CN218782591U - Power supply equipment - Google Patents

Power supply equipment Download PDF

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Publication number
CN218782591U
CN218782591U CN202222465329.8U CN202222465329U CN218782591U CN 218782591 U CN218782591 U CN 218782591U CN 202222465329 U CN202222465329 U CN 202222465329U CN 218782591 U CN218782591 U CN 218782591U
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Prior art keywords
heat
heat sink
power supply
plate
radiator
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CN202222465329.8U
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Chinese (zh)
Inventor
穆安全
兰勇
龙小明
赵自强
吴明福
王友军
韦焕东
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Great Wall Power Technology Shenzhen Co ltd
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Great Wall Power Technology Shenzhen Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

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Abstract

The application provides a power supply device, which comprises a shell, a mainboard, a plurality of power devices and a plurality of radiators; the main board is arranged in the shell, and the plurality of power devices are respectively arranged on the main board and are electrically connected with the main board; the radiators are respectively connected with the power devices and used for conducting heat of the power devices; a plurality of heat dissipation holes are distributed on at least one side wall of the shell. According to the power supply equipment, the heat dissipation of the plurality of power devices is realized through the plurality of heat radiators and the heat dissipation holes in the shell, a fan is not needed, and noise pollution and dust pollution caused by the fan are avoided; meanwhile, the plurality of power devices are respectively radiated by the plurality of radiators, so that each power device can independently radiate heat, thermal interference among the power devices is reduced, and the radiating efficiency of the whole power supply equipment is effectively improved.

Description

Power supply equipment
Technical Field
The application belongs to the technical field of heat dissipation, and more specifically relates to a power supply device.
Background
The computer power supply is a device which converts 220V alternating current into direct current and specially supplies power for computer accessories such as a CPU, a mainboard, a hard disk, a memory card, a display card, an optical disk drive and the like, is a hub for supplying power for each part of a computer and is an important component of the computer. The computer power supply can produce a large amount of heats at the course of the work, and computer power supply adopts the fan to force the heat dissipation usually, and the fan can bring certain noise pollution in the course of the work, and the fan during operation also can drive the inside dust of computer power supply and flow in order to pollute computer power supply simultaneously, influences computer power supply's use reliability and influences user's use and experiences.
SUMMERY OF THE UTILITY MODEL
An object of the embodiment of the application is to provide a power supply unit to solve the technical problem that the adoption fan heat dissipation that exists among the prior art leads to noise pollution and dust pollution.
In order to achieve the purpose, the technical scheme adopted by the application is as follows: the power supply equipment comprises a shell, a mainboard, a plurality of power devices and a plurality of radiators; the main board is arranged in the shell, and the plurality of power devices are respectively arranged on the main board and are electrically connected with the main board; the heat radiators are respectively connected with the power devices and used for conducting heat of the power devices; a plurality of heat dissipation holes are distributed in at least one side wall of the shell.
In one possible design, the plurality of power devices includes a transformer, the plurality of heat sinks includes a first heat sink, the first heat sink is mounted above the transformer, and a first heat conduction fin is abutted between the first heat sink and the transformer.
In one possible design, the transformer includes a main body portion, a bottom plate, and side plates; the bottom plate is attached to the main plate, the side plate is vertically arranged on the bottom plate, and the main body part is arranged on the bottom plate and connected with the side plate; the first heat conducting sheet is attached to the main body part, the first radiator is attached to the first heat conducting sheet, and the first radiator is locked on the side plate through a first fastener.
In a possible design, the plurality of heat sinks further include a second heat sink, and the plurality of power devices include at least one MOS transistor and at least one rectifier bridge; the second radiator is vertically inserted into the mainboard, the MOS tube and the rectifier bridge are respectively inserted into the mainboard, and the MOS tube and the rectifier bridge are respectively attached to the second radiator.
