TWI449497B - Method of manufacturing fin - Google Patents

Description

Heat dissipation fin manufacturing method

The invention relates to a method for manufacturing a heat dissipation fin, in particular to a heat dissipation fin, a heat sink and a manufacturing method thereof.

With the increasing demand for the efficiency of computer devices, the computer devices on the market are more powerful and faster to execute, and the overall size of the computer devices is moving toward a light and portable appearance.

In today's thin and light computer devices, there is limited space available, especially for electronic processing units such as central processing units (CPUs), graphics processing units (GPUs), south bridge chips or north bridge chips. The components are all equipped with ultra-high-frequency computing power. When the computing operation is performed, the operating temperature and thermal energy generated by the components are higher. If the high-level heat energy generated by the electronic components is not eliminated in time, the computer device will be caused. Overheating can't be performed normally, or even cause electronic components to burn out.

In order for the computer device to function properly and to perform its maximum function, it is important to fully dissipate the high amount of heat energy inside the computer device. At present, the most commonly used heat dissipation method is to mount a heat sink made of aluminum alloy or copper alloy on a heat generating component (for example, a central processing unit), and generate an electronic component through the heat sink during operation. The high thermal energy is taken away, and a cooling fan is used to blow a flow of air to the heat sink to perform heat dissipation of forced heat convection.

The conventional heat sink is composed of a plurality of heat-dissipating fins, and the conventional heat-dissipating fins are mostly made by continuous extrusion molding, and the manufacturer cuts them into various sizes. Cooling fins. Therefore, the shape of the conventional heat sink fin is designed as a long rectangular thin plate, so as to facilitate the manufacture of heat sinks of different sizes and models.

However, the long rectangular shape of the above-mentioned conventional heat sink fins causes the heat dissipation performance of the heat sink to be inconspicuous. In detail, the heat dissipation fin receives the high thermal energy generated by the electronic component, and transmits the thermal energy to the external radiation by the cross-sectional area of the heat dissipation fin, but the heat energy is closer to the outer edge of the heat dissipation fin, and the surface area thereof The greater the influence of the heat dissipation effect, the surface area, the cross-sectional area and the width dimension of the central portion and the outer edge portion of the conventional heat-dissipating fin are the same, so that the heat energy transmitted to the outer edge of the heat-dissipating fin cannot be dissipated in time and quickly, still causing the computer device. Internal heat accumulation problem.

In view of the above problems, the present invention provides a method for manufacturing a heat dissipating fin, which solves the problem that the surface area, the cross-sectional area and the width dimension of the central portion and the outer edge portion of the conventional heat dissipating fin are the same, resulting in the inability of the conventional heat dissipating fin to utilize the surface area. Quickly dissipate the thermal energy generated by electronic components.

The invention discloses a heat dissipating fin suitable for dissipating heat from a heating element, and the heating element generates a thermal energy. The heat dissipating fin includes a heat transfer portion and a heat dissipating portion, wherein the heat transfer portion has at least one side, and the heat transfer portion receives the heat energy of the heat generating component and transmits the heat to the heat dissipating portion. The heat dissipating portion is disposed on a side of the heat transfer portion, and the heat dissipating portion receives the heat energy transmitted by the heat transfer portion. The width of the heat dissipating portion gradually increases from one end of the connecting side toward the side away from the side.

The heat transfer portion disclosed in the present invention further has a heat transfer section, and the heat dissipation portion further has a heat dissipation section, wherein the area of the heat transfer section is substantially larger than the area of the heat dissipation section.

The invention further discloses a heat sink, which is arranged by the plurality of heat dissipation fins The columns are composed, and the fins are connected to each other by a fixing member.

The invention further discloses a method for manufacturing a heat dissipating fin, which firstly applies a force to the edge of a heat dissipating fin, the unstressed portion forms a heat transfer portion, the stressed portion forms a heat dissipating portion, and the heat dissipating portion is connected to the heat transfer portion. The side of the department. Next, the heat radiating portion is extended so that the width of the heat radiating portion is gradually increased from one end of the connecting side toward the side away from the side.

The effect of the invention is that the heat dissipation portion of the heat dissipation fin is designed to be larger than the width of the heat transfer portion, and the heat energy generated by the heat generating component is not affected by the area of the heat transfer portion, and the heat transfer portion is The heat is radiated outward to the heat dissipating portion at the outer edge of the heat dissipating fin, and the heat energy is quickly dissipated by occupying the heat dissipating portion of a larger width, thereby effectively improving the heat dissipating performance of the heat dissipating fin.

