CN105716454B - The assemble method of heat pipe heat radiation type heat-exchange device - Google Patents
The assemble method of heat pipe heat radiation type heat-exchange device Download PDFInfo
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- CN105716454B CN105716454B CN201410711477.0A CN201410711477A CN105716454B CN 105716454 B CN105716454 B CN 105716454B CN 201410711477 A CN201410711477 A CN 201410711477A CN 105716454 B CN105716454 B CN 105716454B
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Abstract
The present invention provides a kind of assemble method of heat pipe heat radiation type heat-exchange device, heat-exchange device includes heat carrier and Duo Gen heat pipe, multiple jacks are offered on heat carrier, heat pipe sealing is inserted in jack, the first through hole is provided between two neighboring jack, heat pipe is inserted in the end in jack and offers the second through hole, and the first through hole and the second through hole, which are interconnected, forms channel, the Single port in channel is provided with filler, and another port is provided with safe pressure valve；Assemble method are as follows: the end of heat pipe is inserted into jack, and the first through hole is made to be connected to form channel with the second through hole, then by heat pipe sealing welding in jack, finally, filler and safe pressure valve are connected on the port in channel.When heat pipe hypertonia, safe pressure valve automatically opens pressure release, improves security performance.More heat pipes, which are uniformly connected to heat carrier, can effectively simplify the cold end assembling steps of heat-exchange device Yu semiconductor refrigerating module, reduce assembling cost.
Description
Technical field
The present invention relates to refrigerating plant more particularly to a kind of assemble methods of heat pipe heat radiation type heat-exchange device.
Background technique
Currently, refrigeration equipment (such as refrigerator, refrigerator, wine cabinet) is common electric appliance, refrigeration equipment in people's daily life
In usually have refrigeration system, refrigeration system is made of compressor, condenser and evaporator under normal circumstances, can be realized lower
The refrigeration of temperature.However, with the development of semiconductor refrigerating technology, the refrigeration equipment to be freezed using semiconductor chilling plate also by
It is widely used.Semiconductor refrigerating equipment in the prior art connects heat pipe by the cold end of semiconductor refrigerating module, to pass through heat
Pipe released cold quantity freezes to the intracorporal storage space of case.But in actual use, more heat pipes are generally connected to
It is placed directly against the cold end of semiconductor refrigerating module together, when semiconductor refrigerating module breaks down, is easy to cause in heat pipe
Pressure rises, and the phenomenon that heat pipe is burst occurs, causes the safety of semiconductor refrigerating equipment in the prior art lower.
Summary of the invention
The technical problems to be solved by the present invention are: a kind of assemble method of heat pipe heat radiation type heat-exchange device is provided, it is real
Now improve the safety of semiconductor refrigerating equipment.
Technical solution provided by the invention is a kind of assemble method of heat pipe heat radiation type heat-exchange device, the heat exchange
Device includes heat carrier and Duo Gen heat pipe, and multiple jacks are offered on the heat carrier, and the heat pipe sealing is inserted in the jack
In, the first through hole is provided between the two neighboring jack, the end that the heat pipe is inserted in the jack offers
Two through holes, first through hole and second through hole, which are interconnected, forms channel, the Single port setting in the channel
There is filler, another port is provided with safe pressure valve；Assemble method are as follows: the end of the heat pipe is inserted into the jack
In, and first through hole is made to be connected to form the channel with second through hole, then by the heat pipe sealing welding
It connects in the jack, finally, the filler and the safe pressure valve are connected on the port in the channel.
The present invention also provides a kind of assemble method of heat pipe heat radiation type heat-exchange device, the heat-exchange device includes thermally conductive
Body and Duo Gen heat pipe offer multiple jacks on the heat carrier, and the heat pipe sealing is inserted in the jack, two neighboring institute
It states and is provided with the first through hole between jack, the end that the heat pipe is inserted in the jack offers the second through hole, described
First through hole and second through hole, which are interconnected, forms channel；Assemble method are as follows: be inserted into the end of the heat pipe
In the jack, the heat pipe sealing welding is then offered into perforation in the jack from the side wall of the heat carrier
The through-hole of the heat carrier and the heat pipe, to form first through hole and the shape on the heat pipe on the heat carrier
At second through hole, finally, the filler and the safe pressure valve are connected on the port in the channel.
