CN101852564A - Cooling device - Google Patents

Cooling device Download PDF

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Publication number
CN101852564A
CN101852564A CN200910301218A CN200910301218A CN101852564A CN 101852564 A CN101852564 A CN 101852564A CN 200910301218 A CN200910301218 A CN 200910301218A CN 200910301218 A CN200910301218 A CN 200910301218A CN 101852564 A CN101852564 A CN 101852564A
Authority
CN
China
Prior art keywords
heat
plate shaped
heat transfer
heat pipe
radiating fin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200910301218A
Other languages
Chinese (zh)
Inventor
刘鹏
周世文
陈俊吉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
Original Assignee
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hong Jun Precision Industry Co ltd, Fuzhun Precision Industry Shenzhen Co Ltd filed Critical Hong Jun Precision Industry Co ltd
Priority to CN200910301218A priority Critical patent/CN101852564A/en
Priority to US12/504,683 priority patent/US20100243207A1/en
Publication of CN101852564A publication Critical patent/CN101852564A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to a cooling device. The cooling device comprises a plate type heat pipe, a plurality of cooling fins and a plurality of heat transfer columns, wherein the plate type heat pipe is used to contact with a heat source, a hollow sealed cavity is formed in the plate type heat pipe, working medium is filled in the hollow sealed cavity, one end of each heat transfer column is fixed on the plate type heat pipe, and the other end of the heat transfer column penetrates the cooling fins.

