200947190 九、發明說明： ’【發明所屬之技術領域】 本發明涉及-種散熱裝置，特別係—種用以冷卻電路 板上電子元件之散熱裝置。 【先前技術】 隨著電腦產業不斷發展，電子元件如中央處理器、顯 聲卡片等運行頻率和速度不斷提升，發熱量越來越大，若 不及時散發，熱量積累引起溫度升高，影響電子 常運行。 電腦性能之提升使得記憶體條、顯音效卡等板卡上晶 片容量曰益增加，體積越來越小，工作速度越來越快，於 此過程產生之熱量不斷增加，如何快速將該等附加卡上之 晶片熱量快速有效散發，也成為目前業者需解決之問題。 通常業界於電子元件上安裝散熱器輔助其散熱，習知 散熱器大都為鋁擠型散熱器，其結構單一，成本較高。 〇 【發明内容】 有鑒於此，有必要提供一種成本較低、且散熱效率較 高之散熱裝置。 -種散熱裝置1於對—電路板兩側之發熱電子元件 進行散熱，包括-對散熱板及夾置二散熱板於該電路板兩 侧之夾持件’該夾持件包括一連接部及由連接部兩端部延 伸出之-對彈性夾持部，每一散熱板之背向電路板之外侧 表面衝壓形成複數列散熱片，每一散熱板上形成散熱片之 位置處設有開口，二散熱板相對兩端部相互扣接，該夾持 200947190 *部夾持二散熱板貼靠於電路板兩側。 ’ 與習知技術相比，本發明中散熱板之外側表面衝壓形 成複數列散熱片較鋁擠型成本低，每一散熱板上凸伸出散 熱片之位置處設有開口，該電路板兩侧之發熱電子元件通 過散熱板之散熱片進行散熱，同時氣流可通過散熱片位置 處相應之開口吹向發熱電子元件，進一步提高散熱裝置之 散熱效率。 【實施方式】 ❹ 請參閱圖1，本發明散熱裝置用於對一電路板10上之 複數發熱電子元件50進行散熱，本實施例中之電路板10 為一記憶體條，該散熱裝置包括貼設於電路板10兩侧之第 一散熱板20、第二散熱板30及夾持電路板10於第一、二 散熱板20，30之間之四個爽持件40。 請同時參閱圖2至圖3，該電路板10呈矩形板狀，該 複數發熱電子元件50貼設於該電路板10之前侧表面，該 φ 電路板10之後側表面貼設一主要發熱電子元件（圖未示）， 該主要發熱電子元件之面積大於前述其他發熱電子元件 50。電路板10兩端邊緣設有一對缺口 12。 第一、二散熱板20、30均由一次沖模成型，較習知之 鋁擠型成本較低。第一、二散熱板20、30呈矩形板狀貼設 於電路板10之兩側，第一、二散熱板20、30採用鈑金設 計，即第一、二散熱板20、30之厚度均小於6mm。自第一、 二散熱板20、30上一次沖模形成呈魚鱗狀且背向電路板10 之複數列散熱片60。每列散熱片60沿第一、二散熱板20、 8 200947190 30之長度方向平行設置，每一散熱片60因衝壓向外彎曲呈 弧狀結構’其下方因衝壓對應形成長條狀之開口 6〇〇。該相 鄰兩散熱片60之間形成一氣流通道’相鄰之氣流通道與開 口 600彼此相通。該散熱片6〇分別與第一、二散熱板2〇、 30間之夾角可於衝壓之過程中根據實際需要調整。第一、 二散熱板20、30背向電路板1〇之外侧面還於其中位於第 一、二散熱板20、30靠近最外端之兩列散熱片60位置處 ❹間隔設置四組凸出部7〇,每組凸出部7〇沿第一、二散熱板 20、30之長度方向平行設置。 第一散熱板20包括一基板22，該基板22兩端部邊緣 水準向外延伸出一對凸片24,且每一凸片24設有一卡口 240。第二散熱板3〇包括一本體％，該本體32兩端部邊緣 對應第一散熱板2〇之卡口 24〇垂直向外彎折延伸出一對條 狀且呈L形之疋位柱34。該本體32面向電路板於本體 32中央設有一呈矩形之收容槽32〇，該收容槽用來收 ❾容主要發熱電子元件。 第二散熱板30上之定位柱34與第一散熱板2〇之凸片 ★ /、同、及成將第一、二散熱板2〇、3〇扣接之扣合結構，即 第二散熱板3G上之定位柱34順次穿過f路板1()之缺口 12、伸入一第一散熱板2〇凸片24之卡口 24〇，使第一散熱板 j與第一散熱板3〇扣接於一起同時夾置電路板於第 、一散熱板20、30之間。 該夾持件40為-彈性片體，其包括一連接部42及由 連接部42兩端部同向彎折延伸之一對彈性爽持部44。每一 9 200947190 對夾持部44中央處之間距小於兩端部之間距，其中一夾持 ' 部44中央位置處内側面凸設出一圓狀凸點440，另一夾持 部44中央位置處内側面則向内沖設出與該凸點440相對之 一卡片442，該凸點440抵靠於第一、二散熱板20、30之 凸出部70上，該卡片442卡止於第一、二散熱板20、30 上相鄰兩凸出部70間之空間内。該夾持件40之彈性夾持 部44形成卡片442之位置處設有孔口 4420。夾持件40之 夾持部44夾持於第一、二散熱板20、30上之凸出部70並 向内抵壓第一、二散熱板20、30於電路板10兩側，夾持 件40之夾持部44彎曲提供之彈力使第一、二散熱板20、 30夾緊於電路板10兩側。 本發明中該第一、二散熱板20、30之外側表面衝壓形 成複數列散熱片60，較傳統之鋁擠型成本低，第一、二散 熱板20、30上凸伸出散熱片60之位置處設有開口 600,該 電路板10兩侧之發熱電子元件50通過第一、二散熱板20、 0 30之散熱片60進行散熱，同時氣流可通過散熱片60位置 處相應之開口 600吹向發熱電子元件50，進一步提高散熱 裝置之散熱效率。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾 或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱裝置之立體分解圖。 200947190 圖2係圖1中之立體組裝圖。 圖3係圖1之第一散熱板之側視刮面圖。 【主要元件符號說明】 電路板 10 缺口 12 發熱電子元件 50 第一散熱板 20 基板 22 凸片 24 卡口 240 第二散熱板 30 本體 32 定位柱 34 收容槽 320 散熱片 60 開口 600 凸出部 70 失持件 40 連接部 42 爽持部 44 凸點 440 卡片 442 孔口 4420200947190 IX. INSTRUCTIONS: </ RTI> The technical field to which the invention pertains relates to a heat dissipating device, and in particular to a heat dissipating device for cooling electronic components on a circuit board. [Prior Art] With the continuous development of the computer industry, the operating frequency and speed of electronic components such as central processing units and audio-visual cards continue to increase, and the heat generation is getting larger and larger. If not distributed in time, the heat accumulation causes the temperature to rise, affecting the electronics. Always running. The improvement of computer performance has led to an increase in the capacity of chips on memory boards, audio cards, etc., the volume is getting smaller and smaller, the working speed is getting faster and faster, the heat generated in this process is increasing, how to attach it quickly The heat of the chip on the card is quickly and effectively distributed, which has become a problem that the current industry needs to solve. Generally, the industry installs a heat sink on an electronic component to assist its heat dissipation. Conventionally, the heat sink is mostly an aluminum extruded heat sink, which has a single structure and high cost. 