The features, implementations, and utilities of the present invention are described in detail below with reference to the drawings.

Please refer to the schematic diagrams and plan views shown in Figures 1 to 3, and also refer to the flow chart of the manufacturing method shown in Figure 7. The heat dissipation fin 100 disclosed in the first embodiment of the present invention includes a heat transfer portion 110 and a heat dissipation portion 120. The heat dissipation portion 120 is disposed on the side 112 of the heat transfer portion 110. In the embodiment of the heat dissipation fin 100 disclosed in the embodiment, the heat dissipation portion 120 surrounds the three side edges 112 of the heat transfer portion 110 (including one long side and two opposite short sides of the heat transfer portion 110).

In order to dissipate the thermal energy, the heat transfer portion 110 and the heat dissipating portion 120 of the heat dissipating fin 100 of the present embodiment may be made of a metal material having a high thermal conductivity such as aluminum, aluminum alloy, copper or copper alloy. However, those skilled in the art may also use any material having a high thermal conductivity as the material of the heat dissipation fin 100 of the present embodiment, and Limited.

It should be noted that the heat transfer portion 110 and the heat dissipation portion 120 of the embodiment of the present invention are integrally formed, and the heat dissipation portion 120 extends from the side 112 of the heat transfer portion 110. The heat dissipating portion 120 can be formed by applying a force to the edge of the heat dissipating fin 100, and the unstressed portion forms the heat transfer portion 110, and the stressed portion constitutes the heat dissipating portion 120, and the heat dissipating portion 120 is connected to the heat dissipating portion 120. The side 112 of the heat transfer portion 110 (step 500 shown in FIG. 7), in the first to third figures, the present embodiment applies force to the three edges of the heat dissipation fin 100 to form respectively. The three heat dissipation portions 120 are connected to the three side edges 112 of the heat transfer portion 110, but are not limited to the number of installations disclosed in the embodiment.

Then, an external force is continuously applied to the heat dissipating portion 120 to deform the heat dissipating portion 120 outwardly, so that the width D1 of the heat dissipating portion 120 is gradually changed from the end connected to the side 112 of the heat transfer portion 110 toward the side away from the side 112. Increased formation (step 510 shown in Figure 7). That is, the width D2 of the heat dissipating portion 120 away from the side 112 of the heat transfer portion 110 is substantially larger than the width D1 of the side portion 112 of the heat dissipating portion 120 connected to the heat transfer portion 110.

Those skilled in the art can use any suitable machining method to form the heat dissipating portion 120, such as a rolling process (making tool) or a stamping method (manufacturing tool), but not limited to the above-mentioned manufacturing method. .

Referring to FIGS. 1 to 3 , the heat transfer portion 110 of the heat dissipation fin 100 of the present embodiment has a heat transfer surface 111 and a heat transfer portion 113 , and the heat dissipation portion 120 has a heat dissipation surface 121 and a heat dissipation portion. Section 122. Wherein, the heat dissipating portion 120 located at the outer edge of the heat transfer portion 110 is subjected to the width D2 of the heat dissipating surface 121 after the force is extended. The heat is greater than the width D1 of the heat transfer surface 111 of the heat transfer portion 110, and since the heat dissipation portion 120 is pressed outward from the side 112 of the heat transfer portion 110 by an external force (for example, a mechanical process such as rolling or pressing), The area of the heat transfer section 113 of the heat transfer portion 110 is substantially larger than the area of the heat dissipation portion 122 of the heat dissipation portion 120.

Of course, the heat transfer portion 110 and the heat dissipating portion 120 disclosed in the present invention may be separate members, and the heat dissipating portion 120 may be coupled to the side 112 of the heat transfer portion 110 by a combination of welding, bonding, locking, or the like. It is not limited to the integrally formed aspect disclosed in the present invention. In addition, since the heat transfer portion 110 and the heat dissipating portion 120 are separate members, the embodiment of the present invention is not constituted by a process of applying an external force by pressing, rolling, or the like, and thus the heat transfer section of the heat transfer portion 110 The area of 113 may be larger than the area of the heat dissipation section 122 of the heat dissipation portion 120, or the area of the heat transfer section 113 of the heat transfer portion 110 may be equal to the area of the heat dissipation section 122 of the heat dissipation portion 120, or the area of the heat transfer portion 113 of the heat transfer portion 110 may be smaller than The area of the heat dissipation section 122 of the heat dissipation portion 120 is not limited thereto.