Description

Heat abstractor
Technical field
The present invention relates to a kind of heat abstractor, particularly a kind of heat abstractor that is applicable to electronic element radiating.
Background technology
Along with developing rapidly of information industry, heat-generating electronic elements such as central processing unit are pursued high-speedization, the heat dissipation problem that multifunction and miniaturization are derived is more and more serious, therefore, heat must be distributed timely and effectively, otherwise can greatly influence the service behaviour of electronic component, also can reduce the service life of electronic component simultaneously, therefore must dispel the heat electronic component.
Present heat abstractor adopts metal heat absorption base plate to cooperate the combination of round heat pipe and radiating fin mostly, and wherein, the two ends of heat pipe link to each other with radiating fin with this heat absorption base plate respectively, thereby the heat that the base plate that will absorb heat absorbs conducts on the radiating fin.Yet, because the cost of heat pipe is higher, for controlling cost, the negligible amounts of the general heat pipe that adopts of heat abstractor, thus the contact area between heat pipe and radiating fin is also few, has limited heat transfer rate, simultaneously, higher temperature distributing disproportionation greatly reduces the utilization rate of radiating fin and lower away from the regional temperature of heat pipe near the regional temperature of heat pipe on the radiating fin, thereby has limited the heat dispersion of heat abstractor.
Summary of the invention
In view of this, thus be necessary to provide a kind of utilization rate that improves radiating fin to improve the heat abstractor of heat dispersion.
A kind of heat abstractor, comprise a plate shaped heat pipe, some radiating fins and some heat transfer poles, this plate shaped heat pipe is used for contacting with thermal source, form a hollow airtight chamber in the described plate shaped heat pipe and accommodate working media, one end of described heat transfer pole is fixed on the described plate shaped heat pipe, and the other end of described heat transfer pole is located on the described radiating fin.
In the above-mentioned heat abstractor, this plate shaped heat pipe can promptly absorb the heat of thermal source and heat is conducted to heat transfer pole, because the quantity of heat transfer pole is many, has increased the contact area of heat transfer pole and plate shaped heat pipe and radiating fin, has improved heat transfer efficiency greatly.Simultaneously, heat can pass to radiating fin in the mode of even diffusion by numerous heat transfer poles, make each radiating fin each several part thermally equivalent, eliminated the phenomenon of the temperature distributing disproportionation on the radiating fin in the traditional heat-dissipating device, improve the utilization rate of radiating fin greatly, promoted the radiating efficiency of heat abstractor.
Description of drawings
Fig. 1 is the three-dimensional combination figure of heat abstractor preferred embodiment of the present invention.
Fig. 2 is the three-dimensional exploded view of Fig. 1.
Fig. 3 is the schematic diagram at another visual angle of heat abstractor shown in Figure 1.
Fig. 4 is the generalized section of heat abstractor shown in Figure 1 along IV-IV line.
The specific embodiment
See also Fig. 1 to Fig. 4, this heat abstractor 10 comprises a plate shaped heat pipe 12, a radiating fin group 14 and some heat transfer poles 16.
This plate shaped heat pipe 12 is tabular, comprises a housing 120 and is located at capillary structure 121 in the housing 120, and this capillary structure 121 can be groove, silk screen, fiber or sintered powder etc.This housing 120 is made by the good material of heat conductivility.This housing 120 surrounds a hollow airtight chamber 125, accommodates working media (figure does not show) in this chamber 125 such as water, alcohol etc.This plate shaped heat pipe 12 has an end face 122 and a bottom surface 124 on the other side, and this bottom surface 124 is used for contacting to absorb the heat that heat-generating electronic elements produces with heat-generating electronic elements.This bottom surface 124 is outwards protruded and is formed a lug boss 126, and this lug boss 126 is used for closely contacting with heat-generating electronic elements.When having the different heat-generating electronic elements of a plurality of height to dispel the heat simultaneously, the different lug boss of a plurality of height 126 can be set, in the bottom surface 124 of plate shaped heat pipe 12 respectively to each heat-generating electronic elements heat radiation.
This some heat transfer pole 16 is evenly spaced apart on the end face 122 of plate shaped heat pipe 12.These heat transfer poles 16 are made by the good material of heat transfer property, such as copper, aluminium.Each heat transfer pole 16 is the filled circles column, and the bottom of each heat transfer pole 16 is connected with the end face 122 of plate shaped heat pipe 12, and this bottom extends upward formation one free end certainly.
This radiating fin group 14 is positioned at the top of plate shaped heat pipe 12 and parallel with plate shaped heat pipe 12, this radiating fin group 14 is piled up by some radiating fins that are parallel to each other 140 and is formed, and these radiating fins 140 and plate shaped heat pipe 12 are parallel and along piling up mutually perpendicular to end face 122 directions of this plate shaped heat pipe 12.These radiating fins 140 can be made by heat transfer property good metal such as aluminium, copper.The position of corresponding heat transfer pole 16 forms some through holes 142 on each radiating fin 140.Through hole 142 on each radiating fin 140 is aimed at from top to bottom mutually, wears for heat transfer pole 16 thereby form through hole in radiating fin group 14.The periphery of each through hole 142 upwards forms a ring edge 144, and this ring edge 144 helps increasing the contact area of heat transfer pole 16 and radiating fin 140.
When assembling this heat abstractor 10, the free end of these heat transfer poles 16 is vertically passed through hole 142 on each radiating fin 140, and can utilize the mode of interference fit or welding that these heat transfer poles 16 are connected and fixed with radiating fin group 14.The bottom of these heat transfer poles 16 then is connected with the end face 122 of plate shaped heat pipe 12 by welding.
During heat abstractor 10 work, this plate shaped heat pipe 12 absorbs heat by lug boss 126 from heat-generating electronic elements, then this lug boss 126 is by the working media of bottom surface 124 with these plate shaped heat pipe 12 inside of heat transferred, working media is passed to end face 122 by phase change rapidly equably with heat then, reach the heat transfer pole 16 that is connected with end face 122, and then heat is passed to radiating fin group 14 by heat transfer pole 16.
Because heat transfer pole 16 One's name is legions, increased the contact area of heat transfer pole 16 with this plate shaped heat pipe 12 and radiating fin group 14, and the some ring edge 144 on the radiating fin 140 have further increased the contact area of radiating fin 140 with heat transfer pole 16, thereby improved greatly heat from heat transfer pole 16 to radiating fin 140 transmission speed, improved heat transfer efficiency.Simultaneously, because these some heat transfer poles 16 are distributed in the end face 122 and radiating fin group 14 of this plate shaped heat pipe 12 equably, the heat of this plate shape heat pipe 12 can pass to radiating fin group 14 in the mode of even diffusion by heat transfer pole 16, make each radiating fin 140 each several part thermally equivalent, eliminated the phenomenon of the temperature distributing disproportionation on the radiating fin in the traditional heat-dissipating device, improve the utilization rate of radiating fin 140 greatly, promoted the radiating efficiency of heat abstractor 10.

