- Publication number
- CN105627677B CN105627677B CN201410711517.1A CN201410711517A CN105627677B CN 105627677 B CN105627677 B CN 105627677B CN 201410711517 A CN201410711517 A CN 201410711517A CN 105627677 B CN105627677 B CN 105627677B
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- metal liner
- semiconductor refrigerating
- heat pipe
- metal
- heat
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 87
- 238000005057 refrigeration Methods 0.000 title claims abstract description 36
- 239000002184 metal Substances 0.000 claims abstract description 97
- 238000005452 bending Methods 0.000 claims description 15
- 210000000232 gallbladder Anatomy 0.000 claims description 2
- 239000004744 fabric Substances 0.000 claims 1
- 238000003860 storage Methods 0.000 abstract description 11
- 238000001816 cooling Methods 0.000 description 41
- 230000017525 heat dissipation Effects 0.000 description 13
- 239000003507 refrigerant Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
- 238000007789 sealing Methods 0.000 description 7
- 238000009423 ventilation Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 206010008190 Cerebrovascular accident Diseases 0.000 description 2
- 208000006011 Stroke Diseases 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000003044 adaptive effect Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000010412 perfusion Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
Abstract
The present invention provides a kind of refrigeration equipment cabinet and semiconductor refrigerating equipment.Refrigeration equipment cabinet is provided with thermal insulating connectors including the metal liner that shell and at least two are spaced each other between two neighboring metal liner, two neighboring metal liner is linked together by thermal insulating connectors；Metal liner is located in shell, and insulating layer is provided between metal liner and shell.By using multiple spaced metal liners, independent semiconductor refrigerating module can be arranged in each metal liner to freeze, due to mutually isolated between metal liner, so that different metal liner is formed by storage space and is capable of forming independent warm area range, so as to control the refrigerating capacity of semiconductor refrigerating mould group as needed to realize that multi-temperature zone is freezed, the refrigeration requirement of different articles is met.
Description
Technical field
The present invention relates to refrigerating plant more particularly to a kind of refrigeration equipment cabinets and semiconductor refrigerating equipment.
Background technique
Currently, refrigeration equipment (such as refrigerator, refrigerator, wine cabinet) is common electric appliance, refrigeration equipment in people's daily life
In usually have refrigeration system, refrigeration system is made of compressor, condenser and evaporator under normal circumstances, can be realized lower
The refrigeration of temperature.However, with the development of semiconductor refrigerating technology, the refrigeration equipment that is freezed using semiconductor refrigerating module
It is widely used.Semiconductor refrigerating equipment in the prior art is by the cold end released cold quantity of semiconductor refrigerating module in cabinet
Storage space freeze.In actual use, the cold end of semiconductor refrigerating module is usually connected with heat pipe, passes through heat
Cooling capacity is transmitted in the liner of semiconductor refrigerating equipment by pipe freezes, and liner is generally the plastic liner for being molded and being formed,
Cryogenic temperature in liner is single, can not achieve multi-temperature zone refrigeration, is unable to satisfy the refrigeration requirement of different articles.How one is designed
It is that the present invention to be solved that kind, which can be realized multi-temperature zone refrigeration to meet the semiconductor refrigerating equipment that the refrigeration of different articles requires,
The technical issues of.
Summary of the invention
The technical problems to be solved by the present invention are: a kind of refrigeration equipment cabinet and semiconductor refrigerating equipment are provided, it is real
Existing multi-temperature zone refrigeration is required with the refrigeration for meeting different articles.
Technical solution provided by the invention is that a kind of refrigeration equipment cabinet, including shell and at least two are spaced each other
Metal liner, be provided with thermal insulating connectors between the two neighboring metal liner, the two neighboring metal liner passes through
The thermal insulating connectors link together；The metal liner is located in the shell, the metal liner and the shell it
Between be provided with insulating layer.
