TWM423286U - Heat pipe type heat sink for enhancing heat conducting efficiency - Google Patents

Heat pipe type heat sink for enhancing heat conducting efficiency Download PDF

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Publication number
TWM423286U
TWM423286U TW100215971U TW100215971U TWM423286U TW M423286 U TWM423286 U TW M423286U TW 100215971 U TW100215971 U TW 100215971U TW 100215971 U TW100215971 U TW 100215971U TW M423286 U TWM423286 U TW M423286U
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TW
Taiwan
Prior art keywords
heat
groove
wedge
conducting block
pipe type
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Application number
TW100215971U
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Chinese (zh)
Inventor
an-zhi Wu
Mu-Shu Fan
Zheng-Shuan Jiang
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Auras Technology Co Ltd
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Application filed by Auras Technology Co Ltd filed Critical Auras Technology Co Ltd
Priority to TW100215971U priority Critical patent/TWM423286U/en
Publication of TWM423286U publication Critical patent/TWM423286U/en

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Description

M423286 五、新型說明: 【新型所屬之技術領域】 本創作係關於一種散熱裝置,尤指一種具可提高導熱效 率的熱管式散熱裝置。 【先前技術】 科技的發展日新月異,產品的發展不止多樣化,更是M423286 V. New description: [New technical field] This creation is about a heat sink, especially a heat pipe heat sink with improved heat transfer efficiency. [Prior Art] The development of science and technology is changing with each passing day, and the development of products is not only diversified, but also

微型化,然而產品做的愈小,其產品内部的晶片及零件就 愈為靠近,相對的其熱量會更為集中,故如何快速的將該 熱能排除係相當重要的一環’因此散熱裝置在產品的發展 上相形之下就更為重要。 “目前各家廠商所生產的散熱裝置,多半是藉由增加導 熱e、增加散熱韓片密度或是增加風扇㈣量以增進散熱 效率,然上述的方法都是藉由外在的改變去改善,目前散 …、裝置上的散熱鰭片@定方式,請參考圖6及目卜坊間普 ,的做法是將複數鰭片6(3分別插設在_基座5g上形成: 夕數凹槽51内’藉由梳狀的沖麼治具7〇擠壓基座5〇 鄰凹槽51間的凸&版μ ^ 狀物52產生形變,透過形變使該凸狀物 往相鄰兩旁的凹槽51擠壓進而固定凹槽Μ内的韓片 。惟此方式常因擠壓所產生的形變未 :=與。基座―密合不完全,造成在熱: ’在不改變材質下,如 能更為密合,顯有進— 針對前述問題 的基座與散熱鳍片 何針對散熱裝置 步檢討,並謀求 3 M423286 可行解決方案之必要。 【新型内容】 本創作主要目的係提供一具可裎古 散埶#署士亜技入熱效率的熱管式 …、裝置,主要係令該散熱裝置的基座與鰭 合,使其能散熱的更為有效率。 馬在 置包=成前述目的採取的主要技術手段係令前述散熱裝 —導熱塊,係、呈-塊狀,其具有__接觸面及—扣接部, =接觸面上形成有多數容置槽,該扣接部上形成數個插換 槽; ' 一鰭片組,係由數個鰭片所構成,每一鰭片的上緣分 別形成一由側面觀之為倒L形的楔片,進而與相鄰鰭片2 的楔片組成一連續的插楔部,該插楔部形狀係與導熱塊扣 接部的插楔槽相匹配,使可相互楔合,另鰭片組兩端構成 一套管; 一個以上的導熱管,係狀似U型,其兩端分別穿入導 熱塊的容置槽及鰭片組兩端的套管; 由前述元件組成的散熱裝置,該鰭片組的插楔部與導 熱塊的插楔槽楔合後,可藉由其楔合部位進行沖壓,以提 尚接合密度,並提升導熱及散熱效率。而藉由導熱塊的接 觸面與會產生熱能的晶片一同接觸,使晶片的熱能可傳導 至接觸面,藉由金屬的熱傳導效應,可快速的將熱能分別 傳遞至鰭片組’再透過鰭片組與空氣的接觸以達到散熱之 目的。 M423286 【實施方式】 關於本創作之一實施例,請參閱圖1,其包括與一導熱 塊1 0相扣接的一鰭片組20,透過一個以上的導熱管30兩 端分別穿入導熱塊1 〇及鰭片組2〇以構成熱接觸。 有關前述的導熱塊1〇,請參閱圖2,具有一接觸面ήMiniaturization, however, the smaller the product is made, the closer the wafers and parts inside the product are, and the more the heat will be concentrated. Therefore, how to quickly remove the heat energy is a very important part of the heat-dissipating device. The development is even more important. "At present, the heat sinks produced by various manufacturers are mostly improved by adding heat conduction e, increasing the density of heat dissipation, or increasing the amount of fans (four) to improve heat dissipation efficiency. However, the above methods are all improved by external changes. At