201031881 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種散熱裝置及其相關散熱系統，尤指 一種可增進散熱效率之散熱裝置及其相關散熱系統。 【先前技術】 Ο 散熱問題於現今散熱系統之應用仍為一急需克服之難 題，而坊間各種不同類型之散熱系統亦採用各式不同散熱方 式。然習知之散熱技術已不敷解決各式熱源大量產生之熱 量，故有許多散熱技術之應用便應運而生，以使電子裝置能 維持正常工作溫度之作用。然而目前普遍使用的空氣冷卻系 統，不論冷卻風扇的效能如何改良，在解決散熱問題上仍有 © 其限制，故利用現行傳統風扇強制空氣對流並改善其他散熱 元件之效率仍為一建構於現行散熱裝置上增加散熱效率之 方式。 請參閱第1圖與第2圖，第1圖為先前技術一散熱裝置 20之示意圖，第2圖為先前技術散熱裝置20之剖面示意圖。 散熱裝置20包含一導熱基板22，其係設置於一熱源24上， 藉以傳導熱源24所產生之熱量；以及複數個散熱鰭片26， 201031881 其係實質上平行設置於導熱基板22上’各相鄰散熱鰭片26 間係形成複數個通道261 ’藉以提供空氣對流之路徑，各散 熱鰭片26於其自導熱基板22延伸之方向（X方向）上係為 光滑平面，藉以散除導熱基板22所接受熱源24所產生之熱 量。如第1圖所示，導熱基板22可由高傳導係數之金屬材 質所組成，如鋁或銅材質。導熱基板22設置於熱源24之一 側與其直接接觸’熱源24所產生之熱能，即會因熱傳導效 應而傳遞至導熱基板22上。與此同時，由於複數個散熱鰭 片26亦可由高傳導係數之金屬材質所組成，如鋁或銅材質， 故由熱源24傳導至導熱基板22之熱能’便會因熱傳導效應 而傳遞炱複數個散熱鰭片26上。複數個散熱鰭片26係實質 上平行設置於導熱基板22上，其目的在於增加熱能與空氣 接觸之面積，意即與空氣接觸之面積由導熱基板22上相對 於接觸熱源24該側之一側表面積，增加成複數個散熱鰭片 26其兩側表面積之總和。因此，熱源24所產生之熱能便能 藉由大幅增加散熱縛片26與空氣接觸之面積而將熱能有效 地散除。由於複數個通道261之任意位置之一間距W1係為 疋值，故空氣於複數個通道261内流動時，其所受的空氣阻 力疋均勻的，此種自然循環、無外力強制的對流方式稱為自 然對流（Natural convection )。散熱裝置2〇的優點是其光滑 表面可於旁侧進風以及上方進風時降低風阻。散熱裝置2〇 的缺點則是散絲面料鼓，因此賴效能㈣。因此， 散,、、、裝置2G另可外加—風扇28以加強空氣對流效果，此種 201031881 藉外力輔助的對流方式稱為強制對流（Forced convection)。 風扇28係設置於複數個散熱鳍片26之旁側或上方’以送風 或抽風的方式加強空氣於複數個通道261内對流作用，藉以 散除熱源24所產生之熱量。 請參閱第3圖與第4圖，第3圖為先前技術可增加散熱 效率之一散熱裝置40之示意圖，第4圖為先前技術散熱裝 φ 置40之刮面示意圖。散熱裝置40包含一導熱基板42，其係 設置於一熱源44上，藉以傳導熱源44所產生之熱量；以及 複數個散熱鰭片46，其係實質上平行設置於導熱基板42 上’各相鄰散熱鰭片46間係形成複數個通道461，藉以提供 空氣對流之路徑，各散熱鰭片46於其自導熱基板42延伸之 方向（X方向）上係形成有複數個凸出部463，且相鄰散熱鰭 片46之複數個凸出部463於散熱鰭片46自導熱基板42延 ⑩ 伸之方向上係為對稱排列，藉以散除導熱基板42所接受熱 源44所產生之熱量。導熱基板42、熱源44、以及複數個散 熱鱗片46之功用與配置如前所述，故於此不再詳述。然而， 散熱裝置40為了增加與空氣接觸之面積’於複數個散熱鰭 片46上係形成有複數個凸出部463。相鄰散熱鰭片46之各 凸出部463形成有一間距W20,相鄰散熱鰭片46之光滑表 面形成有—間距W22，且間距W22大於間距W20。 : 相較於散熱裝置20，散熱裝置40具有較大之表面積， 6 201031881 可更快速的將熱源44所產生之熱能藉由氣冷方式散除掉， 故散熱效率較散熱裝置20為佳。但由於間距W20與間距 W22之差異，使得複數個通道461内之空氣阻力與風壓分佈 不均，造成複數個通道461之自然對流作用受到限制。因此， 散熱裝置40可設置一風扇48以加強空氣對流效果（強制對 流）。由第3圖可知，當風扇48設置於複數個散熱鰭片46 之侧面，以送風或抽風的方式加強空氣對流時，因對稱排列 p 之凸出部463所造成之差異使得入風處以及複數個通道461 内之風阻不均，意即散熱鰭片46上帶走熱量的風流不均， 造成風流穩定度下降，故強制風流帶走熱量的穩定度下降， 而降低其散熱效率。另外當風扇設置於複數個散熱鰭片46 之上方，以送風或抽風的方式增強空氣於相鄰散熱鰭片46 之空間流通時，亦會因對稱排列之凸出部463所造成之差異 使得入風處以及複數個通道461内之風阻較散熱裝置20所 受之風阻為大，意即散熱鰭片46上帶走熱量的風量下降， 而使得通過複數個通道4 61内之強制氣流所能帶走熱量之效 能下降，故影響其散熱效率。因此，由於散熱裝置40之複 數個凸出部463之配置並不理想，故散熱裝置40僅能適用 於強制對流之散熱應用且無法達到理想之散熱效率。故如何 設計出不但能增加與空氣接觸之面積，並能同時適用於自然 對流與強制對流之散熱應用之散熱裝置，便為現今科技產業 所需努力之重要課題。 7 201031881 【發明内容】 本發明之申請專利範圍係揭露一種可增進散熱效率之 散熱裝置，其包含有一導熱基板，其係設置於一熱源上，藉 以傳導該熱源所產生之熱量；以及複數個散熱鰭片，其係實 質上平行設置於該導熱基板上，各散熱鰭片於其自該導熱基 板延伸之方向上係形成有複數個凸出部，且相鄰散熱鰭片之 _ 該複數個凸出部於該散熱鰭片自該導熱基板延伸之方向上201031881 VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device and related heat dissipating system, and more particularly to a heat dissipating device capable of improving heat dissipating efficiency and related heat dissipating system. [Prior Art] 散热 The problem of heat dissipation in today's heat dissipation system is still an urgent need to overcome, and various types of heat dissipation systems in the market also use different heat dissipation methods. However, the heat dissipation technology of the prior art is insufficient to solve the heat generated by various heat sources. Therefore, many applications of heat dissipation technology have emerged to enable the electronic device to maintain the normal operating temperature. However, the air cooling system currently in common use, regardless of the improvement of the efficiency of the cooling fan, still has its limitations in solving the heat dissipation problem. Therefore, the current conventional fan is used to force air convection and improve the efficiency of other heat dissipating components. The way to increase heat dissipation efficiency on the device. Referring to Figures 1 and 2, Figure 1 is a schematic view of a heat sink 20 of the prior art, and Figure 2 is a schematic cross-sectional view of a heat sink 20 of the prior art. The heat dissipating device 20 includes a heat-conducting substrate 22 disposed on a heat