1307007 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種散熱裝置，尤指一種用以冷卻電路 板上電子元件之散熱裝置。 【先前技術】 ^隨著電腦產業不斷發展，電子元件如中央處理器、顯 聲卡片等運行頻率和速度不斷提升，發熱量越來越大，若 不及時政發，熱量累積引起溫度升高，影響電子元件正常 運行。 一電腦性能提升使得記憶體條、顯音效卡等板卡上晶片 f量日益增加，體積越來越小，工作速度越來越快，此過 程產生之熱量不斷增加，如何快速將該附加卡上晶片熱量 快速有效散發，也成爲目前業者需解決之問題。 ‘’、 通常業界於電子元件上安裝散熱器輔助其散熱，爲使 U與發熱電子元件接觸緊密牢固，需借助—扣具實現 散熱器與該發熱電子元件之穩固連接。 * 由於板卡上元件密布’空間小且相鄰板卡間距 乍，於其上安裝散熱器多有不便，且極易因於一板卡上安 ==與其相鄰板卡產生操作干涉’給散熱器安裝拆 【發明内容】 散熱效率高之 有鑒於此，有必要提供一種結構緊凑 散熱裝置。 … 1307007 種熱官，包括：一對散熱板，其中一散熱板一側容 置熱官，該二散熱板相對兩端部相互扣接；及—夾持件， 其包括一連接部及由連接部兩端部延伸之一對彈性夾持 部，該夾持部夾持該二散熱板貼靠於一電路板之兩側。 該實％方式與習知技術相比較，本發明中一散熱板内 設熱官，發熱電子元件之熱量通過該熱管快速傳至該散熱 板，散熱效率顯著；該熱管嵌設於該散熱板一側内，結構 緊湊’節省空間。 σ 【實施方式】 請參閱圖1 ’本發明散熱裝置包括一電路板1〇、貼設 於電路板10兩側之第一散熱板2〇、第二散熱板3〇及夾持 電路板10於第一、二散熱板20，3〇之間之四個夾持件。 請同時參關2至圖4,該電路板1G呈矩形板狀，包 括貼設其前側表面之複數發熱電子it件50及後側表面一主 要發熱電子το件52。電路板1〇兩端邊緣設有一對缺口 12。 第一、一散熱板20、30均呈矩形板狀並貼設於電路板ι〇 兩側第一散熱板2〇、3〇背向電路板1〇之外側面分 別設有相互對應之四對“U”形凸出部26，每一凸出部％ 圍設-空間，該空間中央位置設有—凹點·。第一、二散 熱板20 30外側面中央位置上端^有相互對應之凹陷部 28 38凹* 28、38朝向電路板10凹設，其上分別設 有穿孔280、380以供鉚釘（圖未示）穿過連接第一 '二散熱 板20、30於電路板1〇兩側。 1307007 第-散熱板20包括一基才反22,該基板心 垂直彎折延伸出—對定位柱24。第二散熱板3q包括一 ^ 32及一嵌設於本體32内之熱管36,該本體32兩端部 對應定位柱24水平向外延伸出一對凸片34，且每—凸片 34没有供定位柱24伸進之卡口 34〇。該本體％面向 板1〇 -側邊緣沿本體32長度方向設有―呈長條狀之第— 溝槽320，該熱管36緊貼於第一溝槽320内並通過錫膏 =定。第-溝槽咖上方設有—呈矩形之第二溝槽32 該第一溝槽322用來容置主要發熱電子元件％。 該第一散熱板20上定位柱24與第二散熱板3〇之卡口 3扣共同組成將第—、二散熱板2()、％扣接之扣合結構， 即第-散熱板2G上定位柱24順次穿過電路板ig之缺口 1一2、伸入第二散熱板3〇之卡口 34〇，使第一散熱板如與第 一散熱板30扣接於一起，同時炎置電路板ι〇於第一、二 散熱板20、30之間。 — 該夾持件40爲-彈性片體，其包括一連接部42及由 連接部42兩端部同向彎折延伸之―對大致相互平行之彈性 夾持部44。每一對夾持部44相對内側下端部凸設出卡止於 第一、二散熱板20、30之凹點26〇内之一對凸點44〇。該 夾持件40之夾持部44夹持於第—、二散熱板2〇、3〇上之 凸出部26所圍設之空間内並向内抵壓第-、二散熱板20、 30於電路板1〇兩側，夾持部44彎曲提供之彈力使第一、 二散熱板20、30夾緊於電路板1〇兩側。 請參閱圖4,該散熱裝置工作時，貼設於第二散熱板 1307007 30第二溝槽322内主要發熱電子元件52產生之熱量首先被 第二散熱板30吸收並聚集於第二溝槽322内，臨近第二溝 槽322之熱管36中部吸收第二溝槽322内熱量並由熱管36 中部快速傳向其兩端部，該第二散熱板30底部吸收熱管36 兩端部熱量並沿第二散熱板3〇底部向上傳遞，最終熱量快 速分佈於第二散熱板3〇。由於熱管36嵌設於第二散熱板 3〇内’結構緊凑、所占空間小。 _ 本發明中第一、二散熱板2〇、3〇同時貼設於電路板1〇 兩侧表面，充分利用電路板1〇兩侧空間，增大散熱表面積， 散熱效果顯著；第二散熱板3〇内設熱管36，將主要發熱電 子兀*件52熱量由其中部快速傳至兩側，加快散熱速度。 ，=上所述，本發明符合發明專利要件，爰依法提出專 利申4。惟，以上所述者僅為本發明之較佳實施例，舉凡 本案技藝之人士，在爰依本發明精神所作之等效修飾 s、變化’皆應涵蓋於以下之申請專利範圍内。 •【圖式簡單說明】 圖1係本發明散熱裝置之立體組合圖。 圖2係圖1之立體分解圖。 圖3係圖1之俯視圖。 圖4係圖2中孰答目上& 立面 T…、s貼5又於第二散熱板内之傳熱路徑示 9 1307007 【主要元件符號說明】 電路板 10 缺口 12 第一散熱板 20 基板 22 定位柱 24 凸出部 26 凹陷咅P 28、38 第二散熱板 30 本體 32 凸片 34 卡口 340 第一溝槽 320 第二溝槽 322 熱管 36 穿孔 280 > 380 夾持件 40 連接部 42 夾持部 44 凸點 440 發熱電子元件 50 凹點 260 主要發熱電子元件 52 101307007 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for cooling electronic components on a circuit board. [Prior Art] With the continuous development of the computer industry, the operating frequency and speed of electronic components such as central processing units and audio-visual cards continue to increase, and the heat generation is getting larger and larger. If it is not timely, the heat accumulation will cause the temperature to rise, affecting The electronic components are operating normally. A computer performance improvement makes the amount of wafer f on the memory card, the audio card, etc. is increasing, the volume is getting smaller and smaller, the working speed is getting faster and faster, the heat generated in this process is increasing, how to quickly add the card The rapid and effective dissipation of heat from the wafer has become a problem that the industry has to solve. ‘‘, the industry usually installs a heat sink on the electronic component to assist its heat dissipation. In order to make the U and the heat-generating electronic component in close contact with each other, a secure connection between the heat sink and the heat-generating electronic component is required by means of a buckle. * Due to the small space on the board, the space is small and the