The present invention also provides a kind of semiconductor refrigerating equipment, including multiple semiconductor refrigerating modules, the semiconductor refrigeratings
The cold end thermal connection of module has heat pipe, further includes above-mentioned refrigeration equipment cabinet；The institute connected in the semiconductor refrigerating module
Heat pipe is stated to be attached in the refrigeration equipment cabinet in corresponding metal liner
Semiconductor refrigerating equipment provided by the invention can be each by using multiple spaced metal liners
Independent semiconductor refrigerating module is arranged in metal liner to freeze, in the semiconductor refrigerating mould group course of work, semiconductor
Refrigeration module will be to corresponding metal liner released cold quantity, and cooling capacity is directly emitted to its internal storing by metal liner
Space, due to mutually isolated between metal liner so that different metal liner be formed by storage space be capable of forming it is independent
Warm area range is met not so as to control the refrigerating capacity of semiconductor refrigerating mould group as needed to realize that multi-temperature zone is freezed
With the refrigeration requirement of article.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Bright some embodiments for those of ordinary skill in the art without any creative labor, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of semiconductor refrigerating equipment embodiment of the present invention；
Fig. 2 is the explosive view of semiconductor refrigerating equipment embodiment of the present invention；
Fig. 3 is the structural schematic diagram of cabinet in semiconductor refrigerating equipment embodiment of the present invention；
Fig. 4 is the partial sectional view of cabinet in semiconductor refrigerating equipment embodiment of the present invention；
Fig. 5 is the structural schematic diagram of mounting plate in semiconductor refrigerating equipment embodiment of the present invention；
Fig. 6 is the structural schematic diagram of cold end radiator in semiconductor refrigerating equipment embodiment of the present invention；
Fig. 7 is the assembling figure of cold end radiator and metal liner in semiconductor refrigerating equipment embodiment of the present invention；
Fig. 8 is the cross-sectional view of the first heat carrier in semiconductor refrigerating equipment embodiment of the present invention；
Fig. 9 is the assembled relation figure of the first heat carrier and locating piece in semiconductor refrigerating equipment embodiment of the present invention；
Figure 10 is the structural schematic diagram one of hot-side heat dissipation device in semiconductor refrigerating equipment embodiment of the present invention；
Figure 11 is the structural schematic diagram two of hot-side heat dissipation device in semiconductor refrigerating equipment embodiment of the present invention；
Figure 12 is flow principles figure of Figure 11 apoplexy in cooling fin group；
Figure 13 is the structural schematic diagram of the second heat carrier in semiconductor refrigerating equipment embodiment of the present invention.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
Every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
As Figure 1-Figure 2, the present embodiment semiconductor refrigerating equipment, including refrigeration equipment cabinet, wherein refrigeration equipment
Include the metal liner 100 that shell 101 at least two is spaced each other with cabinet, is provided with one in each metal liner 100
Semiconductor refrigerating mould group, the semiconductor refrigerating mould group include that semiconductor refrigerating module 200, cold end radiator 300 and hot end dissipate
Hot device 400, the cold end radiator 300 are connected to the cold end of the semiconductor refrigerating module 200, the hot-side heat dissipation device 400
It is connected to the hot end of the semiconductor refrigerating module 200, the cold end radiator 300 is also connect with the metal liner 100.
Specifically, the present embodiment semiconductor refrigerating equipment includes multiple metal liners 100 and is arranged outside metal liner 100
There is shell 101, insulating layer is provided between shell 101 and metal liner 100, metal liner 100 forms storage space for cold
Hiding or frozen goods.Wherein, each metal liner 100 is corresponding with semiconductor refrigerating mould group, and semiconductor refrigerating mould group will be corresponding
Freeze metal liner 100 in storage space, and in semiconductor refrigerating mould group semiconductor refrigerating module 200 cold end generate it is cold
Amount is transmitted in metal liner 100 by cold end radiator 300, and rapidly cooling capacity will be discharged into it by metal liner 100
Freeze in the storage space of formation, and the heat that the hot end of semiconductor refrigerating module 200 generates passes through hot-side heat dissipation device 400
Heat dissipation.And be arranged since multiple metal liners 100 are spaced, meanwhile, each metal liner 100 is by corresponding semiconductor refrigerating module
200 carry out independent refrigeration, in actual use, can be freezed according to the article stored in different metal liner 100
It is required that it is different, the cooling capacity that corresponding semiconductor refrigerating module 200 discharges adaptive capacity is controlled, realizes multi-temperature zone refrigeration.
