CN211087141U - High-efficiency heat dissipation type CPU heat dissipation plate - Google Patents
High-efficiency heat dissipation type CPU heat dissipation plate Download PDFInfo
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- CN211087141U CN211087141U CN201921115305.1U CN201921115305U CN211087141U CN 211087141 U CN211087141 U CN 211087141U CN 201921115305 U CN201921115305 U CN 201921115305U CN 211087141 U CN211087141 U CN 211087141U
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Abstract
The utility model relates to a high-efficient heat dissipation type CPU heating panel, include: the heat dissipation substrate is provided with connecting lugs on two sides; the connecting support is borne on the radiating substrate and comprises at least two groups of connecting sheets which are arranged in parallel, and two ends of each connecting sheet are bent upwards to form a connecting part protruding out of the surface of the radiating substrate; and, supporting a thermally conductive assembly, the supporting thermally conductive assembly comprising: the CPU heat dissipation device comprises a support supporting plate borne on a heat dissipation substrate and a heat conduction plate borne on the support supporting plate and attached to a CPU chip, wherein a plurality of heat conduction grooves are formed in the heat conduction plate. When the CPU chip is assembled with the connecting part, the bottom of the CPU chip is simultaneously attached to the heat conducting plate, and the connecting part protrudes out of the surface of the heat radiating substrate, and the heat conducting plate is provided with a plurality of heat conducting grooves, so that a heat radiating channel is formed between the heat conducting plate and the heat radiating substrate, and when air of the heat radiating fan passes through the heat radiating channel, the heat on the CPU chip can be directly taken away.
Description
Technical Field
The utility model relates to a hardware fitting technical field, in particular to high-efficient heat dissipation type CPU heating panel.
Background
The CPU heat dissipation plate is mainly used in a notebook computer, generally, the CPU heat dissipation plate is fixed on a shell and assembled with a CPU chip to fix, conduct heat and dissipate heat for the CPU chip, the existing CPU chip is directly fixed on the CPU heat dissipation plate through heat dissipation glue, so that the CPU chip is in sealing connection with the heat dissipation plate, the heat dissipation effect of the contact surface of the CPU chip and the heat dissipation plate is poor, local overheating is easily caused, and the CPU chip is damaged.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a high-efficient heat dissipation type CPU heating panel has the advantage that improves the radiating effect, reduces the CPU damage.
In order to achieve the above purpose, the technical scheme of the utility model is as follows:
An efficient heat dissipation type CPU heat dissipation plate, comprising:
The heat dissipation substrate is provided with connecting lugs at two sides for connecting with the computer case;
The connecting support is borne on the heat dissipation substrate and used for being assembled with the CPU chip, the connecting support comprises at least two groups of connecting sheets which are arranged on the heat dissipation substrate in parallel, and two ends of each connecting sheet are bent upwards to form connecting parts which protrude out of the surface of the heat dissipation substrate; and the number of the first and second groups,
Bear in the heat dissipation base plate and be located two sets of support heat conduction assembly between the connection piece, support heat conduction assembly includes: the heat-conducting plate comprises a supporting plate and a heat-conducting plate, wherein the supporting plate is borne on the heat-radiating substrate, the heat-conducting plate is borne on the supporting plate and is attached to the CPU chip, and a plurality of heat-conducting grooves are formed in the heat-conducting plate.
Realize above-mentioned technical scheme, when CPU chip and connecting portion assemble mutually, the bottom of CPU chip is laminated with the heat conduction board simultaneously, because connecting portion protrusion in heat dissipation substrate surface, and seted up a plurality of heat-conducting grooves on the heat conduction board, consequently, a heat dissipation channel has been formed between heat conduction board and heat dissipation substrate, when radiator fan's wind process this heat dissipation channel, can directly take away the heat on the CPU chip, simultaneously through heat conduction board and supporting plate, can disperse heat conduction to heat dissipation substrate, the local overheated phenomenon of CPU chip has been less taken place, reduce CPU's damage.
As an optimized scheme of the utility model, the supporting plate with heat dissipation base plate integrated into one piece.
By the technical scheme, the supporting support plate can be directly punched and formed, and the supporting support plate is convenient to process.
As an optimized scheme of the utility model, it is adjacent be formed with the conducting strip between the heat conduction groove, the middle part of conducting strip buckle downwards and with the heat dissipation base plate laminates mutually.
