1338215 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種散熱模組之製作方法，尤指一種可 堆疊出所需型態之散熱單元，並增加各散熱板體與外部空 氣之接觸面積，而達到具有較佳之散熱效果者。 【先前技術】 & 按，一般習用之散熱裝置係將複數熱導管之一端接合 一基座，且於複數散熱鰭片上分別設有複數同軸之穿孔， 之後將各散熱鰭片藉由穿孔逐一堆疊於各熱導管上，讓各 散熱鰭片與熱導管固接，且使各散熱鰭片平行排列，使其 面與面相互對應，而令各散熱鰭月之間具有適當之寬度。 藉此構成一散熱裝置，可將該基座直接設置於主機板之 CPU或其他電子發熱元件上，使該基座吸收發熱元件之熱 源，而將熱源由基座傳導至各熱導管上，再配合各散熱鰭 • 片進行散熱；另，亦可於各散熱鰭片之一側設置一風扇， 讓風扇導引氣體至各散熱鰭片上，藉以辅助各散熱鰭片所 吸收熱源之散逸。 雖然上述習用之散熱裝置單獨使用或配合風扇進行散 熱，但是由於各散熱鰭片係呈面與面相互對應之設置，因 此，其第一片散熱鰭片會擋住後面之各散熱鰭片，而造成 各散熱鰭片與空氣接觸之裸露部分較少，導致該散熱裝置 無設置風扇使用時，有空氣對流不佳之情形，再者，當配 合設置風扇使用時，同樣會因為各散熱鰭片與空氣接觸之 5 1338215 裸露部分較少，導致風扇導引氣體時其第一片散熱鰭片會 擋住後面之各散熱鰭片，造成氣體無法導引至各散熱鰭片 上，導致各散熱鰭片之受風面積有限，而無法達到較佳之 散熱效果。 【發明内容】 因此，本發明之主要目的係在於，可堆疊出所需型態 之散熱單元，並增加各散熱板體與外部空氣之接觸面積， 而達到具有較佳之散熱效果。 為達上述之目的，本發明之一種散熱模組之製作方法 的第一態樣，包含下列步驟： (1) 提供一導熱單元，其包含複數熱導管及一基座，該 些熱導管分別具有一受熱段與一冷卻段，該些受熱 段結合於該基座； (2) 提供複數散熱板體，該些散熱板體分別於其外周緣 設有相鄰之複數凸出部，該些散熱板體分別於其表 面設有複數固定孔； (3) 將該些散熱板體相互錯位且間隔堆疊以形成一散 熱單元，使該散熱板體之該凸出部露出於相鄰之該 散熱板體之二該凸出部之間；以及 (4) 使該散熱單元利用該些固定孔穿設於該些冷卻段 上。 本發明之一種散熱模組之製作方法的第二態樣，包含 下列步驟： P38215 (1) 提供一導熱單元，其包含複數熱導管及一基座，該 些熱導管分別具有一受熱段與一冷卻段，該些受熱 段結合於該基座； (2) 提供複數散熱單元，該些散熱單元分別具有複數散 熱板體，該些散熱板體分別於其外周緣設有相鄰之 複數凸出部，該些散熱板體分別於其表面設有複數 固定孔； (3) 使該散熱單元之該些散熱板體相互同位且間隔堆 疊； (4) 將該些散熱單元相互錯位且間隔堆疊，使該散熱單 元同位之該些凸出部露出於相鄰之該散熱單元二 同位之該些凸出部之間； (5) 使該些散熱單元利用該些固定孔穿設於該些冷卻 段上。 【實施方式】 請參閱『第一圖及第二圖』所示，係分別為本發明之 製作方法示意圖及本發明第一實施例之立體外觀示意圖。 如圖所示，本發明之一種散熱模組之製作方法的第一態 樣，其至少包含下列步驟： (1)提供一導熱單元1，其包含複數熱導管1 1及一基 座1 2，該些熱導管1 1分別具有一受熱段1 1 1 與一冷卻段1 1 2，該些受熱段1 1 1結合於該基 座1 2 ; 7 1338215 (2) 提供複數散熱板體2 ，該些散熱板體2丄分別於 其外周緣設有相鄰之複數凸出部2 3，該些散熱板 體2 1分別於其表面設有複數固定孔2 5及複數 穿孔2 6，該些散熱板體2 1係分別可為一環形板 體或一弧形板體； (3) 將該些散熱板體2 1相互錯位且間隔堆疊以形成 一散熱單元2，使該散熱板體2 1之該凸出部2 3 疼出於相鄰之該散熱板體2 1之二該凸出部2 3 之間；以及 (4) 使該散熱單元2利用該些固定孔2 5穿設於該些 冷卻段1 1 2上，該些散熱板體2 1堆疊後形成螺 旋狀之散熱單元2，其增加各散熱板體2 與外部 空氣之接觸面積。 »月參閱『第一圖及第三圖』所示，係分別為本發明第 貝加例之立體外觀示意圖及本發明第一實施例之側視狀 恕不意圖。如圖所示，當本發明於運用時，係可將導熱單 疋1之基座1 2直接與主機板之CPU或其他電子發熱元件 直接接觸（圖未示），使該基座i 2吸收發熱元件之熱源， 且將熱源由基座12傳導至各熱導管11之受熱端11 1，使熱導管1 1藉由其内部工作流體之氣液相變化，而 快速將受熱端11 1之熱源傳導至冷卻端i i 2，再由各 散熱板體21吸收，如此，即可利用冷卻端丄丄2配合散 熱單元2之各散熱板體21進行散熱，而由於該散熱單元 2上母一相鄰散熱板體2 1外周緣之凸出部2 3係相互錯 印 8215 位’因此’可增加各散熱板體2 i與外部空氣之接觸面積， 而提升熱傳導效率；且當實際運用時，更可於散熱單元2 之-側設置-風扇（圖中未示），使該風扇進行氣體之導 引，讓氣體導引至各散熱板體2 i之表面、中央及表面上 多數穿孔2 6處，藉以更快速達到各散熱板體2 1所吸收 熱源之散逸。 請參閱『第四圖』所示，係本發明第二實施例之立體 外觀示意，。如圖所示’本發明之各散熱板體2丄除可為 上述第一實施例之型態外，其各散熱板體2 la亦可由多 數弧形板體對應而成，使各散熱板體2 la於組裝時，可 同樣使每一相鄰散熱板體2 la外周緣之凸出部2 3a相 互形成錯位’而形成另__散熱單元23，亦可達到上述所提 相同之功效。1338215 IX. Description of the Invention: [Technical Field] The present invention relates to a method for fabricating a heat dissipation module, and more particularly to a heat dissipation unit that can stack a desired type and increase the contact between each heat dissipation plate body and outside air. The area is achieved to achieve better heat dissipation. [Prior Art] According to the conventional heat dissipating device, one end of a plurality of heat pipes is joined to a base, and a plurality of coaxial perforations are respectively disposed on the plurality of heat radiating fins, and then the heat radiating fins are stacked one by one by perforation. The heat-dissipating fins are fixed to the heat pipes, and the heat-dissipating fins are arranged in parallel so that the faces and the faces correspond to each other, so that the heat-dissipating fins have an appropriate width. Thereby forming a heat dissipating device, the pedestal can be directly disposed on the CPU or other electronic heating element of the motherboard, so that the susceptor absorbs the heat source of the heating element, and