In one possible design, the second heat sink includes a pin plate, a first heat sink portion, and a second heat sink portion; the plug board is vertically inserted on the main board, and at least one MOS tube and at least one rectifier bridge are respectively attached to two opposite sides of the plug board; the first heat dissipation part and the second heat dissipation part are respectively arranged on two opposite sides of the plugboard and used for dissipating heat on the plugboard.
In a possible design, the first heat dissipation part comprises a plurality of second heat dissipation fins arranged at intervals, the second heat dissipation part comprises a plurality of third heat dissipation fins arranged at intervals, and the surfaces of the second heat dissipation fins and the third heat dissipation fins are both wavy.
In a possible design, the first heat sink is spaced from the plugboard, and the first heat sink portion is disposed on a side of the plugboard facing the first heat sink; a first heat dissipation groove penetrating along a first direction is formed in the first heat radiator, and a second heat dissipation groove penetrating along a second direction is formed in the first heat dissipation part; the first direction is perpendicular to the second direction, and the first heat dissipation part is provided with ventilation notches corresponding to the first heat dissipation grooves.
In one possible design, the plurality of power devices further include an inductor and a capacitor, and the plurality of heat sinks further include a third heat sink; the inductor and the capacitor are arranged at intervals, and the third radiator is arranged above the inductor and the capacitor and is in locking connection with the second radiator; the third radiator is used for respectively radiating heat for the inductor and the capacitor.
In a possible design, the inductor is attached with a second heat-conducting fin, the capacitor is attached with a third heat-conducting fin, and the bottom side of the third heat sink is attached to the second heat-conducting fin and the third heat-conducting fin respectively.
In a possible design, a connecting plate extends from the top of the insertion plate, the power supply device further includes a connecting member, the connecting member is respectively attached to the connecting plate and the third heat sink, and the connecting member is respectively locked to the connecting plate and the third heat sink by a second fastener.
The application provides a power supply unit's beneficial effect lies in: according to the power supply equipment provided by the embodiment of the application, the plurality of radiators are arranged and are respectively connected with the plurality of power devices, so that heat generated by the plurality of power devices during working can be conducted to the plurality of radiators, and is respectively conducted and radiated through the plurality of radiators; through distribute a plurality of louvres on at least one lateral wall at the casing to make the inside and outside circulation of air of casing, thereby can promote a plurality of radiators and give off the heat to the casing outside fast, improved power equipment's radiating effect. According to the power supply equipment, the heat dissipation of the plurality of power devices is realized through the plurality of heat radiators and the heat dissipation holes in the shell, and a fan is not needed, so that noise pollution and dust pollution caused by the fan are avoided; meanwhile, the plurality of power devices are respectively radiated by the plurality of radiators, so that each power device can independently radiate heat, thermal interference among the power devices is reduced, and the radiating efficiency of the whole power supply equipment is effectively improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a schematic perspective view of a power supply device provided in an embodiment of the present application;
FIG. 2 is a schematic perspective view of the power supply apparatus of FIG. 1 with the housing removed;
FIG. 3 is a schematic side view of the power supply apparatus of FIG. 2;
FIG. 4 is a partially exploded schematic view of the power supply apparatus of FIG. 2;
FIG. 5 is a schematic view of the transformer and the first heat sink of FIG. 2;
FIG. 6 is an exploded view of the transformer and the first heat sink of FIG. 5;
FIG. 7 is a schematic view of the first heat sink shown in FIG. 6;
FIG. 8 is a schematic view of a second heat sink shown in FIG. 2;
fig. 9 is a schematic structural diagram of the third heat sink in fig. 2.
