200926945 九、發明說明： 【發明所屬之技術領域】 本發明係提供一種具有散熱片的柱狀散熱器設計，尤 指利用底座端面一體成型的複數個散熱柱與散熱月的對應 開孔直接緊配結合，或再配置風扇，或是結合熱管，以提 升散熱器的散熱功率。 【先前技術】 習知散熱器，主要是由複數散熱片構成的散熱片模組 與一底座結合，或可視高散熱功率的需求再配置結合熱管 以組成，散熱片或底座通常是採鋁質或銅質金屬，散熱片 模組係由複數個的散熱片呈間隔相鄰的層疊排列，利用底 座可導引晶體熱源通過複數散熱片而達成散熱功能。 省知小型政熱益，亦有直接在底座一體成型複數個間 隔平㈣列的散熱板片，利用底座導引晶體熱源通過複數 個平行的散熱板片以達到散熱目的，此種散熱器的散熱功 ❿率，低’往往無法滿足實際所需的散熱功率；另一種附有 熱管的習知，熱器，其散熱功率強’體積較大且結構複雜 ，故成本較局’因此若將熱管散熱器使用到低散教功率需 即顯得供過於求，並不適配，反而造成無謂浪 =二可知’最佳的散熱器設計，應指能夠 滿足實際散熱需求的散熱器，過與不及均非適宜。 【發明内容】 本發明之主要目的，乃在於提供—種具有散教 狀散熱㈣計，包括—底座與複數個散熱片所組成，係在 200926945 底座端面一體設有複數個呈垂直延伸狀的散熱柱，各散熱 片設有與散熱柱對應的複數個開孔，以供緊配套入底座的 散熱柱形成緊配結合，令底座所導引的晶體熱源可快速通 過複數散熱片，進而提高其散熱功率。 本發明之次要目的，乃在於提供一種具有散熱片的柱 狀散熱器設計，該底座可視各種不同的散熱功率需求，而 自由增減散熱片的配置數量，於散熱功率需求較高時可適 量增加散熱片的數量，反之則可遞減，故能精確供應最適 © 當的散熱功率，滿足各種不同的散熱需求，充份符合結構 精簡化及成本經濟化的要求。 本發明之又一目的，乃在於提供一種具有散熱片的柱 狀散熱器設計，所述底座的散熱柱與散熱片開孔，係可任 意成型為各種不同的對應形狀，例如散熱柱柱體與散熱片 開孔可分別設為矩形柱與矩形孔、圓形柱與圓形孔、十字 柱與十字孔、六角柱與六角孔、三角柱與三角孔、長片柱 與長槽孔等各種相對匹配的形態。 ® 本發明之又一目的，乃在於提供一種具有散熱片的柱 狀散熱器設計，所述底座的散熱柱係可實施為高度不同的 柱體，利用不同高度的散熱柱形成高低層次的分佈，以供 適配大小形狀不等的散熱片緊配套入。 本發明之又一目的，乃在於提供一種具有散熱片的柱 狀散熱器設計，所述底座的散熱柱係可實施為二階級或多 階級的柱體，散熱片的開孔大小亦可相對匹配改變，以供 緊配套入結合。 200926945 本發明之又一目的，乃在於提供一種具有散熱片的柱 狀散熱器設計，所述底座除可選用如鋁或銅金屬或其它具 良好導熱的金屬材外，亦可在底座底面的接觸部嵌入一導 熱係數更好的金屬塊，進而構成一複合金屬材的底座。 本發明之又一目的，乃在於提供一種具有散熱片的柱 狀散熱器設計，所述複數個散熱片的開孔，係可成型為雙 階級孔，使前後相鄰的散熱片可相互嵌插，獲得更為穩固 的緊配結合。 © 本發明之又一目的，乃在於提供一種具有散熱片的柱 狀散熱器設計，所述各散熱柱的根部或頂端部，均可實施 為適當倒角形狀，如C角或凸R或凹R等各種倒角，利用 根部倒角設計，可使晶體熱源沿著底座根部快速通達散熱 柱與散熱片，達到快速散熱效果，而頂端部的倒角則可方 便散熱片的緊配套入，並避免出現尖銳邊面。 本發明之又一目的，乃在於提供一種具有散熱片的柱 狀散熱器設計，所述底座與複數個散熱片的配置組成，亦 ❿可進一步於底座的選定位置（例如邊側或中央）安裝結合 一任意形態的風扇，以通過風扇提供送風，加強散熱器的 快速散熱功能。 本發明之又一目的，乃在於提供一種具有散熱片的柱 狀散熱器設計，所述底座與複數個散熱片的配置組成，係 可進一步於底座結合熱管，以構成一種附有熱管的散熱器 ，且底座與熱管的結合亦可採用緊配嵌入組合，以提高散 熱器的散熱功率，並節省熱管的組裝成本。 200926945 【實施方式】 茲依附圖實施例將本發明結構 詳細說明如下： 谓及其他作用、目的 如第-圖及第二圖所示，本發明所為「且 柱狀散熱器」設計，主要係包括_ /、有政”，、片的 2所組成，其中：要係匕括底座1與複數個散熱片 ’係—具良好導熱性的金屬座體（如採用銘質 或銅負金屬，即俗稱銘底或銅底），特別 面一體設有複數個呈垂直延伸狀的散熱柱n，各散孰= 可為規則狀或不規則狀相鄰間隔的分佈排列，實施例圖所 不的散熱柱11係呈矩陣形態的規則狀分佈排列； 、複數個政熱片2，係具有與上述散熱柱n呈相互對應 的複數個開孔21，令開孔21可適配套人散熱柱11而與底座 1結合，利用開孔21與散熱柱丨丨的緊配對應，使散熱片2 的開孔21依序緊配套入底座1的散熱柱1卜並逐片與底座 1形成間隔相鄰的緊配結合； 藉上述底座1與複數個散熱片2組成的柱狀散熱器， 為利用底座1垂直延伸狀的散熱柱u與各散熱片2的開孔 對應套入而形成結合，故能將底座1所接觸導引的晶體熱 源通過複數散熱片2而快速散熱，以提高散熱器的散熱功 率。 依本發明的組成形態，散熱柱11與散熱片開孔21的結 合’主要係採用緊配對應的組裝，使散熱片2的開孔21係 些微小於散熱柱11的直徑大小，因此可緊配套入散熱柱11 200926945 ，快速完成緊配結合，符仆☆壯产 本發明的底座1U 序，並降低成本。 求，自由增減JL所需散執j種晶體不同的散熱功率需 =時可適量增加散熱片2的數量，反之則遞減2 ==晶體的散熱需求，故能兼顧 本的經濟化，提供最理想的散熱功率。 ”成 如上述底座工的散熱柱叫散熱片2的開孔& 體或開孔形狀並無特別限制，自可任意成型為各種不^ ==盘如第-三圖或第四圖所示’係利用十字柱形狀的 … 十子孔形狀的開孔2ia相對匹配成型，亦可緊 配套入散熱柱1卜完成底座la與散熱>j 2a的結合。 同理如第五圖至第九圖所示，散熱柱Ub〜iif與散熱 片2b〜2f’係亦可分別實施為矩形柱雜的散熱柱爪與矩 形孔形狀的開孔21b(如第五圖）、或是實施為圓形柱形狀的 散熱柱11c與圓形孔形狀的開孔21c(如第六圖）、或是實施 為八角柱形狀的散熱柱lld與六角孔形狀的開孔21d (如第 七圖）、或是實施為三角柱形狀的散熱柱Ue與三角孔形狀 的開孔21e(如第八圖）或實施為狹長片形狀的散熱柱uf與 狹長形狀的開孔21f(如第九圖）等各種相對匹配的形態。惟 上述僅例舉一些可行實施樣態，但並不以此為限。 如弟十圖至第十二圖所示’上述散熱柱11 ( 11a〜Ilf 亦同）與底座1的相連根部121或122或123，係可實施為C 角或凸R或凹R等各種不同的倒角形狀，使晶體熱源可沿 著底座1的相連根部121或122或123快速通達散熱柱^與 200926945 散熱片2而加速散熱。 如第-圖及第十三圓所示，上述複數個散熱片2(或 1开所設的開孔21(或21a〜21f)，並可在開孔21的孔 邊細，因此於散熱片2逐片緊配套入底座工的散 jnum〜m)時’可利用邊框211與散熱仙產生較 大的接觸面，以利於快速散熱。 如第十四圖所示，本發明的底絲可選肋或銅等單 —金屬材質’亦可在底座的底面接觸部嵌人—導埶係數更 ©好的金屬塊η，以構成一具有金屬複合材質的·底座、心 如第十五圖所示’上述底座i的散熱仙⑽〜⑽係 亦:實施為高度不同的柱體，利用不同高度的散熱柱⑽ 成南低層次的分佈’以供適配大小形狀不等的散熱片2緊 配套入。 又，本發明底座1的散熱柱11(或lla〜Ilf)係亦可實 施為二階級或多階級的柱體，如第十六圖所示係揭露一種 具有三階級柱體的散熱柱⑽—種實施形態，令底座工的 散熱柱11可同時形成第一階級柱m、第二階級柱ιΐ2及第 二階級柱113’且散熱片2的開孔21大小亦應相對匹配改變 ’使各散熱片2可分批緊配套入各階級柱111、112及113 如第十七圖所示之另一種實施例，其係使用另一種形 態的散熱片2g’用以緊配套入於底座1的散熱柱丨丨（或11& 〜Ilf亦同）’圖中的複數個散熱片2g，其所設開孔21g係 成型為雙階級孔的形狀，故可使前後相鄰的散熱片2丨g相互 200926945 嵌插套置二形成緊配套入’藉此獲得更穩固的結合。