spacing between adjacent boards is small. It is inconvenient to install the heat sink on it, and it is easy to interfere with the operation of one board with the adjacent board. Radiator installation and disassembly [Summary of the Invention] In view of the high heat dissipation efficiency, it is necessary to provide a compact heat sink. 1307007 kinds of heat officials, comprising: a pair of heat dissipation plates, wherein one of the heat dissipation plates receives a heat official, and the two heat dissipation plates are mutually fastened to each other; and the clamping member comprises a connecting portion and a connection One end portion of the portion extends to the elastic clamping portion, and the clamping portion clamps the two heat dissipation plates against two sides of a circuit board. Compared with the prior art, in the present invention, a heat sink is disposed in a heat dissipation plate, and heat of the heat-generating electronic component is quickly transmitted to the heat dissipation plate through the heat pipe, and the heat dissipation efficiency is remarkable; the heat pipe is embedded in the heat dissipation plate Inside the side, compact structure 'saving space. σ [Implementation] Please refer to FIG. 1 'The heat sink of the present invention includes a circuit board 1 , a first heat sink 2 贴 attached to both sides of the circuit board 10 , a second heat sink 3 〇 , and a clamping circuit board 10 . Four clamping members between the first and second heat dissipation plates 20, 3〇. Please refer to FIG. 2 to FIG. 4 at the same time. The circuit board 1G has a rectangular plate shape, and includes a plurality of heat-generating electronic components 50 on the front side surface and a main heat-generating electrons 52 on the rear side surface. A pair of notches 12 are provided on both ends of the circuit board 1 . The first heat dissipating plates 20 and 30 are respectively in the shape of a rectangular plate and are attached to the first and second sides of the first heat dissipating plate 2 〇, 3 〇 on the two sides of the circuit board The "U"-shaped projections 26 each enclose a space in which a central point is provided with a pit. The upper end of the outer surface of the first and second heat radiating plates 20 30 has a corresponding recessed portion 28 38 recessed * 28, 38 recessed toward the circuit board 10, and perforations 280, 380 are respectively provided for the rivets (not shown) ) is connected to the first 'two heat sinks 20, 30 on both sides of the circuit board 1 。. 1307007 The first heat sink 20 includes a base 22 which extends perpendicularly to the alignment post 24. The second heat dissipating plate 3q includes a heat pipe 36 and a heat pipe 36 embedded in the body 32. The two ends of the body 32 extend horizontally outwardly from the positioning post 24 to form a pair of fins 34, and each of the tabs 34 is not provided. The positioning post 24 extends into the bayonet 34〇. The body % faces the board 1 - the side edge is provided along the length direction of the body 32 - a strip-shaped first groove - 320 which is in close contact with the first trench 320 and passes through the solder paste. A second trench 32 is formed above the first trench surface for accommodating the main heat-generating electronic component. The positioning post 24 on the first heat dissipation plate 20 and the bayonet 3 buckle of the second heat dissipation plate 3 together form a fastening structure of the first and second heat dissipation plates 2 () and %, that is, the first heat dissipation plate 2G The positioning post 24 passes through the notch 1 - 2 of the circuit board ig and protrudes