the heat source is transmitted from the pedestal to each heat pipe, and then The heat dissipation fins and the heat dissipation fins are disposed on one side of each of the heat dissipation fins, and the fan is guided to the heat dissipation fins to assist the dissipation of the heat source by the heat dissipation fins. Although the above-mentioned conventional heat dissipating device is used alone or in combination with a fan for heat dissipation, since each of the heat dissipating fins has a surface and a surface corresponding to each other, the first fins of the heat dissipating fins block the heat dissipating fins behind, thereby causing The exposed fins of the heat sink fins are less in contact with the air, resulting in poor air convection when the heat sink is not provided with a fan. Further, when the fan is used in combination, the heat sink fins are also in contact with the air. 5 1338215 Less exposed parts, causing the first fins of the fan to block the heat sink fins when the gas is guided by the fan, so that the gas cannot be guided to the fins, resulting in the wind receiving area of each fin. Limited, and can not achieve better heat dissipation. SUMMARY OF THE INVENTION Therefore, the main object of the present invention is to stack heat dissipation units of a desired type and increase the contact area between the heat dissipation plates and the outside air to achieve a better heat dissipation effect. For the above purpose, a first aspect of a method for fabricating a heat dissipation module of the present invention comprises the following steps: (1) providing a heat conduction unit comprising a plurality of heat pipes and a base, the heat pipes respectively having a heat receiving section and a cooling section, the heat receiving sections are coupled to the base; (2) providing a plurality of heat radiating plate bodies respectively provided with adjacent plurality of protruding portions on an outer peripheral edge thereof, the heat radiating portions The plate body is respectively provided with a plurality of fixing holes on the surface thereof; (3) the heat dissipation plate bodies are mutually displaced and spaced apart to form a heat dissipation unit, so that the protruding portion of the heat dissipation plate body is exposed to the adjacent heat dissipation plate The second portion of the body is between the protrusions; and (4) the heat dissipation unit is disposed on the cooling segments by using the fixing holes. A second aspect of the method for fabricating a heat dissipation module of the present invention comprises the following steps: P38215 (1) providing a heat conduction unit comprising a plurality of heat pipes and a base, the heat pipes respectively having a heat receiving section and a heat receiving unit a cooling section, the heat receiving sections are coupled to the base; (2) providing a plurality of heat dissipating units, each of the heat dissipating units having a plurality of heat dissipating plates respectively provided with adjacent plurality of protruding protrusions on an outer circumference thereof The heat dissipating plate body is respectively provided with a plurality of fixing holes on the surface thereof; (3) the heat dissipating plate bodies of the heat dissipating unit are in the same position and spaced apart from each other; (4) the heat dissipating units are misaligned and stacked at intervals, The protruding portions of the heat dissipating unit