The assemble method of heat pipe heat radiation type heat-exchange device provided by the invention, made of being formed by using the above method
Heat-exchange device, the cold end cooling capacity of semiconductor refrigerating module can be passed to heat pipe by heat carrier, and heat pipe is due in heat carrier
Channel connection, the pressure in heat carrier channel is identical as the pressure in heat pipe, when heat pipe hypertonia, is connected to heat carrier
On safe pressure valve automatically open pressure release, and avoid heat pipe bombing, improve security performance.Meanwhile more heat pipes uniformly connect
It connects in heat carrier, is connect by heat carrier with the cold end of semiconductor refrigerating module, can effectively simplify heat-exchange device and partly lead
The cold end assembling steps of body refrigeration module reduce assembling cost.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Bright some embodiments for those of ordinary skill in the art without any creative labor, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of semiconductor refrigerating equipment of the present invention；
Fig. 2 is the explosive view of semiconductor refrigerating equipment of the present invention；
Fig. 3 is the structural schematic diagram of cabinet in semiconductor refrigerating equipment of the present invention；
Fig. 4 is the partial sectional view of cabinet in semiconductor refrigerating equipment of the present invention；
Fig. 5 is the structural schematic diagram of mounting plate in semiconductor refrigerating equipment of the present invention；
Fig. 6 is the structural schematic diagram of heat-exchange device in semiconductor refrigerating equipment of the present invention；
Fig. 7 is the assembling figure of heat-exchange device and thermally conductive liner in semiconductor refrigerating equipment of the present invention；
Fig. 8 is the cross-sectional view of the first heat carrier in semiconductor refrigerating equipment of the present invention；
Fig. 9 is the assembled relation figure of the first heat carrier and locating piece in semiconductor refrigerating equipment of the present invention；
Figure 10 is the structural schematic diagram one of hot-side heat dissipation device in semiconductor refrigerating equipment of the present invention；
Figure 11 is the structural schematic diagram two of hot-side heat dissipation device in semiconductor refrigerating equipment of the present invention；
Figure 12 is flow principles figure of Figure 11 apoplexy in cooling fin group；
Figure 13 is the structural schematic diagram of the second heat carrier in semiconductor refrigerating equipment of the present invention.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
Every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
As Figure 1-Figure 2, heat exchange made of the assemble method composition of the present embodiment heat pipe heat radiation type heat-exchange device
Device 300 can be used in semiconductor refrigerating equipment, and the semiconductor refrigerating equipment includes thermally conductive liner 100 and semiconductor refrigerating
Mould group, the semiconductor refrigerating mould group include semiconductor refrigerating module 200, heat-exchange device 300 and hot-side heat dissipation device 400, institute
The cold end that heat-exchange device 300 is connected to the semiconductor refrigerating module 200 is stated, the hot-side heat dissipation device 400 is connected to described
The hot end of semiconductor refrigerating module 200, the heat-exchange device 300 are also connect with the liner 100, wherein such as Fig. 6-Fig. 9 institute
Show, the heat-exchange device 300 in the present embodiment includes the first heat carrier 31 and the first heat pipe of Duo Gen 32, the first heat carrier 31
On offer multiple jacks 311, the sealing of the first heat pipe 32 is inserted in the jack 311, the two neighboring jack 311 it
Between be provided with the first through hole 312, the end that first heat pipe 32 is inserted in the jack 311 offers the second through hole
(not shown), first through hole and second through hole are interconnected and form channel, channel and first heat pipe 32
In be provided with the refrigerant that gas-liquid two-phase coexists, the one end in channel is connected with switchable filler 313, and the other end is connected with peace
Total pressure valve 314；First heat carrier 31 is attached to the cold end of the semiconductor refrigerating module 200, and first heat pipe 32 pastes
On the liner 100, the first heat pipe 32 is realized by the first heat carrier 31 to be connected with the cold end heat of semiconductor refrigerating module 200
It connects.
During 300 actual assembled of heat-exchange device, the first heat pipe 32 is inserted into jack 311, passes through rational design
The position of second through hole in the depth of jack 311 and the first heat pipe 32, so that the first through hole 312 and the second through hole connect
It is logical to form channel, then by 32 sealing welding of the first heat pipe in the jack 311, finally, by 313 He of filler
The safe pressure valve 314 is connected on the port in the channel.Alternatively, during actual assembled, on the first heat carrier 31
It is first provided with jack 311, after the first heat pipe 32 is inserted into jack 311, is offered from the side wall of the first heat carrier 31
The through-hole of the first heat carrier 31 and the first heat pipe 32 is penetrated through, to form channel in the first heat carrier 31, finally, by the filling
Mouth 313 and the safe pressure valve 314 are connected on the port in the channel.
