CN220086032U - Bidirectional heat conduction heat dissipation structure - Google Patents

Abstract

The utility model belongs to the technical field of heat dissipation, and particularly relates to a bidirectional heat conduction heat dissipation structure which comprises a heat pipe, an aluminum extrusion and a fin assembly, wherein the heat pipe is bent into a ring shape, two ends of the heat pipe are abutted with an electric element, the aluminum extrusion is abutted to the end part of the heat pipe, and a mounting part is arranged at the abutting part, and the fin assembly is abutted to one side of the aluminum extrusion far away from the heat pipe. The heat pipe is formed into the annular heat pipe, the chip is mounted on the aluminum extrusion and is abutted with the two ends of the heat pipe, the contact area between the heat pipe and the chip is increased, the heat dissipation of the heat pipe is accelerated, the heat pipe is not required to be flattened, the performance loss of the heat pipe is caused, two heat pipes are not required to be used, and the cost is increased. The fin assembly is arranged on one side of the aluminum extrusion, the aluminum extrusion absorbs heat of the heat pipe, the heat is transferred to the fin assembly, the contact area between the fin assembly and air is large, and the heat dissipation rate can be increased more quickly.

Description

Bidirectional heat conduction heat dissipation structure

Technical Field

The utility model belongs to the technical field of heat dissipation, and particularly relates to a bidirectional heat conduction heat dissipation structure.

Background

With the maturation and the redevelopment of the electronics industry, the increasing of the power demands of users on computers, the continuous expansion of software and hardware and the increasing of the duty cycle, while high power is required to be generated, the release of more heat by electronic components will be a necessary trend according to the principle of conservation of physical energy. While considering heat dissipation performance, reduced cost is a great advantage.

Chinese patent publication No.: CN203884127U discloses a heat sink comprising a base and a first fin group, the first fin group having a plurality of heat radiating fins arranged in parallel, the heat sink further comprising: apron and heat conduction board, the apron includes: the base and the base are respectively positioned at two sides of the first fin group; the heat conducting plate is positioned between the base and the first fin group and is attached to the surface of the base; the second fin group passes through the first fin group and is abutted with the heat conducting plate; the mounting plate is abutted with the base and fixedly mounted on the base; the middle parts of the radiating fins of the first fin group are respectively abutted with the heat conducting plate and the base. The radiator also comprises a heat pipe, one end of the heat pipe is connected with the base, and the other end of the heat pipe is inserted into the first fin group. In this scheme, when the heat pipe is designed to contact a larger area with the chip, the heat pipe needs to be flattened, which means that the performance of the heat pipe is lost, and the cost is increased by using two heat pipes.

Disclosure of Invention

The utility model aims to provide a bidirectional heat conduction heat dissipation structure, and aims to solve the technical problem that the heat pipe in the prior art needs to be flattened if a larger area is required to be contacted with a chip, the flattening means the loss of the performance of the heat pipe, and the cost is increased by two heat pipes.

In order to achieve the above-mentioned objective, the heat dissipation structure with bidirectional heat conduction provided by the embodiment of the utility model comprises a heat pipe bent into a ring shape and having two ends abutting against an electrical element, an aluminum extrusion abutting against the end of the heat pipe and provided with a mounting part at the abutting position, and a fin assembly abutting against one side of the aluminum extrusion far away from the heat pipe.

Further, the mounting part is provided with a groove matched with the heat pipe, and the end part of the heat pipe is embedded in the groove.

Further, the heat dissipation assembly is arranged at one side of the fin assembly, and comprises a heat dissipation box with a plurality of through holes at the bottom end, a heat dissipation fan arranged in each through hole, and a bracket with two sides respectively connected with the fin assembly and the inner cavity of the heat dissipation box.

Further, the side face of the heat dissipation box is provided with patterns.

Further, the fin assembly is provided with a mounting groove for placing the heat pipe.

Further, the fin assembly comprises a first fin group and a second fin group which are adjacently arranged, the first fin group is provided with a connecting part, and aluminum extrusion is arranged on the connecting part.

Further, the heat pipe comprises two aluminum bottom plates which are respectively arranged at the upper ends of the first fin group and the second fin group, and the heat pipe is positioned between the aluminum bottom plates and the fin components.

Further, the upper end of the aluminum bottom plate is provided with heat-conducting glue.

Further, the ends of the heat pipe are coated with a thermally conductive paste.

Further, the fin assembly comprises a plurality of radiating fins, each radiating fin is parallel to each other, and the intervals between two adjacent radiating fins are equal.