According to the technical scheme, the heat dissipation channel is formed between the heat conducting fin and the CPU chip, the heat dissipation effect is further improved, and meanwhile, heat on the CPU chip can be rapidly dispersed on the heat dissipation substrate.
As an optimized proposal of the utility model, the heat conducting plate is also provided with positioning salient points.
By the technical scheme, the CPU chip is conveniently positioned, and the installation precision of the CPU chip is improved.
As a preferred scheme of the utility model, be located on the heat dissipation base plate the corresponding position department of connecting portion is equipped with supplementary thermovent.
According to the technical scheme, the auxiliary heat dissipation port is used for facilitating heat dissipation, and the heat dissipation effect is further improved.
As an optimized scheme of the utility model, still be equipped with a plurality of crisscross radiating groove that distribute on the heat dissipation base plate.
According to the technical scheme, the heat dissipation efficiency of the heat dissipation substrate is improved through the heat dissipation grooves.
To sum up, the utility model discloses following beneficial effect has:
The embodiment of the utility model provides a through providing a high-efficient heat dissipation type CPU heating panel, include: the heat dissipation substrate is provided with connecting lugs at two sides for connecting with the computer case; the connecting support is borne on the heat dissipation substrate and used for being assembled with the CPU chip, the connecting support comprises at least two groups of connecting sheets which are arranged on the heat dissipation substrate in parallel, and two ends of each connecting sheet are bent upwards to form connecting parts which protrude out of the surface of the heat dissipation substrate; and, bear in the heat dissipation base plate and be located two sets of support heat conduction assembly between the connection piece, support heat conduction assembly includes: the heat-conducting plate comprises a supporting plate and a heat-conducting plate, wherein the supporting plate is borne on the heat-radiating substrate, the heat-conducting plate is borne on the supporting plate and is attached to the CPU chip, and a plurality of heat-conducting grooves are formed in the heat-conducting plate. When the CPU chip is assembled with the connecting part, the bottom of the CPU chip is simultaneously attached to the heat conducting plate, the connecting part protrudes out of the surface of the heat radiating substrate, and the heat conducting plate is provided with a plurality of heat conducting grooves, so that a heat radiating channel is formed between the heat conducting plate and the heat radiating substrate, when air of the heat radiating fan passes through the heat radiating channel, heat on the CPU chip can be directly taken away, and meanwhile, the heat can be conducted to the heat radiating substrate to be dispersed through the heat conducting plate and the supporting plate, so that the phenomenon of local overheating of the CPU chip is reduced, and the damage of the CPU is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of the supporting heat-conducting assembly according to an embodiment of the present invention.
The corresponding part names indicated by the numbers and letters in the drawings:
1. A heat-dissipating substrate; 11. connecting a lug plate; 12. an auxiliary heat dissipation port; 13. a heat sink; 2. connecting a bracket; 21. connecting sheets; 22. a connecting portion; 3. supporting a heat conducting assembly; 31. a support pallet; 32. a heat conducting plate; 321. a heat conducting groove; 322. a heat conductive sheet; 323. and positioning the salient points.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Examples
A high-efficiency heat dissipation type CPU heat sink, as shown in fig. 1 and 2, comprising: the heat dissipation substrate 1, the both sides of the heat dissipation substrate 1 are equipped with the connection lug 11 used for connecting with computer chassis; the connecting support 2 is borne on the heat dissipation substrate 1 and used for being assembled with the CPU chip, the connecting support 2 comprises at least two groups of connecting pieces 21 which are arranged on the heat dissipation substrate 1 in parallel, and two ends of each connecting piece 21 are bent upwards to form connecting parts 22 which protrude out of the surface of the heat dissipation substrate 1; and a supporting heat-conducting component 3 carried on the heat-dissipating substrate 1 and located between the two sets of connecting sheets 21.
Specifically, heat dissipation base plate 1 is made by copper product or aluminum product, is made by the copper product in this embodiment, and connection piece 21 is fixed with heat dissipation base plate 1 riveting, and is located the corresponding position department of connecting portion 22 on heat dissipation base plate 1 and is equipped with supplementary thermovent 12, makes things convenient for the heat effluvium more through supplementary thermovent 12, further improves the radiating effect.