Wherein, thermal insulating connectors 102, the two neighboring metal are provided between the two neighboring metal liner 100
Liner 100 is linked together by the thermal insulating connectors 102.Specifically, as shown in Figure 3-Figure 5,102 1 side of thermal insulating connectors
Face, which can play, links together two adjacent metal liners 100, on the other hand can also be subtracted by thermal insulating connectors 102
Heat transfer occurs less or between the two neighboring metal liner 100 of blocking, so that each metal liner 100 is formed by warm area
It is more independent.Thermal insulating connectors 102 can use various ways, such as: the thermal insulating connectors 102 are provided with backwards to arrangement
Slot 1021, the metal liner 100 is inserted in the slot 1021, will be in metal when assembling two metal liners 100
The edge of gallbladder 100 is inserted into slot 1021, realizes that two metal liners 100 link together, and metal liner 100 is inserted in institute
It can be fastened using modes such as gluing, screw fixations after stating in slot 1021, it is preferred that the metal liner 100 is installed on slotting
In slot 1021, specifically, the end that the metal liner 100 is inserted in the slot 1021 is provided with barb structure 1001, it is described
The side wall of slot 1021 is provided with the fixture block 1022 with the barb structure 1001 cooperation, and the barb structure 1001 is stuck in described
On fixture block 1022.In addition, horizontal arrangement can be used between multiple metal liners 100 in the present embodiment, it is preferred that Duo Gesuo
Metal liner 100 is stated from top to bottom to be stacked, and semiconductor refrigerating module 200 is respectively positioned on the metal liner of topmost
On 100.Specifically, semiconductor refrigerating module 200 is uniformly mounted in the metal liner 100 of topmost, and in order to facilitate the installation of
Equal semiconductor refrigerating module 200,100 are provided with mounting plate 103, the semiconductor system in the metal liner of topmost
Cold module 200 is fixed on the mounting plate 103.Mounting plate 103 can be supported using heat-barrier material, to avoid metal liner
100 by occurring heat transmitting between mounting plate 103 and semiconductor refrigerating module 200, and be also provided with and add in mounting plate 103
Strong plate 1031, enhances the structural strength of mounting plate 103 by stiffening plate 1031.Metal liner 100 can be that cross section is U-shaped
Enclosing structure, the metal liner 100 positioned at topmost also have top cover, and the metal liner 100 positioned at topmost is gone back
With bottom plate, to realize that multiple metal liners 100 form the structure of storage spaces perforation, and thermal insulating connectors 102 are reduced or
It blocks and heat transfer occurs between two neighboring metal liner 100, so that forming different warm areas in 100 region of different metal liner.
And in order to avoid draining, drainage hole (not shown) is additionally provided on the bottom plate of the metal liner 100 of bottom.
In actual use, the existing equipment using semiconductor refrigerating generallys use cooling fin and carries out forced convertion,
With by cooling capacity by being dispersed into storage space, and in order to enable the heat of 200 cold end of semiconductor refrigerating module is more effectively right
Storage space freezes, and ensures being evenly distributed for cooling capacity, the cold end heat dissipation as shown in Fig. 6-Fig. 9, in the present embodiment
Device 300 includes the first heat carrier 31 and the first heat pipe of Duo Gen 32, is formed with cavity (not shown), institute in first heat carrier 31
The sealing of the first heat pipe 32 is stated to be inserted in first heat carrier 31 and be connected to the cavity；First heat carrier 31 is attached to institute
The cold end of semiconductor refrigerating module 200 is stated, first heat pipe 32 is attached in the metal liner 100, and the first heat pipe 32 passes through
First heat carrier 31 is realized to be thermally connected with the cold end of semiconductor refrigerating module 200.Specifically, semiconductor refrigerating module 200 is cold
The cooling capacity that end generates passes to the first heat pipe 32 by the first heat carrier 31, and the first heat pipe 32 can quickly disperse cooling capacity
Onto metal liner 100, cooling capacity directly can be discharged into its internal storage space formed and freezed by metal liner 100,
Effectively raise refrigerating efficiency, avoid semiconductor refrigerating module 200 cold end generate cooling capacity using cooling fin carry out it is scattered
It is cold and the low phenomenon of refrigerating efficiency occur.Wherein, multiple jacks 311, first heat pipe 32 are offered on the first heat carrier 31
Sealing is inserted in the jack 311, and the first through hole 312, first heat pipe are provided between the two neighboring jack 311
32 ends being inserted in the jack 311 offer the second through hole (not shown), and first through hole is passed through with described second
Through-hole, which is interconnected, forms channel, and the channel is the cavity.During cold end 300 actual assembled of radiator, the first heat