Wherein, in the figures, the various reference numbers:
1. a housing; 100. heat dissipation holes; 2. a main board; 3. a transformer; 31. a main body part; 32. a base plate; 33. a side plate; 4. an MOS tube; 5. a rectifier bridge; 6. a capacitor; 7. an inductance; 8. a first heat sink; 81. a first heat dissipation plate; 82. a first heat sink; 83. a first heat sink; 9. a second heat sink; 91. a plugboard; 92. a first heat sink portion; 921. a second heat dissipation plate; 922. a second heat sink; 923. a second heat sink; 924. a vent gap; 93. a second heat sink member; 931. a third heat sink; 94. a connecting plate; 95. a positioning column; 10. a third heat sink; 101. a third heat sink; 11. a first heat-conductive sheet; 12. a second heat-conducting fin; 13. a third thermally conductive sheet; 14. a connection assembly; 141. a connecting member; 1411. a first adhesive sheet; 1412. a second adhesive sheet; 142. a second fastener; 15. a first fastener; x, a first direction; y, a second direction.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1, a power supply apparatus provided in an embodiment of the present application will now be described. The power supply device is specifically a computer power supply and is used for supplying power to computer accessories such as a CPU, a mainboard, a hard disk, a memory card, a display card, an optical disk drive and the like. It is to be understood that, in other embodiments of the present application, the power supply device may also be a power supply for supplying power to other devices, for example, a power supply for supplying power to a display screen, a power supply for supplying power to an air conditioner, and the like, which is not limited herein.
Referring to fig. 1 to 4, the power supply device includes a housing 1, a motherboard 2, a plurality of power devices, and a plurality of heat sinks. The main board 2, the plurality of power devices and the plurality of radiators are all arranged in the shell 1, and the plurality of power devices are respectively arranged on the main board 2 and are electrically connected with the main board 2; the radiators are respectively connected with the power devices and used for conducting heat of the power devices; a plurality of heat dissipation holes 100 are distributed on at least one sidewall of the housing 1.
The plurality of power devices refer to components which generate more heat among a plurality of components arranged on the main board 2 in the power supply equipment, such as a transformer 3, an inductor 7, a capacitor 6, a MOS transistor 4, a rectifier bridge 5, and the like.
In addition, a plurality of heat dissipation holes 100 are distributed on at least one sidewall of the housing 1, which means that the heat dissipation holes 100 are distributed on one sidewall or a plurality of sidewalls according to the design requirement of the housing 1. The heat dissipation holes 100 penetrate through the inside and outside of the housing 1, so that air flows through the inside and outside of the housing 1, thereby facilitating heat dissipation. For example, in the present application, a plurality of heat dissipation holes 100 are distributed on the top side wall and the front side wall of the housing 1, so as to facilitate heat dissipation.
When power supply unit during operation, a plurality of power device produce the heat because of long-time work, and the heat that a plurality of power device produced can conduct to a plurality of radiators in to distribute away the heat conduction through a plurality of radiators, distribute away to the power supply unit outside nature through a plurality of louvres 100 on the casing 1 at last.
According to the power supply equipment, the radiators are arranged and are respectively connected with the power devices, so that heat generated by the power devices during working can be conducted to the radiators, and the heat can be conducted and radiated out through the radiators; through distributing a plurality of louvres 100 on at least one lateral wall at casing 1 to make inside and outside circulation of air of casing 1, thereby can promote a plurality of radiators and give off the heat to casing 1 outside fast, improved power equipment's radiating effect. According to the power supply equipment, the heat dissipation of a plurality of power devices is realized through a plurality of heat radiators and the heat dissipation holes 100 on the shell 1, and a fan is not needed, so that noise pollution and dust pollution caused by the fan are avoided; meanwhile, the plurality of power devices are respectively radiated by the plurality of radiators, so that each power device can independently radiate heat, thermal interference among the power devices is reduced, and the radiating efficiency of the whole power supply equipment is effectively improved.
In one embodiment, referring to fig. 2, 5 and 6, the power devices include a transformer 3, the heat sinks include a first heat sink 8, the first heat sink 8 is mounted above the transformer 3, and a first heat-conducting fin 11 is abutted between the first heat sink 8 and the transformer 3. In this embodiment, through the setting of first conducting strip 11 and first radiator 8, make can be earlier through first conducting strip 11 with the heat of transformer 3 conduct to first radiator 8 fast, and distribute away through first radiator 8, thereby improved transformer 3's radiating effect, improved transformer 3's life. Meanwhile, the first heat sink 8 and the first heat-conducting fin 11 are mounted above the transformer 3, so that the first heat sink 8 and the first heat-conducting fin 11 do not occupy the space of the motherboard 2 and do not affect the circuit design of the motherboard 2 and the components thereon.