The above technical solutions in the bidirectional heat conduction heat dissipation structure provided by the embodiments of the present utility model have at least one of the following technical effects: the heat pipe is formed into the annular heat pipe, the chip is mounted on the aluminum extrusion and is abutted with the two ends of the heat pipe, the contact area between the heat pipe and the chip is increased, the heat dissipation of the heat pipe is accelerated, the heat pipe is not required to be flattened, the performance loss of the heat pipe is caused, two heat pipes are not required to be used, and the cost is increased. The fin assembly is arranged on one side of the aluminum extrusion, the aluminum extrusion absorbs heat of the heat pipe, the heat is transferred to the fin assembly, the contact area between the fin assembly and air is large, and the heat dissipation rate can be increased more quickly.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a bidirectional heat-conducting heat dissipation structure according to an embodiment of the present utility model.

Fig. 2 is an exploded schematic view of a bidirectional heat-conducting heat dissipation structure according to an embodiment of the present utility model.

Reference numerals: 10. a heat pipe; 11. a thermally conductive paste; 20. extruding aluminum; 21. a mounting part; 22. a groove; 30. a fin assembly; 31. a mounting groove; 32. a first fin group; 33. a second fin group; 34. a connection part; 35. a heat radiation fin; 40. a heat dissipation assembly; 41. a heat dissipation box; 42. a through hole; 43. a heat radiation fan; 44. a bracket; 45. a pattern; 50. an aluminum bottom plate; 51. a heat-conducting adhesive;

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and intended to illustrate embodiments of the utility model and should not be construed as limiting the utility model.

In the description of the embodiments of the present utility model, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the embodiments of the present utility model and simplify description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present utility model, the meaning of "plurality" is two or more, unless explicitly defined otherwise.

In the embodiments of the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured" and the like are to be construed broadly and include, for example, either permanently connected, removably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the embodiments of the present utility model will be understood by those of ordinary skill in the art according to specific circumstances.

In an embodiment of the present utility model, referring to fig. 1-2, a heat dissipation structure with bidirectional heat conduction is provided, which includes a heat pipe 10 bent into a ring shape and having two ends abutting against an electrical component, an aluminum extrusion 20 abutting against an end of the heat pipe 10 and having a mounting portion 21 at an abutting position, and a fin assembly 30 abutting against a side of the aluminum extrusion 20 away from the heat pipe 10. In this embodiment, the heat pipe 10 is formed into the annular heat pipe 10, the chip is mounted on the aluminum extrusion 20 and is abutted against two ends of the heat pipe 10, so that the contact area between the heat pipe 10 and the chip is increased, the heat dissipation of the heat pipe 10 is accelerated, the heat pipe 10 does not need to be flattened, the performance of the heat pipe 10 is lost, and two heat pipes 10 are not needed, so that the cost is increased. The fin assembly 30 is installed on one side of the aluminum extrusion 20, the aluminum extrusion 20 absorbs heat of the heat pipe 10, and then the heat is transferred to the fin assembly 30, so that the contact area between the fin assembly 30 and air is large, and the heat dissipation rate can be increased more quickly.

Specifically, referring to fig. 1 to 2, the mounting portion 21 is provided with a groove 22 that engages with the heat pipe 10, and the end portion of the heat pipe 10 is fitted into the groove 22. In the present embodiment, two parallel grooves 22 are disposed on the mounting portion 21, two ends of the heat pipe 10 are respectively embedded in the two grooves 22, and the heat pipe 10 is tightly combined with the grooves 22, so as to improve heat dissipation efficiency.

Specifically, referring to fig. 1-2, the heat dissipation assembly 40 is further included on one side of the fin assembly 30, the heat dissipation assembly 40 includes a heat dissipation box 41 with a plurality of through holes 42 at the bottom, a heat dissipation fan 43 disposed in each through hole 42, and a bracket 44 with two sides respectively connected to the fin assembly 30 and the inner cavity of the heat dissipation box 41. In this embodiment, the bracket 44 connects the heat dissipation box 41 and the fin assembly 30, so that the fin assembly 30 is located in the inner cavity of the heat dissipation box 41, and the heat dissipation fan 43 at the bottom end of the heat dissipation box 41 rotates to accelerate the air circulation in the heat dissipation box 41, so that the heat exchange speed of the heat dissipation fins 35 is faster. Meanwhile, the support 44 pads the heat dissipation fins 35, so that the ventilation in the heat dissipation box 41 is quickened, and the heat exchange speed of the heat dissipation fins 35 is faster.

Specifically, referring to fig. 1 to 2, the side surface of the radiator box 41 is provided with a pattern 45. In this embodiment, the surface of the heat dissipation box 41 is provided with the patterns 45, the patterns 45 can increase the friction force, fang Bianren can be taken, and meanwhile, the contact area between the outer surface of the heat dissipation box 41 and the air is increased, so that the heat dissipation speed is increased.