同理 可头上述手#又自亦可應用於二階級或多階級的柱體，利 用具有雙階級開孔的散熱片相互礙插套置於多階級的柱體 * 〇 . 如第十八圖所示，各散熱柱11的頂端部114,亦可實施 為C角或凸R或凹R等各種不同的倒角形狀，以方便散熱 片2的緊配套入，並避免出現尖銳邊面，同理，如第十= 圖至第二十-圖所示的散熱柱山、Uc、Ud或其他形狀的 ©散熱柱，亦均可在頂端部114a、114c、114d成型倒角設計 〇 依本發明底座1與複數個散熱片2之配置組成，當然 亦可進一步於底座1 (底座形狀不拘）的選定位置提二二 任意形態的風扇安裝結合，如第二十二圖及第二十三圖所 示，主要是在底座1的邊侧位置預留一風扇的安裝區，以 供一風扇3或3a鎖設結合，而底座1的其餘區域則成型設 有複數個散熱柱11，因此可通過風扇3或仏提供送風，以 ®加強散熱器的快速散熱。 同理，如第二十四圖及第二十五圖所示，則是在底座 1 (底座形狀亦不拘）的中央位置預留一風扇的安裝區， 以供一風扇3b或3c鎖設結合，而底座1的週邊區域則成型 設有複數個散熱柱11，因此可通過風扇扑或孔提供送風， 以加強散熱器的快速散熱。 依本發明設計意旨’所述底座1與複數個散熱片2的 配置組成’除可依需要而增加設置風扇3 (或3&、3b)以 11 200926945 外，當然也可以在底座1的底面結合一個或一個以上的熱 管4(請參閱第二十六圖至第二十八圖的實施例所示）， 以構成一種附有熱管4的散熱器，該底座i係在底面開設 ' 一個或一個以上的嵌槽14 (如第二十八圖），以供熱管4 •匹配後入而形成緊配的後入組合，或熱管4亦可利用錫焊 結合於底座1底面，且熱管4底面為扁平狀，與底座工底 面為同-平面，故可直接貼觸晶體，以提供高功率的快速 散熱效果。此外，底座i、散熱片2、風扇3 β 3c)及熱管4的相互配置，自不限於上述實施例，如第二 十六圖至第二十八圖所示是利用熱管4的變部緊配嵌入底 座1,’但實際上熱管4亦可只利用其中一單邊管柱與底座 1形成緊配的嵌入組合，自屬同理可行’惟此種形 習知，故不另贅。 ’、 依上述各種實施例所揭，僅係本發明技術内容 說明，其並非用以限定本案的技術範圍，舉凡涉及等 用或基於前項技術手段所為之㈣_ ^ 擊視為屬於本案技術範圍内。 乂直換均應 綜上所述，可知本發明所為「具有散200926945 IX. Description of the Invention: [Technical Field] The present invention provides a columnar heat sink design having a heat sink, especially a plurality of heat dissipating columns integrally formed by the end surface of the base and directly matching the corresponding openings of the heat dissipation month Combine, or reconfigure the fan, or combine the heat pipe to increase the heat dissipation power of the heat sink. [Prior Art] A conventional heat sink is mainly composed of a heat sink module composed of a plurality of heat sinks combined with a base, or a heat sink with a high heat dissipation power, and the heat sink or the base is usually made of aluminum or The copper metal and the heat sink module are arranged by a plurality of heat sinks arranged at intervals, and the base can guide the crystal heat source through the plurality of heat sinks to achieve the heat dissipation function. The province knows the small-scale heat and benefits, and also has a plurality of heat-dissipating plates arranged in a plurality of spaced-apart (four) columns directly on the base. The base-guided crystal heat source passes through a plurality of parallel heat-dissipating plates to achieve the purpose of heat dissipation, and the heat dissipation of the heat sink Power rate, low 'often can not meet the actual required heat dissipation power; another kind of heat pipe with the knowledge, the heat device, its heat dissipation power is 'large size and complex structure, so the cost is better than the bureau' so if the heat pipe is cooled The use of low-deployment power needs to be oversupply, not suitable, but causes unnecessary waves = two can be known 'the best heat sink design, should refer to the radiator that can meet the actual heat dissipation requirements, too much is not suitable. SUMMARY OF THE INVENTION The main object of the present invention is to provide a heat-dissipating (four) meter, including a base and a plurality of heat sinks, which are integrally provided with a plurality of vertically extending heat sinks on the end surface of the 200926945 base. Columns, each of the heat sinks is provided with a plurality of openings corresponding to the heat dissipation columns, so as to form a tight fit of the heat dissipation columns that are tightly fitted into the base, so that the crystal heat source guided by the base can quickly pass through the plurality of heat sinks, thereby improving heat dissipation. power. A