〇 [Summary of the Invention] In view of the above, it is necessary to provide a heat sink having a lower cost and a higher heat dissipation efficiency. a heat dissipating device 1 for dissipating heat from the heat-generating electronic components on both sides of the circuit board, comprising: a pair of heat dissipating plates and clamping members for sandwiching the two heat dissipating plates on both sides of the circuit board, the clamping member comprising a connecting portion and Extending from the two ends of the connecting portion, the elastic holding portion, each of the heat radiating plates is punched toward the outer surface of the circuit board to form a plurality of fins, and each of the heat radiating plates is provided with an opening at a position where the heat sink is formed. The two heat dissipating plates are fastened to each other at opposite ends, and the clamping portion 200947190 * holds the two heat dissipating plates against the two sides of the circuit board. Compared with the prior art, in the present invention, the outer side surface of the heat dissipation plate is stamped to form a plurality of heat sinks which are lower in cost than the aluminum extrusion type, and each of the heat dissipation plates is provided with an opening at a position protruding from the heat sink, and the circuit board has two The heat-generating electronic component on the side is dissipated through the heat sink of the heat sink, and the airflow can be blown to the heat-generating electronic component through the corresponding opening at the position of the heat sink, thereby further improving the heat dissipation efficiency of the heat sink. [Embodiment] Referring to FIG. 1, a heat dissipating device of the present invention is used for dissipating heat from a plurality of heat-generating electronic components 50 on a circuit board 10. In the embodiment, the circuit board 10 is a memory strip, and the heat sink includes a sticker. The first heat dissipation plate 20, the second heat dissipation plate 30, and the four holding members 40 that sandwich the circuit board 10 between the first and second heat dissipation plates 20, 30 are disposed on the two sides of the circuit board 10. Referring to FIG. 2 to FIG. 3 , the circuit board 10 has a rectangular plate shape, and the plurality of heat-generating electronic components 50 are attached to the front side surface of the circuit board 10 , and a main heat-generating electronic component is attached to the rear surface of the φ circuit board 10 . (not shown), the area of the main heat-generating electronic component is larger than the other heat-generating electronic component 50 described above. A pair of notches 12 are provided at both end edges of the circuit board 10. The first and second heat radiating plates 20 and 30 are formed by one-shot molding, which is lower in cost than the conventional aluminum extrusion type. The first and second heat dissipation plates 20 and 30 are disposed on the two sides of the circuit board 10 in a rectangular plate shape, and the first and second heat dissipation plates 20 and 30 are formed by a sheet metal design, that is, the thicknesses of the first and second heat dissipation plates 20 and 30 are smaller than 6mm. From the first and second heat radiating plates 20, 30, a plurality of fins 60 which are fish scales and are facing away from the circuit board 10 are formed by one die. Each of the fins 60 is disposed in parallel along the length direction of the first and second heat radiating plates 20, 8 200947190 30, and each of the fins 60 is bent outwardly by an arc to form an arc-shaped structure. Hey. An air flow passage is formed between the adjacent fins 60. The adjacent air flow passage and the opening 600 communicate with each other. The angle between the heat sink 6〇 and the first and second heat dissipation plates 2〇, 30 can be adjusted according to actual needs during the pressing process. The first and second heat dissipation plates 20, 30 are facing away from the outer side of the circuit board 1 and further disposed at four positions of the heat dissipation fins 60 located at the outermost ends of the first and second heat dissipation plates 20, 30. In the portion 7〇, each of the projections 7〇 is disposed in parallel along the longitudinal direction of the first and second heat dissipation