1379717 六、發明說明： * 【發明所屬之技術領域】 本發明係關於一種散熱器及其製造方法，尤指一種散 熱面積大且具有充足間隙的散熱器及其製造方法。 【先前技術】 在電腦等電子裝置内的各電子元件運作時會產生熱 置，因電子兀件的工作溫度直接決定其使用壽命和穩定性， 為了要讓電子裝置各元件的工作溫度保持在合理的範圍 • 内，除了使該等電子裝置工作環境的溫度處於合理範圍内之 外必須於會產熱的電子元件上加設一散熱器，以促進與環 境之熱父換，達到排散電子元件熱量進而使該等電子裝置 能正常運作之目的。傳統的散熱器外觀圖如圖彳彳所示，其 係在一基座90上形成複數鰭片91，該基座9〇的底面92 係與如中央處理器（CPU)、電晶體等電子元件接觸，從該等 電子π件產生的熱能通過與其緊密接觸的散熱器底面92以 熱傳導的方式傳遞到鰭片91，積聚在鰭片91的熱能再通過 • 如風扇吹動等熱對流的方式傳到外界空氣中散熱，藉由前述 散熱器之熱傳導與熱對流，即可移除電子元件所產生的熱 量。 唯’傳統的散熱器是用複數鰭片散熱，容易因該散熱 器與風扇或出風口的對應位置不同產生擾流的現象，熱量 無法有效的被熱對流的方法帶到外界空氣中散熱，使整體 散熱效果變差，且因傳統散熱器係由鋁擠型構成，其將使 轉片的高度和最小間距有其限制，因而使散熱面積的擴充 受到影響’進而影響其散熱效果。以上所述者皆為傳統的 3 1379717 散熱器未臻理想之處，實有待進一步檢討，並謀求 • 解決方案。 订的 【發明内容】 有鑑於傳統散熱器結構的缺點，本發明的主 曰的在 於提供一種散熱器，其散熱面積大且具有充足間隙可迅速 排散電子元件運作時所產生的熱能。 、 為達成前述目的採取的主要技術手段係令前述 • 包括有： = 一固定座，該固定座上係形成有一個以上的開口； 複數片狀基材，該片狀基材上形成有複數盲溝，該複 數片狀基材具有一第一端及與該第一端相對應的—第二 端，其第一端固定於固定座的開口内，其第二端沿盲溝分 離而形成複數呈放射狀散開的散熱條。 當本發明裝設在-電子元件上時，係利用散熱條的第 一端與該電子元件的表面接觸並進行熱傳導，將電子元件 _產生上的熱能傳導到該散熱條的第二端，再由該散熱條的 第二端進行熱對流將熱能傳至外界空氣中散熱；且因該散 熱器的片狀基材形成的散熱條係呈放射狀散開，故其散熱 、效果不受對應空間的不同所影響，並使該散熱器的散熱面、 積大且具有充足間隙’可迅速排散電子元件運作時所產生的 熱能》 本發明另提供-種前述散熱器的製造方法，其步驟包 括有： #供複數片狀基材，每—片狀基材在其—面以上形成 4 1379717 有複數盲溝； 將複數片狀基材併排後，以一端置入並固定於—固定 座的開口内； 將片狀基材沿另端的盲溝扳開以形成複數散熱條，使 各散熱條呈放射狀散開； . 刖述製造方法因固定於固定座上的基材為片狀，故可 方便置入固定座及執行固定作業，等到其中一端固定後再 把片狀基材另端分開來成為條狀，以有效提高散熱面積， 鲁 故具有製造方便的優點。 【實施方式】 本發明一較佳實施例之組裝完成的立體圖如圖彳所 示，本發明係為一種散熱器’其包括有一固定座2〇與已分 割為複數散熱條315的複數片狀基材31(如圖3所示）所組 成，該片狀基材31具有一第一端與一第二端，其第_端係 固定於固定座20的開口 21(如圖2所示）内，其第二端呈放 • 射狀散開；該散熱器組裝前的形狀如圖2至圖4所示，該 固定座20為一平板狀，其上係形成有一個以上的開口 21， 其可容納複數片狀基材31，在此較佳實施例中，該開口 Μ 係位於固定座20的中央，該開口 21形狀為矩形其數量 為一個；又請參照圖2所示，在該開口 21周圍形成有一個 以上的凹槽22，該凹槽22上各設有一個以上迫緊件23， 且在開口 21與各凹槽22之間各形成有一迫緊部24，在固 定座20上係形成有一個以上突出的固定部，各固定部上分 別形成有一個以上的鎖固孔25,其係供設固定件（圖中未示 5 1379717 將散熱器固定在欲散熱的電子元件上用，在此較佳實施例 中，在該開口 21四周各形成有一凹槽22，且該凹槽22上 各設有一迫緊件23’該迫緊件23係具有一頂面與一底面’ 且該迫緊件23在接近迫緊部24 —側的寬度從頂面沿底面 遞減（如圖6所示）’且固定座20係為一矩形，且該固定座 20的各角落係分別形成有一突出的固定部，各固定部上分 別形成有一鎖固孔25;尚未組裝的複數片狀基材31直立排 列成一矩體，單一片狀基材31的放大圖如圖3所示，該片 狀基材31具有一第一面311與一第二面312(如圖4所 示）’其第一面311形成有複數盲溝313,其第二面也形成 有複數盲溝314，該複數片狀基材31上的複數盲溝313、 314可使用壓輪滾壓片狀基材31形成，或用工具剖切片狀 基材31專方式形成’請參閱圖4所示，且第二面312上形 成有盲溝314的位置係對應於第一面311上各盲溝313的 位置，在此較佳實施例中，各盲溝31 3間為等距且第一 面311上各盲溝313與第二面.312上各盲溝314的形狀與 深度相同，各盲溝313與盲溝314之間的片狀基材31厚度 較未設盲溝313、314之部分薄，在組裝時可從盲溝31 3、 314處將片狀基材31分開。當該散熱器裝設在一電子元件 上時，係利用散熱條315的第一端與該電子元件的表面接 觸並進行熱傳導，將電子元件產生上的熱能傳導到該散_ 條315的第二端’再由該散熱條315的第二 將熱能傳至外界空氣中散熱。 仃” ·、對机 茲將本發明之複數片狀基材31與固定座2〇結合方法 以連續之分解圖式加以說明，請參閱目5與圖6所示，係 6 1379717 將複數片狀基材併排，且複數片狀基材31之間的盲溝 31 3(如圖3所示）位置互相對齊後，以盲溝313盥固定座2〇 非平行的方向將複數片狀基# 31的第一端置入、固定座2〇 的開口 2，内，再將迫緊件23塞入凹槽㈡内；請參閱" 與圖7所示’複數片狀基材31與迫緊部24間形成有一間 隙，當把迫緊件23塞入固定座2〇的凹槽。後，迫緊部 24便會被迫緊件23擠壓而往開口 21的方向移動使開口 2”目對内縮，返緊複數片狀基材31進而束緊該複數片狀基 材31的第-端，使複數片狀基材31能夠固定在固定座2〇 上’在此較佳實施例中，該迫緊部24因受到寬度從頂面沿 底面遞減的迫緊件23壓迫，故該迫緊部24的上半部係接 觸到複數片狀基材31，且該迫緊部24產生了寬度變窄的形 變；且該片狀基材31與固定座2G除了用前述方法固定外， 還可使用焊接或使用黏著劑等方法固$，請參_目 示，係將複數片狀基材31併排，且複數片狀基材31之間 的盲溝313(如圖3所示）位置互相對齊後，將該複數片狀基 材31的第-端置入固定座2〇的開口 21内使用焊接工且 將突設於該開口底端的各片狀基材與開口，再用焊接工且 將突設於該開口21底端的各片狀基材31與開口 2 : 劑 一焊料層41，使各片狀基材31與開卩21相互連接 7複數Μ基材31固定在該岐座2Q上，最後 複數片狀基材31與該焊料層化组成的底面42磨光使w :平坦的接觸面；也可將複數片狀基材的第-端沾上點著 夏数月狀基材置入固定座的開口内，待黏荽 乾固後該複數片狀基材即固定在固定座上。 