in the same position are exposed between the protruding portions of the adjacent heat dissipating unit; (5) the heat dissipating units are bored in the cooling segments by using the fixing holes on. [Embodiment] Please refer to the first drawing and the second drawing, which are schematic views of the manufacturing method of the present invention and a perspective view of the first embodiment of the present invention. As shown in the figure, a first aspect of a method for fabricating a heat dissipation module of the present invention includes at least the following steps: (1) providing a heat conduction unit 1 comprising a plurality of heat pipes 1 1 and a base 1 2, The heat pipes 1 1 respectively have a heat receiving section 1 1 1 and a cooling section 1 1 2, and the heat receiving sections 1 1 1 are coupled to the base 1 2 ; 7 1338215 (2) providing a plurality of heat radiating plate bodies 2, The heat dissipating plate bodies 2 are respectively provided with adjacent plurality of protruding portions 23 on the outer peripheral edge thereof, and the heat dissipating plate bodies 2 1 are respectively provided with a plurality of fixing holes 25 and a plurality of perforations 2 6 on the surface thereof. The plate body 2 1 can be an annular plate body or a curved plate body respectively; (3) the heat dissipation plate bodies 21 are offset from each other and stacked to form a heat dissipation unit 2, so that the heat dissipation plate body 2 1 The protruding portion 2 3 is caused by the adjacent portion of the heat dissipating plate body 2 1 and the protruding portion 2 3; and (4) the heat dissipating unit 2 is disposed through the fixing holes 25 On the cooling section 1 1 2, the heat dissipation plate bodies 21 are stacked to form a spiral heat dissipation unit 2, which increases the contact area of each of the heat dissipation plate bodies 2 with the outside air. The "monthly view" of the first embodiment of the present invention and the side view of the first embodiment of the present invention are not intended. As shown in the figure, when the present invention is applied, the base 12 of the heat conducting unit 1 can be directly in direct contact with the CPU or other electronic heating element of the motherboard (not shown), so that the base i 2 is absorbed. a heat source of the heating element, and the heat source is conducted from the susceptor 12 to the heat receiving end 11 of each heat pipe 11, so that the heat pipe 1 1 rapidly changes the heat source of the heated end 11 1 by the gas-liquid phase change of the internal working fluid. Conducted to the cooling end ii 2, and then absorbed by the heat dissipating plate body 21, so that the cooling end 丄丄2 can be used to dissipate the heat dissipating plate body 21 of the heat dissipating unit 2, and the heat dissipating unit 2 is adjacent to the heat dissipating unit 2 The protruding portion 2 3 of the outer peripheral edge of the heat dissipating plate body 2 1 is misprinted with each other at the position of 8215, so that the contact area of each of the heat dissipating plate bodies 2 i with the outside air can be increased, thereby improving the heat transfer efficiency; and when practically used, Providing a fan (not shown) on the side of the heat dissipating unit 2, the fan is guided by the gas, and the gas is guided to the surface, the center and the surface of each of the heat dissipating plate bodies 2 i. In order to more quickly