Claims (10)

1. heat abstractor, it is characterized in that: comprise a plate shaped heat pipe, some radiating fins and some heat transfer poles, this plate shaped heat pipe is used for contacting with thermal source, form a hollow airtight chamber in the described plate shaped heat pipe and accommodate working media, one end of described heat transfer pole is fixed on the described plate shaped heat pipe, and the other end of described heat transfer pole is located on the described radiating fin.
2. heat abstractor as claimed in claim 1, it is characterized in that: described radiating fin is parallel with plate shaped heat pipe and along piling up mutually perpendicular to the direction of this plate shaped heat pipe, each radiating fin is provided with some through holes, the position of the through hole on these radiating fins is aimed at mutually, thereby the through hole that common formation can supply described heat transfer pole to pass, described heat transfer pole is in through hole is arranged in these radiating fins.
3. heat abstractor as claimed in claim 2 is characterized in that: described heat transfer pole is the filled circles column.
4. heat abstractor as claimed in claim 3 is characterized in that: described heat transfer pole is made by copper or aluminium.
5. heat abstractor as claimed in claim 2 is characterized in that: described heat transfer pole is distributed in evenly, dispersedly on the described plate shaped heat pipe and reaches in the radiating fin.
6. heat abstractor as claimed in claim 2 is characterized in that: described heat transfer pole links to each other with radiating fin by the mode of interference fit or welding.
7. heat abstractor as claimed in claim 2 is characterized in that: the periphery of each through hole is provided with a ring edge.
8. heat abstractor as claimed in claim 2 is characterized in that: the bottom surface of described plate shaped heat pipe is used for contacting with thermal source, and the bottom of described heat transfer pole is fixed on the end face of described plate shaped heat pipe by the mode of welding.
9. heat abstractor as claimed in claim 8 is characterized in that: outwards protrude on the bottom surface of this plate shaped heat pipe and form at least one lug boss of contacting with thermal source of being used for.
10. heat abstractor as claimed in claim 9 is characterized in that: described thermal source is the different heat-generating electronic elements of a plurality of height, and this plate shaped heat pipe comprises the lug boss that a plurality of height are different, respectively to each heat-generating electronic elements heat radiation.
CN200910301218A 2009-03-30 2009-03-30 Cooling device Pending CN101852564A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200910301218A CN101852564A (en) 2009-03-30 2009-03-30 Cooling device
US12/504,683 US20100243207A1 (en) 2009-03-30 2009-07-17 Thermal module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200910301218A CN101852564A (en) 2009-03-30 2009-03-30 Cooling device

Publications (1)

Publication Number Publication Date
CN101852564A true CN101852564A (en) 2010-10-06

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ID=42782683

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200910301218A Pending CN101852564A (en) 2009-03-30 2009-03-30 Cooling device

Country Status (2)

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US (1) US20100243207A1 (en)
CN (1) CN101852564A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105813433A (en) * 2015-01-20 2016-07-27 富士通株式会社 Heat dissipation device and method of dissipating heat
CN110690184A (en) * 2019-09-12 2020-01-14 无锡江南计算技术研究所 Double-sided enhanced heat exchange cold plate with multi-mass composite three-dimensional flow channel

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Publication number Priority date Publication date Assignee Title
US20110214842A1 (en) * 2010-03-05 2011-09-08 Lea-Min Technologies Co., Ltd. Heat sink
JP5953206B2 (en) * 2011-11-11 2016-07-20 昭和電工株式会社 Liquid cooling type cooling device and manufacturing method thereof
US9863716B2 (en) * 2013-07-26 2018-01-09 Hamilton Sundstrand Corporation Heat exchanger with embedded heat pipes
CN105716454B (en) * 2014-12-01 2019-05-31 青岛海尔特种电冰柜有限公司 The assemble method of heat pipe heat radiation type heat-exchange device
US20180023895A1 (en) * 2016-07-22 2018-01-25 Trane International Inc. Enhanced Tubular Heat Exchanger
US20180106500A1 (en) * 2016-10-18 2018-04-19 Trane International Inc. Enhanced Tubular Heat Exchanger

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105813433A (en) * 2015-01-20 2016-07-27 富士通株式会社 Heat dissipation device and method of dissipating heat
CN105813433B (en) * 2015-01-20 2019-06-18 富士通株式会社 Radiator and heat dissipating method
CN110690184A (en) * 2019-09-12 2020-01-14 无锡江南计算技术研究所 Double-sided enhanced heat exchange cold plate with multi-mass composite three-dimensional flow channel

Also Published As

Publication number Publication date
US20100243207A1 (en) 2010-09-30

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Application publication date: 20101006