Pipe 32 is inserted into jack 311, the position of the second through hole in the depth and the first heat pipe 32 by rationally designing jack 311
It sets, so that the first through hole 312 is connected to form channel with the second through hole, alternatively, during actual assembled, the first heat carrier
It is first provided with jack 311 on 31, after the first heat pipe 32 is inserted into jack 311, is opened from the side wall of the first heat carrier 31
Through hole equipped with perforation the first heat carrier 31 and the first heat pipe 32, to form cavity in the first heat carrier 31, then, then will
For in gas-liquid phase transition refrigerant filling in heat pipe to the first heat pipe 32 and cavity, so that the first heat pipe 32 has heat pipe speed heat
Performance.And can quickly enter in the first heat pipe 32 and freeze for the ease of the refrigerant after liquefaction, described first
The lower end of heat carrier 31 offers the jack 311.Wherein, switchable filling is additionally provided on first heat carrier 31
Mouth 313, the filler 313 is connected to the cavity, can be easily perfused and be made into the first heat pipe 32 by filler 313
Cryogen, and in actual use, in order to avoid leading to semiconductor refrigerating module 200 due to being not normally functioning because of failure
The excessive generation bombing of pressure in first heat pipe 32 is additionally provided with safe pressure valve 314, the safety pressure on the first heat carrier 31
Power valve 314 is connected to the cavity, and after the pressure in the first heat pipe 32 is more than setting value, safe pressure valve 314 releases opening
Power is bled off pressure, to ensure using safe.For the refrigerant of perfusion, needing to be perfused refrigerant working medium in the first heat pipe 32 can be ice
Case refrigeration system often uses refrigerant, such as R134a, R600a, CO2, and the selection of specific refrigerant working medium can be according to versatility
It is required that, system pressure requirements, cooling capacity delivery request, working medium physical property, the combined factors such as environmental protection determine.Preferably, in order to reduce
The quantity of one heat pipe 32, meanwhile, meet cold scattering and uniformly require, cold end radiator 300 includes two first heat pipes 32, institute
It states and is opened up on the first heat carrier 31 there are four the jack 311, the both ends of first heat pipe 32 are inserted in corresponding described
In jack 311；Wherein the bending of one first heat pipe 32 is distributed in the both sides of the metal liner 100, another first heat pipe
32 bendings are distributed in the back of the metal liner 100.Specifically, the both ends of the first heat pipe 32 are inserted in jack 311, make
The cold scattering ability that the first heat pipe 32 realizes two heat pipes is obtained, and wherein the bending of one first heat pipe 32 is distributed in metal liner 100
Both sides, another first heat pipe 32 are bent the back for being distributed in metal liner 100, during passing through the first 32 cold scattering of heat pipe,
The first heat pipe 32 for being bent distribution and the contact area of metal liner 100 are bigger, so that metal liner 100 can more
Even acquisition cooling capacity, meanwhile, the both sides and back of metal liner 100 are distributed with the first heat pipe 31 and carry out cold scattering, so that golden
Belong to the cold scattering surface that liner 100 forms encircling type, so that it is guaranteed that internal storage space refrigeration is uniform.And in order to enable the first heat
Pipe 31, which can quickly extend cooling capacity from its end, to be transmitted, and the first heat pipe 32 from its both ends, prolong inclined downward respectively by bending
Stretch, specifically, the refrigerant in the first heat pipe 32 is gasificated into gas being liquefied as liquid after being cooled when heated, pass through by
First heat pipe 32 is extended by the way of bending inclined downward, and during the first 32 cold scattering of heat pipe, liquefied refrigerant
It is thermally conductive that the refrigerant that can be flowed downward, and gasify under the effect of gravity can rise to first along inclined first heat pipe 32
Freezing in the cavity that body 31 is formed, wherein the first heat pipe 32 will form straight pipe and bend loss after bending extends, for
The tilt angle of the straight pipe of first heat pipe 32 are as follows: the pipeline diameter in millimeters of the first heat pipe 32 (is hereinafter referred to as managed
Diameter) it is configured to the 1.2-1.3 of inclination angle theta relative to horizontal direction more than or equal to first heat pipe 32 as unit of spending
Times, in actual production, the straight pipe of each first heat pipe 32 is arranged with the angle tilt for being with respect to the horizontal plane in 10 ° to 70 °
To guarantee that liquid refrigerant flows in it by free gravity, to improve the cold scattering efficiency of the first heat pipe 32.In addition, for list
The first heat pipe of root 32, the both ends of the first heat pipe 32 tilt down bending in symmetric mode and extend.