present, the heat sink fins on the device, the fixed mode, please refer to Figure 6 and the eye, the practice is to insert a plurality of fins 6 (3 respectively) on the _ base 5g: eve number groove 51 The inside of the squeezing base 5 is pressed by a comb-like punching squeegee 5, and the convex & rim 52 of the adjacent groove 51 is deformed, and the convex shape is caused to be concave toward the adjacent sides. The groove 51 is pressed to fix the Korean piece in the groove 。. However, the deformation caused by the extrusion is usually not: = and the pedestal - the adhesion is not complete, resulting in the heat: 'without changing the material, such as Can be more intimate and tangible – the pedestal and heat sink fins for the above problems are reviewed for the heat sink and the 3 M423286 feasible solution is required. [New content] The main purpose of this creation is to provide a裎古散埶#The sergeant’s skill into the thermal efficiency of the heat pipe type..., device, main The base of the heat dissipating device is combined with the fin to make it more efficient to dissipate heat. The main technical means adopted by the horse in the package = the above-mentioned heat-dissipating heat-conducting block, in a block-like manner , having a __ contact surface and a fastening portion, a plurality of accommodating grooves are formed on the contact surface, and a plurality of insertion grooves are formed on the fastening portion; 'a fin group is composed of a plurality of fins The upper edge of each fin forms a wedge piece which is viewed from the side as an inverted L shape, and further forms a continuous insertion wedge portion with the wedge piece of the adjacent fin 2, the shape of the insertion wedge portion and the heat conduction block. The wedge grooves of the fastening portion are matched so as to be wedged with each other, and the other ends of the fin group form a sleeve; more than one heat pipe is shaped like a U-shaped, and the two ends thereof are respectively inserted into the heat-conducting block. a sleeve at both ends of the groove and the fin group; a heat dissipating device composed of the foregoing components, the wedge portion of the fin group is wedged with the wedge groove of the heat conducting block, and can be punched by the wedge portion thereof to be lifted Bonding density and improving thermal and thermal efficiency, while the contact surface of the thermal block is along with the wafer that generates thermal energy Contact, so that the thermal energy of the wafer can be conducted to the contact surface, and the thermal conduction effect of the metal can quickly transfer the thermal energy to the fin group respectively, and then contact the air through the fin group to achieve the purpose of heat dissipation. M423286 For an embodiment of the present invention, please refer to FIG. 1 , which includes a fin set 20 that is fastened to a heat conducting block 10 , and penetrates the heat conducting block 1 and the fin through two ends of the heat conducting tube 30 respectively. The sheet group 2 is formed to constitute a thermal contact. Regarding the aforementioned heat conducting block 1〇, please refer to FIG. 2, having a contact surface ή

