1283161 九、發明說明： 【發明所屬之技術領域】 本發明涉及-種散熱裝置，特別係 板上電子元件之散熱裝置。 令“ 【先前技術】 隨著電腦產業不斷發展，電子元件如中央 聲卡片料行料和速度精提升，發熱量^越;^ =時散發’熱量累積w溫度升高，影響電子元件正常 電腦性能提升使得記憶體條、顯音效 容量日益增加，體積鉞夾揣丨 卡上日日片 輕產生熱量不斷增加，如何快速將該附加卡=晶= 里快速有效散發，成爲目前業者需解決之問題。… 通常業界於電子元件上安裝散熱器辅助其散敎 散熱器與發熱元件接觸緊密牢固，需借助一扣且實散執 為與該發熱元件之穩固連接。 放…、 於二由=上二密布’空間小且相鄰板卡間距窄， 熱器而與其相鄰板卡產生操作干涉，給散妖== 散 造成困難。 …為之女裝拆卸 【發明内容】 有鑒於此 ’有必要提供-種結構緊湊、操作方便之散 7 1283161 '熱裝置。 ' 本發明實施例之散熱裝置包括一對散熱板及將二散熱 板夾置於-電路板兩側之夾持件，該夾持件包括一連接部 _及由連接部兩端部延伸出之一對彈性夾持部，每一夾持部 相對二側邊形成有可與二散熱板卡扣之扣鈎及由夾持部末 .端向内彎折貼合於散熱板内侧自之扣合片.，該夾持部向内 抵壓而使二散熱板緊密貼靠於電路板表面。 • 該實施方式與f知技術相比較，兩散熱板同時貼設於 電路板兩侧進行散熱效果顯著；該夾持件將二散熱板緊緊 夾持於電路板兩侧，該散熱裝置整體結構緊湊、使用方便 快捷。 【實施方式】 請參閱圖1 ’本發明散熱裝置包括一對散熱板1〇及將 二散熱板10夾置於一電路板2〇兩侧之四個夾持件3〇。 鲁 明同時參閱圖1至圖4，二散熱板10均呈矩形板狀， 其背向電路板10外侧面分別設有相互對應之四對長條狀凸 起部12,每一夾持件30對應設置於每一對凸起部12之間。 二散熱板外側面中央位置設有相互對應之凹陷部14，凹 、陷部14朝向電路板10凹設，其上設有穿孔140以供鉚釘（圖 未示）穿過從而將二散熱板10連接至電路板2〇。每一散熱 板10前端設有與夾持件30卡合之卡槽,後側末梢設有 與凸起部12相對應且供夾持件3〇插入之插槽18，插槽丄8 延伸方向垂直於該矩形板狀散熱板之長邊。其中一散熱 8 1283161 板ίο内側面貼設有導熱膠帶以貼合於電路板2〇上發熱電 、子元件表面用以傳導熱量，增進散熱效果。 又… 該夾持件30爲一彈性片體，其包括一連接部32及由 連接部32㊆端部同向延伸出一對相i平行之彈性夹持部 .34。每一夾持部34相對兩側邊、臨近連接部32内彎形1 有扣鈎342,夾持部34末端内彎卡於散熱板1〇之前端卡槽 16内並貼設於散熱板1〇内側表面形成有扣合片3料。插入 ，插槽18之扣鈎342勾扣固定於散熱板1〇内侧面。扣合片 344中央設有一卡口 346，利於外部工具抵止於卡口 3邨内 將二散熱板10前端撐開放入電路板2〇。 請參閱圖4,夾持件30,組裝於二散熱板1〇之前，夾持 件30,中夾持部34,前端平行於散熱板1〇 ;組裝時，夾持部 34上扣鈎342’插入散熱板1〇之插槽18並勾扣固定於散熱 板1〇内侧面，同時夾持件3〇,兩夾持部34，緊貼於二散熱板 ίο外側面，借助外力將夾持部34，帶有卡口 346，之前端向 ’二散熱板ίο内側面彎折形成扣合片344並卡抵於卡槽16, 夾緊散熱板10前端，完成夾持件3〇,與二散熱板1〇之組 裝。夾持件30,組裝於二散熱板1〇之後形成夾持件3〇。 使用該散熱裝置時，借助工具抵止於扣合片344之卡 口 346内，將散熱板1〇前端撐開再放入電路板2〇，夹持件 3〇因自身彈力向内抵壓散熱板1〇緊密貼靠電路板2〇表 面’即二散熱板10緊密夾靠電路板2〇上。 本發明二散熱板10同時貼設於電路板2〇兩側面，散 9 1283161 ，表面大，與電路板2G上電子元件緊密接觸，散熱效 者，一散熱板10與夾持件3〇緊密結合，使用時只* :力張開:政熱板1〇前端’通過夹持件3〇彈力夹:緊二板 ，#作間早、方便；此外，二散熱板1()同時貼設於電路 板10兩側面可增強電路板20剛度，保護電路板2〇上晶片。 综上所述，本發明符合發明專利要件.，爰依法提出專 J申叫准，以上所述者僅為本發明之較佳實施例，舉凡 鳙熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾 或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱裝置與一電路板立體組裝圖。 圖2係本發明散熱裝置之立體示意圖。 圖3係圖2中沿m-n線之剖面圖。 圖4係圖2之部分組裝圖。 •【主要元件符號說明】 散熱板 10 凸起部 12 凹陷部 14 穿孔 140 卡槽 16 插槽 18 夹持件 30 、 30， 連接部 32 失持部 34 、 34， 扣鈎 342 ' 342, 卡口 346 、 346， 扣合片 344 電路板 201283161 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, particularly a heat dissipating device for electronic components on a board. "[Previous technology] With the continuous development of the computer industry, electronic components such as the central acoustic card material and speed are improved, and the heat generation is more; ^ = when the 'heat accumulation w temperature rises, affecting the normal computer performance of electronic components The improvement makes the memory strip and the display sound effect capacity increase day by day. The heat generated by the daily volume of the volume clip is gradually increased. How to quickly and effectively distribute the add-on card=crystal= is a problem that the current industry needs to solve. ... Generally, the industry installs a heat sink on an electronic component to assist the heat sink of the heat sink to be in close contact with the heat generating component, and a solid connection with the heat generating component is required by means of a buckle and a solid dispersion. 