And during needing semiconductor refrigerating module 200 being installed to metal liner 100, in metal liner 100
Mounting plate 103 is formed with card slot 1032 again, and the first heat carrier 31 is inserted in card slot 1032, and semiconductor refrigerating module 200 and
Heat-conducting silicone grease is set between one heat carrier 31 and is installed on mounting plate 103 by the first heat carrier 31.Preferably, semiconductor system
The periphery of cold module 200 is cased with sealing ring 201, and auxiliary mounting deck 202, auxiliary mounting deck are further fixedly arranged on mounting plate 103
Installing port 2021 is provided on 202, sealing ring 201 is located in installing port 2021, passes through sealing ring 201 and auxiliary mounting deck 202
Stronger semiconductor refrigerating module 200 can be subjected to installation fixation, meanwhile, sealing ring 201 again can be by semiconductor system
The peripheral sealing of cold module 200 avoids cooling capacity from scattering and disappearing from the periphery of semiconductor refrigerating module 200.And in order to the first heat pipe 32
It is positioned, first heat pipe, 32 stress when carrying out foaming processing before to metal liner 100 and shell 101 is avoided to shift, the
The bending place of one heat pipe 32 is provided with locating piece 104, and the locating piece 104 is fixed in the metal liner 100.First heat pipe
32 bending place is positioned by locating piece 104, and locating piece 104 is able to maintain the bending state of the first heat pipe 32, so that
In foaming process and routine use, the bending state of the first heat pipe 32 is remained unchanged, while avoiding the occurrence of the shifting of the first heat pipe 32
Position.Wherein, locating piece 104 includes locating piece 1041 and connecting column 1042, and the locating piece 1041 is connected to the connecting column
On 1042, the connecting column 1042 is fixed in the metal liner 100, and first heat pipe 32 is wound on the connecting column 1042
It goes up and is located between the locating piece 1041 and the metal liner 100, in an assembling process, the first heat pipe 32 is wound on connecting column
1042 bendings, and the bending place of the first heat pipe 32 is clipped between locating piece 1041 and the metal liner 100, for locating piece
Connection between 104 and metal liner 100, riveting has riveting nut 105 in metal liner 100, and the locating piece 104 offers logical
Hole 1043, the riveting nut 105 are located in the through-hole 1043, and screw 106 is inserted in the through-hole 1043 and is threaded in institute
It states in riveting nut 105.
In actual use, the existing equipment using semiconductor refrigerating generallys use fan to semiconductor refrigeration module
200 hot end carries out wind-cooling heat dissipating, need to consume a large amount of electric energy and fan operating noise is more serious always, such as Fig. 2 and figure
Shown in 10, the hot-side heat dissipation device 400 in the present embodiment includes the second heat carrier 41, more second heat pipes 42 and cooling fin group 43,
Second heat pipe 42 is connected on second heat carrier 41, and the cooling fin group 43 is connected on second heat pipe 42.