secondary object of the present invention is to provide a columnar heat sink design having a heat sink, which can be used to increase and decrease the number of heat sinks, and can be appropriately increased when the heat dissipation power demand is high. Increasing the number of heat sinks, and vice versa, can accurately supply the optimum heat dissipation power to meet various heat dissipation requirements, fully complying with the requirements of structural simplicity and cost-effectiveness. Another object of the present invention is to provide a columnar heat sink design having a heat sink, wherein the heat dissipating post and the fin opening of the base can be arbitrarily shaped into various corresponding shapes, such as a heat sink cylinder and The fin opening can be set as a rectangular column and a rectangular hole, a circular column and a circular hole, a cross column and a cross hole, a hexagonal column and a hexagonal hole, a triangular column and a triangular hole, a long column and a long slot, and the like. Shape. A further object of the present invention is to provide a columnar heat sink design having a heat sink, the heat dissipating column of the base can be implemented as a cylinder of different heights, and the heat dissipation columns of different heights are used to form a high and low level distribution. The heat sinks with different sizes and shapes are tightly fitted. Another object of the present invention is to provide a columnar heat sink design having a heat sink, the heat dissipating column of the base can be implemented as a two-stage or multi-stage cylinder, and the opening size of the heat sink can also be relatively matched. Change to match the tight fit. 200926945 Another object of the present invention is to provide a columnar heat sink design with a heat sink, which can be contacted on the bottom surface of the base, in addition to metal materials such as aluminum or copper metal or other materials having good heat conductivity. A metal block with a better thermal conductivity is embedded in the portion to form a base of a composite metal material. Another object of the present invention is to provide a columnar heat sink design having heat sinks, wherein the plurality of heat sinks can be formed into two-stage holes so that adjacent heat sinks can be inserted into each other. , to get a more stable tight fit. Another object of the present invention is to provide a columnar heat sink design having fins, and the root or the tip end portion of each of the heat dissipating columns can be implemented as a suitably chamfered shape, such as a C-angle or a convex R or a concave R and other chamfers, using the root chamfer design, can make the crystal heat source quickly reach the heat sink and the heat sink along the root of the base to achieve rapid heat dissipation, and the chamfer at the top part can facilitate the tight fit of the heat sink. Avoid sharp edges. Another object of the present invention is to provide a columnar heat sink design having a heat sink, the base and the plurality of heat sinks being configured to be further mounted at selected positions of the base (eg, side or center) Combine an arbitrary fan to provide air supply through the fan to enhance the rapid heat dissipation of the heat sink. Another object of the present invention is to provide a columnar heat sink design having a heat sink, the base and a plurality