Specifically, referring to fig. 5 and 6, the transformer 3 includes a main body 31, a bottom plate 32, and a side plate 33. The bottom plate 32 is attached to the main plate 2, the side plate 33 is vertically installed on the bottom plate 32, the main body portion 31 is installed on the bottom plate 32 and connected with the side plate 33, the first heat conducting strip 11 is attached to the main body portion 31, the first heat sink 8 is attached to the first heat conducting strip 11, and the first heat sink 8 is locked on the side plate 33 through the first fastening piece 15. In this embodiment, the bottom plate 32 of the transformer 3 is extended to the side, and the first heat sink 8 is locked and fixed by the side plates 33, so that the first heat sink 8 does not occupy the space of the main board 2, and can be firmly mounted.
Referring to fig. 5 to 7, the first heat sink 8 includes a first heat dissipating plate 81 and a plurality of first heat dissipating fins 82, the first heat dissipating plate 81 is in a thin plate shape, the first heat dissipating plate 81 is attached to the first heat conducting fins 11, the first heat dissipating plate 81 is fastened to the side plate 33 by the first fastening member 15, and the plurality of first heat dissipating fins 82 are sequentially formed on the first heat dissipating plate 81 at intervals. The first heat dissipation plate 81 and the plurality of first heat dissipation fins 82 are integrally connected to each other, such as an aluminum profile or an aluminum alloy profile, so as to dissipate heat quickly.
In one embodiment, referring to fig. 2 and fig. 4, the plurality of heat sinks further includes a second heat sink 9, and the plurality of power devices includes at least one MOS transistor 4 and at least one rectifier bridge 5; the second radiator 9 is vertically inserted into the main board 2, the MOS tube 4 and the rectifier bridge 5 are respectively inserted into the main board 2, and the MOS tube 4 and the rectifier bridge 5 are respectively fixed and attached to the second radiator 9.
Wherein, MOS pipe 4 and rectifier bridge 5 are all inserted and are located mainboard 2, and MOS pipe 4 and rectifier bridge 5 are equal vertical setting, and along the horizontal direction occupation space few, consequently can't install second radiator 9 on MOS pipe 4 and rectifier bridge 5. In this embodiment, the second heat sink 9 is inserted into the motherboard 2, so that the second heat sink 9 occupies less space of the motherboard 2, and can be fixedly mounted on the motherboard 2; in addition, fix respectively with MOS pipe 4 and rectifier bridge 5 and paste and locate on second radiator 9 to make MOS pipe 4 and rectifier bridge 5 work the heat homoenergetic that produces conduct respectively to second radiator 9 on, and distribute away through second radiator 9, can also support fixedly MOS pipe 4 and rectifier bridge 5 through second radiator 9 simultaneously.
Specifically, referring to fig. 8, the second heat sink 9 includes a socket board 91, a first heat sink portion 92 and a second heat sink portion 93; the plug board 91 is in a thin plate shape, the plug board 91 is vertically inserted on the main board 2, and the at least one MOS transistor 4 and the at least one rectifier bridge 5 are respectively attached to two opposite sides of the plug board 91; the first heat sink portion 92 and the second heat sink portion 93 are respectively disposed on opposite sides of the socket board 91 and are configured to dissipate heat from the socket board 91. In this embodiment, at first, realize the fixed of second radiator 9 on mainboard 2 through pegging graft between plugboard 91 and mainboard 2, then through pasting MOS pipe 4 and rectifier bridge 5 respectively on plugboard 91, thereby can conduct MOS pipe 4 and rectifier bridge 5's heat to plugboard 91 fast, at last through locating the first heat dissipation portion 92 and the second heat dissipation portion 93 of plugboard 91 both sides with the heat distribute away fast, thereby realize MOS pipe 4, rectifier bridge 5 and mainboard 2's heat dissipation.