Specifically, the second heat carrier 41 is attached to the hot end of semiconductor refrigerating module 200, and cooling fin group 43 is attached on shell 101, is partly led
The heat that the hot end of body refrigeration module 200 generates passes to the second heat pipe 42 by the second heat carrier 41, and the second heat pipe 42 can
Quickly transfer heat in cooling fin group 43, and the radiator of larger area can be made in cooling fin group 43 as needed,
Cooling fin group 43 can carry out rapid cooling to the heat that the second heat pipe 42 transmits using itself biggish heat dissipation area, thus nothing
It need to directly be radiated to the hot end of semiconductor refrigeration module 200 by fan.Wherein, in order to adequately utilize each cooling fin
Group 43 radiates, and third heat pipe 44 is also connected on the second heat carrier 41, and described the in any hot-side heat dissipation device 400
Three heat pipes 44 are also connect with the cooling fin group 43 in hot-side heat dissipation device 400 described in remaining.In actual use, when each
When the heat that a work of semiconductor refrigerating module 200 generates is identical, each semiconductor refrigerating module 200 passes through respective cooling fin
Group 43 radiates, and when the heat dissipation capacity of some semiconductor refrigerating module 200 is larger, it is connected to the semiconductor refrigerating module
Second heat carrier 41 of 200 heats transfers heat to that other semiconductor refrigerating modules 200 are corresponding to be dissipated by third heat pipe 44
In backing group 43, so as to more efficiently be radiated using whole cooling fin groups 43；In the design process, each second
Heat carrier 41 can be thermally connected by third heat pipe 44 and remaining cooling fin group 43, for dissipating for whole cooling fin groups 43
Thermal energy power, to realize natural cooling.And in order to enhance the draught capacity of cooling fin group 43, cooling fin group 43 radiates including multi-disc
Fin 431 is provided with ventilation hole 432 on the radiating fin 431, multiple 432 shapes of ventilation hole on same axis
At air duct, cooling fin group 43 also utilizes the formation of ventilation hole 432 other than being aerated using the interval between radiating fin 431
Air duct is aerated, so as to effectively enhance the draught capacity of cooling fin group 43.And work as each semiconductor refrigerating module 200
It is run under relatively high power, in order to meet the requirement of high-power heat-dissipation, fan 45 is arranged side by side and is located at cooling fin group 43
The side in air duct, the direction outlet air that fan 45 extends towards air duct, the wind that fan 45 is blown out enter in air duct to accelerate air duct
The flowing of apoplexy, and since hot-air is gentlier easy to flow upward, the wind to flow in ventilation hole 432 is incited somebody to action so that hot-air is two
Vortex flow between a radiating fin 431 is radiated using the area of radiating fin 431 to the greatest extent.Such as Figure 10-Figure 12
It is shown, in order to more fully be radiated using radiating fin 431, other than being located at the radiating fin 431 in outside, remaining heat dissipation
Fin 431 opens up jagged 433, and the notch 433 on sustained height position forms auxiliary air duct, and radiating fin 431 is vertical
It arranges, cover 46 is additionally provided in cooling fin group 43, and the fan 45 is also located at the inside in auxiliary air duct and is fixed on cover 46
On, cover 46 covers in cooling fin group 43, and the lower end of cover 46 forms air inlet, and the upper end of cover 46 forms outlet air
Mouthful, fan 45 start after to auxiliary air duct in dry, accelerate radiating fin 431 between air flowing, and hot-air rise from
Air outlet output so that extraneous cold air enters between radiating fin 431 from the air inlet of bottom, enable cold wind from
Under in supreme motion process, by the whole surface of radiating fin 431, to make full use of the heat-sinking capability of radiating fin 431；And
Position on cover 46 for installing fan 45 is also provided with ventilation opening 461, fan 45 by ventilation opening 461 by extraneous wind into
One step is introduced into radiating fin 431.Wherein, the two sides of each second heat carrier 41 are respectively arranged with cooling fin group 43, and
Fan 45 is located between two cooling fin groups 43 simultaneously.And connect for the ease of heat pipe with the second heat carrier 41, as shown in figure 13,
Multiple mounting holes 410 are formed on second heat carrier 41, second heat pipe 42 and the third heat pipe 44 are inserted in corresponding institute
It states in mounting hole 410, heat pipe is inserted in the contact area being capable of increasing between the second heat carrier 41 in mounting hole 410, improves heat
Conduction efficiency；And the second heat carrier 41 includes that reeded briquetting 411 is arranged in two surfaces, two briquettings 411 are fixed to be connected
It being connected together, corresponding two grooves form the mounting hole 410, the second heat carrier 41 is formed using two briquettings 411,
It can be convenient for the assembly and connection between heat pipe and the second heat carrier 41.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
Present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: it still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features；
And these are modified or replaceed, technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution spirit and
Range.