And can quickly enter in the first heat pipe 32 and freeze for the ease of the refrigerant after liquefaction, described first
The lower end of heat carrier 31 offers the jack 311.For the refrigerant of perfusion, in the first heat pipe 32 need that refrigerant is perfused
Working medium can often use refrigerant, such as R134a, R600a, CO2, the selection of specific refrigerant working medium for refrigerator refrigeration system
It can be determined according to combined factors such as versatility requirement, system pressure requirements, cooling capacity delivery request, working medium physical property, environmental protection.It is preferred that
, in order to reduce the quantity of the first heat pipe 32, meanwhile, meet cold scattering and uniformly require, heat-exchange device 300 includes described in two
First heat pipe 32 opens up on first heat carrier 31 there are four the jack 311, and the both ends of first heat pipe 32 are inserted
In the corresponding jack 311；Wherein the bending of one first heat pipe 32 is distributed in the both sides of the thermally conductive liner 100, another
First heat pipe 32 is bent the back for being distributed in the thermally conductive liner 100.Specifically, the both ends of the first heat pipe 32 are inserted in
In jack 311, so that the first heat pipe 32 realizes the cold scattering ability of two heat pipes, and wherein the bending of one first heat pipe 32 is distributed in and leads
The both sides of hot liner 100, another first heat pipe 32 are bent the back for being distributed in thermally conductive liner 100, are passing through the first heat pipe 32
During cold scattering, the contact area for being bent the first heat pipe 32 and thermally conductive liner 100 of distribution is bigger, so that thermally conductive liner
100 can be more uniform acquisition cooling capacity, meanwhile, the both sides and back of thermally conductive liner 100 be distributed with the first heat pipe 31 into
Row cold scattering, so that thermally conductive liner 100 forms the cold scattering surface of encircling type, so that it is guaranteed that internal storage space refrigeration is uniform.And
It is transmitted in order to enable the first heat pipe 31 can quickly extend cooling capacity from its end, the first heat pipe 32 inclines respectively from its both ends
Extension is bent obliquely, specifically, the refrigerant in the first heat pipe 32 is being liquefied as liquid and gasification when heated after being cooled
At gas, extended by way of using the first heat pipe 32 and bending inclined downward, and during the first 32 cold scattering of heat pipe,
Liquefied refrigerant can flow downward under the effect of gravity, and the refrigerant to gasify can be along on inclined first heat pipe 32
It is raised in the cavity of the first heat carrier 31 formation and freezes, wherein the first heat pipe 32 will form straight pipe after bending extends
And bend loss, for the tilt angle of the straight pipe of the first heat pipe 32 are as follows: the pipeline in millimeters of the first heat pipe 32 is straight
What diameter (hereinafter referred to as caliber) was configured to more than or equal to first heat pipe 32 as unit of spending relative to horizontal direction inclines
1.2-1.3 times of angle θ, in actual production, the straight pipe of each first heat pipe 32 is to be with respect to the horizontal plane in 10 ° to 70 °
Angle tilt setting is to guarantee that liquid refrigerant flows in it by free gravity, to improve the cold scattering effect of the first heat pipe 32
Rate.In addition, the both ends of first heat pipe 32 tilt down bending in symmetric mode and extend for single first heat pipe 32.
Wherein, the present embodiment semiconductor refrigerating equipment may include multiple thermally conductive liners 100, and each thermally conductive liner 100 is right
There should be a semiconductor refrigerating mould group, semiconductor refrigerating mould group is by the storage space in the corresponding thermally conductive liner 100 of refrigeration, and semiconductor
The cooling capacity that the cold end of semiconductor refrigerating module 200 generates in refrigeration module is transmitted to thermally conductive liner 100 by heat-exchange device 300
On, rapidly cooling capacity will be discharged into the storage space formed in it by thermally conductive liner 100 and freezed, and semiconductor refrigerating
The heat that the hot end of module 200 generates is radiated by hot-side heat dissipation device 400.And due to the multiple thermally conductive interval of liner 100 settings, together
When, each thermally conductive liner 100 carries out independent refrigeration by corresponding semiconductor refrigerating module 200, in actual use, can
Difference is required according to the article refrigeration stored in different thermally conductive liners 100, corresponding semiconductor refrigerating module 200 is controlled and discharges
The cooling capacity of adaptive capacity realizes multi-temperature zone refrigeration.