into the bayonet 34 第二 of the second heat dissipating plate 3 , so that the first heat dissipating plate is fastened together with the first heat dissipating plate 30 , and the igniting circuit The board is sandwiched between the first and second heat sinks 20, 30. The holding member 40 is an elastic sheet body comprising a connecting portion 42 and an elastic holding portion 44 which is substantially parallel to each other and which is bent in the same direction from both end portions of the connecting portion 42. Each pair of clamping portions 44 protrudes from the inner lower end portion to abut one of the bumps 44 of the first and second heat dissipation plates 20, 30. The clamping portion 44 of the clamping member 40 is clamped in the space enclosed by the protruding portion 26 on the first and second heat dissipation plates 2, 3, and presses the first and second heat dissipation plates 20, 30 inwardly. On both sides of the circuit board 1 , the elastic force provided by the bending of the clamping portion 44 causes the first and second heat dissipation plates 20 and 30 to be clamped on both sides of the circuit board 1 . Referring to FIG. 4 , when the heat sink is in operation, the heat generated by the main heat-generating electronic component 52 disposed in the second trench 322 of the second heat sink 1307007 30 is first absorbed by the second heat sink 30 and collected in the second trench 322 . The middle portion of the heat pipe 36 adjacent to the second trench 322 absorbs heat in the second trench 322 and is rapidly transferred from the middle portion of the heat pipe 36 to both ends thereof. The bottom portion of the second heat sink 30 absorbs heat at both ends of the heat pipe 36 and follows The bottom of the two heat sinks 3 is transferred upward, and the final heat is quickly distributed to the second heat sink 3〇. Since the heat pipe 36 is embedded in the second heat dissipation plate 3', the structure is compact and the space occupied is small. _ In the present invention, the first and second heat dissipation plates 2〇 and 3〇 are simultaneously attached to both sides of the circuit board 1 ,, and the space on both sides of the circuit board 1 is fully utilized to increase the heat dissipation surface area, and the heat dissipation effect is remarkable; the second heat dissipation plate The heat pipe 36 is arranged in the 3〇, and the heat of the main heat-generating electronic component 52 is quickly transmitted from the middle to the two sides to accelerate the heat dissipation speed. According to the above, the invention complies with the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only the preferred embodiment of the present invention, and those skilled in the art will be able to cover the equivalent modifications and variations of the present invention within the scope of the following claims. • [Simple Description of the Drawings] Fig. 1 is a perspective assembled view of the heat dissipating device of the present invention. 2 is an exploded perspective view of FIG. 1. Figure 3 is a plan view of Figure 1. 4 is a heat transfer path of the second surface of the second heat sink in FIG. 2, and the heat transfer path is shown in the second heat sink. 9 1307007 [Description of main components] Circuit board 10 notch 12 First heat sink 20 Substrate 22 positioning post 24 projection 26 recessed 咅P 28, 38 second heat sink 30 body 32 tab 34 bayonet 340 first trench 320 second trench 322 heat pipe 36 perforation 280 > 380 clamping member 40 connection Portion 42 Clamping portion 44 Bump 440 Heated electronic component 50 Pit 260 Mainly heat-generating electronic component 52 10