Referring to fig. 8, two positioning posts 95 are disposed at the bottom end of the inserting plate 91, two positioning holes are disposed on the main board 2 corresponding to the two positioning posts 95, and the two positioning posts 95 are inserted into the two positioning holes one by one, so as to fix the second heat sink 9 on the main board 2.
The number of the MOS transistors 4 may be one, two, three, or more than three, and the number of the rectifier bridges 5 may be one, two, three, or more than three, and is mainly set according to the design requirement of the power supply device. Each MOS tube 4 and each rectifier bridge 5 are attached to the plug board 91 and are cooled by the second radiator 9, that is, each MOS tube 4 and each rectifier bridge 5 are cooled by the integral second radiator 9, so that the overall structural strength of each MOS tube 4, each rectifier bridge 5 and the second radiator 9 is effectively increased, and the assembly difficulty of each MOS tube 4, each rectifier bridge 5 and the second radiator 9 is also reduced.
Referring to fig. 8, the first heat sink portion 92 includes a second heat sink 921 and a plurality of second heat sinks 922. The second heat dissipating plate 921 is perpendicular to the inserting plate 91, the second heat dissipating fins 922 are respectively distributed on the second heat dissipating plate 921, the second heat dissipating fins 922 are respectively arranged along the first direction X at intervals in sequence and respectively extend along the second direction Y, and the second heat dissipating fins 922 are used for dissipating heat along the second direction Y. The first direction X is perpendicular to the second direction Y, and the second direction Y is parallel to the length extending direction of the inserting plate 91.
Referring to fig. 8 again, the second heat dissipating part 93 includes a plurality of third heat dissipating fins 931 disposed at intervals, the plurality of third heat dissipating fins 931 are respectively connected to the socket plate 91 vertically, the plurality of third heat dissipating fins 931 are sequentially disposed at intervals along the vertical direction, the plurality of third heat dissipating fins 931 respectively extend along the second direction Y, and the plurality of third heat dissipating fins 931 are configured to conduct heat away from the socket plate 91 along the second direction Y.
The surfaces of the second and third fins 922, 931 are wavy, and the shape design can increase the surface area of the second and third fins 922, 931, so as to improve the heat dissipation effect of the second and third fins 922, 931.
Similarly, the surface of the first heat sink 82 may be corrugated to improve the heat dissipation effect of the first heat sink 82.
In one embodiment, referring to fig. 2, 8 and 9, the first heat sink 8 is disposed at a distance from the plug board 91, and the first heat sink portion 92 is disposed on a side of the plug board 91 facing the first heat sink 8. The first heat sink 8 is provided with a plurality of first heat dissipation grooves 83 penetrating along the first direction X, and the first heat dissipation part 92 is provided with a plurality of second heat dissipation grooves 923 penetrating along the second direction Y; a ventilation notch 924 is formed in the position of the first heat dissipation portion 92 corresponding to the first heat dissipation groove 83; the first direction X is perpendicular to the second direction Y, the second direction Y is parallel to the length extending direction of the socket board 91, and the second direction Y is perpendicular to the socket board 91.
Each first heat dissipation groove 83 is formed by spacing two adjacent first heat dissipation fins 82, and each second heat dissipation groove 923 is formed by spacing two adjacent second heat dissipation fins 922. In this embodiment, first, the first heat sink 8 and the patch board 91 are disposed at an interval, so that heat on the patch board 91 can be dissipated through the first heat dissipating portion 92 between the first heat sink 8 and the patch board 91; meanwhile, because the extending directions of the first heat dissipation groove 83 and the second heat dissipation groove 923 are perpendicular to each other, the heat on the first heat sink 8 can be dissipated to the direction of the first heat dissipation part 92, and dissipated at the ventilation notch 924 or dissipated from the ventilation notch 924 via the second heat dissipation plate 922.