In addition, thermal insulating connectors 102 are provided between the two neighboring thermally conductive liner 100, it is two neighboring described thermally conductive
Liner 100 is linked together by the thermal insulating connectors 102.Specifically, as shown in Figure 3-Figure 5,102 1 side of thermal insulating connectors
Face, which can play, links together two adjacent thermally conductive liners 100, on the other hand can also be subtracted by thermal insulating connectors 102
Heat transfer occurs less or between the two neighboring thermally conductive liner 100 of blocking, so that each thermally conductive liner 100 is formed by warm area
It is more independent.Thermal insulating connectors 102 can use various ways, such as: the thermal insulating connectors 102 are provided with backwards to arrangement
Slot 1021, the thermally conductive liner 100 is inserted in the slot 1021, when assembling two thermally conductive liners 100, will it is thermally conductive in
The edge of gallbladder 100 is inserted into slot 1021, realizes that two thermally conductive liners 100 link together, and thermally conductive liner 100 is inserted in institute
It can be fastened using modes such as gluing, screw fixations after stating in slot 1021, it is preferred that the thermally conductive liner 100 is installed on slotting
In slot 1021, specifically, the end that the thermally conductive liner 100 is inserted in the slot 1021 is provided with barb structure 1001, it is described
The side wall of slot 1021 is provided with the fixture block 1022 with the barb structure 1001 cooperation, and the barb structure 1001 is stuck in described
On fixture block 1022.In addition, horizontal arrangement can be used between multiple thermally conductive liners 100 in the present embodiment, it is preferred that Duo Gesuo
Thermally conductive liner 100 is stated from top to bottom to be stacked, and semiconductor refrigerating module 200 is respectively positioned on the thermally conductive liner of topmost
On 100.Specifically, semiconductor refrigerating module 200 is uniformly mounted on the thermally conductive liner 100 of topmost, and in order to facilitate the installation of
Equal semiconductor refrigerating module 200,100 are provided with mounting plate 103, the semiconductor system on the thermally conductive liner of topmost
Cold module 200 is fixed on the mounting plate 103.Mounting plate 103 can be supported using heat-barrier material, to avoid thermally conductive liner
100 by occurring heat transmitting between mounting plate 103 and semiconductor refrigerating module 200, and be also provided with and add in mounting plate 103
Strong plate 1031, enhances the structural strength of mounting plate 103 by stiffening plate 1031.
And during needing semiconductor refrigerating module 200 being installed to thermally conductive liner 100, on thermally conductive liner 100
Mounting plate 103 is formed with card slot 1032 again, and the first heat carrier 31 is inserted in slot 1032, and semiconductor refrigerating module 200 and
Heat-conducting silicone grease is set between one heat carrier 31 and is installed on mounting plate 103 by the first heat carrier 31.Preferably, semiconductor system
The periphery of cold module 200 is cased with sealing ring 201, and auxiliary mounting deck 202, auxiliary mounting deck are further fixedly arranged on mounting plate 103
Installing port 2021 is provided on 202, sealing ring 201 is located in installing port 2021, passes through sealing ring 201 and auxiliary mounting deck 202
Stronger semiconductor refrigerating module 200 can be subjected to installation fixation, meanwhile, sealing ring 201 again can be by semiconductor system
The peripheral sealing of cold module 200 avoids cooling capacity from scattering and disappearing from the periphery of semiconductor refrigerating module 200.And in order to the first heat pipe 32
It is positioned, first heat pipe, 32 stress when carrying out foaming processing before to thermally conductive liner 100 and shell 101 is avoided to shift, the
The bending place of one heat pipe 32 is provided with locating piece 104, and the locating piece 104 is fixed on the thermally conductive liner 100.First heat pipe
32 bending place is positioned by locating piece 104, and locating piece 104 is able to maintain the bending state of the first heat pipe 32, so that
In foaming process and routine use, the bending state of the first heat pipe 32 is remained unchanged, while avoiding the occurrence of the shifting of the first heat pipe 32
Position.Wherein, locating piece 104 includes locating piece 1041 and connecting column 1042, and the locating piece 1041 is connected to the connecting column
On 1042, the connecting column 1042 is fixed on the thermally conductive liner 100, and first heat pipe 32 is wound on the connecting column 1042
It goes up and is located between the locating piece 1041 and the thermally conductive liner 100, in an assembling process, the first heat pipe 32 is wound on connecting column
1042 bendings, and the bending place of the first heat pipe 32 is clipped between locating piece 1041 and the thermally conductive liner 100, for locating piece
Connection between 104 and thermally conductive liner 100, riveting has riveting nut 105 on thermally conductive liner 100, and the locating piece 104 offers logical
Hole 1043, the riveting nut 105 are located in the through-hole 1043, and screw 106 is inserted in the through-hole 1043 and is threaded in institute
It states in riveting nut 105.