Moreover, the heat transfer surface 111 of the heat transfer portion 110 may have an area larger than the heat dissipation surface 121 of the heat dissipation portion 120, or the heat transfer surface 111 of the heat transfer portion 110 may have an area equal to the heat dissipation surface 121 of the heat dissipation portion 120 or heat transfer. The area of the heat transfer section 113 of the portion 110 may be smaller than the area of the heat dissipation surface 121 of the heat dissipation portion 120, and is not limited thereto. It is important that the width D2 of the heat dissipation surface 121 of the heat dissipation portion 120 must be relatively larger than the width D1 of the heat transfer surface 111 of the heat transfer portion 110 in order to optimize the heat dissipation performance of the heat dissipation fin 100 disclosed in the present invention.

Referring to FIG. 4, if a plurality of heat dissipation fins 100 of the present invention are arranged in a direction, and each of the heat dissipation fins 100 is provided with a fixing member 210 (for example, an elongated plate) Connected to each other to form a heat sink 200.

5A and 5B are a perspective view and a plan side view of a heat sink 200 applied to an electronic device according to an embodiment of the present invention. As shown in the figure, a heat sink 200 composed of a plurality of heat dissipation fins 100 of the present invention can be installed in an electronic device for heat dissipation, and the electronic device includes a heat generating component 300, such as a central processing unit (central An electronic component such as a processing unit (CPU) or a graphics processing unit (GPU), and the above-mentioned electronic components generate a large amount of thermal energy when in operation. In addition, the electronic device further has at least one fan 400 for generating an airflow to blow the heat sink 200 and the heat generating component 300 to perform heat dissipation work of forced heat convection.

As shown in FIG. 4, FIG. 5A and FIG. 5B, each of the heat dissipation fins 100 has an appropriate spacing. When the airflow generated by the fan 400 blows the heat sink 200 in a gas flow direction F, the airflow is along. The heat transfer portion 110 and the heat radiating portion 120 of each of the heat radiating fins 100 are blown unimpeded in the airflow direction F, and the heat radiating fins 100 are radiated by heat convection.

Continuing to refer to FIGS. 5A and 5B , the heat sink 200 is in contact with the base 500 by the heat transfer portion 110 of each of the heat dissipation fins 100 , and the heat generating component 300 is also attached to the base 500 . That is, the mounting position of the base 500 is between the heat dissipation fins 100 and the heat generating component 300, and the base 500 is in contact with the heat transfer portion 110 and the heat generating component 300, respectively.

The base 500 of the embodiment may be a material having a high thermal conductivity, such as a metal material such as gold, silver or copper, but is not limited thereto. The heat sink 200 of the present embodiment needs to be in contact with the heat generating component 300 by means of the base 500 having a relatively large flat surface. The medium can achieve a better heat conduction effect, thereby improving the heat dissipation performance of the heat sink 200 of the present invention.

The base 500 receives the heat energy generated by the heat generating component 300, transfers the heat energy to the heat transfer portion 110, and finally transmits it to the heat radiating portion 120 to be dispersed. Since the heat transfer section 113 of the heat transfer portion 110 of the embodiment of the present invention has a large area, the heat energy is quickly conducted outward to the heat radiating portion 120, so that the heat transfer portion 110 achieves the most efficient conduction heat energy effect. The heat dissipating surface 121 of the heat dissipating portion 120 has a large width. When the heat energy is transmitted to the heat dissipating portion 120, the heat dissipating surface 121 occupies a large width and is convected with the outside air, so that the heat energy can be dissipated more quickly. The overall heat dissipation performance of the heat sink 200 is improved, and the problems caused by heat accumulation are more effectively avoided.

Moreover, the heat dissipation surface 121 of the large width of the heat dissipation portion 120 disclosed in the present invention forms a forced heat convection effect with the airflow blown by the fan 400, thereby improving the heat dissipation capability of the heat sink 200.

6A is a plan view showing a heat dissipating fin 100 according to a second embodiment of the present invention, and FIG. 6B is a plan view showing a heat dissipating fin 100 according to a third embodiment of the present invention. The heat dissipation fins 100 of the second embodiment and the third embodiment are similar in structure to the heat dissipation fins 100 of the first embodiment, and the heat dissipation fins 100 of the second embodiment and the third embodiment each include a heat transfer. The heat dissipation portion 120 is disposed on the side 112 of the heat transfer portion 110 .