The supporting heat-conductive member 3 includes: bear in supporting plate 31 of radiating basal plate 1, and bear in supporting plate 31 and the heat-conducting plate 32 of laminating mutually with the CPU chip, a plurality of heat conduction grooves 321 have been seted up on the heat-conducting plate 32, supporting plate 31 and radiating basal plate 1 integrated into one piece, can directly with supporting plate 31 stamping forming in practical application, make things convenient for supporting plate 31's processing, be formed with conducting strip 322 between the adjacent heat conduction groove 321, the middle part of conducting strip 322 is buckled downwards and is laminated mutually with radiating basal plate 1, thereby also form the radiating passage between conducting strip 322 and the CPU chip, further improve the radiating effect, make the heat on the CPU chip can be more quick dispersion to radiating basal plate 1 simultaneously.
Furthermore, the heat conducting plate 32 is also provided with a positioning convex point 323, the positioning convex point 323 can be formed in a stamping convex hull mode, correspondingly, the CPU chip is provided with a positioning hole matched with the positioning convex point 323, the positioning convex point 323 is butted with the positioning hole, the CPU chip is conveniently positioned, and the installation precision of the CPU chip is improved.
Further, still be equipped with a plurality of radiating grooves 13 that distribute crisscross on radiating basal plate 1, radiating grooves 13 include two cross slots of symmetric distribution and the vertical slot of two cross slots of intercommunication in this embodiment, improve radiating basal plate 1's radiating efficiency through radiating grooves 13.
When the CPU chip is assembled with the connection portion 22, the bottom of the CPU chip is attached to the heat-conducting plate 32 at the same time, because the connection portion 22 protrudes out of the surface of the heat-dissipating substrate 1, and the heat-conducting plate 32 is provided with the plurality of heat-conducting grooves 321, a heat-dissipating channel is formed between the heat-conducting plate 32 and the heat-dissipating substrate 1, when the air of the heat-dissipating fan passes through the heat-dissipating channel, the heat on the CPU chip can be directly taken away, and meanwhile, through the heat-conducting plate 32 and the supporting plate 31, the heat can be conducted to the heat-dissipating substrate 1 to be dissipated, so that the local overheating phenomenon of the CPU chip is reduced.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (6)
1. A high-efficient heat dissipation type CPU heating panel which characterized in that includes:
The heat dissipation substrate is provided with connecting lugs at two sides for connecting with the computer case;
The connecting support is borne on the heat dissipation substrate and used for being assembled with the CPU chip, the connecting support comprises at least two groups of connecting sheets which are arranged on the heat dissipation substrate in parallel, and two ends of each connecting sheet are bent upwards to form connecting parts which protrude out of the surface of the heat dissipation substrate; and the number of the first and second groups,
Bear in the heat dissipation base plate and be located two sets of support heat conduction assembly between the connection piece, support heat conduction assembly includes: the heat-conducting plate comprises a supporting plate and a heat-conducting plate, wherein the supporting plate is borne on the heat-radiating substrate, the heat-conducting plate is borne on the supporting plate and is attached to the CPU chip, and a plurality of heat-conducting grooves are formed in the heat-conducting plate.
2. The high efficiency heat dissipating CPU heatsink plate of claim 1, wherein the support plate is integrally formed with the heatsink base plate.
3. The CPU heat sink as recited in claim 1 or 2, wherein a heat conducting plate is formed between adjacent heat conducting grooves, and a middle portion of the heat conducting plate is bent downward and attached to the heat sink substrate.
4. The CPU heat sink as recited in claim 3, wherein said heat conductive plate further comprises positioning bumps.
5. The high efficiency heat dissipation type CPU heat dissipation plate as defined in claim 1, wherein an auxiliary heat dissipation opening is formed in the heat dissipation substrate at a position corresponding to the connection portion.
6. The CPU heat sink plate with high efficiency as claimed in claim 1, wherein the heat sink substrate further comprises a plurality of heat sink grooves disposed in a staggered manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921115305.1U CN211087141U (en) | 2019-07-16 | 2019-07-16 | High-efficiency heat dissipation type CPU heat dissipation plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921115305.1U CN211087141U (en) | 2019-07-16 | 2019-07-16 | High-efficiency heat dissipation type CPU heat dissipation plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211087141U true CN211087141U (en) | 2020-07-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921115305.1U Active CN211087141U (en) | 2019-07-16 | 2019-07-16 | High-efficiency heat dissipation type CPU heat dissipation plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211087141U (en) |
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2019
- 2019-07-16 CN CN201921115305.1U patent/CN211087141U/en active Active
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