7 1379717 請參閱圖8及圖9所示，當複數片狀基材31固定在固 定座20上後’便可將複數片狀基材31盲溝313、314 (如 圖3所不）分開進而形成散熱條315,並使用治具將散熱條 315板開’使在同一片狀基材31上的各散熱條315的第二 端呈對稱或不對稱扇狀散開；請參閱圖1所示，最後使用 治具將靠不同片狀基材31上的散熱條31 5往與同一片狀基 材31散熱條31 5間呈扇狀散開的不同方向扳開，使各片狀 基材31間的散熱條31 5也呈對稱或不對稱扇狀散開，進而1379717 VI. Description of the invention: * Technical field to which the invention pertains The present invention relates to a heat sink and a method of manufacturing the same, and more particularly to a heat sink having a large heat dissipation area and sufficient clearance and a method of manufacturing the same. [Prior Art] When electronic components in an electronic device such as a computer operate, heat is generated. The operating temperature of the electronic component directly determines its service life and stability, in order to keep the operating temperature of each component of the electronic device reasonable. Scope • In addition to making the temperature of the working environment of the electronic device within a reasonable range, a heat sink must be added to the electronic component that generates heat to promote the replacement with the environment, to achieve the discharge of electronic components. The heat in turn allows the electronic devices to function properly. The conventional heat sink is shown in the figure, which is formed on a base 90 to form a plurality of fins 91. The bottom surface 92 of the base 9 is connected to electronic components such as a central processing unit (CPU) and a transistor. The heat generated by the electrons from the electrons is transmitted to the fins 91 by heat conduction through the bottom surface 92 of the heat sink, and the heat accumulated in the fins 91 passes through the heat convection such as a fan blow. By dissipating heat into the outside air, the heat generated by the electronic components can be removed by the heat conduction and heat convection of the aforementioned heat sink. Only the traditional radiator uses a plurality of fins to dissipate heat. It is easy to cause turbulence due to the difference between the radiator and the corresponding position of the fan or the air outlet. The heat cannot be effectively radiated by the convection method to the outside air to dissipate heat. The overall heat dissipation effect is deteriorated, and since the conventional heat sink is composed of an aluminum extrusion type, it will limit the height and the minimum pitch of the rotor, thereby affecting the expansion of the heat dissipation area, thereby affecting the heat dissipation effect. All of the above are the ideals of the traditional 3 1379717 radiator, which needs further review and seek solutions. SUMMARY OF THE INVENTION In view of the shortcomings of the conventional heat sink structure, the main body of the present invention provides a heat sink having a large heat dissipation area and sufficient clearance for rapidly dissipating heat energy generated when the electronic component operates. The main technical means adopted to achieve the foregoing objectives are: • including: a fixed seat having more than one opening formed therein; a plurality of sheet-like substrates on which a plurality of blinds are formed a plurality of sheet-like substrates having a first end and a second end corresponding to the first