of heat sinks being configured to further combine a heat pipe with the base to form a heat sink with a heat pipe. The combination of the base and the heat pipe can also be tightly fitted and embedded to improve the heat dissipation power of the heat sink and save the assembly cost of the heat pipe. 200926945 [Embodiment] The structure of the present invention will be described in detail below with reference to the embodiments of the present invention. Other functions and purposes are as shown in the first and second figures. The design of the "column radiator" of the present invention mainly includes _ /, 政政", the two components of the film, including: the base 1 and a plurality of heat sinks - a metal seat with good thermal conductivity (such as the use of the name or copper negative metal, commonly known as The bottom of the inscription or the copper base), the special surface is integrally provided with a plurality of heat dissipating columns n extending vertically, and each divergence = a regular or irregular arrangement of adjacent intervals, and the heat dissipating column of the embodiment is not shown. The 11 series are arranged in a regular pattern of a matrix form; and the plurality of political heat sheets 2 have a plurality of openings 21 corresponding to the heat dissipating columns n, so that the openings 21 can be adapted to the heat dissipation column 11 and the base. 1 combination, using the opening 21 corresponding to the tight fit of the heat dissipating post ,, so that the opening 21 of the heat sink 2 is closely matched into the heat dissipating post 1 of the base 1 and is closely spaced apart from the base 1 by a piece. Combined with the above base 1 and a plurality of heat sinks 2 The columnar heat sink is formed by combining the heat dissipating columns u extending vertically from the base 1 and the openings of the fins 2, so that the crystal heat source guided by the base 1 can be quickly passed through the plurality of fins 2 The heat dissipation is used to improve the heat dissipation power of the heat sink. According to the composition of the present invention, the combination of the heat dissipation column 11 and the heat sink opening 21 is mainly assembled by tight fitting, so that the opening 21 of the heat sink 2 is slightly cooled. The diameter of the column 11 can be tightly matched into the heat-dissipating column 11 200926945, and the tight-fit combination can be quickly completed, and the base of the invention can be produced in a 1U order, and the cost can be reduced. The different heat dissipation power of the crystal needs to increase the number of heat sinks 2, and vice versa. 2 == the heat dissipation requirement of the crystal, so it can take into account the economicalization of the present and provide the most ideal heat dissipation power. The heat sink is called the opening of the heat sink 2. The shape of the body or the opening is not particularly limited, and it can be arbitrarily formed into various types. The === disk is as shown in the third to fourth or the fourth figure. ... ten hole shape The opening 2ia is relatively matched and formed, and can also be fitted into the heat dissipating column 1 to complete the combination of the base la and the heat dissipation > j 2a. Similarly, as shown in the fifth to ninth figures, the heat dissipation columns Ub to iif and the heat dissipation fins 2b to 2f' can be respectively