source 24 to conduct heat generated by the heat source 24; and a plurality of heat-dissipating fins 26, 201031881 which are substantially parallel disposed on the heat-conducting substrate 22 A plurality of channels 261 ′ are formed between the adjacent heat dissipation fins 26 to provide a path for air convection. Each of the heat dissipation fins 26 has a smooth plane in a direction (X direction) from which the heat conductive substrate 22 extends, thereby dissipating the heat conductive substrate 22 . The heat generated by the heat source 24 is received. As shown in Fig. 1, the thermally conductive substrate 22 may be composed of a metal material having a high conductivity such as aluminum or copper. The heat-conducting substrate 22 is disposed on one side of the heat source 24 and is in direct contact with the heat energy generated by the heat source 24, i.e., transmitted to the heat-conducting substrate 22 due to the heat transfer effect. At the same time, since the plurality of heat dissipation fins 26 can also be composed of a metal material having a high conductivity, such as aluminum or copper, the heat energy transmitted from the heat source 24 to the heat conductive substrate 22 is transmitted by the heat conduction effect. Heat sink fins 26. A plurality of heat dissipating fins 26 are disposed substantially parallel to the thermally conductive substrate 22 for the purpose of increasing the area of contact of the thermal energy with the air, that is, the area in contact with the air from the side of the thermally conductive substrate 22 opposite the side of the contact heat source 24. The surface area is increased by the sum of the surface areas of the plurality of heat sink fins 26 on both sides. Therefore, the heat energy generated by the heat source 24 can effectively dissipate the heat energy by greatly increasing the area of the heat-dissipating tab 26 in contact with the air. Since the distance W1 of any one of the plurality of channels 261 is a threshold value, when the air flows in the plurality of channels 261, the air resistance is uniform, and the natural circulation and the external force-free convection method are called For natural convection. The advantage of the heat sink 2〇 is that its smooth surface reduces wind resistance when entering the side and when entering the wind. The disadvantage of the heat sink 2〇 is the loose fabric drum, so it depends on the performance (4). Therefore, the device 2G can be additionally provided with a fan 28 to enhance the air convection effect. Such a convection method assisted by external force is called Forced Convection. The fan 28 is disposed on the side or above the plurality of fins 26 to enhance the convection of air in the plurality of channels 261 by air or air, thereby dissipating heat generated by the heat source 24. Please refer to FIG. 3 and FIG. 4, FIG. 3 is a schematic diagram of a heat dissipating device 40 which can increase heat dissipation efficiency in the prior art, and FIG. 4 is a schematic view of a scraping surface of the prior art heat dissipating device. The heat sink 40 includes a heat-conducting substrate 42 disposed on a heat source 44 to conduct heat generated by the heat source 44, and a plurality of heat-dissipating fins 46 disposed substantially parallel to the heat-conducting substrate 42. A plurality of channels 461 are formed between the heat dissipating fins 46 to provide a path for air convection. Each of the heat dissipating fins 46 is formed with a plurality of protrusions 463 in a direction (X direction) extending from the heat conducting substrate 42. The plurality of protrusions 463 of the adjacent heat dissipation fins 46 are symmetrically arranged in the direction in which the heat dissipation fins 46 extend from the heat conductive substrate 42 to dissipate heat generated by the heat source 44 received by the