及一扣接部12 ’於本實施例中,該接觸面11位於導熱塊 1 〇的一表面,扣接部1 2則位於導熱塊,〇上相對於接觸面 11的另一表面上,又導熱塊1〇上形成有一個以上橫向貫穿 的容置槽14,供導熱管30以一端穿設並構成熱接觸,於本 實施例中’該谷置槽14係貫穿該接觸面1 1 ’使位於其間的 導熱管30亦可直接與熱源接觸; 該扣接部1 2上形成數個插楔槽彳3,於本實施例中,該 插楔槽13係、分別由—長邊、—短邊及兩等邊所構成的續尾 狀凹槽’該短邊係為插楔槽1 3的開口端。 有關上述的鰭片組2〇,請參閱圖2,係由多個鰭片 、卫0而成,各鰭片21上緣分別形成一由侧面觀之為倒L 的楔片22 ’當各個鰭片21相互組合後,相鄰鰭片2,上 楔片22即組成一連續的插模部24,請參閲圖3,該插模 24形狀係與導熱塊1〇扣接部12的插楔槽^相匹配, 可相互楔合,另各鰭片21兩端分別構成-筒孔23,進而 相鄰鰭片21上的筒孔23組成一連續的套管,供形狀相丨 配之導熱管30得以穿設其間並構成熱接觸; 有關上述的導熱管3G,請參_ 2,係―概成U们 金屬管’其兩端分別插入導熱塊1〇的容置槽14内及鰭, 5 M423286 組20兩端的套孔β 有關上述組成的散熱裝置,請參聞圖4,該鰭片21上 緣的插楔部24形狀係與導熱塊1 〇上的插楔槽彳3相匹配, 且該鰭片21插楔部24置於導熱塊10的插楔槽13後,透 過一沖壓治具40針對該插楔槽13的兩短邊角上進行沖 歷,使該角造成形變並使該插楔部24與插楔槽13能更為 密合,如此一來即可提供可提高導熱效率的熱管式散熱裝 置。 關於本創作之另一實施例,請參閱圖5,其基本架構與 前一實施例大致相同,主要係於一導熱塊1〇具有一接觸面 11與一扣接部12,該接觸面11上形成數個容置槽14供導 熱管30置放,鰭片組2〇兩端分別具有套管以供導熱管3〇 穿設並構成熱接觸,另鰭片組2〇的插楔部24,係與插楔槽 13形狀相互匹配’其唯一不同之處係扣捿部以的插楔槽13, 為長邊、一知邊及兩等邊所構成的凸字塑凹槽,故該插 模部24’穿設於插楔槽13,後,藉由一沖壓治具4〇針對該插 楔槽13’的短邊兩端角上進行沖壓,使該角造成形變並使該 插模部24’與插楔槽13,能更為密合,如此〆來亦可提供可 提高導熱效率的熱管式散熱裝置。 【圖式簡單說明】 圖1 :係本創作之立體圖。 圖2 .係本創作之分解圖。 圖3 .係本創作之導熱塊與結片址合側視圖。 圖4 :係本創作之治具沖壓示意圖。 M423286 圖5 :係本創作另一實施例之導熱塊與鰭片組合側視 圖。 圖6 :係木創作之先前技術立體圖。 圖7 :係本創作之先前技術治具沖壓示意圖。And a fastening portion 12 ′ in the embodiment, the contact surface 11 is located on a surface of the heat-conducting block 1 , and the fastening portion 12 is located on the heat-conducting block, on the other surface of the crucible relative to the contact surface 11 , One or more laterally extending receiving grooves 14 are formed in the heat conducting block 1 , and the heat conducting tube 30 is pierced at one end to form a thermal contact. In the embodiment, the valley groove 14 extends through the contact surface 1 1 ' The heat conducting tube 30 located therebetween can also be in direct contact with the heat source; the fastening portion 1 2 is formed with a plurality of wedge grooves 3, and in the embodiment, the wedge groove 13 is respectively long-length The trailing groove formed by the side and the two sides is the open end of the wedge groove 13. For the above-mentioned fin group 2〇, please refer to FIG. 2, which is formed by a plurality of fins and a guard 0. The upper edges of each fin 21 respectively form a wedge piece 22 which is viewed from the side as an inverted L. After the sheets 21 are combined with each other, the adjacent fins 2 and the upper wedge pieces 22 constitute a continuous inserting portion 24. Referring to FIG. 3, the inserting mold 24 is shaped like a wedge of the heat conducting block 1 〇 fastening portion 12. The slots are matched to each other, and the two fins 21 respectively form a cylindrical hole 23, and the cylindrical holes 23 on the adjacent fins 21 form a continuous sleeve for the shape of the heat pipe. 30 can be placed between them to form a thermal contact; for the above-mentioned heat pipe 3G, please refer to _ 2, the system is a U-shaped metal pipe, and its two ends are respectively inserted into the receiving groove 14 of the heat-conducting block 1〇 and the fin, 5 M423286 Set hole 20 at both ends of group 20 For the heat dissipation device of the above composition, please refer to FIG. 4, the shape of the wedge portion 24 of the upper edge of the fin 21 matches the wedge groove 3 on the heat conducting block 1 ,, and After the wedge portion 24 of the fin 21 is placed in the wedge groove 13 of the heat conducting block 10, the stamping fixture 40 is used to punch the short corners of the wedge groove 13 to deform the corner. The wedge portion 24 and the wedge groove 13 can be more closely fitted, thereby providing a heat pipe type heat dissipating device capable of improving heat conduction efficiency. Referring to FIG. 5 , the basic structure of the present invention is substantially the same as that of the previous embodiment. The main heat dissipation block 1 has a contact surface 11 and a fastening portion 12 on the contact surface 11 . A plurality of accommodating grooves 14 are formed for the heat-conducting tubes 30 to be placed, and two ends of the fin group 2 具有 have sleeves for the heat-conducting tubes 3 to pass through and form a thermal contact, and the fin portions 24 of the other fin group 2 , The shape of the wedge groove 13 is matched with each other. The only difference is the wedge groove 13 of the buckle portion, which is a convex groove formed by a long side, a known edge and two equal sides. The portion 24 ′ is disposed in the wedge groove 13 , and then punched by the punching jig 4 〇 on both ends of the short side of the wedge groove 13 ′ to deform the corner and make the insert portion 24 'With the wedge groove 13, it can be more closely combined, so that it can also provide a heat pipe type heat sink that can improve the heat conduction efficiency. [Simple description of the diagram] Figure 1: A perspective view of the creation. Figure 2. An exploded view of the creation. Figure 3. A side view of the heat-conducting block and the junction of the present invention. Figure 4: This is a schematic diagram of the stamping of the fixture. M423286 Figure 5: Side view of a thermally conductive block and fin combination of another embodiment of the present invention. Figure 6: A prior art perspective view of a woodwork creation. Figure 7: Schematic diagram of the prior art fixture stamping of this creation.

