CN214384959U - Heat abstractor, circuit board and electrical apparatus thereof - Google Patents
Heat abstractor, circuit board and electrical apparatus thereof Download PDFInfo
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- CN214384959U CN214384959U CN202120120433.6U CN202120120433U CN214384959U CN 214384959 U CN214384959 U CN 214384959U CN 202120120433 U CN202120120433 U CN 202120120433U CN 214384959 U CN214384959 U CN 214384959U
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Abstract
The application discloses heat abstractor, circuit board and electrical apparatus thereof relates to heat source heat dissipation technical field. The heat dissipation device comprises a first heat dissipation module, a second heat dissipation module, a fluid driving piece and a connecting piece, wherein the fluid driving piece is assembled at least one end of the first heat dissipation module and the second heat dissipation module and drives a fluid to dissipate heat of a heat source, the connecting piece is positioned between the first heat dissipation module and the second heat dissipation module, and the first heat dissipation module and the second heat dissipation module are fixedly connected to two sides of the heat source through the connecting piece. The first heat dissipation module and the second heat dissipation module are fastened on two sides of the heat source through the connecting piece, so that the fixing stability between the heat source and the heat dissipation module is improved, meanwhile, the attaching area between the heat dissipation module and the heat source is increased, and the heat dissipation effect is further improved; in addition, the first heat dissipation module or the second heat dissipation module is dissipated through the fluid driving piece, the heat dissipation effect on a heat source is further improved through the fluid, and the heat dissipation effect is improved.
Description
Technical Field
The application relates to the technical field of heat source heat dissipation, in particular to a heat dissipation device, a circuit board and an electric appliance thereof.
Background
The heat dissipation of the heat source in the electronic device is usually adhered to the surface of the heat source through the metal sheet, and the metal sheet is dissipated through natural heat dissipation so as to improve the heat dissipation effect. However, this heat dissipation method is mainly performed by a natural heat dissipation method, and the heat dissipation effect is limited, and since the electronic device is often required to be sleeved with a protective housing, it is not directly contacted with natural air and exchanges heat. In order to improve the situation, the fan and the like are often added to increase the air flow on the surface of the metal sheet, and although the heat exchange on the surface of the metal sheet is increased in the mode, the fan is newly added to cause the metal sheet to bear larger pressure, the stability of connection between the metal sheet and the heat source is reduced, the metal sheet cannot be tightly attached to the heat source, the heat conduction efficiency between the metal sheet and the heat source is reduced, and the heat dissipation efficiency of the whole heat dissipation device on the heat source is further reduced.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problems of poor stability and low heat dissipation efficiency of connection between a heat conducting piece and a heat source, the main purpose of the application is to provide a heat dissipation device, a circuit board and an electric appliance thereof, wherein the heat dissipation device can be stably connected with the heat source and has high heat dissipation efficiency.
In order to realize the purpose of the utility model, the following technical scheme is adopted in the application:
according to an aspect of the application, a heat dissipation device is provided, including first heat dissipation module, second heat dissipation module, fluid drive spare and connecting piece, the fluid drive spare assemble in first heat dissipation module with the one end of at least one in the second heat dissipation module to it is right to drive fluid the heat source dispels the heat, the connecting piece is located first heat dissipation module with between the second heat dissipation module, first heat dissipation module reaches second heat dissipation module passes through connecting piece fastening connection in the heat source both sides.
According to an embodiment of the present application, a plurality of heat dissipation fins are disposed on a side of at least one of the first heat dissipation module and the second heat dissipation module facing the fluid driving member, a heat dissipation channel is formed between the plurality of heat dissipation fins, and the fluid driving member can drive the fluid to dissipate heat with the heat source through the heat dissipation channel.
According to an embodiment of the present application, the plurality of fins are in a tooth-shaped structure with continuous intervals, and the plurality of fins extend along the same direction.