heat conductive substrate 42. The functions and arrangements of the thermally conductive substrate 42, the heat source 44, and the plurality of heat sinking fins 46 are as described above and therefore will not be described in detail herein. However, the heat sink 40 is formed with a plurality of projections 463 on the plurality of heat dissipation fins 46 in order to increase the area in contact with the air. Each of the projections 463 of the adjacent heat dissipation fins 46 is formed with a pitch W20, and the smooth surfaces of the adjacent heat dissipation fins 46 are formed with a pitch W22, and the pitch W22 is larger than the pitch W20. Compared with the heat dissipating device 20, the heat dissipating device 40 has a large surface area, and the heat energy generated by the heat source 44 can be more quickly dissipated by the air cooling method, so that the heat dissipating efficiency is better than that of the heat dissipating device 20. However, due to the difference between the spacing W20 and the spacing W22, the air resistance and the wind pressure distribution in the plurality of channels 461 are uneven, which causes the natural convection of the plurality of channels 461 to be limited. Therefore, the heat sink 40 can be provided with a fan 48 to enhance the air convection effect (forced convection). As can be seen from FIG. 3, when the fan 48 is disposed on the side of the plurality of heat radiating fins 46 to enhance air convection by air blowing or air blowing, the difference between the protruding portions 463 of the symmetrically arranged p makes the air inlet and the plurality The wind resistance in the channel 461 is uneven, which means that the heat flow on the heat dissipation fin 46 is uneven, which causes the stability of the airflow to decrease, so that the stability of the forced air flow is reduced, and the heat dissipation efficiency is lowered. In addition, when the fan is disposed above the plurality of heat dissipation fins 46, the air is circulated in the space of the adjacent heat dissipation fins 46 by air or air, and the difference is caused by the difference of the symmetrically arranged protrusions 463. The wind resistance in the wind and the plurality of channels 461 is greater than the wind resistance of the heat sink 20, which means that the amount of heat taken away from the heat sink fins 46 is reduced, so that the forced air flow in the plurality of channels 4 61 can be carried. The efficiency of heat removal is reduced, which affects its heat dissipation efficiency. Therefore, since the arrangement of the plurality of projections 463 of the heat sink 40 is not ideal, the heat sink 40 can only be applied to the heat dissipation application of forced convection and the desired heat dissipation efficiency cannot be achieved. Therefore, how to design a heat sink that not only increases the area of contact with air, but also applies to the heat dissipation of natural convection and forced convection is an important task for the current technology industry. The invention relates to a heat dissipating device capable of improving heat dissipation efficiency, which comprises a heat conducting substrate disposed on a heat source to conduct heat generated by the heat source; and a plurality of heat dissipation The fins are disposed substantially parallel to the heat-conducting substrate, and the heat-dissipating fins are formed with a plurality of protrusions in a direction extending from the heat-conductive substrate, and the plurality of protrusions of the adjacent heat-dissipating fins Exposed in a direction in which the heat dissipation fin extends from the heat conductive substrate