Claims (7)
1. a kind of semiconductor refrigerating equipment, including multiple semiconductor refrigerating modules and refrigeration equipment cabinet, the semiconductor system
Cold module cold end thermal connection have heat pipe, which is characterized in that the refrigeration equipment cabinet include shell and at least two each other
The metal liner at interval is provided with thermal insulating connectors, the two neighboring metal liner between the two neighboring metal liner
It is linked together by the thermal insulating connectors；The metal liner is located in the shell, the metal liner and described outer
Insulating layer is provided between shell, the side and back of the metal liner are respectively arranged with heat pipe locating piece, the heat pipe positioning
Part includes locating piece and connecting column, and the locating piece is connected on the connecting column, and the connecting column is fixed in the metal
On gallbladder, the heat pipe connected in the semiconductor refrigerating module is attached to corresponding metal liner in the refrigeration equipment cabinet
On；The heat pipe is wound on the connecting column bending, and the bending place of the heat pipe is clipped between locating piece and the metal liner.
2. semiconductor refrigerating equipment according to claim 1, which is characterized in that the thermal insulating connectors are provided with backwards to cloth
The slot set, the metal liner are inserted in the slot.
3. semiconductor refrigerating equipment according to claim 2, which is characterized in that the metal liner is inserted in the slot
End is provided with barb structure, and the side wall of the slot is provided with the fixture block with barb structure cooperation, the barb structure
It is stuck on the fixture block.
4. semiconductor refrigerating equipment according to claim 1, which is characterized in that multiple metal liners from top to bottom heap
Laying up is set.
5. semiconductor refrigerating equipment according to claim 4, which is characterized in that the metal liner is that cross section is U-shaped
Enclosing structure, the metal liner positioned at topmost also has top cover, and the metal liner positioned at topmost also has
Bottom plate.
6. semiconductor refrigerating equipment according to claim 5, which is characterized in that the bottom plate is concave surface, on the bottom plate
It is additionally provided with drainage hole；Mounting plate is provided in the metal liner of topmost.
7. semiconductor refrigerating equipment according to claim 1, which is characterized in that riveting has riveting spiral shell in the metal liner
Mother, the connecting column offer through-hole, and the riveting nut is located in the through-hole, and screw is inserted in the through-hole and is threaded in
In the riveting nut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410711517.1A CN105627677B (en) | 2014-12-01 | 2014-12-01 | Refrigeration equipment cabinet and semiconductor refrigerating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410711517.1A CN105627677B (en) | 2014-12-01 | 2014-12-01 | Refrigeration equipment cabinet and semiconductor refrigerating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105627677A CN105627677A (en) | 2016-06-01 |
| CN105627677B true CN105627677B (en) | 2019-03-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410711517.1A Active CN105627677B (en) | 2014-12-01 | 2014-12-01 | Refrigeration equipment cabinet and semiconductor refrigerating equipment |
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| CN (1) | CN105627677B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107014143B (en) * | 2017-04-25 | 2020-04-24 | 合肥华凌股份有限公司 | Refrigerator with a door |
| CN108800711B (en) * | 2017-04-28 | 2020-12-15 | 青岛海尔智能技术研发有限公司 | Double-temperature-zone solid-state refrigeration equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02238282A (en) * | 1989-03-10 | 1990-09-20 | Hitachi Ltd | Refrigerator box |
| CN2257000Y (en) * | 1996-05-28 | 1997-06-25 | 潘明海 | Electronic cold / heat mini-refrigerator |
| CN100507334C (en) * | 2007-10-26 | 2009-07-01 | 重庆长安汽车股份有限公司 | Perkins joint for mounting pipeline |
| CN201892363U (en) * | 2010-11-03 | 2011-07-06 | 无锡松下冷机有限公司 | Refrigerator |
| US20130291555A1 (en) * | 2012-05-07 | 2013-11-07 | Phononic Devices, Inc. | Thermoelectric refrigeration system control scheme for high efficiency performance |
| CN204373306U (en) * | 2014-12-01 | 2015-06-03 | 青岛海尔特种电冰柜有限公司 | Refrigeration plant casing and semiconductor refrigerating equipment |
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