According to an embodiment of the present application, at least two of the fluid drivers are included, and the fluid drivers are symmetrically disposed on both sides of the heat source.
According to an embodiment of the application, the fluid driver comprises a plurality of fluid drivers, and the plurality of fluid drivers are arranged at intervals along the extending direction of the heat source.
According to an embodiment of the application, wherein the connecting piece includes first heat-conducting plate and second heat-conducting plate, first heat-conducting plate reaches the laminating of second heat-conducting plate assemble in the both ends of heat source, fluid driving piece assemble in first heat-conducting plate with at least one in the second heat-conducting plate.
According to an embodiment of the present application, the heat conduction glue is further included, and the heat conduction glue is disposed between the heat source and at least one of the first heat conduction plate and the second heat conduction plate.
According to an embodiment of the present application, including the fastening piece, the first heat-conducting plate and the second heat-conducting plate are provided with dodging holes facing the heat source, the fastening piece passes through dodging holes fasten the first heat-conducting plate and the second heat-conducting plate on both sides of the heat source.
According to an embodiment of the present application, wherein the fluid driver is a fan.
According to an embodiment of the present application, the fluid driving member is disposed at a middle portion of at least one of the first heat dissipation module and the second heat dissipation module.
According to another aspect of the present application, there is provided a circuit board comprising the heat dissipation device.
According to another aspect of the application, an electric appliance is provided, which comprises the circuit board.
According to the technical scheme, the heat dissipation device, the circuit board and the electric appliance have the advantages and positive effects that:
the first heat dissipation module and the second heat dissipation module are respectively arranged on the two sides of the heat source, heat dissipation is carried out on the two sides of the heat source, and the circulation speed of at least one surface fluid in the first heat dissipation module and the second heat dissipation module is increased by arranging the fluid driving piece, so that the heat exchange efficiency can be improved; in addition, a connecting piece is arranged between the first heat dissipation module and the second heat dissipation module and fastens the first heat dissipation module and the second heat dissipation module on two sides of the heat source, so that the stability of the whole structure is improved when the fluid driving piece exchanges heat with the first heat dissipation module and the second heat dissipation module, the first heat dissipation module, the second heat dissipation module and the heat source can be kept in close fit in real time, the heat exchange area between the first heat dissipation module and the heat source and between the second heat dissipation module and the heat source are improved, and the heat dissipation effect of the whole heat dissipation device is further improved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive labor.
Fig. 1 is a schematic front view of a heat dissipation device according to an exemplary embodiment.
Fig. 2 is a side view of a heat dissipation device according to an exemplary embodiment.
Fig. 3 is a schematic view of another side view of a heat dissipation device according to an exemplary embodiment.
Fig. 4 is a schematic top view of a heat dissipation device according to an exemplary embodiment.
Wherein the reference numerals are as follows:
1. a first heat dissipation module; 2. a second heat dissipation module; 3. a fluid driver; 4. a heat dissipation channel; 5. a heat sink; 6. a first heat-conducting plate; 7. a second heat-conducting plate; 8. conducting heat and gluing; 9. a fastener; 100. a heat source.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the prior art, the heat dissipation of the electronic device is realized by adhering a metal heat conducting sheet on a heat source, the heat source quickly dissipates heat in a heat conduction mode through the metal heat conducting sheet so as to increase the heat conduction efficiency, but the mode is only suitable for directly arranging the electronic device on one side close to the air, for the electronic devices arranged inside, the heat dissipation effect is greatly limited, the heat dissipation effect is low, and to change the situation, often, additional driving components such as a fan are used to make the fan radiate heat from the heat source or the metal heat-conducting plate, in order to improve the fluidity of cooling air, in the heat dissipation process, the metal heat conducting fins need to additionally bear the gravity pressure or the wind pressure and the like caused by the fan, so that a large gap exists between the metal heat conducting fins and a heat source, the assembly connection is unstable, the heat contact area from the heat source to the metal heat conducting fins is small, and the heat dissipation efficiency of the whole heat dissipation device is influenced. In order to solve the technical problems of poor stability and low heat dissipation efficiency of connection between a heat conducting piece and a heat source in the prior art, the heat dissipation device disclosed by the application comprises a first heat dissipation module 1, a second heat dissipation module 2 and a fluid driving piece, wherein the first heat dissipation module 1 and the second heat dissipation module 2 are respectively assembled on two sides of the heat source 100, the fluid driving piece is assembled on at least one end of the first heat dissipation module 1 and the second heat dissipation module 2, at least one of the first heat dissipation module 1 and the second heat dissipation module 2 is provided with a heat dissipation channel 4 towards the heat source 100, and the fluid driving piece can drive fluid to dissipate heat through the heat dissipation channel 4 towards the heat source 100.