P 係為交錯排列，藉以散除該導熱基板所接受該熱源所產生之 熱量。 本發明之申請專利範圍係揭露一種可增進散熱效率之 散熱系統，其包含有一電路板；一熱源，其係安裝於該電路 板上；以及一散熱裝置，其包含有一導熱基板，其係設置於 該熱源上，藉以傳導該熱源所產生之熱量；以及複數個散熱 鰭片，其係實質上平行設置於該導熱基板上，各散熱鰭片於 其自該導熱基板延伸之方向上係形成有複數個凸出部，且相 鄰散熱鰭片之該複數個凸出部於該散熱鰭片自該導熱基板 延伸之方向上係為交錯排列，藉以散除該導熱基板所接受該 熱源所產生之熱量。 【實施方式】 8 201031881 請參閱第5圖與第6圖，第5圖為本發明第一實施例可 增進散熱效率之一散熱裝置60之示意圖，第6圖為本發明 第一實施例散熱裝置60之剖面示意圖。散熱裝置60包含一 導熱基板62，其係設置於一熱源64上，藉以傳導熱源64 所產生之熱量；以及複數個散熱鰭片66,其係實質上平行設 置於導熱基板62上，各相鄰散熱鰭片66間係形成複數個通 道661，藉以提供空氣對流之路徑，各散熱鰭片66於其自導 熱基板62延伸之方向（X方向）上係形成有複數個凸出部 663,且相鄰散熱鰭片66之複數個凸出部663於散熱鰭片66 自導熱基板62延伸之方向（X方向）上係為交錯排列，藉以散 除導熱基板62所接受熱源64所產生之熱量。相鄰凸出部663 間係形成有一相對應凸出部663之凹入部664，意即複數個 凸出部663間係形成有複數個凹入部664。交錯排列係定義 為相鄰散熱鰭片66間之複數個通道661之兩側分別可沿X 方向上形成複數個凸出部663與相對應凸出部663之凹入部 664，其中散熱鰭片66之凸出部663係面對於相鄰散熱鰭片 66之凹入部，藉以保持複數個通道661之寬度沿X方向上 皆可保持定值。熱源64可選擇性地安裝於一電路板63上。 例如：熱源64可為一中央處理器或一晶片，係安裝於電路 板63上，因高速運算而產生熱能。熱源64亦可為一金屬板， 係用以自一發熱元件傳導熱能至散熱裝置60藉以散逸熱 量，則熱源64不需安裝於電路板63上。導熱基板62與複 數個散熱鰭片66係可由金屬材質所組成，如銅或鋁材質。 201031881 導熱基板62設置於熱源64之一側與其直接接觸，熱源64 所產生之熱能，即會因熱傳導效應而傳遞至導熱基板62上。 與此同時，由熱源64傳導至導熱基板62之熱能，亦會因熱 傳導效應而傳遞至複數個散熱鰭片66上。複數個散熱鰭片 66係實質上平行設置於導熱基板62上，其目的在於增加熱 能與空氣接觸之面積。 如第5圖與第6圖所示，本發明於各散熱鰭片66自導 熱基板62延伸之方向上係形成有交錯排列之複數個凸出部 663，且複數個凸出部663可分別為一長條型結構，其方向 實質上平行於該導熱基板62。複數個凸出部663之功用在於 可增加複數個散熱鰭片66與空氣接觸之表面積，藉以增進 散熱效率。由於複數個凸出部663的配置係為交錯排列，故 相鄰散熱鰭片66之一間距W3於複數個通道661内之任意 位置皆可保持定值，使得空氣阻力與風壓於複數個通道661 内之任意位置皆可保持恆定。自複數個散熱鰭片66之旁側 進風時，因交錯排列之凸出部663與凹入部664使得入風處 以及複數個通道661内之風阻均等，複數個通道内之氣流所 能帶走熱量之效能穩定，故散熱效率較先前技術之散熱裝置' 40為佳。自複數個散熱鰭片之上方進風時，因交錯排列之凸 出部663與凹入部664使得入風處以及複數個通道661内之 風阻較先前技術之散熱裝置40為小，使得複數個通道内之 氣流所能帶走熱量之效能不易受到影響，故散熱效率較先前 ❿ ❿ 鰭片66可以黏貼或焊 π民好。 切削、壓模、或沖壓方U疋於導熱基板62上 中壓方式成型於導熱基板62上。 201031881 技術之散熱裝置40為佳。因此，複數個散熱鰭片％ 進風以及上方進風之自然對流作用良好。 散熱裝置60另可設置一風扇68於複數個散熱鰭片％ 之旁側或上方，藉以散除該複數個散熱鰭片66之熱量。a 風扇68設置於複數個散熱鰭片66之旁側時，由於空氣阻虽 與風壓於人風處以及複數崎道661内之㈣位置皆=力 均等，而提升複數個通道661内氣流帶走熱量之穩定性'，、持 散熱效率較先前技術之散熱裝置4〇為佳。同樣地♦故 68設置於複數個散熱·鰭片66之上方時，由上而下=風扇 因所受之Μ阻力與風壓較先前技術之散熱裝=亦 且通過通道66!之氣流所帶走熱量之 還小， 可於入風處以及複數個通道661㈣立—b =影響，故 環，可將複數個通道661内接近導熱又好的熱對^循 且等速地與複數個通道661 、、、 之熱空氣穩定 較先前技術之散熱裝置4〇為估V空氣進行交換，散熱效率 之旁側進風以及上方進風制因^ ’複數個通道⑹内 片66可以龜㈣搜強制對流作用良好。複數個散熱 或可以 再者，複數個凸出部663 之圓弧形，其係可為三角形、 之多邊形。請參閱第7圖、第 可不限於第5圖與第6圖所示 雜齒形、H形、或其他種類 8圖、第9圖、與帛10圖。 201031881 第7圖為本發明第二實施例一具有複數個三角形凸出部72 之散熱裝置70之示意圖。第8圖為本發明第三實施例一具 有複數個鋸齒形凸出部82之散熱裝置80之示意圖。第9圖 為本發明第四實施例一具有複數個波浪形凸出部92之散熱 裝置90之示意圖。第10圖為本發明第五實施例一於複數個 波浪形凸出部102上另配置有交錯排列之複數個凸出部104 以及相對應之凹入部106之散熱裝置100之示意圖。散熱裝 φ 置70、散熱裝置80、散熱裝置90、以及散熱裝置100之各 組成元件之配置與功用如第一實施例所述所述，其可增加複 數個散熱鰭片與空氣接觸之表面積，藉以增進散熱效率，且 相鄰散熱鰭片之間距於通道内之任意位置皆可保持定值，使 得空氣阻力與風壓於通道内之任意位置皆可保持恆定，故於 此不再詳述。三角形凸出部72、鋸齒形凸出部82、波浪形 凸出部92、以及具有複數個凸出部104與凹入部106之波浪 形凸出部102之功用亦與第一實施例所述之突出部663相 同，惟其外形之選擇與配置端視實際應用而定。 再者，本發明散熱鰭片可不限於前述實施例所示之配 置，其另可為一複合先前技術與本發明所述實施例之散熱鰭 片配置。請參閱第11圖與第12圖。第11圖為本發明第六 實施例一同時具有交錯排列之複數個凸出部1104以及光滑 平面1106之散熱裝置110之示意圖。第12圖為本發明第七 實施例一同時具有交錯排列之複數個凸出部1204以及對稱 12 201031881 排列之複數個凸出部1206之散熱裝置120之示意圖。當散 熱裝置no之複數個散熱韓片1102以及散熱裝置12〇之複 數個散熱縛片靡之中間位置所欲散逸之熱量較韓片兩侧 所欲散逸之熱量為尚時’僅需加強散熱裝置UG以及㈣裝 置120中間位置之自然對流作心及強制對流作用，故可於 中間位料計具有本發日倾術特徵之散熱則聰與散敎 鳍片咖，而兩侧散熱需求較低之位置設置先前技術之散熱 ❹‘鶴片。散熱裝置110以及散熱裝置120上之各式散熱鰭片之 選擇與配置端視實際應用而定，其作用原理係相同於前述實 施例所述’於此不再詳述。 再者，複數個散熱鰭片66可不限於前述實施例所示之 長型片狀結構，其另可分別為一柱狀結構或一短型片狀結 構，藉以同時增加散熱裝置60與空氣接觸之面積以及增進 自然對流與強制對流的效果。請參閱第13圖與第14圖。第 _ 13圖為本發明第八實施例一柱狀結構之散熱鰭片1306之示 意圖，第14圖為本發明第九實施例一短型片狀結構之散熱 鰭片1406之示意圖。其作用原理係相同於前述實施例所述， 故於此不再詳述。 相較於先前技術，本發明可增進散熱效率之散熱裝置可 改善先前技術僅著重於增加散熱鰭片之表面積，而忽略風阻 不均與風流穩定度下降於影響自然對流於相鄰散熱鰭片間 13 201031881 熱交換之重要性；本發明係交錯配置散熱鰭片上之複數個凸 出部之位置，使得相鄰散熱鰭片内通道之風阻在任意位置保 持均等，且對流作用之風量穩定。如此一來，本發明在增加 散熱面積以改善散熱效率的同時，亦可加強自然對流或強制 對流之熱循環作用來更進一步增進散熱效率。 以上所述僅為本發明之較佳實施例，凡依本發明申請專 ^ 利範圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。 【圖式簡單說明】 第1圖為先前技術散熱裝置之示意圖。 第2圖為先前技術散熱裝置之剖面示意圖。 第3圖為先前技術可增加散熱效率之散熱裝置之示意圖。 第4圖為先前技術散熱裝置之剖面示意圖。 ❿ 第5圖為本發明第一實施例可增進散熱效率之散熱裝置之示 意圖。 第6圖為本發明第一實施例散熱裝置之剖面示意圖。 第7圖為本發明第二實施例具有複數個三角形凸出部之散熱 裝置之示意圖。 第8圖為本發明第三實施例具有複數個鋸齒形凸出部之散熱 裝置之示意圖。 第9圖為本發明第四實施例具有複數個波浪形凸出部之散熱 14 201031881 裝置之示意圖。 第ίο圖為本發明第五實施例於複數個波浪形凸出部上另配 置有交錯排列之複數個凸出部以及相對應之凹入部之 散熱裝置之示意圖。 第11圖為本發明第六實施例同時具有交錯排列之複數個凸 出部以及光滑平面之散熱裝置之示意圖。 第12圖為本發明第七實施例同時具有交錯排列之複數個凸 | 出部以及對稱排列之複數個凸出部之散熱裝置之示意 圖。 第13圖為本發明第八實施例柱狀結構之散熱鰭片之示意圖。 第14圖為本發明第九實施例短型片狀結構之散熱鰭片之示 意圖。 