'The space is small and the spacing between adjacent boards is narrow, and the heat device interferes with the operation of its adjacent boards, which makes it difficult for the demon == to disperse. ... for the disassembly of women's clothing [invention] In view of this, it is necessary to provide - The utility model relates to a heat dissipating device comprising a pair of heat dissipating plates and clamping the two heat dissipating plates on both sides of the circuit board. a clamping member, the clamping member comprises a connecting portion _ and a pair of elastic clamping portions extending from the two ends of the connecting portion, and each of the clamping portions is formed with a buckle that can be buckled with the two heat dissipation plates The hook and the end of the clamping portion are bent inwardly to be bonded to the inner side of the heat dissipation plate from the fastening piece. The clamping portion is pressed inwardly to make the two heat dissipation plates closely abut against the surface of the circuit board. Compared with the known technology, the two heat dissipation plates are simultaneously attached to both sides of the circuit board for significant heat dissipation effect; the clamping member tightly clamps the two heat dissipation plates on both sides of the circuit board, and the heat dissipation device has a compact overall structure and is used. [Embodiment] Please refer to FIG. 1 'The heat dissipating device of the present invention comprises a pair of heat dissipating plates 1 and 4 clamping members 3 夹 sandwiching the two heat dissipating plates 10 on both sides of a circuit board 2 〇. Referring to FIG. 1 to FIG. 4, the two heat dissipation plates 10 are all in the shape of a rectangular plate, and the outer sides of the circuit board 10 are respectively provided with four pairs of elongated protrusions 12 corresponding to each other, and each of the clamping members 30 is correspondingly disposed. Between each pair of raised portions 12. The central portion of the outer surface of the two heat dissipation plates is provided with a corresponding concave The recesses and recesses 14 are recessed toward the circuit board 10, and the through holes 140 are provided thereon for rivets (not shown) to pass through the two heat sinks 10 to the circuit board 2. The front end of each heat sink 10 The slot is engaged with the clamping member 30, and the rear end is provided with a slot 18 corresponding to the boss 12 for inserting the clip 3, and the slot 丄8 extends perpendicularly to the rectangular plate The long side of the heat sink. One of the heat dissipation 8 1283161 board ίο is provided with thermal conductive tape on the inner side to be attached to the circuit board 2〇, and the surface of the sub-component is used to conduct heat to improve the heat dissipation effect. 30 is an elastic piece body, which comprises a connecting portion 32 and an elastic clamping portion 34 extending from the seven end portions of the connecting portion 32 in the same direction. The opposite sides of each clamping portion 34 are adjacent to each other. The inner portion of the portion 32 has a buckle 342. The end of the clamping portion 34 is bent in the front end slot 16 of the heat dissipation plate 1 and is attached to the inner surface of the heat dissipation plate 1 to form a fastening piece 3 . Inserted, the hook 342 of the slot 18 is fastened to the inner side of the heat sink 1〇. The middle of the fastening piece 344 is provided with a bayonet 346, which facilitates the external tool to resist the bayonet. 