Referring to fig. 1, a schematic front overall structure of a heat dissipation device according to an exemplary embodiment is shown, and fig. 4 is a schematic top overall structure of a heat dissipation device according to an exemplary embodiment, in which a first heat dissipation module 1 and a second heat dissipation module 2 are respectively disposed on two sides of a heat source 100, and the first heat dissipation module 1 and the second heat dissipation module 2 are stably clamped on two sides of the heat source 100 through a connecting member, so that a contact area between the heat dissipation modules and the heat source 100 and connection and fixation stability can be improved, and when the fluid driving member is used to dissipate heat of the first heat dissipation module 1 and the second heat dissipation module 2, a problem that a gap occurs between contact surfaces of the first heat dissipation module 1 and the second heat dissipation module 2 and the heat source 100 to affect heat dissipation efficiency is prevented.
In addition, it should be noted that the connecting member may be configured as a fastening collar or a flange structure, and the size of the connecting member is adjusted to enable the connecting member to be fixed between the first heat dissipation module 1 and the second heat dissipation module 2, so that the heat source 100 can be fastened between the first heat dissipation module 1 and the second heat dissipation module 2, and displacement or clearance is prevented.
Furthermore, the fluid driving member may be correspondingly disposed on one side of the first heat dissipation module 1 and the second heat dissipation module 2 away from the heat source 100, and a distance is set between the fluid driving member and the heat source 100, so that a heat dissipation channel 4 is provided between the fluid driving member and the heat source 100, and after the fluid driving member is started, the fluid in the heat dissipation channel 4 is driven to flow rapidly, and further the heat of the heat source 100 can be rapidly taken out through the fluid, so as to improve the heat dissipation effect of the overall heat dissipation device.
Preferably, at least two or more fluid driving members are provided, so that the fluid driving members are correspondingly and symmetrically disposed on the first heat dissipation module 1 and the second heat dissipation module 2, thereby improving the heat exchange effect of the heat source 100 at a specific position, and the fluid driving members are disposed at intervals along the extending direction of the heat source 100 to improve the circulation rate of the fluid. The number of the fluid driving members can be set by a person skilled in the art according to actual conditions so as to meet actual use requirements.
Preferably, the fluid driving member may be disposed at a middle portion corresponding to the heat source 100, to reduce a distance between the fluid and the heat source 100 and to reduce an air volume loss between the fluid and the heat source 100.
Referring to fig. 2, a schematic side view of a heat dissipation apparatus according to an exemplary embodiment is shown, according to an embodiment of the present application, wherein a plurality of heat dissipation fins 5 are disposed on a side of the first heat dissipation module 1 and/or the second heat dissipation module 2 facing the fluid driver, a heat dissipation channel 4 is formed between the plurality of heat dissipation fins 5, and the fluid driver can drive a fluid to dissipate heat from the heat source 100 through the heat dissipation channel 4.
It should be noted that the air inlet of the heat dissipation channel 4 corresponds to the air outlet of the fluid driving member, so as to realize the circulation of the fluid in the heat dissipation channel 4.