end, wherein the first end is fixed in the opening of the fixing seat, and the second end is separated along the blind groove to form a plurality Radiating strips that radiate radially. When the present invention is mounted on an electronic component, the first end of the heat dissipation strip is brought into contact with the surface of the electronic component and thermally conducted, and the generated thermal energy is transmitted to the second end of the heat dissipation strip. The heat convection of the second end of the heat strip transfers heat energy to the outside air to dissipate heat; and the heat dissipation strip formed by the sheet substrate of the heat sink is radially dispersed, so that the heat dissipation and the effect are not affected by the corresponding space. Differently affected, and the heat dissipating surface of the heat sink, accumulating and having sufficient gap 'to quickly dissipate heat energy generated when the electronic component operates" The present invention further provides a method for manufacturing the foregoing heat sink, the steps including : # supply a plurality of sheet-like substrates, each sheet-like substrate forms 4 1379717 above its surface with a plurality of blind grooves; after the plurality of sheet-like substrates are arranged side by side, one end is placed and fixed in the opening of the fixing seat Opening the sheet substrate along the blind groove at the other end to form a plurality of heat dissipation strips, so that the heat dissipation strips are radially dispersed; Entering Base and performing the fixing operation, wherein one end is fixed until after the end of the other sheet-like substrate to be separated from a strip, effective to increase heat dissipation area, so that Lu has the advantage of easy manufacturing. [Embodiment] An assembled perspective view of a preferred embodiment of the present invention is shown in FIG. 1 . The present invention is a heat sink that includes a fixing base 2 and a plurality of sheet bases that have been divided into a plurality of heat dissipation strips 315. The material 31 (shown in FIG. 3) has a first end and a second end, and the first end is fixed to the opening 21 of the fixing base 20 (as shown in FIG. 2). The second end of the heat sink is arranged to be scattered; the shape of the heat sink before assembly is as shown in FIG. 2 to FIG. 4, and the fixing base 20 is a flat plate having more than one opening 21 formed thereon. The plurality of sheet-like substrates 31 are accommodated. In the preferred embodiment, the openings are located at the center of the fixing base 20. The opening 21 is rectangular in shape and has a number of one; as shown in FIG. 2, the opening 21 is also shown. More than one groove 22 is formed around the groove 22, and each of the grooves 22 is provided with one or more pressing members 23, and a pressing portion 24 is formed between the opening 21 and each groove 22, and is fixed on the fixing base 20. One or more protruding fixing portions are formed, and one or more locking portions are respectively formed on each fixing portion 25, which is provided with a