【主要元件符號說明】P is staggered to dissipate the heat generated by the heat-conducting substrate from the heat source. The patent application scope of the present invention discloses a heat dissipation system capable of improving heat dissipation efficiency, comprising: a circuit board; a heat source mounted on the circuit board; and a heat sink comprising a heat conductive substrate disposed on the heat dissipation system The heat source is configured to conduct heat generated by the heat source; and a plurality of heat dissipating fins are disposed substantially parallel to the heat conducting substrate, and each of the heat dissipating fins is formed in a plurality of directions extending from the heat conducting substrate And a plurality of protrusions of the adjacent heat dissipation fins are staggered in a direction in which the heat dissipation fins extend from the heat conductive substrate, thereby dissipating the heat generated by the heat source substrate to receive the heat source . [Embodiment] 8 201031881 Please refer to FIG. 5 and FIG. 6 , FIG. 5 is a schematic diagram of a heat dissipating device 60 which can improve heat dissipation efficiency according to a first embodiment of the present invention, and FIG. 6 is a heat dissipating device according to a first embodiment of the present invention. Schematic diagram of the 60 section. The heat sink 60 includes a heat-conducting substrate 62 disposed on a heat source 64 to conduct heat generated by the heat source 64, and a plurality of heat-dissipating fins 66 disposed substantially parallel to the heat-conducting substrate 62, adjacent to each other. A plurality of channels 661 are formed between the heat dissipation fins 66 to provide a path for air convection. Each of the heat dissipation fins 66 is formed with a plurality of protrusions 663 in a direction (X direction) extending from the heat conductive substrate 62, and the phase is formed. The plurality of protrusions 663 of the adjacent heat dissipation fins 66 are staggered in a direction (X direction) in which the heat dissipation fins 66 extend from the heat conductive substrate 62, thereby dissipating heat generated by the heat source 64 received by the heat conductive substrate 62. A concave portion 664 corresponding to the convex portion 663 is formed between the adjacent convex portions 663, that is, a plurality of concave portions 664 are formed between the plurality of convex portions 663. The staggered arrangement is defined as a plurality of protrusions 663 and a recess 664 of the corresponding protrusions 663 formed on the opposite sides of the plurality of channels 661 between the adjacent heat dissipation fins 66, wherein the heat dissipation fins 66 are formed. The protrusions 663 are opposite to the recesses of the adjacent heat dissipation fins 66, thereby maintaining the width of the plurality of channels 661 constant in the X direction. The heat source 64 is selectively mountable on a circuit board 63. For example, the heat source 64 can be a central processing unit or a chip mounted on the circuit board 63 to generate thermal energy due to high speed operation. The heat source 64 can also be a metal plate for transferring thermal energy from a heat generating component to the heat sink 60 to dissipate heat, so that the heat source 64 does not need to be mounted on the circuit board 63. The heat conductive substrate 62 and the plurality of heat dissipation fins 66 may be made of a metal material such as copper or aluminum. 