In one embodiment, referring to fig. 2 to 4, the plurality of power devices further includes an inductor 7 and a capacitor 6, and the plurality of heat sinks further includes a third heat sink 10; the inductor 7 and the capacitor 6 are arranged at intervals, and the third radiator 10 is arranged above the inductor 7 and the capacitor 6 and is in locking connection with the second radiator 9; the third heat sink 10 is used for dissipating heat of the inductor 7 and the capacitor 6, respectively. In this embodiment, the third heat sink 10 is used to dissipate heat from the inductor 7 and the capacitor 6, respectively, so as to simplify the heat dissipation structure of the power supply device; through locating inductance 7 and electric capacity 6 top and with second radiator 9 locking connection with third radiator 10 to make the setting of third radiator 10 can not occupy the space of mainboard 2, can not influence circuit design on mainboard 2 yet, also make whole power equipment compact structure simultaneously, occupation space is little.
In one embodiment, referring to fig. 3, the inductor 7 is attached with a second heat-conducting strip 12, the capacitor 6 is attached with a third heat-conducting strip 13, and the bottom side of the third heat sink 10 is attached to the second heat-conducting strip 12 and the third heat-conducting strip 13, respectively. In this embodiment, the heat generated by the inductor 7 and the capacitor 6 is rapidly conducted to the third heat sink 10 through the second heat-conducting fin 12 and the third heat-conducting fin 13, and is dissipated through the third heat sink 10, so as to improve the heat dissipation efficiency of the inductor 7 and the capacitor 6. Meanwhile, because the inductor 7 and the capacitor 6 have different structures, and the height of the inductor 7 and the height of the capacitor 6 are also different, through the design of the second heat-conducting strip 12 and the third heat-conducting strip 13, the bottom side of the third heat sink 10 can be arranged in a parallel and level manner, for example, the thickness of the second heat-conducting strip 12 is set to be larger, and the thickness of the third heat-conducting strip 13 is set to be smaller, so that the top side of the second heat-conducting strip 12 and the top side of the third heat-conducting strip 13 are arranged in a parallel and level manner, the bottom side of the third heat sink 10 is arranged in a parallel and level manner, and the third heat sink 10 is ensured to be installed stably.
Referring to fig. 8, a connecting plate 94 extends from the top of the inserting plate 91, the connecting plate 94 is disposed close to the third heat sink 10, and the connecting plate 94 is connected to the third heat sink 10 by a connecting assembly 14. Specifically, the connecting assembly 14 includes a connecting member 141 and a second fastening member 142, the connecting member 141 is respectively attached to the connecting plate 94 and the third heat sink 10, one end of the connecting member 141 is fastened to the third heat sink 10 by the second fastening member 142, and the other end of the connecting member 141 is fastened to the connecting plate 94 by the second fastening member 142, so that the third heat sink 10 is fixed to the second heat sink 9.
Referring to fig. 2, 4 and 8, the top side of the third heat sink 10 is flush with the top side of the connection plate 94, and the top side of the connection plate 94 is lower than the top side of the third heat sink 10. The connection member 141 includes a first engagement piece 1411 and a second engagement piece 1412 connected in a step manner, the first engagement piece 1411 is attached to the top side of the third heat sink 10 and locked by the second fastening member 142, and the second engagement piece 1412 is attached to the top side of the connection plate 94 and locked by the second fastening member 142.
Referring to fig. 2 and 9, the third heat sink 10 has a top side and a bottom side opposite to each other, the top side of the third heat sink 10 is attached to the connecting member 141, and the bottom side of the third heat sink 10 is attached to the second heat-conducting fin 12 and the third heat-conducting fin 13. The third heat sink 10 has a plurality of third heat dissipating grooves 101 formed on opposite sides thereof along the first direction X, each third heat dissipating groove 101 penetrates both ends of the third heat sink 10 along the second direction Y, and the third heat dissipating grooves 101 on the same side of the third heat sink 10 are arranged at intervals along the vertical direction. The third heat sink 10 in this embodiment is provided with the third heat dissipation grooves 101, so that the surface area of the third heat sink 10 is increased, and the third heat sink 10 is favorable for rapid heat dissipation.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. A power supply device is characterized by comprising a shell, a mainboard, a plurality of power devices and a plurality of radiators; the main board is arranged in the shell, and the plurality of power devices are respectively arranged on the main board and are electrically connected with the main board; the heat radiators are respectively connected with the power devices and used for conducting heat of the power devices; a plurality of heat dissipation holes are distributed in at least one side wall of the shell.