3 The front end of the two heat dissipating plates 10 is opened into the circuit board 2〇. Referring to FIG. 4, the clamping member 30 is assembled before the two heat dissipating plates 1 , the clamping member 30 , the middle clamping portion 34 , the front end is parallel to the heat dissipating plate 1 〇; when assembled, the clamping portion 34 has a fastening hook 342 ′ Inserting the slot 18 of the heat sink 1〇 and hooking and fixing it to the inner side of the heat sink 1,, while the clamping member 3〇, the two clamping portions 34 are tightly attached to the outer side of the two heat sinks, and the clamping portion is clamped by an external force. 34, with a bayonet 346, the front end is bent to the inner side of the 'two heat sinks ίο, forming a fastening piece 344 and snapping against the card slot 16, clamping the front end of the heat sink 10, completing the clamping member 3〇, and dissipating heat Assembly of the board 1〇. The clamping member 30 is assembled to the two heat dissipating plates 1 to form a clamping member 3〇. When the heat dissipating device is used, the tool is pressed against the bayonet 346 of the fastening piece 344, and the front end of the heat dissipating plate 1 is opened and then placed in the circuit board 2, and the clamping member 3 is pressed inward by the elastic force. The board 1 〇 closely abuts the surface of the circuit board 2', that is, the two heat sinks 10 are closely clamped to the board 2 。. The two heat dissipating plates 10 of the present invention are simultaneously attached to both sides of the circuit board 2, with a dispersion of 9 1283161, the surface is large, and is in close contact with the electronic components on the circuit board 2G, and the heat dissipating effect is tightly combined with the clamping member 3〇. When using only *: force open: political hot plate 1 〇 front end 'through the clamping member 3 〇 elastic clamp: tight two plates, #作早早,方便; In addition, two heat sink 1 () simultaneously attached to the circuit Both sides of the board 10 enhance the rigidity of the board 20 and protect the board 2 from the wafer. In summary, the present invention is in accordance with the requirements of the invention patent. The above is only a preferred embodiment of the present invention. The above is only a preferred embodiment of the present invention, and those who are familiar with the skill of the present invention are in the spirit of the present invention. Equivalent modifications or variations are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective assembled view of a heat sink and a circuit board of the present invention. 2 is a schematic perspective view of a heat sink of the present invention. Figure 3 is a cross-sectional view taken along line m-n of Figure 2. Figure 4 is a partial assembled view of Figure 2. • [Main component symbol description] Heat sink 10 Raised portion 12 Recessed portion 14 Perforated 140 Card slot 16 Slot 18 Clamping members 30, 30, Connection portion 32 Missing portions 34, 34, Clasp 342 ' 342, Bayonet 346, 346, fastening piece 344 circuit board 20