fixing member (not shown in FIG. 5 1379717, the heat sink is fixed on the electronic component to be cooled, and in the preferred embodiment, a groove 22 is formed around the opening 21, and Each of the recesses 22 is provided with a pressing member 23' having a top surface and a bottom surface' and the width of the pressing member 23 on the side close to the pressing portion 24 decreases from the top surface along the bottom surface (eg Figure 6)) and the fixing base 20 is a rectangular shape, and each corner of the fixing base 20 is respectively formed with a protruding fixing portion, and each fixing portion is respectively formed with a locking hole 25; a plurality of sheets not yet assembled The substrate 31 is arranged upright in a rectangular body. An enlarged view of the single sheet substrate 31 is shown in FIG. 3. The sheet substrate 31 has a first surface 311 and a second surface 312 (shown in FIG. 4). The first surface 311 is formed with a plurality of blind grooves 313, and the second surface is also formed with a plurality of blind grooves 314. The plurality of blind grooves 313, 314 on the plurality of sheet-like substrates 31 can be used to roll the sheet-like substrate 31 by using a pressure roller. Forming, or forming a sliced substrate 31 by means of a tool, please refer to FIG. 4, and a blind groove 314 is formed on the second surface 312. The position corresponds to the position of each blind groove 313 on the first surface 311. In the preferred embodiment, the blind grooves 31 3 are equidistant and the blind grooves 313 and the second surface 312 on the first surface 311. The shape and depth of each of the upper blind grooves 314 are the same, and the thickness of the sheet-like base material 31 between each of the blind grooves 313 and the blind groove 314 is thinner than that of the portion where the blind grooves 313 and 314 are not provided, and can be separated from the blind groove 31 3 during assembly. The sheet substrate 31 is separated at 314. When the heat sink is mounted on an electronic component, the first end of the heat dissipation strip 315 is brought into contact with the surface of the electronic component and thermally conducted to generate thermal energy from the electronic component. Conducted to the second end of the strip 315, and then the second heat of the strip 315 transfers heat to the outside air for heat dissipation.仃 、 对 对 对 对 对 对 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 After the substrates are arranged side by side, and the positions of the blind grooves 31 3 (shown in FIG. 3) between the plurality of sheet-like substrates 31 are aligned with each other, the plurality of sheet-like bases are formed in the non-parallel direction of the blind grooves 313. The first end is inserted into the opening 2 of the fixing seat 2, and the pressing member 23 is inserted into the groove (2); see " and the plurality of sheet-like substrate 31 and the pressing portion shown in FIG. 24 forms a gap, and when the pressing member 23 is inserted into the groove of the fixing seat 2, the pressing portion 24 is pressed by the pressing member 23 to