2. The power supply apparatus of claim 1, wherein the plurality of power devices comprises a transformer, the plurality of heat sinks comprises a first heat sink, the first heat sink is mounted above the transformer, and a first heat-conducting fin is abutted between the first heat sink and the transformer.
3. The power supply apparatus according to claim 2, wherein the transformer includes a main body portion, a bottom plate, and side plates; the bottom plate is attached to the main plate, the side plate is vertically arranged on the bottom plate, and the main body part is arranged on the bottom plate and connected with the side plate; the first heat conducting sheet is attached to the main body part, the first radiator is attached to the first heat conducting sheet, and the first radiator is locked on the side plate through a first fastener.
4. The power supply apparatus of claim 2 wherein said plurality of heat sinks further comprises a second heat sink, and said plurality of power devices comprises at least one MOS transistor and at least one rectifier bridge; the second radiator is vertically inserted into the mainboard, the MOS tube and the rectifier bridge are respectively inserted into the mainboard, and the MOS tube and the rectifier bridge are respectively attached to the second radiator.
5. The power supply device according to claim 4, wherein the second heat sink includes a socket board, a first heat sink portion, and a second heat sink portion; the plug board is vertically inserted on the main board, and at least one MOS tube and at least one rectifier bridge are respectively attached to two opposite sides of the plug board; the first heat dissipation part and the second heat dissipation part are respectively arranged on two opposite sides of the plugboard and used for dissipating heat on the plugboard.
6. The power supply apparatus according to claim 5, wherein the first heat sink member includes a plurality of second heat sinks arranged at intervals, the second heat sink member includes a plurality of third heat sinks arranged at intervals, and surfaces of the second heat sinks and the third heat sinks are both wavy.
7. The power supply device according to claim 5, wherein the first heat sink is disposed at a distance from the socket board, and the first heat sink portion is disposed on a side of the socket board facing the first heat sink; a first heat dissipation groove penetrating along a first direction is formed in the first heat radiator, and a second heat dissipation groove penetrating along a second direction is formed in the first heat dissipation part; the first direction is perpendicular to the second direction, and the first heat dissipation part is provided with ventilation notches corresponding to the first heat dissipation grooves.
8. The power supply apparatus of claim 5 wherein a plurality of said power devices further comprise an inductor and a capacitor, a plurality of said heat sinks further comprising a third heat sink; the inductor and the capacitor are arranged at intervals, and the third radiator is arranged above the inductor and the capacitor and is in locking connection with the second radiator; the third radiator is used for respectively radiating heat for the inductor and the capacitor.
9. The power supply apparatus according to claim 8, wherein a second heat-conducting plate is attached to the inductor, a third heat-conducting plate is attached to the capacitor, and bottom sides of the third heat sink are attached to the second heat-conducting plate and the third heat-conducting plate, respectively.
10. The power supply device of claim 8, wherein a connecting plate extends from a top of the insertion plate, the power supply device further comprising a connecting member, the connecting member is attached to the connecting plate and the third heat sink, and the connecting member is fastened to the connecting plate and the third heat sink by a second fastening member.
CN202222465329.8U 2022-09-16 2022-09-16 Power supply equipment Active CN218782591U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202222465329.8U CN218782591U (en) 2022-09-16 2022-09-16 Power supply equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202222465329.8U CN218782591U (en) 2022-09-16 2022-09-16 Power supply equipment

Publications (1)

Publication Number Publication Date
CN218782591U true CN218782591U (en) 2023-03-31

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