201031881 The heat conductive substrate 62 is disposed in direct contact with one side of the heat source 64, and the heat energy generated by the heat source 64 is transmitted to the heat conductive substrate 62 due to the heat conduction effect. At the same time, the thermal energy conducted by the heat source 64 to the thermally conductive substrate 62 is also transferred to the plurality of fins 66 due to the heat transfer effect. A plurality of heat dissipating fins 66 are disposed substantially parallel to the thermally conductive substrate 62 for the purpose of increasing the area of contact of the thermal energy with the air. As shown in FIG. 5 and FIG. 6 , in the present invention, a plurality of protrusions 663 are staggered in a direction in which the heat dissipation fins 66 extend from the heat conductive substrate 62, and the plurality of protrusions 663 can be respectively A strip-shaped structure having a direction substantially parallel to the thermally conductive substrate 62. The function of the plurality of protrusions 663 is to increase the surface area of the plurality of heat dissipation fins 66 in contact with the air, thereby improving heat dissipation efficiency. Since the arrangement of the plurality of protrusions 663 is staggered, the spacing W3 of one of the adjacent heat dissipation fins 66 can be maintained at any position within the plurality of channels 661, so that air resistance and wind pressure are applied to the plurality of channels. Any position within the 661 can be kept constant. When the air is introduced from the side of the plurality of heat dissipation fins 66, the airflow in the air inlet and the plurality of channels 661 are equalized by the staggered projections 663 and the recessed portions 664, and the airflow in the plurality of channels can be taken away. The heat efficiency is stable, so the heat dissipation efficiency is better than that of the prior art heat sink '40. When the wind is introduced from above the plurality of heat dissipating fins, the staggered portion 663 and the recessed portion 664 cause the wind resistance in the air inlet portion and the plurality of channels 661 to be smaller than that of the prior art heat sink 40, so that the plurality of channels are The efficiency of the internal airflow can not be affected, so the heat dissipation efficiency can be better than that of the previous 鳍 ❿ fin 66. The cutting, stamping, or stamping is performed on the heat conductive substrate 62 by medium pressure molding on the heat conductive substrate 62. The heat sink 40 of the technology of 201031881 is preferred. Therefore, the natural convection of the plurality of fins and the upper air inlet are good. The heat sink 60 can further be disposed on a side of or above the plurality of heat sink fins to dissipate heat of the plurality of heat sink fins 66. a When the fan 68 is disposed on the side of the plurality of heat radiating fins 66, the air flow band in the plurality of channels 661 is improved because the air resistance is equal to the wind pressure at the wind and the (four) positions in the plurality of the shovel 661 are equal. The stability of the heat is taken, and the heat dissipation efficiency is better than that of the prior art heat sink. Similarly, when the 68 is disposed above the plurality of heat dissipation fins 66, the top-down = the fan is subjected to the airflow of the prior art and the wind pressure is also caused by the airflow of the channel 66! The heat is still small, can be in the wind and a number of channels 661 (four) stand - b = impact, so the ring, can be a plurality of channels 661 close to the heat conduction and good heat on the ^ and the constant speed and a plurality of channels 661 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Good effect. The plurality of heat dissipation or the plurality of protrusions 663 may be a circular arc shape, which may be a triangle or a polygon. Please refer to Fig. 7, and may be limited to the figure of Fig. 5 and Fig. 6 for the tooth profile, the H shape, or the other types of Fig. 9, Fig. 9, and Fig. 10. 