move in the direction of the opening 21 to make the opening 2" Retracting, tightening the plurality of sheet-like substrates 31 to thereby tighten the first ends of the plurality of sheet-like substrates 31, so that the plurality of sheet-like substrates 31 can be fixed on the fixing base 2'. In the preferred embodiment, The pressing portion 24 is pressed by the pressing member 23 whose width decreases from the top surface along the bottom surface, so that the upper half of the pressing portion 24 contacts the plurality of sheet-like base materials 31, and the pressing portion is tight. The portion 24 is deformed in which the width is narrowed; and the sheet-like base material 31 and the fixing base 2G are fixed by the method described above, or by welding or using an adhesive, etc. The sheet-like base materials 31 are arranged side by side, and the blind grooves 313 (shown in FIG. 3) between the plurality of sheet-like base materials 31 are aligned with each other, and the first end of the plurality of sheet-like base materials 31 is placed in the fixed seat 2〇. In the opening 21, a sheet metal substrate and an opening protruding from the bottom end of the opening are used in the opening 21, and the sheet-like substrate 31 and the opening 2 protruding from the bottom end of the opening 21 are welded by a welder: The solder layer 41 connects the sheet-like substrate 31 and the opening 21 to each other. 7 The plurality of base materials 31 are fixed to the shank 2Q, and finally the plurality of sheet-like substrates 31 and the bottom surface 42 of the solder layer are polished. w: a flat contact surface; the first end of the plurality of sheet-like substrates may be placed in the opening of the fixing seat with the summer moon-shaped substrate, and the plurality of sheet-like substrates shall be after the adhesive is dried. Fixed to the fixed seat. 7 1379717 Referring to FIG. 8 and FIG. 9, when the plurality of sheet-like base materials 31 are fixed on the fixing base 20, the blind grooves 313 and 314 of the plurality of sheet-like base materials 31 can be separated (as shown in FIG. 3). Forming the heat dissipation strips 315, and using the jig to open the heat dissipation strips 315, so that the second ends of the heat dissipation strips 315 on the same sheet substrate 31 are symmetrical or asymmetrically fanned out; see FIG. Finally, the heat-dissipating strips 31 5 on the different sheet-like base materials 31 are pulled apart in different directions from the heat-dissipating strips 31 5 of the same sheet-like base material 31 by using the jig, so that the respective sheet-like base materials 31 are separated. The heat strips 3 5 are also scattered in a symmetrical or asymmetrical fan shape, and further