reach the heat source absorbed by each heat sink body 2 1 . Please refer to the fourth figure, which is a perspective view of the second embodiment of the present invention. As shown in the figure, the heat dissipating plate body 2 of the present invention may be in the form of the first embodiment, and the heat dissipating plate bodies 2 la may be formed by a plurality of arc plates, so that the heat dissipating plate bodies are formed. When the assembly is 2 la, the protrusions 2 3a of the outer peripheral edges of each adjacent heat dissipation plate body 2 la can be dislocated from each other to form another heat dissipation unit 23, and the same effects as mentioned above can be achieved.
‘凊參閱『第五圖』所示，係本發明第三實施例之立幸 ★卜觀示思圖°如圖所示’本發明之各散熱板體除可為上立 第:及第二實施例之型態外，其各散熱板體2 ib係可』 一裱形板體，且各散熱板體2 lb周緣之凸出部2 3b係』 $、小弧面相互配合之構型，使各散熱板體2 ib於組聋 時’可同樣使每-相鄰散熱板體2 lb外周緣之凸出部^ 3 b分別相互形成錯位，形成另一散熱單元^，亦可達至 上述所提相同之功效。 “月 > 閱第/、圖』所示，係本發明第四實施例之立靡 卜=不忍®。4同時參考第—圖’本發明之—種散熱模紐 之製作方法的第二態樣’其至少包含下列步驟： 9 1338215 (1)提ί、導熱單元1，其包含複數熱導管1 1及一基 座1 2，該些熱導管i丄分別具有一受熱段i工工 與一冷卻段1 1 2,該些受熱段i 2丄結合於該基 座1 2 ; (2)提供複數散熱單元2 G，2 Q g，該些散熱單元2 c，2 0 c分別具有複數散熱板體2丄c，該些散 熱板體2 1 c分別於其外周緣設有相鄰之複數凸 出部2 .3 c，該些散熱板體21 c分別於其表面設 有複數固定孔2 5 c，該些散熱板體2丄c係分別 可為一環形板體或一弧形板體； (3) 使該散熱單元2 c，2 0 c之該些散熱板體2丄c 相互同位且間隔堆疊； (4) 將該些散熱單元2 c，2 0 c相互錯位且間隔堆 疊，使該散熱單元2 c，2 0 c同位之該些凸出部 2 3 c露出於相鄰之該散熱單元2 c ’ 2 0 c二同 位之該些凸出部2 3 c之間； (5) 使該些散熱單元2 c，2 0 c利用該些固定孔2 5 c穿設於該些冷卻段1 1 2上。 如第六圖所示，本發明之各散熱板體除可為上述第 一、二及第三實施例之型態外，各散熱板體2 le於組裝 時，係使各散熱板體2 1 c外周緣之凸出部2 3 c分別相互 對應’而形成多數個散熱單元2c、2 Oc，而每一相鄰之 政熱單元2 c、2 0 c則以相互錯位之方式設置，同樣可讓 各散熱單元2c、20c之凸出部23c形成錯位，亦可達 1338215 到上述所提相同之功效。 综上所述，本發明散熱模組之製作方法可有效改善習 用之種種缺點，可堆疊出所需型態之散熱單元，並增加各 散熱板體與外部空氣之接觸面積，而達到具有較佳之散熱 效果，進而使本發明之産生能更進步、更實用、更符合使 用者之所需，確已符合發明專利申請之要件，爰依法提出 專利申請。 惟以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍；故，凡依本發明申請專利 範圍及發明說明書内容所作之簡單的等效變化與修飾，皆 應仍屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 第一圖，係本發明之製作方法示意圖。 第二圖，係本發明第一實施例之立體外觀示意圖。 第三圖，係本發明第一實施例之側視狀態示意圖。 第四圖，係本發明第二實施例之立體外觀示意圖。 第五圖，係本發明第三實施例之立體外觀示意圖。 第六圖，係本發明第四實施例之立體外觀示意圖。 【主要元件符號說明】 1 導熱單元 II 熱導管 III 受熱段 11 1338215 112 冷卻段 12 基座 2 散熱單元 2a 散熱單元 2b 散熱單元 2c 散熱單元 2 〇c 散熱單元 2 1 散熱板體 2 1a 散熱板體 2 lb 散熱板體 2 1c 散熱板體 2 3 凸出吾P 2 3a 凸出部 2 3b 凸出部 2 3c 凸出部 2 5 固定孔 2 5a 固定孔 2 5b 固定孔 2 5c 固定孔 2 6 穿孔 2 6a 穿孔'凊Reviewed in the fifth figure, is the third embodiment of the present invention, the fortunately, the view of the figure is shown as shown in the figure, 'the heat sink body of the present invention can be the upper one: and the second In addition to the type of the embodiment, each of the heat dissipation plate bodies 2 ib can be a slab-shaped plate body, and the projections 2 3b of the peripheral edges of the heat dissipation plate bodies 2 lb are configured to match each other with a small curved surface. When the heat dissipating plate bodies 2 ib are disposed in the group, the protrusions 3 3 b of the outer periphery of each of the adjacent heat dissipating plate bodies 2 lb can be dislocated to each other to form another heat dissipating unit ^ The same effect is mentioned. According to the fourth embodiment of the present invention, the second embodiment of the present invention is the same as the second embodiment of the present invention. The sample includes at least the following steps: 9 1338215 (1) A heat transfer unit 1 comprising a plurality of heat pipes 1 1 and a base 1 2, each of which has a heated section i and a a cooling section 1 1 2, the heat receiving sections i 2 丄 are coupled to the pedestal 1 2 ; (2) providing a plurality of heat dissipating units 2 G, 2 Q g, the heat dissipating units 2 c, 2 0 c respectively having a plurality of heat dissipating plates The heat dissipation plate body 2 1 c is provided with adjacent plurality of protrusions 2 . 