plates 20 and 30. The first heat sink 20 includes a substrate 22, and a pair of tabs 24 extend outwardly from the edge portions of the substrate 22. Each of the tabs 24 is provided with a bayonet 240. The second heat dissipating plate 3 includes a body portion, and the two end portions of the body 32 correspond to the first heat dissipating plate 2, and the bayonet 24 is bent perpendicularly outward to extend a pair of strip-shaped and L-shaped clamping posts 34. . The main body 32 faces the circuit board and is provided with a rectangular receiving groove 32 中央 in the center of the main body 32 for receiving the main heat-generating electronic components. The positioning post 34 on the second heat dissipating plate 30 and the tabs of the first heat dissipating plate 2/, and the fastening structure for fastening the first and second heat dissipating plates 2〇, 3〇, that is, the second heat dissipating structure The positioning post 34 on the board 3G sequentially passes through the notch 12 of the f-way board 1 (), and extends into the bayonet 24 of the first heat sink 2, the tab 24, so that the first heat sink j and the first heat sink 3 The cymbals are fastened together to sandwich the circuit board between the first and second heat dissipation plates 20 and 30. The holding member 40 is an elastic sheet body including a connecting portion 42 and a pair of elastic holding portions 44 extending from the opposite ends of the connecting portion 42 in the same direction. Each 9 200947190 is less than the distance between the ends of the clamping portion 44, and a circular protrusion 440 is protruded from the inner side of the central portion of the clamping portion 44, and the center of the other clamping portion 44 is located at the center of the clamping portion 44. The inner side surface is inwardly punched with a card 442 opposite to the bump 440. The bump 440 abuts against the protruding portion 70 of the first and second heat dissipation plates 20, 30, and the card 442 is locked to the first And the space between the two protruding portions 70 on the two heat dissipation plates 20 and 30. An opening 4420 is formed at a position where the elastic grip portion 44 of the holding member 40 forms the card 442. The clamping portion 44 of the clamping member 40 is clamped on the protruding portion 70 of the first and second heat dissipation plates 20, 30 and presses the first and second heat dissipation plates 20, 30 on both sides of the circuit board 10 inwardly, and clamps The elastic force provided by the bending of the clamping portion 44 of the member 40 causes the first and second heat dissipation plates 20, 30 to be clamped to both sides of the circuit board 10. In the present invention, the outer surface of the first and second heat dissipation plates 20 and 30 is stamped to form a plurality of heat dissipation fins 60, which is lower in cost than the conventional aluminum extrusion type, and the first and second heat dissipation plates 20 and 30 protrude from the heat dissipation fins 60. An opening 600 is disposed at the position, and the heat-generating electronic component 50 on both sides of the circuit board 10 is dissipated through the heat sink 60 of the first and second heat dissipation plates 20 and 30, and the airflow can be blown through the corresponding opening 600 at the position of the heat sink 60. The heat-generating electronic component 50 further improves the heat dissipation efficiency of the heat sink. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view of a heat sink of the present invention. 200947190 Figure 2 is a perspective assembled view of Figure 1. 3 is a side plan view of the first heat sink of FIG. 1. [Major component symbol description] Circuit board 10 Notch 12 Heated electronic component 50 First heat sink 20 Substrate 22 Tab 24 Bayonet 240 Second heat sink 30 Body 32 Positioning post 34 Storage groove 320 Heat sink 60 Opening 600 Projection 70 Missing member 40 connecting portion 42 holding portion 44 bump 440 card 442 opening 4420
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