implemented as rectangular columnar heat dissipation column claws and rectangular hole-shaped openings 21b (such as the fifth FIG. 4 or an opening 21c having a circular column shape and a circular hole-shaped opening 21c (as shown in FIG. 6), or an octagonal-shaped heat dissipation column 11d and a hexagonal hole-shaped opening 21d. (as shown in the seventh figure), or the heat-radiating column Ue in the shape of a triangular prism and the opening 21e in the shape of a triangular hole (as shown in the eighth figure) or the heat-dissipating post uf in the shape of a slit and the opening 21f of the elongated shape (such as The ninth figure) and other forms of relative matching. However, the above only exemplifies some feasible implementations, but it is not limited to this. As shown in the tenth to twelfth figures, the above-mentioned heat radiating column 11 (11a to Ilf is the same) and the connecting root portion 121 or 122 or 123 of the base 1 can be implemented as C angle or convex R or concave R. The chamfered shape allows the crystal heat source to quickly pass through the heat sink 2 and the 200926945 heat sink 2 along the associated root 121 or 122 or 123 of the base 1 to accelerate heat dissipation. As shown in the first and the thirteenth circles, the plurality of fins 2 (or the openings 21 (or 21a to 21f) provided in the first hole and the holes 21 of the opening 21 can be thinned, so that the heat sink is 2 When the piece is tightly fitted into the base of the jnum~m), the frame 211 can be used to create a large contact surface with the heat sink to facilitate rapid heat dissipation. As shown in FIG. 14 , the bottom wire optional rib of the present invention or the single metal material such as copper may also be embedded in the bottom contact portion of the base—the guiding coefficient is better than the good metal block η to form a The base and the heart of the metal composite material are as shown in the fifteenth figure. The heat dissipation of the base i (10) to (10) is also implemented as a cylinder of different heights, and the heat dissipation column (10) of different heights is used to form a low-level distribution in the south. The heat sink 2 of different sizes and shapes is tightly fitted. Moreover, the heat dissipating post 11 (or 11a~Ilf) of the base 1 of the present invention can also be implemented as a two-stage or multi-stage cylinder. As shown in the sixteenth embodiment, a heat dissipating post (10) having a three-stage cylinder is disclosed. In an embodiment, the heat dissipation column 11 of the pedestal can simultaneously form the first-stage column m, the second-stage column ιΐ2, and the second-stage column 113', and the opening 21 of the heat sink 2 should also be relatively matched in size to make each heat dissipation The sheet 2 can be closely matched to each of the columnes 111, 112 and 113. Another embodiment as shown in Fig. 17 uses another form of heat sink 2g' for heat dissipation to the base 1. The column fins (or 11 & ~Ilf are the same) 'the plurality of fins 2g in the figure, the openings 21g are formed into the shape of the double-stage holes, so that the adjacent fins 2丨g can be mutually 200926945 Inserting the sleeves into two sets tightly into the 'by taking a more stable bond. Similarly, the above-mentioned hand # can also be applied to a column of two-class or multi-class, using a heat sink with two-class openings to block the