【主要元件符號說明】 10 導熱塊 11 接觸面 12 扣接部 13 、13’插楔槽 14 容置槽 20 鰭片组 21 縛片 22 楔片 23 筒孔 24 、24’插楔部 30 導熱管 40 沖壓治具 50 基座 51 凹槽 60 鰭片 70 沖壓治具 7[Main component symbol description] 10 Thermal block 11 Contact surface 12 Fastening part 13, 13' Wedge groove 14 accommodating groove 20 Fin set 21 Baffle 22 Wedge 23 Cylinder hole 24, 24' Insert wedge part 30 Heat pipe 40 Stamping Fixture 50 Base 51 Groove 60 Fin 70 Stamping Fixture 7

Claims (1)

M423286 六、申請專利範圍: 1. -種可提高導熱效率的熱管式散熱裝置,其包括: -導熱塊’係呈一塊狀,其上形成有多數容置槽又 具有接觸面及&接部,該扣接部上形成數個插楔槽; 一鰭片組,係由數個鰭片所構成,每一鰭片的上緣分 別形成一由側面觀之為倒L形的楔片,進而與相鄰鰭片上 的楔片組成一連續的插楔部,該插楔部形狀係與導熱塊扣 接部的插楔槽相匹配,使可相互模合,另鰭片組兩端構成 一套管; 一個以上的導熱管,係狀似U型,其兩端分別穿入導熱 塊的容置槽及鰭片組兩端的套管。 2. 如申請專利範圍第彳項所述可提高導熱效率的熱管 式散熱裝置’該導熱塊的插楔槽係一具有一長邊、一短邊 及二等邊之鳩尾狀凹槽,該短邊係為凹槽開口端。 3_如申請專利範圍第彳項所述可提高導熱效率的熱管 式散熱裝置’該導熱塊的插楔槽係一具有一長邊、一短邊 及二等邊之凸字型狀的凹槽,該短邊係為凹槽開口端。 4.如申請專利範圍第1至3項中任一項所述可提高導 熱效率的熱管式散熱裝置’該導熱塊上的容置槽係貫穿接 觸面,使導熱管穿設於容置槽的一端露出於接觸面。 七、圖式:(如次頁)M423286 VI. Patent application scope: 1. A heat pipe type heat dissipating device capable of improving heat conduction efficiency, comprising: - a heat conducting block is formed in a block shape, and a plurality of receiving grooves are formed thereon and have contact faces and & a plurality of wedge grooves are formed on the fastening portion; a fin group is composed of a plurality of fins, and the upper edges of each fin respectively form a wedge piece which is viewed from the side as an inverted L shape. Further, the wedges on the adjacent fins form a continuous wedge portion, and the shape of the wedge portion is matched with the wedge groove of the heat-conducting block fastening portion so as to be mutually coupled, and the other ends of the fin group constitute a Casing; more than one heat-conducting tube, which is U-shaped, and its two ends are respectively inserted into the accommodating groove of the heat-conducting block and the sleeve at both ends of the fin group. 2. The heat pipe type heat dissipating device capable of improving heat conduction efficiency as described in the scope of claim 2, wherein the wedge groove of the heat conducting block has a long side, a short side and a second side of the dovetail groove, the short The edge is the open end of the groove. 3_The heat pipe type heat dissipating device capable of improving heat conduction efficiency as described in the scope of claim 2, the wedge groove of the heat conducting block has a long side, a short side and a second side convex type groove The short side is the open end of the groove. 4. The heat pipe type heat dissipating device capable of improving heat conduction efficiency according to any one of claims 1 to 3, wherein the accommodating groove on the heat conducting block penetrates the contact surface to allow the heat pipe to pass through the accommodating groove One end is exposed on the contact surface. Seven, the pattern: (such as the next page)
TW100215971U 2011-08-26 2011-08-26 Heat pipe type heat sink for enhancing heat conducting efficiency TWM423286U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102973112A (en) * 2012-12-08 2013-03-20 张秋红 Folding ledge
TWI451061B (en) * 2012-03-08 2014-09-01 Asia Vital Components Co Ltd Thermal module and manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI451061B (en) * 2012-03-08 2014-09-01 Asia Vital Components Co Ltd Thermal module and manufacturing method thereof
CN102973112A (en) * 2012-12-08 2013-03-20 张秋红 Folding ledge

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