使各散熱條315的第二端呈放射狀散開，即完成該散熱器 的製造。此種製造方法因放入固定座2〇開口 21的片狀基 材31形狀為片狀，等到第一端固定後才把片狀基材31分 開形成條狀的散熱條315，無須將散熱條315插入固定座 20的開σ 21 ，故具有製造方便的優點，且因該散熱 器的片狀基材31形成的散熱條315係呈放射狀散開，故其 散熱效果不受對應空間的不同所影響，並使該散熱器的散 熱面積大且具有充足的間隙，可迅速排散電子元件運作時所 產生的熱能。 以上所述僅為本發明之較佳實施例，並非對本發明作 任何形式上之限制，雖然本發明已以較佳實施例揭露如 上，然而並非用以限定本發明，任何熟悉本專業的技術人 員’在不脫離本發明技術方案的範圍内，當可利用上述揭 示的技術内容作出些許更動或修飾為等同變化的等效實施 例，但凡是未脫離本發明技術方案的内容，依據本發明的 技術實質對以上實施例所作的任何簡單修改、等同變化與 修飾，均仍屬於本發明技術方案的範圍内。 8 1379717 【圖式簡單說明】 圖1係為本發明—較佳實施例組裝完成之立體圖 圖2係為本發明一較佳實施例之分解圖 圖3係為本發明一較佳實施例片狀基材之放大圖 圖4係為本發明一較佳實施例片狀基材之上視圓 圖5係為本發明一較佳實施例之組裝過程圖 圖6係為本發明一較佳實施例之組裝過程剖面圖 圖7係為本發明一較佳實施例之另一組裝過程剖 圖8係為本發明一較佳實施例之另一組裝過程圖 圖9係為本發明一較佳實施例之組裝過程 1 忍圖 圖1 〇係為本發明另—較佳實施例之組裝過程刊 圖1 1係為既有散熱器之外觀圖 1 【主要元件符號說明】 21開口 23迫緊件 25鎖固孔 311第一面 313盲溝 315散熱條 42底面 91鰭片 2 0固定座 22 凹槽 24迫緊部 31片狀基材 312第二面 314盲溝 41焊料層 90基座 92底面The second end of each of the heat dissipating strips 315 is radially dispersed to complete the manufacture of the heat sink. In the manufacturing method, the sheet-like base material 31 placed in the opening 21 of the fixing base has a shape of a sheet, and the sheet-like base material 31 is separated into strip-shaped heat radiating strips 315 after the first end is fixed, without disposing the heat radiating strip. 315 is inserted into the opening σ 21 of the fixing base 20, so that it has the advantage of being convenient to manufacture, and the heat dissipation strip 315 formed by the sheet-like base material 31 of the heat sink is radially dispersed, so that the heat dissipation effect is not affected by the corresponding space. The effect is that the heat sink has a large heat dissipation area and a sufficient gap to quickly dissipate heat generated by the operation of the electronic component. The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. The present invention has been disclosed in the above preferred embodiments, but is not intended to limit the present invention, and any skilled person skilled in the art. 'Equivalent embodiments that may be modified or modified to equivalent variations may be made without departing from the technical scope of the present invention, without departing from the technical scope of the present invention, the technology according to the present invention. Any simple modifications, equivalent changes and modifications made to the above embodiments are still within the scope of the technical solutions of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a preferred embodiment of the present invention. FIG. 2 is an exploded view of a preferred embodiment of the present invention. FIG. 3 is a view of a preferred embodiment of the present invention. 4 is a top view of a sheet substrate according to a preferred embodiment of the present invention. FIG. 5 is an assembly process diagram of a preferred embodiment of the present invention. FIG. 6 is a preferred embodiment of the present invention. FIG. 7 is another assembly process of a preferred embodiment of the present invention. FIG. 8 is another assembly process of the present invention. FIG. 9 is a preferred embodiment of the present invention. Assembly Process 1 FIG. 1 is an assembly process of another preferred embodiment of the present invention. FIG. 1 is an appearance of an existing heat sink. FIG. 1 [Main component symbol description] 21 opening 23 pressing member 25 lock Solid hole 311 first surface 313 blind groove 315 heat sink strip 42 bottom surface 91 fin 2 0 fixing seat 22 groove 24 pressing portion 31 sheet substrate 312 second surface 314 blind groove 41 solder layer 90 base 92 bottom surface