Referring specifically to fig. 1-2, the fin assembly 30 is provided with a mounting groove 31 for receiving the heat pipe 10. In this embodiment, the heat pipe 10 is disposed in the mounting groove 31, and after the end portion of the heat pipe 10 receives the heat emitted by the chip, the heat is transferred to the middle portion of the heat pipe 10, and the middle portion of the heat pipe 10 abuts against the fin assembly 30, so as to increase the heat dissipation speed.

Specifically, referring to fig. 1 to 2, the fin assembly 30 includes a first fin group 32 and a second fin group 33 disposed adjacently, a connection portion 34 is disposed on the first fin group 32, and the aluminum extrusion 20 is mounted on the connection portion 34. In the present embodiment, the fin assembly 30 is divided into a plurality of fin groups, so as to reduce the cost and prevent the fin assembly 30 from being broken due to insufficient rigidity caused by excessive length.

Specifically, referring to fig. 1-2, two aluminum bottom plates 50 are further included, the two aluminum bottom plates 50 are respectively disposed at the upper ends of the first fin group 32 and the second fin group 33, and the heat pipe 10 is located between the aluminum bottom plates 50 and the fin assembly 30. In the present embodiment, two aluminum bottom plates 50 are respectively disposed at the upper ends of the first fin group 32 and the second fin group 33, and the heat pipe 10 is disposed between the aluminum bottom plates 50 and the fin assembly 30, so as to protect the heat pipe 10, prevent the heat pipe 10 from being broken down after collision, influence the performance of the heat pipe 10, and prevent the fin assembly 30 from scratching hands.

Specifically, referring to fig. 1 to 2, the upper end of the aluminum base plate 50 is provided with a heat conductive adhesive 51. In this embodiment, the upper end of the aluminum bottom plate 50 is provided with a heat-conducting glue 51, and the heat of the fin assembly 30 is transferred to the heat-conducting glue 51, so as to accelerate the heat transfer speed.

Specifically, referring to fig. 1 to 2, the end of the heat pipe 10 is coated with a thermally conductive paste 11. In this embodiment, the chip is abutted against the end of the heat pipe 10, and a thermal paste 11 is disposed between the chip and the end, so as to accelerate the heat transfer rate.

Specifically, referring to fig. 1-2, the fin assembly 30 includes a plurality of heat dissipation fins 35, each heat dissipation fin 35 is parallel to each other, and the spacing between two adjacent heat dissipation fins 35 is equal. In the present embodiment, when the heat dissipating fan 43 is used to blow the fin assembly 30, resistance to air circulation is reduced, and air circulation is faster, so as to achieve better heat dissipation effect.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.

Claims (10)

1. A heat radiation structure of two-way heat conduction, its characterized in that: the heat pipe comprises a heat pipe which is bent into a ring shape and the two ends of which are abutted with electric elements, an aluminum extrusion which is abutted with the end part of the heat pipe and provided with a mounting part at the abutting part, and a fin component which is abutted with one side of the aluminum extrusion away from the heat pipe.

2. The bi-directional thermally conductive heat dissipating structure of claim 1, wherein: the installation part is provided with a groove matched with the heat pipe, and the end part of the heat pipe is embedded in the groove.

3. The bi-directional thermally conductive heat dissipating structure of claim 1, wherein: the heat dissipation assembly comprises a heat dissipation box with a plurality of through holes at the bottom end, a heat dissipation fan arranged in each through hole, and a support with two sides respectively connected with the fin assembly and the inner cavity of the heat dissipation box.

4. A bi-directional thermally conductive heat dissipating structure as set forth in claim 3 wherein: the side face of the radiating box is provided with patterns.

5. The bi-directional thermally conductive heat dissipating structure of claim 1, wherein: and the fin component is provided with a mounting groove for placing the heat pipe.

6. The bi-directional heat conducting and dissipating structure of claim 5 wherein: the fin assembly comprises a first fin group and a second fin group which are adjacently arranged, a connecting part is arranged on the first fin group, and the aluminum extrusion is arranged on the connecting part.

7. The bi-directional heat conducting and dissipating structure of claim 6 wherein: the heat pipe is positioned between the aluminum bottom plates and the fin assemblies.

8. The bi-directional thermally conductive heat dissipating structure of claim 7, wherein: and the upper end of the aluminum bottom plate is provided with heat-conducting glue.

9. The bi-directional thermally conductive heat dissipating structure of claim 1, wherein: the end of the heat pipe is coated with heat conducting paste.

10. The bi-directional heat conductive heat dissipating structure of any of claims 1 to 9, wherein: the fin assembly comprises a plurality of radiating fins, wherein each radiating fin is parallel to each other, and the intervals between two adjacent radiating fins are equal.