insertion of the sleeve into a multi-class cylinder* 如. As shown in the figure, the top end portion 114 of each of the heat dissipating columns 11 can also be formed into various chamfer shapes such as a C angle or a convex R or a concave R to facilitate the tight fitting of the heat sink 2 and avoid sharp edges. For example, the heat-dissipating column mountain, Uc, Ud or other shape of the heat-dissipating column as shown in the tenth to the twentieth-graphs can also be formed in the top end portions 114a, 114c, 114d to form a chamfer design according to the present invention. The base 1 and the plurality of heat sinks 2 are arranged, and of course, the fan can be mounted in any of the selected positions of the base 1 (the shape of the base is not limited), as shown in the twenty-second and twenty-third figures. It is shown that a fan mounting area is reserved at the side of the base 1 for a fan 3 or 3a lock combination, and the remaining area of the base 1 is formed with a plurality of heat dissipation columns 11 so that the fan can be passed through 3 or 仏 provide air supply to enhance the heat dissipation of the heat sink. Similarly, as shown in the twenty-fourth and twenty-fifth diagrams, a fan mounting area is reserved at a central position of the base 1 (the shape of the base is not limited) for a fan 3b or 3c lock combination. The peripheral area of the base 1 is formed with a plurality of heat dissipation columns 11 so that air can be supplied through the fan or the holes to enhance the rapid heat dissipation of the heat sink. According to the design of the present invention, the configuration of the base 1 and the plurality of fins 2 can be increased by adding the fan 3 (or 3&, 3b) to 11 200926945 as needed, and of course, the bottom surface of the base 1 can be combined. One or more heat pipes 4 (refer to the embodiments of FIGS. 26 to 28) to constitute a heat sink with a heat pipe 4 attached to the bottom surface of one or one The above-mentioned recessed groove 14 (such as the twenty-eighth figure) is formed by the heat supply pipe 4 to be matched and formed to form a tightly fitted back-in combination, or the heat pipe 4 may be welded to the bottom surface of the base 1 by soldering, and the bottom surface of the heat pipe 4 is The flat shape is the same plane as the bottom surface of the base, so it can be directly attached to the crystal to provide high-power rapid heat dissipation. In addition, the mutual arrangement of the base i, the heat sink 2, the fan 3 β 3c), and the heat pipe 4 is not limited to the above embodiment, and as shown in the twenty-sixth to twenty-eighthth drawings, the variable portion of the heat pipe 4 is used. Equipped with the base 1, 'but in fact, the heat pipe 4 can also use only one of the single-sided pipe columns to form a tight fit with the base 1, which is the same as the case. The invention is not limited to the technical scope of the present invention, and is not limited to the technical scope of the present invention, and is considered to be within the technical scope of the present invention. In the above, it should be noted that the present invention is