201031881 Figure 7 is a schematic view of a heat sink 70 having a plurality of triangular projections 72 in accordance with a second embodiment of the present invention. Figure 8 is a schematic view of a heat sink 80 having a plurality of zigzag projections 82 in accordance with a third embodiment of the present invention. Figure 9 is a schematic view of a heat sink 90 having a plurality of undulating projections 92 in accordance with a fourth embodiment of the present invention. FIG. 10 is a schematic view showing a heat dissipating device 100 in which a plurality of staggered portions 104 and corresponding recessed portions 106 are alternately arranged on a plurality of undulating projections 102 according to a fifth embodiment of the present invention. The arrangement and function of the components of the heat dissipating device φ 70, the heat dissipating device 80, the heat dissipating device 90, and the heat dissipating device 100 are as described in the first embodiment, which can increase the surface area of the plurality of heat dissipating fins in contact with the air. In order to improve the heat dissipation efficiency, the position between the adjacent heat dissipation fins in the channel can be kept constant, so that the air resistance and the wind pressure can be kept constant at any position in the channel, and thus will not be described in detail. The function of the triangular projection 72, the zigzag projection 82, the undulating projection 92, and the undulating projection 102 having the plurality of projections 104 and the recess 106 is also as described in the first embodiment. The protrusions 663 are the same, but the choice and configuration of the shape depends on the actual application. Furthermore, the heat dissipating fin of the present invention may not be limited to the configuration shown in the foregoing embodiment, and may be a composite fin structure of the prior art and the embodiment of the present invention. Please refer to Figure 11 and Figure 12. Fig. 11 is a view showing a heat dissipating device 110 having a plurality of projections 1104 and a smooth plane 1106 which are alternately arranged in a sixth embodiment of the present invention. Figure 12 is a schematic view showing a heat sink 120 of a plurality of projections 1204 having a plurality of projections 1204 arranged in a staggered manner and a plurality of projections 1206 arranged in a symmetrical 12 201031881. When the heat dissipation device no of the plurality of heat-dissipating Korean chips 1102 and the heat-dissipating device 12 are in the middle of the plurality of heat-dissipating clips, the heat to be dissipated is more than the heat to be dissipated on both sides of the Korean film. UG and (4) the natural convection centering and forced convection in the middle position of the device 120, so it can be used in the middle level meter to have the heat dissipation characteristics of the current day, and the heat dissipation of the two sides is low. The location sets the heat dissipation of the prior art. The selection and arrangement of the heat dissipating fins 110 and the heat dissipating fins on the heat dissipating device 120 depend on the actual application, and the principle of operation is the same as that described in the foregoing embodiments. Furthermore, the plurality of heat dissipation fins 66 are not limited to the long sheet structure shown in the foregoing embodiment, and may be respectively a columnar structure or a short sheet structure, thereby simultaneously increasing the heat sink 60 in contact with the air. Area and the effect of increasing natural convection and forced convection. Please refer to Figure 13 and Figure 14. FIG. 13 is a schematic view showing a heat dissipating fin 1306 of a columnar structure according to an eighth embodiment of the present invention, and FIG. 14 is a schematic view showing a heat dissipating fin 1406 of a short sheet structure according to a ninth embodiment of the present invention. The principle of operation is the same as that described in the previous