However, the structure of the heat dissipation fin 100 of the second embodiment is different in that the heat dissipation portion 120 of the heat dissipation fin 100 of the second embodiment is only from one side 112 of the heat transfer portion 110 (the long side of the heat transfer portion 110). Gradually extended, as shown in Figure 6A; The heat dissipating portion 120 of the heat dissipating fin 100 of the embodiment is formed by gradually extending from the opposite side 112 of the heat transfer portion 110 (the two short sides of the heat transfer portion 110) as shown in FIG. 6B. The design of the second embodiment and the third embodiment can reduce the space occupied by the heat dissipation fins 100, and is suitable for use in an electronic device with limited internal space, and has better heat dissipation performance.

The heat sink fin of the invention is designed such that the width of the heat dissipating surface of the heat dissipating portion is substantially larger than the width of the heat transfer surface of the heat transfer portion, and the heat energy generated by the heat generating component is not affected by the surface area of the heat transfer portion, and is quickly outward from the heat transfer portion. Conducted to the heat dissipating portion on the outer edge of the heat dissipating fin, and thermally convected with the outside air by a large-width heat dissipating surface, thereby increasing the heat exchange performance of the heat dissipating fin, so that the heat energy can be quickly dissipated, thereby effectively improving heat dissipation. The heat dissipation performance of the fins avoids the occurrence of heat accumulation.

Moreover, the heat transfer portion and the heat dissipating portion of the heat dissipating fin of the present invention are integrally formed, and the external force pressing method gradually increases to form a heat dissipating portion having a larger width, so that the material cost of the heat dissipating fin and the heat sink is not additionally increased, and Both have good heat dissipation performance.

Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, structures, and features described in the scope of the present application. And the number of modifications may be made, and the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to the specification.

100‧‧‧heat fins

110‧‧‧Transfer Department

111‧‧‧heat transfer surface

112‧‧‧ side

113‧‧‧heat transfer section

120‧‧‧ Department of heat dissipation

121‧‧‧heating surface

122‧‧‧heat section

200‧‧‧heatsink

210‧‧‧Fixed parts

300‧‧‧heating components

400‧‧‧fan

500‧‧‧Base

F‧‧‧Airflow direction

D1, D2‧‧‧ width

FIG. 1 is a perspective view of a heat dissipating fin according to a first embodiment of the present invention.

Fig. 2 is a front elevational view showing the heat dissipating fin of the first embodiment of the present invention.

Fig. 3 is a top view of the heat dissipation fin of the first embodiment of the present invention.

Figure 4 is a perspective view of a heat sink according to a first embodiment of the present invention.

FIG. 5A is a perspective view showing the heat sink of the first embodiment of the present invention applied to an electronic device.

Fig. 5B is a side view showing the application of the heat sink of the first embodiment of the present invention to an electronic device.

Fig. 6A is a front elevational view showing a heat dissipating fin according to a second embodiment of the present invention.

FIG. 6B is a front elevational view showing the heat dissipation fin of the third embodiment of the present invention.

Figure 7 is a flow chart showing the steps of the method for manufacturing the heat sink fin of the present invention.

100‧‧‧heat fins

110‧‧‧Transfer Department

111‧‧‧heat transfer surface

112‧‧‧ side

120‧‧‧ Department of heat dissipation

121‧‧‧heating surface

Claims (4)

A method for manufacturing a heat dissipation fin, comprising the steps of: applying a force to an edge of a heat dissipation fin; forming a heat transfer portion on the unstressed portion, forming a heat dissipation portion on the force receiving portion, and connecting the heat dissipation portion to the heat transfer portion One side of the hot portion; and the heat dissipating portion is extended such that the width of the heat dissipating portion gradually increases from one end of the side to the side away from the side. The method for manufacturing a heat dissipating fin according to claim 1, wherein in the step of extending the heat dissipating portion, an area of a heat dissipating portion of the heat dissipating portion is substantially smaller than a heat transfer portion of the heat transfer portion by being pressed by force Area. The method for manufacturing a heat dissipating fin according to claim 1, wherein in the step of applying a force to the edge of the heat dissipating fin, three heat dissipating portions are respectively formed on three sides of the heat transfer portion. The method for manufacturing a heat sink fin according to claim 1, wherein the step of applying force to the edge of the heat sink fin applies a force to the heat sink fin by a roll press or a stamping tool.