In actual use, hot-side heat dissipation device 400 can be using the side of the direct wind-cooling heat dissipating of fan in the prior art
Formula, it is preferred that as shown in figs. 2 and 10, the hot-side heat dissipation device 400 in the present embodiment includes the second heat carrier 41, more second
Heat pipe 42 and cooling fin group 43, second heat pipe 42 are connected on second heat carrier 41, and the cooling fin group 43 connects
On second heat pipe 42.Specifically, the second heat carrier 41 is attached to the hot end of semiconductor refrigerating module 200, and cooling fin group
43 are attached on shell 101, and the heat that the hot end of semiconductor refrigerating module 200 generates passes to the second heat by the second heat carrier 41
Pipe 42, the second heat pipe 42 can quickly transfer heat in cooling fin group 43, and cooling fin group 43 can be made as needed
At the radiator of larger area, heat that cooling fin group 43 can transmit the second heat pipe 42 using itself biggish heat dissipation area
Rapid cooling is carried out, without directly radiating to the hot end of semiconductor refrigeration module 200 by fan.Wherein, in order to
It is adequately radiated using each cooling fin group 43, third heat pipe 44, any heat is also connected on the second heat carrier 41
The third heat pipe 44 in the radiator 400 of end is also connect with the cooling fin group 43 in hot-side heat dissipation device 400 described in remaining.
In actual use, when the heat that the work of each semiconductor refrigerating module 200 generates is identical, each semiconductor refrigerating mould
Block 200 is radiated by respective cooling fin group 43, and when the heat dissipation capacity of some semiconductor refrigerating module 200 is larger,
The second heat carrier 41 for being connected to 200 heat of semiconductor refrigerating module transfers heat to other by third heat pipe 44 and partly leads
In the corresponding cooling fin group 43 of body refrigeration module 200, so as to more efficiently be radiated using whole cooling fin groups 43；
In the design process, each second heat carrier 41 can be thermally connected by third heat pipe 44 and remaining cooling fin group 43,
For the heat-sinking capability of whole cooling fin groups 43, to realize natural cooling.And in order to enhance the draught capacity of cooling fin group 43,
Cooling fin group 43 includes multi-disc radiating fin 431, is provided with ventilation hole 432 on the radiating fin 431, is located on same axis
Multiple ventilation holes 432 form air ducts, cooling fin group 43 using the interval between radiating fin 431 in addition to being aerated
Outside, it also forms air duct using ventilation hole 432 to be aerated, so as to effectively enhance the draught capacity of cooling fin group 43.And
It runs when each semiconductor refrigerating module 200 is under relatively high power, in order to meet the requirement of high-power heat-dissipation, fan 45 and dissipates
Backing group 43 is arranged side by side and is located at the side in air duct, the direction outlet air that fan 45 extends towards air duct, the wind that fan 45 is blown out
It enters in air duct and accelerates the flowing of air duct apoplexy, and since hot-air is gentlier easy to flow upward, it is worn in ventilation hole 432
The wind of stream will be so that hot-air vortex flow between two radiating fins 431, utilizes the face of radiating fin 431 to the greatest extent
Product radiates.As shown in Figure 10-Figure 12, in order to more fully be radiated using radiating fin 431, in addition to being located at outside
Outside radiating fin 431, remaining radiating fin 431 opens up jagged 433, and the notch 433 on sustained height position forms auxiliary
Air duct is helped, cover 46 is additionally provided in cooling fin group 43, the fan 45 is also located at the inside in auxiliary air duct and is fixed on cover
On 46, cover 46 is covered in cooling fin group 43, and the lower end of cover 46 forms air inlet, and the upper end of cover 46 is formed out
Air port, fan 45 are dried after starting into auxiliary air duct, and the air flowing between radiating fin 431 is accelerated, and hot-air rises
It is exported from air outlet, so that extraneous cold air enters between radiating fin 431 from the air inlet of bottom, enables cold wind
From bottom to up in motion process, by the whole surface of radiating fin 431, to make full use of the heat-sinking capability of radiating fin 431；
And it is also provided with ventilation opening 461 for installing the position of fan 45 on cover 46, fan 45 passes through ventilation opening 461 for extraneous wind
Further it is introduced into radiating fin 431.Wherein, the two sides of each second heat carrier 41 are respectively arranged with cooling fin group 43,