embodiment, and therefore will not be described in detail herein. Compared with the prior art, the heat dissipation device of the present invention can improve the heat dissipation efficiency, and the prior art only focuses on increasing the surface area of the heat dissipation fins, while ignoring the wind resistance unevenness and the air flow stability is reduced to affect the natural convection between the adjacent heat dissipation fins. 13 201031881 The importance of heat exchange; the present invention is to position the plurality of protrusions on the heat dissipation fins in a staggered manner, so that the wind resistance of the channels in the adjacent heat dissipation fins is kept equal at any position, and the air volume of the convection action is stable. In this way, the invention can increase the heat dissipation area to improve the heat dissipation efficiency, and can also enhance the thermal circulation of natural convection or forced convection to further improve the heat dissipation efficiency. The above are only the preferred embodiments of the present invention, and all changes and modifications made to the specific scope of the application of the present invention should fall within the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a prior art heat sink. Figure 2 is a schematic cross-sectional view of a prior art heat sink. Figure 3 is a schematic diagram of a prior art heat sink that increases heat dissipation efficiency. Figure 4 is a schematic cross-sectional view of a prior art heat sink. Fig. 5 is a view showing a heat dissipating device capable of improving heat dissipation efficiency according to the first embodiment of the present invention. Figure 6 is a schematic cross-sectional view showing a heat sink according to a first embodiment of the present invention. Fig. 7 is a schematic view showing a heat dissipating device having a plurality of triangular projections according to a second embodiment of the present invention. Fig. 8 is a schematic view showing a heat dissipating device having a plurality of zigzag projections according to a third embodiment of the present invention. Figure 9 is a schematic view of a device having a plurality of undulating projections according to a fourth embodiment of the present invention. Fig. 00 is a schematic view showing a heat dissipating device in which a plurality of embossing portions and corresponding concave portions are alternately arranged on a plurality of undulating projections according to a fifth embodiment of the present invention. Fig. 11 is a view showing a heat dissipating device having a plurality of projections and a smooth plane which are alternately arranged in a sixth embodiment of the present invention. Fig. 12 is a schematic view showing a heat dissipating device of a plurality of embossing portions and a plurality of symmetrical projection portions which are alternately arranged in a seventh embodiment of the present invention. Figure 13 is a schematic view showing a heat dissipating fin of a columnar structure according to an eighth embodiment of the present invention. Fig. 14 is a view showing the heat radiating fin of the short sheet-like structure of the ninth embodiment of the present invention. [Main component symbol description]
463、 20、40 ' 663、72、 60 、 70 、 82、92、 80、90、散熱裝置 102、 100、 104 ' 110、120 1104、 1204、 凸出部 15 201031881 1206 22 ' 42、 62 導熱基板 28、48、 68 W1、 63 電路板 W20、 W22、W3 24、44、 64 26、46、 66 ' 熱源 664 、 106 1102、 散熱鰭片 1106 風扇 間距 凹入部 光滑平面 1202、 1306、463, 20, 40 '663, 72, 60, 70, 82, 92, 80, 90, heat sink 102, 100, 104 '110, 120 1104, 1204, projection 15 201031881 1206 22 '42, 62 thermal substrate 28, 48, 68 W1, 63 circuit board W20, W22, W3 24, 44, 64 26, 46, 66 'heat source 664, 106 1102, heat sink fin 1106 fan pitch concave smooth surface 1202, 1306,
1406 261、 通道 461 ' 661 161406 261, channel 461 ' 661 16