3 c on the outer peripheral edge thereof, and the heat dissipation plate bodies 21 c are respectively provided with a plurality of fixing holes 2 5 on the surface thereof. The heat dissipation plate body 2丄c can be an annular plate body or a curved plate body respectively; (3) the heat dissipation plate bodies 2丄c of the heat dissipation unit 2c, 20c are in the same position and (4) The heat dissipating units 2 c, 20 0 are offset from each other and stacked at intervals, so that the protrusions 2 3 c of the heat dissipating unit 2 c, 2 0 c are exposed to the adjacent heat dissipation. Unit 2 Between the embossing portions 2 3 c of the c ' 2 0 c bis; (5) the heat dissipating units 2 c, 20 0 are pierced by the fixing holes 2 5 c in the cooling segments 1 1 2, as shown in the sixth figure, in addition to the first, second and third embodiments of the heat dissipating plate body of the present invention, each of the heat dissipating plate bodies 2 le is assembled to make the heat dissipating plates The protrusions 2 3 c of the outer circumference of the body 2 1 c respectively correspond to each other to form a plurality of heat dissipation units 2c, 2 Oc, and each adjacent political heat unit 2 c, 2 0 c is arranged in a mutually dislocated manner. In the same way, the protruding portion 23c of each of the heat dissipating units 2c, 20c can be dislocated, and can reach the same effect as mentioned above. In summary, the manufacturing method of the heat dissipating module of the present invention can effectively improve various disadvantages of the conventional use. The heat dissipation unit of the desired type can be stacked, and the contact area between each heat dissipation plate body and the external air can be increased to achieve better heat dissipation effect, thereby making the invention more progressive, practical and more suitable for users. The requirements are indeed in line with the requirements of the invention patent application, and the patent application is filed according to law. The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto; therefore, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are The first figure is a schematic view of the manufacturing method of the present invention. The second figure is a schematic view of the three-dimensional appearance of the first embodiment of the present invention. A schematic view of a side view of a first embodiment of the present invention. The fourth figure is a schematic perspective view of a second embodiment of the present invention. The fifth drawing is a schematic perspective view of a third embodiment of the present invention. Fig. 6 is a perspective view showing the appearance of a fourth embodiment of the present invention. [Main component symbol description] 1 Heat conduction unit II Heat pipe III Heating section 11 1338215 112 Cooling section 12 Base 2 Heat sink unit 2a Heat sink unit 2b Heat sink unit 2c Heat sink unit 2 〇C Heat sink unit 1 1 Heat sink body 2 1a Heat sink body 2 lb heat sink body 2 1c heat sink body 2 3 bulge my P 2 3a bulge 2 3b bulge 2 3c bulge 2 5 fixing hole 2 5a fixing hole 2 5b fixing hole 2 5c fixing hole 2 6 perforation 2 6a perforation