And fan 45 is located between two cooling fin groups 43 simultaneously.And connect for the ease of heat pipe with the second heat carrier 41, such as Figure 13 institute
Show, multiple mounting holes 410 are formed on the second heat carrier 41, and second heat pipe 42 and the third heat pipe 44 are inserted in corresponding
In the mounting hole 410, heat pipe is inserted in the contact area being capable of increasing between the second heat carrier 41 in mounting hole 410, improves
Heat conduction efficiency；And the second heat carrier 41 includes that reeded briquetting 411 is arranged in two surfaces, two briquettings 411 are fixed
It links together, corresponding two grooves form the mounting hole 410, form the second heat carrier using two briquettings 411
41, it can be convenient for the assembly and connection between heat pipe and the second heat carrier 41.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
Present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: it still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features；
And these are modified or replaceed, technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution spirit and
Range.
Claims (5)
1. a kind of assemble method of heat pipe heat radiation type heat-exchange device, which is characterized in that the heat-exchange device includes heat carrier
With more heat pipes, multiple jacks are offered on the heat carrier, the heat pipe sealing is inserted in the jack, two neighboring described
It is provided with the first through hole between jack, the end that the heat pipe is inserted in the jack offers the second through hole, and described
One through hole and second through hole, which are interconnected, forms channel, and the Single port in the channel is provided with filler, the other end
Mouth is provided with safe pressure valve, and the both ends of the heat pipe are inserted in the corresponding jack, and the heat pipe inclines from its end
Extension is bent obliquely, during the heat pipe cold scattering, liquefied refrigerant flows downward under the effect of gravity, and gasify
Refrigerant, which can be risen to along the inclined heat pipe in the cavity that the heat carrier is formed, to freeze；Assemble method are as follows:
The end of the heat pipe is inserted into the jack, and first through hole is made to be connected to be formed with second through hole
The channel, then by the heat pipe sealing welding in the jack, finally, by the filler and the safe pressure valve
It is connected on the port in the channel.
2. a kind of assemble method of heat pipe heat radiation type heat-exchange device, which is characterized in that the heat-exchange device includes heat carrier
With more heat pipes, multiple jacks are offered on the heat carrier, the heat pipe sealing is inserted in the jack, two neighboring described
It is provided with the first through hole between jack, the end that the heat pipe is inserted in the jack offers the second through hole, and described
One through hole and second through hole, which are interconnected, forms channel, and the Single port in the channel is provided with filler, the other end
Mouth is provided with safe pressure valve, and the both ends of the heat pipe are inserted in the corresponding jack, and the heat pipe inclines from its end
Extension is bent obliquely, during the heat pipe cold scattering, liquefied refrigerant flows downward under the effect of gravity, and gasify
Refrigerant, which can be risen to along the inclined heat pipe in the cavity that the heat carrier is formed, to freeze；Assemble method are as follows:
The end of the heat pipe is inserted into the jack, then leads the heat pipe sealing welding from described in the jack
The through-hole for penetrating through the heat carrier and the heat pipe is offered on the side wall of hot body, to form described first on the heat carrier
Through hole simultaneously forms second through hole on the heat pipe, finally, the filler is connected with the safe pressure valve
On the port in the channel.
3. the assemble method of heat pipe heat radiation type heat-exchange device according to claim 1 or 2, which is characterized in that the heat
The both ends of pipe tilt down bending in symmetric mode and extend.
4. the assemble method of heat pipe heat radiation type heat-exchange device according to claim 1 or 2, which is characterized in that the heat
The pipeline diameter in millimeters of pipe is configured to relative to horizontal direction as unit of spending equal to the heat pipe
1.2-1.3 times of inclination angle theta.
5. the assemble method of heat pipe heat radiation type heat-exchange device according to claim 1 or 2, which is characterized in that described to lead
The lower end of hot body offers the jack.
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