=，其組成形態於申請前並確無相同應用IS 應用確屬新穎首創，且符合預期的功效目的 明專利，敬祈依法賜准專利，實為德便。”、'申Μ 12 200926945 【圖式簡單說明】 第一圖為本發明實施例的分解立體圖。 第二圖為本發明實施例的組合立體圖。 第三圖為本發明另一種實施例的組合立體圖。 第四圖為本發明另一種實施例的局部上視圖。 第五圖至第九圖分別係分職示本發明中散熱柱與散 ^ 熱片可呈其他不同匹配形態的實施示意圖。 *十圖至第十一圖係分別顯示本發明散熱柱根部的各 0 種倒角實施例示意圖。 苐十二圖為本發明的組合侧視圖。 第十四圖為本發明利用兩種金屬複合為底座的組合示 意圖。 第十五圖為本發明將底座散熱柱實施為高度不同柱體 的組合示意圖。 第十六圖為本發明將底座散熱柱實施為多階級柱體形 態的局部組合示意圖。 ® 帛十七圖為本發明將散熱片開孔實施為雙階級孔形態 的局部組合示意圖。 第十八圖至第二十一圖係分別顯示本發明底座散熱柱 頂端部的各種倒角實施示意圖。 第二十二圖為本發明在底座邊侧結合一風扇的組合實 施例圖。 第二十三圖為本發明在底座邊侧結合一風扇的另一種 形態貫施例圖。 13 200926945 第二十四圖為本發明在底座中央結合一風扇的組合實 施例圖。 第一十五圖為本發明在底座中央結合一風扇的另—種 形態實施例圖。 f二十六圖為本發明在底座結合熱管的實施例圖。 第二十七圖為第二十六圖的A—A剖面圖。 第一十八圖為第二十六圖的剖面圖。 【主要元件符號說明】 ❹=, its composition form before the application and does not have the same application IS application is indeed a novel initiative, and meet the expected purpose of the purpose of the patent, and pray for patents in accordance with the law, it is a virtue. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is an exploded perspective view of an embodiment of the present invention. The second figure is a combined perspective view of an embodiment of the present invention. The third figure is a combined perspective view of another embodiment of the present invention. The fourth figure is a partial top view of another embodiment of the present invention. The fifth to ninth figures are respectively schematic diagrams showing the implementation of the heat dissipating column and the heat dissipating sheet in other different matching forms in the present invention. Figure 11 to Figure 11 are schematic views respectively showing the 0 kinds of chamfering embodiments of the root of the heat-dissipating column of the present invention. Figure 12 is a combined side view of the present invention. Figure 14 is a composite of two metals for the present invention. The fifteenth figure is a schematic diagram of the combination of the base heat dissipating column as the height of different columns. The sixteenth figure is a partial combination diagram of the base heat dissipating column of the invention as a multi-stage cylinder form. The seventeenth figure is a partial combination diagram of the invention in which the fin opening is implemented as a double-stage hole form. The eighteenth to twenty-first figures respectively show the top of the base of the present invention. A schematic diagram of various chamfering implementations of the part. The twenty-second figure is a combination embodiment of the invention in which a fan is coupled to the side of the base. The twenty-third figure is another embodiment of the invention for combining a fan on the side of the base. 13 200926945 The twenty-fourth figure is a combination embodiment of a fan in the center of the base of the present invention. The fifteenth figure is another embodiment of the invention in which a fan is combined in the center of the base. Figure 16 is a view showing an embodiment of the present invention in which a heat pipe is coupled to a base. Figure 27 is a cross-sectional view taken along line A-A of Figure 26. Figure 18 is a cross-sectional view of the twenty-sixth figure. Component symbol description] ❹
1、 la、lb 底座 2、 2a、2b、2c、2d、2e、2f、2g 散熱片 11、11a、lib、11c、ild、Ue、nf 散熱柱 21、21a、21b、21c、21d、2le、21f、21g 開孔 121、122、123相連根部 211 邊框 13 金屬塊 111 第一階級柱 112 第二階級柱 113 第三階級柱 114、114a、114c、114d 頂端部 3、 3a、3b、3c 風扇 4 熱管 14 喪槽 141, la, lb base 2, 2a, 2b, 2c, 2d, 2e, 2f, 2g heat sink 11, 11a, lib, 11c, ild, Ue, nf heat sink 21, 21a, 21b, 21c, 21d, 2le, 21f, 21g openings 121, 122, 123 connected to the root 211 frame 13 metal block 111 first class column 112 second class column 113 third class column 114, 114a, 114c, 114d top end 3, 3a, 3b, 3c fan 4 Heat pipe 14 stagnation 14