The heat dissipation fins 5 may be configured as a fin structure of a metal heat conduction fin, such as an aluminum sheet or a copper sheet, and a plurality of heat dissipation fins 5 can quickly dissipate heat of the heat source 100, so as to increase a heat exchange area between the heat dissipation module and the heat source 100, thereby effectively improving the overall heat dissipation efficiency of the heat dissipation device.
The radiating fins 5 can be separated by 5-7mm, so that the fluid driving part can drive the sufficient circulation space of the fluid in the radiating channel 4 to perform rapid circulation.
According to an embodiment of the present application, the plurality of fins 5 are in a tooth-shaped structure with continuous intervals, and the plurality of fins 5 extend along the same direction. Preferably, the area of the cross section of the side of the heat sink 5 close to the heat source 100 is gradually reduced toward the side far from the heat source 100, so that the contact heat exchange area with the heat source 100 can be effectively increased, and the flow space of the fluid in the heat dissipation channel 4 can be increased.
According to an embodiment of the present application, wherein the connecting piece includes first heat-conducting plate 6 and second heat-conducting plate 7, first heat-conducting plate 6 and the laminating of second heat-conducting plate 7 assemble in the both ends of heat source 100, the fluid driving piece assemble in first heat-conducting plate 6 with at least one in the second heat-conducting plate 7. For example, the first heat dissipation module 1 may be assembled and fixed to the first heat conduction plate 6, the second heat dissipation module 2 may be assembled and fixed to the second heat conduction plate 7, the first heat conduction plate 6 and the second heat conduction plate 7 are integrally connected and sleeved on the surface of the heat source 100, and a person skilled in the art may adjust a spacing distance between the first heat conduction plate 6 and the second heat conduction plate 7, so that the first heat conduction plate 6 and the second heat conduction plate 7 are fastened on the surface of the heat source 100. The stability of the first heat conduction plate 6 in fixing the first heat dissipation module 1 and the heat source 100 is further improved, and the heat exchange area is increased.
Further, according to an embodiment of the present application, a heat conducting glue 8 is further included, and the heat conducting glue 8 is disposed between the heat source 100 and at least one of the first heat conducting plate 6 and the second heat conducting plate 7. Preferably, the heat conducting glue 8 is filled between the heat source 100 and at least one of the first heat conducting plate 6 and the second heat conducting plate 7, so that gaps between the heat source 100 and the first heat conducting plate 6 and the second heat conducting plate 7 are further reduced, and the heat conducting effect is improved.
As an example, the heat conductive glue 8 may be provided as a heat conductive silicone layer. Other heat conduction glue 8 can be selected, so that the heat conduction efficiency of the heat conduction glue 8 is greater than that of air, and a person skilled in the art can select the material of the heat conduction glue 8 according to the actual use condition.
Referring to fig. 3, preferably, according to an embodiment of the present application, a fastening member 9 is further included, and the first heat-conducting plate 6 and the second heat-conducting plate 7 are provided with an avoiding hole facing the heat source 100, and the fastening member 9 passes through the avoiding hole to fasten the first heat-conducting plate 6 and the second heat-conducting plate 7 to both sides of the heat source 100. As an example, the fastening member 9 may be provided as a pin or bolt, and the pin or bolt is inserted into the escape hole, so that the first heat conduction plate 6 and the second heat conduction plate 7 can be fixed to both sides of the heat source 100.
It should be noted that the avoiding hole may be a through hole, which facilitates the direct insertion and fixation of the fastening member 9 during use, thereby improving the convenience of use. The avoiding holes should avoid the body area of the heat source 100, and preferably, the avoiding holes can be arranged around the edge of the heat source 100 at intervals to improve the stability of connection and fixation of the whole structure.
According to another aspect of the present application, there is provided a circuit board comprising the heat dissipation device.
According to another aspect of the application, an electric appliance is provided, which comprises the circuit board.
It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above description is only exemplary of the invention, and is intended to enable those skilled in the art to understand and implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the general inventive concept. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (12)
1. The utility model provides a heat abstractor, characterized in that, includes first heat dissipation module (1), second heat dissipation module (2), fluid drive spare (3) and connecting piece, fluid drive spare (3) assemble in first heat dissipation module (1) with the one end of at least one in the second heat dissipation module (2) to driving fluid dispels the heat to heat source (100), the connecting piece is located between first heat dissipation module (1) and the second heat dissipation module (2), first heat dissipation module (1) and second heat dissipation module (2) pass through connecting piece fastening connection in heat source (100) both sides.
2. The heat dissipation device according to claim 1, wherein a plurality of heat dissipation fins (5) are disposed on a side of at least one of the first heat dissipation module (1) and the second heat dissipation module (2) facing the fluid driving member (3), a heat dissipation channel (4) is formed between the plurality of heat dissipation fins (5), and the fluid driving member (3) can drive the fluid to dissipate heat from the heat source (100) through the heat dissipation channel (4).
3. The heat dissipating device according to claim 2, wherein the plurality of heat dissipating fins (5) are formed in a tooth-like structure at a continuous interval, and the plurality of heat dissipating fins (5) are arranged to extend in the same direction.
4. The heat sink according to claim 1, characterized by comprising at least two fluid drivers (3), wherein the fluid drivers (3) are symmetrically arranged on both sides of the heat source (100).
5. The heat dissipating device according to claim 2, comprising a plurality of the fluid drivers (3), the plurality of fluid drivers (3) being arranged at intervals along an extending direction of the heat source (100).
6. The heat dissipating device of claim 1, wherein the connecting member comprises a first heat conducting plate (6) and a second heat conducting plate (7), the first heat conducting plate (6) and the second heat conducting plate (7) being fitted to both ends of the heat source (100), the fluid driving member (3) being fitted to at least one of the first heat conducting plate (6) and the second heat conducting plate (7).
7. The heat dissipating device according to claim 6, further comprising a thermally conductive glue (8), the thermally conductive glue (8) being arranged between the heat source (100) and at least one of the first and second heat-conducting plates (6, 7).
8. The heat dissipating device according to claim 6, characterized in that it comprises fastening means (9), said first heat-conducting plate (6) and said second heat-conducting plate (7) being provided with relief holes facing said heat source (100), said fastening means (9) passing through said relief holes to fasten said first heat-conducting plate (6) and said second heat-conducting plate (7) on both sides of said heat source (100).
9. The heat sink according to claim 1, characterized in that the fluid drive (3) is a fan.
10. The heat sink according to any of claims 1 to 9, wherein the fluid driver (3) is arranged in the middle of at least one of the first heat sink module (1) and the second heat sink module (2).
11. A circuit board comprising a heat dissipating device according to any one of claims 1 to 10.
12. An electrical appliance comprising the circuit board of claim 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120120433.6U CN214384959U (en) | 2021-01-15 | 2021-01-15 | Heat abstractor, circuit board and electrical apparatus thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120120433.6U CN214384959U (en) | 2021-01-15 | 2021-01-15 | Heat abstractor, circuit board and electrical apparatus thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214384959U true CN214384959U (en) | 2021-10-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120120433.6U Active CN214384959U (en) | 2021-01-15 | 2021-01-15 | Heat abstractor, circuit board and electrical apparatus thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214384959U (en) |
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2021
- 2021-01-15 CN CN202120120433.6U patent/CN214384959U/en active Active
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Address after: 601, 6 / F, building 2, No. 18, Kechuang 11th Street, Daxing District, Beijing, 100176 Patentee after: Jingdong Technology Information Technology Co.,Ltd. Address before: 601, 6 / F, building 2, No. 18, Kechuang 11th Street, Daxing District, Beijing, 100176 Patentee before: Jingdong Shuke Haiyi Information Technology Co., Ltd |